Structured light camera module and electronic equipment

Abstract

A structured light camera module comprises: a housing; the transmitting module is arranged in the shell and comprises a transmitting circuit board and a transmitting main body, the transmitting circuit board is connected with the shell, and the transmitting main body is arranged on the transmitting circuit board and electrically connected with the transmitting circuit board; the receiving module is arranged in the shell and comprises a receiving circuit board and a receiving main body, one part of the receiving circuit board is opposite to the transmitting circuit board, the other part of the receiving circuit board extends out of the transmitting circuit board, and the receiving main body is arranged at the part, extending out of the transmitting circuit board, of the receiving circuit board and is electrically connected with the receiving circuit board; the receiving main body is positioned on one side of the transmitting module; one end of the bent circuit board is electrically connected with the transmitting circuit board, and the other end of the bent circuit board is electrically connected with the receiving circuit board. The structured light camera module is compact in layout, small in size and beneficial to miniaturization of electronic equipment. The embodiment of the utility model further provides electronic equipment which comprises a body and the structured light camera module, and the structured light camera module is arranged in the body.

Description

Technical Field

[0001] The present application relates to the technical field of camera devices, and in particular to a structured light camera module and electronic equipment. Background Art

[0002] Depth measurement technology can obtain the depth data of the target object, so as to obtain 3D images with depth information such as RGB-D. Compared with 2D images, 3D images contain more data and can achieve better recognition of targets. Due to the development of technology, they have been applied in face recognition, 3D modeling, VR and other fields. Structured light technology is one of the most widely used technologies.

[0003] In the current mainstream structured light camera modules, the transmitting module and the receiving module are usually arranged side by side on the same circuit board. However, the volume of such structured light camera modules is relatively large, which is not conducive to the miniaturization of electronic equipment. Utility Model Content

[0004] In view of the above, it is necessary to propose a structured light camera module and an electronic device to reduce the size of the structured light camera module.

[0005] The embodiment of the present application provides a structured light camera module, comprising: a shell; a transmitting module, arranged in the shell, comprising a transmitting circuit board and a transmitting body, the transmitting circuit board is connected to the shell, the transmitting body is arranged on the transmitting circuit board and electrically connected to the transmitting circuit board, and the transmitting body is used to transmit a light beam; a receiving module, arranged in the shell, comprising a receiving circuit board and a receiving body, a part of the receiving circuit board is arranged opposite to the transmitting circuit board, and the other part of the receiving circuit board extends out of the transmitting circuit board, the receiving body is arranged at the part of the receiving circuit board extending out of the transmitting circuit board and is electrically connected to the receiving circuit board, the receiving body is located on one side of the transmitting module, and is used to receive the reflected light beam; a bending circuit board, one end of the bending circuit board is electrically connected to the transmitting circuit board, and the other end of the bending circuit board is electrically connected to the receiving circuit board.

[0006] In the above-mentioned structured light camera module, by setting the transmitting body on the transmitting circuit board, and setting the receiving body on the receiving circuit board opposite to the transmitting circuit board, and electrically connecting the transmitting circuit board and the receiving circuit board respectively by bending the circuit board, it is possible to get rid of the position constraint between the transmitting circuit board and the receiving circuit board, which is convenient for simplifying the structural design of the structured light camera module, helps to reasonably arrange the positions of the transmitting module and the receiving module, and makes the layout of the structured light camera module compact, thereby reducing the size of the structured light camera module, which is conducive to the miniaturization of electronic equipment.

[0007] In some embodiments, the housing is provided with a receiving groove, the transmitting circuit board and the transmitting body are both arranged in the receiving groove, and the transmitting circuit board is arranged at the bottom of the receiving groove.

[0008] In this way, the receiving groove can accommodate the transmitting circuit board and the transmitting body, thereby protecting the transmitting body and preventing the transmitting body from being scratched or pushed and becoming loose, thereby affecting the quality of the obtained depth image.

[0009] In some embodiments, the structured light camera module further includes a first heat sink, which is disposed on a side of the transmitting circuit board close to the bottom of the accommodating groove and is used to dissipate heat from the transmitting circuit board.

[0010] In this way, by providing the first heat sink, the heat generated by the transmitting circuit board can be conducted away, thereby improving the heat dissipation performance of the structured light camera module.

[0011] In some embodiments, the structured light camera module also includes a processing chip, which is disposed on the receiving circuit board and electrically connected to the receiving body, and is used to receive and process the optical signal sent by the receiving body to obtain a depth image.

