Die heat dissipation device

Abstract

The utility model relates to a die heat dissipation device which comprises a table top and a circular groove formed in the top of the table top. The mold body is mounted in the circular groove; the spiral pipe is wound on the surface of the mold body; a bottom plate is installed at the bottom of the table top through four supporting columns, when the mold body is cooled, a semiconductor chilling plate is started, the refrigerating face of the semiconductor chilling plate is located in the water tank, the heating face of the semiconductor chilling plate is located outside, cooling treatment is conducted on the interior of the box body, and meanwhile a water pump is started to input cooled water in the water tank into a spiral pipe; the spiral pipe is wound on the surface of the mold body and is attached to the surface of the mold body, so that the mold body is cooled faster, water can be discharged into the water tank from the lower end of the spiral pipe to be cooled again, the distance between the water inlet end and the water drainage end below the spiral pipe is large, and discharged hot water is prevented from affecting the temperature of the water inlet end; and a larger interval can be used for cooling a reserved space for discharged hot water.

Description

Technical Field

[0001] The utility model relates to the technical field of mold cooling equipment, in particular to a mold cooling device. Background Art

[0002] Injection mold is a tool for producing plastic products, and also a tool for giving plastic products a complete structure and precise size. Injection molding refers to injecting heated and melted plastic into a mold cavity by an injection molding machine under high pressure, and obtaining a molded product after cooling and solidification. In the prior art, there is a lack of cooling effect on the mold, or a single air blowing heat dissipation treatment is used for the mold. This method can only reduce the temperature on one side of the mold, but the temperature on the other side remains unchanged, thereby affecting the production efficiency and having a poor cooling effect.

[0003] For example, the authorized patent document with application number CN202322244869.8 discloses a mold positioning device for mold processing, including a positioning plate, two slide grooves are provided on the upper surface of the positioning plate, a slider is slidably connected in the slide groove, the bottom of the slider is fixedly connected to a rack, the rack meshes with a gear, the bottom of the rack is slidably connected to a guide rail, the two ends of the guide rail are fixedly connected to a side plate, the bottom of the side plate is fixedly connected to a base, the top surface of the slider is fixedly connected to a clamping plate, the top surface of the positioning plate is fixedly connected to a connecting plate, and the connecting plate is threadedly connected to an adjusting rod. The utility model can drive the positioning plate and the mold fixed on its upper surface to move in the left and right directions through the coordinated use of the first motor, the transmission rod, the first bevel gear, the second bevel gear and the first screw rod, and the positioning plate and the mold can be moved forward and backward by setting a second motor, a sprocket, a chain, a second screw rod and a third screw rod. The overall structure can move the position of the mold after positioning it for convenient processing.

[0004] The above patents lack cooling effect on the mold, or only use air blowing to dissipate heat on the mold. This method can only reduce the temperature on one side of the mold, but the temperature on the other side remains unchanged, thereby affecting the production efficiency. Therefore, we need to provide a mold cooling device. Utility Model Content

[0005] The utility model aims to provide a mold heat dissipation device, which starts a semiconductor refrigeration plate when cooling the mold body, wherein the cooling surface of the semiconductor refrigeration plate is located in a water tank and the heating surface is located outside, so as to realize cooling treatment in the box body, and at the same time starts a water pump to input the cooled water in the water tank into a spiral tube, and the spiral tube is wound around the surface of the mold body, wherein the spiral tube is a metal tube and fits with the surface of the mold body, so as to realize faster cooling of the mold body, and water will be discharged from the lower end of the spiral tube into the water tank for cooling treatment again, wherein the water inlet end and the discharge end below the spiral tube are spaced relatively large, so as to avoid the discharged hot water affecting the temperature at the water inlet end, and the larger interval can reserve space for cooling the discharged hot water, thereby solving the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a mold heat dissipation device, comprising:

[0007] A table top, and a circular groove formed on the top of the table top;

[0008] A mold body installed inside the circular groove, and a spiral tube wound around the surface of the mold body;

[0009] The bottom of the table top is provided with a bottom plate through four supporting columns;

[0010] A conveying mechanism arranged on the top of the bottom plate for conveying liquid in the spiral tube;

[0011] The conveying mechanism includes a water tank connected to the lower end of the spiral tube, the other end of the spiral tube extends below the liquid level inside the water tank, and the interior of the spiral tube is connected to a water pump, the water pump is fixedly installed on the top of the water tank through a mounting seat, and a temperature control unit for regulating the temperature of the liquid in the water tank is provided inside the water tank, and a water inlet valve pipe and a drain valve pipe are installed on the surface of the water tank.

