Rolled multilayer flexible substrate

Abstract

The utility model discloses a coiled multilayer flexible substrate, which comprises a first insulating substrate, a first conducting layer, a second insulating substrate and a second conducting layer, the first insulating substrate is attached to the second insulating substrate, and the edges of the first insulating substrate and the second insulating substrate protrude out of the edges of the first conducting layer and the second conducting layer; a swallow-tail-shaped clamping groove is formed in the first insulating substrate, and a swallow-tail-shaped clamping block is arranged on the second insulating substrate; the first insulating substrate is provided with at least two clamping holes, and the second insulating substrate is provided with a buckling convex column; and when the adjacent flexible substrates are spliced, the dovetail-shaped clamping blocks are clamped into the dovetail-shaped clamping grooves, and the buckle convex columns are clamped into the clamping holes for positioning. According to the utility model, the structure is reasonable, adjacent flexible substrates can be quickly spliced, the coiling operation can be realized, the technical defect that the coiling operation can not be effectively carried out on the flexible circuit board in the prior art is solved, the packaging cost and the transportation cost can be reduced, the applicability is strong, and the practicability is good.

Description

Technical Field

[0001] The utility model belongs to the technical field of flexible circuit boards, and in particular relates to a rolled multi-layer flexible substrate. Background Art

[0002] A double-sided flexible circuit board is a common printed circuit made of a flexible insulating substrate. It can be bent, wound or folded freely, and can meet the needs of miniaturization and mobility of electronic products. For example, Chinese patent CN202020517561.X discloses a double-sided flexible circuit board. Although it can meet the general usage requirements, in actual application, since the double-sided flexible circuit board can generally only be processed into a sheet structure with a length of 1m or 0.5m, although it can also be bent, wound or folded, it cannot be effectively rolled up during processing. Each double-sided flexible circuit board can only be rolled up separately, which is not conducive to subsequent use and transportation operations. Since the multi-layer flexible circuit board is thicker and the length of a single multi-layer flexible circuit board is limited, it is impossible to splice multiple flexible circuit boards into rolls for processing, which will greatly increase the packaging and transportation costs, so its applicability and practicality are limited. Summary of the invention

[0003] The utility model aims to provide a rolled multi-layer flexible substrate, aiming to solve the technical defect that the flexible circuit board in the prior art cannot be effectively rolled.

[0004] The technical solution to achieve the purpose of the utility model is a rolled multi-layer flexible substrate, comprising a first insulating substrate, a first conductive layer, a second insulating substrate and a second conductive layer, wherein the first insulating substrate and the second insulating substrate are laminated, and the first conductive layer and the second conductive layer are respectively arranged on the first insulating substrate and the second insulating substrate, and the edges of the first insulating substrate and the second insulating substrate protrude from the edges of the first conductive layer and the second conductive layer;

[0005] The first insulating substrate is provided with a dovetail-shaped slot, and the second insulating substrate is provided with a dovetail-shaped block;

[0006] The first insulating substrate is provided with at least two clamping holes, and the second insulating substrate is provided with a clamping protrusion;

[0007] When adjacent flexible substrates are spliced, the dovetail-shaped card block is inserted into the dovetail-shaped card slot, and the buckle protrusion is inserted into the card hole for positioning.

[0008] It is further preferred that: an aluminum film layer is provided between the first insulating substrate and the second insulating substrate;

[0009] The first insulating substrate and the second insulating substrate are symmetrically arranged on both sides of the aluminum film layer through the adhesive layer;

[0010] The card hole passes through the aluminum film layer.

[0011] It is further preferred that: a convex point is integrally formed at the end of the buckle convex column;

[0012] The diameter of the buckle boss matches the diameter of the clamping hole, and the diameter of the convex point is slightly larger than the diameter of the clamping hole.

[0013] More preferably, the first insulating substrate and the second insulating substrate have the same thickness.

[0014] It is further preferred that: the clamping hole is located on the symmetrical edge of the dovetail-shaped clamping groove.

[0015] Further preferably, a buffer avoidance groove is provided on the buckle boss.

[0016] It is further preferred that the total thickness of the first insulating substrate, the first conductive layer, the second insulating substrate, the aluminum film layer and the second conductive layer is 10-20 mm.

[0017] The utility model has positive effects: the structure of the utility model is reasonably arranged, the edges of the first insulating substrate and the second insulating substrate protrude from the edges of the first conductive layer and the second conductive layer, and a dovetail-shaped card slot is provided on the first insulating substrate, and a dovetail-shaped card block is provided on the second insulating substrate, so that adjacent flexible substrates can be quickly spliced, which is conducive to realizing rolling operation, solves the technical deficiency of the flexible circuit board in the prior art that cannot be effectively rolled, is conducive to reducing packaging costs and transportation costs, and has strong applicability and good practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to make the content of the utility model easier to understand, the utility model is further described in detail below according to specific embodiments and in conjunction with the accompanying drawings, wherein:

[0019] Figure 1 It is a schematic diagram of the structure of the utility model;

[0020] Figure 2 This is another perspective structural diagram of the utility model;

[0021] Figure 3 It is a schematic diagram of the structure during splicing in the utility model.