[0012] In this way, by setting up a processing chip, the optical signal sent by the receiving subject can be processed to obtain the required depth image.

[0013] In some embodiments, the shell is further provided with a receiving groove and a receiving cavity connected to the receiving groove, the receiving groove and the receiving groove are arranged on opposite sides of the shell, the receiving circuit board is arranged at the bottom of the receiving groove, the receiving cavity is arranged between the receiving groove and the receiving groove, the receiving cavity includes a first chamber and a second chamber that are connected, the processing chip is located in the first chamber, and the receiving body is located in the second chamber.

[0014] In this way, by arranging the processing chip and the receiving body in different chambers of the receiving cavity, the processing chip and the receiving body can operate independently without interference during operation, and the layout of the structured light camera module can be made compact, thereby reducing the size of the structured light camera module.

[0015] In some embodiments, the receiving body includes a lens seat, a photosensitive chip and an optical lens, the lens seat is arranged on the receiving circuit board, the photosensitive chip is arranged on the receiving circuit board and is electrically connected to the receiving circuit board, the photosensitive chip is located in the lens seat, and the optical lens is arranged in the lens seat and is located on the photosensitive path of the photosensitive chip.

[0016] In this way, the reflected light beam is first converged by the optical lens, and then received by the photosensitive chip to obtain a light signal. The photosensitive chip sends the light signal to the processing chip, and the processing chip obtains the required depth image after processing.

[0017] In some embodiments, the optical lens is rotatably connected to the lens holder via threads.

[0018] In this way, the focal length of the receiving module can be adjusted by rotating the optical lens, thereby improving the imaging quality of the receiving module.

[0019] In some embodiments, the structured light camera module also includes a second heat sink, which is disposed on a side of the receiving circuit board away from the photosensitive chip and is electrically connected to the receiving circuit board for dissipating heat from the receiving circuit board.

[0020] In this way, by providing the second heat sink, the heat generated by the receiving circuit board can be conducted away, thereby improving the heat dissipation performance of the structured light camera module.

[0021] In some embodiments, the structured light camera module also includes an extended circuit board and a connector, one end of the extended circuit board is electrically connected to the receiving circuit board, and one end of the extended circuit board and the bent circuit board are located on opposite sides of the receiving circuit board, and the other end of the extended circuit board is located outside the shell and connected to the connector.

[0022] In this way, by arranging the connector outside the shell and connecting it to the extended circuit board, the connector and the processing chip can operate independently without causing interference during operation, and the layout of the structured light camera module can be made compact, thereby reducing the size of the structured light camera module.

[0023] An embodiment of the present application also provides an electronic device, including a main body and the structured light camera module as described above, wherein the structured light camera module is disposed in the main body.

[0024] The above-mentioned electronic device includes a structured light camera module. By arranging the transmitting body of the structured light camera module on a transmitting circuit board, and arranging the receiving body on a receiving circuit board opposite to the transmitting circuit board, and electrically connecting the transmitting circuit board and the receiving circuit board respectively by bending the circuit board, the layout of the structured light camera module can be made compact, thereby reducing the size of the structured light camera module, which is conducive to the miniaturization of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of an electronic device proposed in one embodiment of the present application.

[0026] Figure 2 yes Figure 1 A schematic diagram of the three-dimensional structure of a structured light camera module in an electronic device is shown.

[0027] Figure 3 yes Figure 2 A partial three-dimensional structural schematic diagram of a structured light camera module is shown.

[0028] Figure 4 yes Figure 2 The schematic diagram of the cross-sectional structure of the structured light camera module along line IV-IV is shown.

[0029] Main component symbols

[0030] Electronic devices 100

[0031] Body 10

[0032] Structured light camera module 20

[0033] Housing 21

[0034] Accommodating groove 211

[0035] Storage tank 212

[0036] Accommodation chamber 213

[0037] First Chamber 2131

[0038] Second chamber 2132

[0039] Transmitter module 22

[0040] Transmitter circuit board 221

[0041] Launch body 222

[0042] Receiving module 23

[0043] Receiving circuit board 231

[0044] Receiving Subject 232

[0045] Mirror mount 2321

[0046] Photosensitive chip 2322

[0047] Optical lens 2323

[0048] Filter element 2324

[0049] Bending circuit board 24

[0050] First heat sink 25

[0051] Processing chip 26

[0052] Second heat sink 27

[0053] Extension circuit board 28

[0054] Connector 29 DETAILED DESCRIPTION

[0055] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0056] The embodiments of the present application are further described below in conjunction with the accompanying drawings.

[0057] See also Figure 1 The embodiment of the present application provides an electronic device 100, including a body 10 and a structured light camera module 20, wherein the structured light camera module 20 is disposed in the body 10. The electronic device 100 may be a tablet computer, an electronic paper book, an MP3 / 4 / 5, a personal digital assistant, a camera, a television, a washing machine, a refrigerator, a sweeping robot, a drone, a pipe cleaning robot, a smart phone, etc.

[0058] See also Figure 2 , Figure 3 and Figure 4 The structured light camera module 20 includes a housing 21 , a transmitting module 22 , a receiving module 23 and a bent circuit board 24 .

[0059] The transmitting module 22 is arranged in the housing 21, and the transmitting module 22 includes a transmitting circuit board 221 and a transmitting body 222. The transmitting circuit board 221 is connected to the housing 21, and the transmitting body 222 is arranged on the transmitting circuit board 221 and electrically connected to the transmitting circuit board 221. The transmitting body 222 is used to transmit a light beam. The receiving module 23 is arranged in the housing 21, and the receiving module 23 includes a receiving circuit board 231 and a receiving body 232. A part of the receiving circuit board 231 is arranged opposite to the transmitting circuit board 221, and another part of the receiving circuit board 231 extends out of the transmitting circuit board 221. The receiving body 232 is arranged at the part of the receiving circuit board 231 extending out of the transmitting circuit board 221 and is electrically connected to the receiving circuit board 231. The receiving body 232 is located on one side of the transmitting module 22, and is used to receive the reflected light beam. One end of the bending circuit board 24 is electrically connected to the transmitting circuit board 221, and the other end of the bending circuit board 24 is electrically connected to the receiving circuit board 231.

[0060] The emitting body 222 includes a light source device, which may be implemented as a vertical cavity surface emitting laser (VCSEL) for emitting a laser beam. The emitting body 222 may be fixed to the emitting circuit board 221 by welding, but not limited to, and the emitting circuit board 221 may be fixed to the housing 21 by gluing, but not limited to. The receiving body 232 may be fixed to the receiving circuit board 231 by gluing, but not limited to, and the receiving circuit board 231 may be fixed to the housing 21 by gluing, but not limited to, gluing.

[0061] The bent circuit board 24 is a flexible circuit board, which can get rid of the position constraint between the transmitting circuit board 221 and the receiving circuit board 231 through the flexible circuit board, so as to simplify the structural design of the structured light camera module 20 and help to reasonably arrange the positions of the transmitting module 22 and the receiving module 23. Of course, in other examples of the present application, the bent circuit board 24 can also be implemented as other types of bent circuit boards 24 such as special-shaped circuit boards, but not limited to them, as long as it can ensure that the transmitting circuit board 221 can be electrically connected to the receiving circuit board 231, and this application will not repeat them.

[0062] In some embodiments, the housing 21 is provided with a receiving groove 211, which is roughly in the shape of a rectangular parallelepiped, and the transmitting circuit board 221 and the transmitting body 222 are both arranged in the receiving groove 211, and the transmitting circuit board 221 is arranged at the bottom of the receiving groove 211. In this way, the receiving groove 211 can accommodate the transmitting circuit board 221 and the transmitting body 222, forming a protection for the transmitting body 222, preventing the transmitting body 222 from being scratched or pushed and becoming loose, thereby affecting the quality of the obtained depth image.

[0063] In some embodiments, the structured light camera module 20 further includes a first heat sink 25, which is disposed on one side of the bottom of the transmitting circuit board 221 near the accommodating groove 211, and is used to dissipate heat from the transmitting circuit board 221. The first heat sink 25 is a sheet structure, and the first heat sink 25 can be made of, but not limited to, graphite sheets, thermally conductive adhesives, or other materials with good heat dissipation performance, as long as the heat dissipation performance of the transmitting circuit board 221 can be improved, which will not be described in detail here. In this way, by providing the first heat sink 25, the heat generated by the transmitting circuit board 221 can be conducted away, thereby improving the heat dissipation performance of the structured light camera module 20.

[0064] The first heat sink 25 may be fixed to the bottom of the receiving groove 211 of the housing 21 by means of, but not limited to, embedding or gluing.