[0022] Figure numerals: first insulating substrate 1, first conductive layer 2, second insulating substrate 3, second conductive layer 4, dovetail-shaped card slot 5, dovetail-shaped card block 6, card hole 7, snap-on protrusion 8, aluminum film layer 9, protrusion 10, buffer avoidance groove 11. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] Example

[0025] See Figures 1 to 3 As shown, a rolled multi-layer flexible substrate includes a first insulating substrate 1, a first conductive layer 2, a second insulating substrate 3 and a second conductive layer 4. The first insulating substrate and the second insulating substrate are bonded, and the first conductive layer and the second conductive layer are respectively arranged on the first insulating substrate and the second insulating substrate, and the edges of the first insulating substrate and the second insulating substrate protrude from the edges of the first conductive layer and the second conductive layer; in this embodiment, the first insulating substrate and the second insulating substrate have the same thickness. With the above structure, the joint does not affect the normal processing of the first conductive layer and the second conductive layer.

[0026] The first insulating substrate is provided with a dovetail-shaped card slot 5, and the second insulating substrate is provided with a dovetail-shaped card block 6; in this embodiment, the dovetail-shaped card slot and the dovetail-shaped card block are matched in size;

[0027] At the same time, in order to ensure the stability after splicing, at least two clamping holes 7 are provided on the first insulating substrate, and a clamping protrusion 8 is provided on the second insulating substrate; and the clamping holes are located on the symmetrical edges of the dovetail-shaped clamping groove. Therefore, the stability and reliability of the splicing can be ensured by the clamping holes and the dovetail-shaped clamping groove, and loosening or falling off during rolling can be avoided. During operation, when adjacent flexible substrates are spliced, the dovetail-shaped clamping block is clamped into the dovetail-shaped clamping groove, and the clamping protrusion is clamped into the clamping hole for positioning.

[0028] In order to improve the overall heat dissipation performance, an aluminum film layer 9 is arranged between the first insulating substrate and the second insulating substrate; the first insulating substrate and the second insulating substrate are symmetrically arranged on both sides of the aluminum film layer through a glue layer; the clamping hole passes through the aluminum film layer. The aluminum film layer is not only conducive to improving the heat dissipation performance, but also can improve the stability and reliability of the connection between the clamping hole and the buckle boss. The total thickness of the first insulating substrate, the first conductive layer, the second insulating substrate, the aluminum film layer and the second conductive layer is 10-20mm. Therefore, although there may be a step bulge at the joint of adjacent flexible substrates when splicing, it does not affect the normal rolling operation.

[0029] The end of the buckle boss is integrally formed with a convex point 10; the diameter of the buckle boss matches the diameter of the clamping hole, and the diameter of the convex point is slightly larger than the diameter of the clamping hole. The buckle boss is provided with a buffer avoidance groove 11. The convex point cooperates with the buffer avoidance groove to achieve the stability of the buckle, prevent loosening or falling off, and also improve the convenience of buckle operation.

[0030] The utility model has positive effects: the structure of the utility model is reasonably arranged, the edges of the first insulating substrate and the second insulating substrate protrude from the edges of the first conductive layer and the second conductive layer, and a dovetail-shaped card slot is provided on the first insulating substrate, and a dovetail-shaped card block is provided on the second insulating substrate, so that adjacent flexible substrates can be quickly spliced, which is conducive to realizing rolling operation, solves the technical deficiency of the flexible circuit board in the prior art that cannot be effectively rolled, is conducive to reducing packaging costs and transportation costs, and has strong applicability and good practicality.

[0031] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification can also be directly processed according to existing technical common sense. At the same time, the connection method of each component adopts the mature conventional means in the prior art, and the machinery, parts and equipment all adopt the conventional models in the prior art, so no specific description will be given here.

[0032] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still belong to the protection scope of the present invention.

Claims

1. A rolled multi-layer flexible substrate, comprising a first insulating substrate, a first conductive layer, a second insulating substrate and a second conductive layer, wherein the first insulating substrate and the second insulating substrate are laminated, and the first conductive layer and the second conductive layer are respectively arranged on the first insulating substrate and the second insulating substrate, characterized in that: The edges of the first insulating substrate and the second insulating substrate protrude from the edges of the first conductive layer and the second conductive layer; The first insulating substrate is provided with a dovetail-shaped slot, and the second insulating substrate is provided with a dovetail-shaped block; The first insulating substrate is provided with at least two clamping holes, and the second insulating substrate is provided with a clamping protrusion; When adjacent flexible substrates are spliced, the dovetail-shaped card block is inserted into the dovetail-shaped card slot, and the buckle protrusion is inserted into the card hole for positioning.

2. The roll-up multi-layer flexible substrate according to claim 1, characterized in that: An aluminum film layer is provided between the first insulating substrate and the second insulating substrate; The first insulating substrate and the second insulating substrate are symmetrically arranged on both sides of the aluminum film layer through the adhesive layer; The card hole passes through the aluminum film layer.

3. The roll-up multi-layer flexible substrate according to claim 2, characterized in that: The end of the buckle boss is integrally formed with a convex point; The diameter of the buckle boss matches the diameter of the clamping hole, and the diameter of the convex point is slightly larger than the diameter of the clamping hole.

4. The roll-up multi-layer flexible substrate according to claim 3, characterized in that: The first insulating substrate and the second insulating substrate have the same thickness.

5. The roll-up multi-layer flexible substrate according to claim 4, characterized in that: The clamping holes are located on the symmetrical edges of the dovetail-shaped clamping groove.

6. The roll-up multi-layer flexible substrate according to claim 5, characterized in that: The buckle boss is provided with a buffer avoidance groove.

7. The roll-up multi-layer flexible substrate according to claim 6, characterized in that: The total thickness of the first insulating substrate, the first conductive layer, the second insulating substrate, the aluminum film layer and the second conductive layer is 10-20 mm.

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