[0065] In some embodiments, the structured light camera module 20 further includes a processing chip 26, which is disposed on the receiving circuit board 231 and electrically connected to the receiving body 232. The processing chip 26 is located between the receiving circuit board 231 and the transmitting circuit board 221, and is used to receive and process the optical signal sent by the receiving body 232 to obtain a depth image. In this way, by providing the processing chip 26, the optical signal sent by the receiving body 232 can be processed to obtain the desired depth image.

[0066] In some embodiments, the housing 21 is further provided with a receiving groove 212 and a receiving cavity 213 connected to the receiving groove 212. The receiving groove 212 and the receiving groove 211 are arranged on opposite sides of the housing 21. The receiving circuit board 231 is arranged at the bottom of the receiving groove 212. The receiving cavity 213 is arranged between the receiving groove 212 and the receiving groove 211. The receiving cavity 213 includes a first cavity 2131 and a second cavity 2132 that are connected. The processing chip 26 is located in the first cavity 2131, and the receiving body 232 is located in the second cavity 2132. In this way, by arranging the processing chip 26 and the receiving body 232 in different cavities of the receiving cavity 213, the processing chip 26 and the receiving body 232 can work independently without interference during operation, and the layout of the structured light camera module 20 can be made compact, thereby reducing the size of the structured light camera module 20.

[0067] In some embodiments, the receiving body 232 includes a lens holder 2321, a photosensitive chip 2322 and an optical lens 2323. The lens holder 2321 is provided on the receiving circuit board 231, the photosensitive chip 2322 is provided on the receiving circuit board 231 and is electrically connected to the receiving circuit board 231, the photosensitive chip 2322 is located in the lens holder 2321, and the optical lens 2323 is provided in the lens holder 2321 and is located on the light sensing path of the photosensitive chip 2322. In this embodiment, the optical lens 2323 is composed of a lens barrel and at least one lens provided in the lens barrel. In this way, the reflected light beam first converges through the optical lens 2323, and then is received by the photosensitive chip 2322 to obtain a light signal. The photosensitive chip 2322 sends the light signal to the processing chip 26, and the processing chip 26 obtains the desired depth image after processing.

[0068] In some embodiments, the receiving body 232 also includes a filter element 2324, which is disposed on the lens holder 2321 and located between the photosensitive chip 2322 and the optical lens 2323, and is used to filter the light beam after being converged by the optical lens 2323, so that the photosensitive chip 2322 receives the light beam filtered by the filter element 2324, which helps to improve the imaging quality of the structured light camera module 20.

[0069] In some embodiments, the optical lens 2323 is rotatably connected to the lens holder 2321 via a thread. Thus, by rotating the optical lens 2323 to move the optical lens 2323 relative to the lens holder 2321 along the optical axis, the focal length of the receiving module 23 can be adjusted, and the imaging quality of the receiving module 23 can be improved. In addition, the threaded connection method can ensure a stable connection between the optical lens 2323 and the lens holder 2321.

[0070] In some embodiments, the structured light camera module 20 further includes a second heat sink 27, which is disposed on a side of the receiving circuit board 231 away from the photosensitive chip 2322 and is electrically connected to the receiving circuit board 231, and is used to dissipate heat from the receiving circuit board 231. The second heat sink 27 is a sheet structure, and the second heat sink 27 can be made of, but not limited to, a graphite sheet, a thermally conductive adhesive, or other materials with good heat dissipation performance, as long as the heat dissipation performance of the receiving circuit board 231 can be improved, and this application will not go into details. In this way, by providing the second heat sink 27, the heat generated by the receiving circuit board 231 can be conducted away, thereby improving the heat dissipation performance of the structured light camera module 20.

[0071] The second heat sink 27 may be fixed to the bottom of the receiving groove 211 of the housing 21 by means of, but not limited to, embedding or gluing.

[0072] In some embodiments, the structured light camera module 20 further includes an extended circuit board 28 and a connector 29, one end of the extended circuit board 28 is electrically connected to the receiving circuit board 231, and one end of the extended circuit board 28 and the bent circuit board 24 are located on opposite sides of the receiving circuit board 231, and the other end of the extended circuit board 28 is located outside the housing 21 and connected to the connector 29. In this way, by arranging the connector 29 outside the housing 21 and connecting the extended circuit board 28, the connector 29 and the processing chip 26 can operate independently without interference during operation, and the layout of the structured light camera module 20 can be made compact, thereby reducing the size of the structured light camera module 20.

[0073] The extended circuit board 28 is a flexible circuit board. Of course, in other examples of the present application, the extended circuit board 28 can also be implemented as other types of circuit boards such as hard circuit boards, but is not limited to them.

[0074] The above-mentioned electronic device 100 includes a structured light camera module 20. By setting the transmitting body 222 on the transmitting circuit board 221, and setting the receiving body 232 on the receiving circuit board 231 opposite to the transmitting circuit board 221, and electrically connecting the transmitting circuit board 221 and the receiving circuit board 231 respectively through the bending circuit board 24, it is possible to get rid of the position constraint between the transmitting circuit board 221 and the receiving circuit board 231, which is convenient for simplifying the structural design of the structured light camera module 20, and helps to reasonably arrange the positions of the transmitting module 22 and the receiving module 23, so that the layout of the structured light camera module 20 is compact, thereby reducing the size of the structured light camera module 20, which is conducive to the miniaturization of the electronic device 100.

[0075] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the preferred embodiments, a person of ordinary skill in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A structured light camera module, characterized in that: include: case; A transmitting module, arranged in the housing, comprising a transmitting circuit board and a transmitting body, wherein the transmitting circuit board is connected to the housing, the transmitting body is arranged on the transmitting circuit board and electrically connected to the transmitting circuit board, and the transmitting body is used to transmit a light beam; A receiving module, arranged in the housing, comprising a receiving circuit board and a receiving body, wherein a portion of the receiving circuit board is arranged opposite to the transmitting circuit board, and another portion of the receiving circuit board extends out of the transmitting circuit board, and the receiving body is arranged at the portion of the receiving circuit board extending out of the transmitting circuit board and is electrically connected to the receiving circuit board, and the receiving body is located at one side of the transmitting module and is used to receive the reflected light beam; A bending circuit board, one end of the bending circuit board is electrically connected to the transmitting circuit board, and the other end of the bending circuit board is electrically connected to the receiving circuit board.

2. The structured light camera module according to claim 1, wherein: The shell is provided with a receiving groove, the transmitting circuit board and the transmitting body are both arranged in the receiving groove, and the transmitting circuit board is arranged at the groove bottom of the receiving groove.

3. The structured light camera module according to claim 2, characterized in that: The structured light camera module further includes a first heat sink, which is disposed on a side of the transmitting circuit board close to the bottom of the accommodating groove and is used to dissipate heat for the transmitting circuit board.

4. The structured light camera module according to claim 2, wherein: The structured light camera module also includes a processing chip, which is disposed on the receiving circuit board and electrically connected to the receiving body, and is used to receive and process the optical signal sent by the receiving body to obtain a depth image.

5. The structured light camera module according to claim 4, characterized in that: The shell is also provided with a receiving groove and a receiving cavity connected to the receiving groove, the receiving groove and the receiving groove are arranged on opposite sides of the shell, the receiving circuit board is arranged at the bottom of the receiving groove, the receiving cavity is arranged between the receiving groove and the receiving groove, the receiving cavity includes a first chamber and a second chamber connected, the processing chip is located in the first chamber, and the receiving body is located in the second chamber.

6. The structured light camera module according to claim 5, characterized in that: The receiving body includes a lens seat, a photosensitive chip and an optical lens. The lens seat is arranged on the receiving circuit board. The photosensitive chip is arranged on the receiving circuit board and is electrically connected to the receiving circuit board. The photosensitive chip is located in the lens seat. The optical lens is arranged in the lens seat and is located on the photosensitive path of the photosensitive chip.

7. The structured light camera module according to claim 6, wherein: The optical lens is rotatably connected to the lens holder via threads.

8. The structured light camera module according to claim 6, wherein: The structured light camera module also includes a second heat sink, which is disposed on a side of the receiving circuit board away from the photosensitive chip and is electrically connected to the receiving circuit board for dissipating heat from the receiving circuit board.

9. The structured light camera module according to claim 1, wherein: The structured light camera module also includes an extended circuit board and a connector, one end of the extended circuit board is electrically connected to the receiving circuit board, and one end of the extended circuit board and the bent circuit board are located on opposite sides of the receiving circuit board, and the other end of the extended circuit board is located outside the shell and connected to the connector.

10. An electronic device, characterized in that: It comprises a main body and a structured light camera module as described in any one of claims 1 to 9, wherein the structured light camera module is arranged in the main body.

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