[0012] Preferably, the temperature control unit includes a semiconductor refrigeration sheet, a mounting seat and a heating tube, the semiconductor refrigeration sheet is embedded in the top of the water tank, the mounting seat is embedded in the interior of the water tank, and a heating tube is arranged on one side of the mounting seat.

[0013] Preferably, a battery and a controller are installed on the top of the base plate.

[0014] Preferably, a heat dissipation fin is fixedly mounted on the top of the semiconductor refrigeration plate, a fan is mounted on the top of the water tank via a connecting plate, and the fan is configured as an inclined surface.

[0015] Preferably, a supporting ring body is fixedly mounted on the inner wall of the circular groove, and the top of the supporting ring body fits with the bottom of the spiral tube.

[0016] Preferably, a side of the lower end of the spiral tube close to the water pump is connected to a filter valve.

[0017] Preferably, the water tank is configured as an insulation box, and support legs are installed at the four corners of the bottom of the base plate.

[0018] Preferably, a transparent scale bar is embedded in the front of the water tank.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] When the utility model cools the mold body, the semiconductor refrigeration plate is started, wherein the cooling surface of the semiconductor refrigeration plate is located in the water tank, and the heating surface is located outside, so as to realize cooling treatment in the box body, and at the same time, the water pump is started to input the cooled water in the water tank into the spiral tube, and the spiral tube is wound around the surface of the mold body, wherein the spiral tube is a metal tube and fits with the surface of the mold body, so as to realize faster cooling of the mold body, and the water will be discharged from the lower end of the spiral tube into the water tank for cooling treatment again, wherein the water inlet end and the discharge end below the spiral tube are spaced relatively large, so as to prevent the discharged hot water from affecting the temperature at the water inlet end, and the larger interval can reserve space for cooling the discharged hot water. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0022] Figure 2 It is a three-dimensional cross-sectional view of the table top of the utility model;

[0023] Figure 3 It is a three-dimensional diagram of the local structure of the utility model;

[0024] Figure 4 It is a three-dimensional diagram of the temperature control unit of the present utility model.

[0025] In the figure: 1. table; 2. round groove; 3. mold body; 4. spiral tube; 5. bottom plate; 6. support column; 7. conveying mechanism; 71. water tank; 72. water pump; 73. water inlet valve pipe; 74. drain valve pipe; 70. temperature control unit; 701. semiconductor cooling plate; 702. mounting seat; 703. heating tube; 8. battery; 9. controller; 10. heat dissipation fin; 11. fan; 12. support ring; 13. filter valve; 14. transparent scale bar. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] See also Figure 1-4 The utility model provides a technical solution: a mold heat dissipation device, comprising: a table 1, and a circular groove 2 opened on the top of the table 1; a mold body 3 installed inside the circular groove 2, and a spiral tube 4 wound around the surface of the mold body 3; a bottom plate 5 is installed at the bottom of the table 1 through four supporting columns 6; a conveying mechanism 7 arranged on the top of the bottom plate 5 for conveying liquid in the spiral tube 4.

[0028] Among them, the conveying mechanism 7 includes a water tank 71 connected to the lower end of the spiral tube 4, the other end of the spiral tube 4 extends below the liquid level inside the water tank 71, and the interior of the spiral tube 4 is connected to a water pump 72, the water pump 72 is fixedly installed on the top of the water tank 71 through a mounting seat 702, and the interior of the water tank 71 is provided with a temperature control unit 70 for adjusting the temperature of the liquid in the water tank 71, and the surface of the water tank 71 is installed with a water inlet valve pipe 73 and a drain valve pipe 74.

[0029] The temperature control unit 70 includes a semiconductor cooling sheet 701, a mounting seat 702 and a heating tube 703. The semiconductor cooling sheet 701 is embedded in the top of the water tank 71, the mounting seat 702 is embedded in the water tank 71, and a heating tube 703 is arranged on one side of the mounting seat 702.

[0030] In this embodiment, when cooling the mold body 3, the semiconductor refrigeration plate 701 is started, wherein the cooling surface of the semiconductor refrigeration plate 701 is located in the water tank 71, and the heating surface is located outside, so as to realize cooling treatment in the box body, and at the same time, the water pump 72 is started to input the cooled water in the water tank 71 into the spiral tube 4, and the spiral tube 4 is wound around the surface of the mold body 3, wherein the spiral tube 4 is a metal tube and fits with the surface of the mold body 3, so as to realize faster cooling of the mold body 3, and the water will be discharged from the lower end of the spiral tube 4 into the water tank 71 for cooling treatment again, wherein the water inlet end and the drainage end below the spiral tube 4 are spaced relatively large, so as to avoid the discharged hot water affecting the temperature at the water inlet end, and the larger interval can reserve space for cooling the discharged hot water, and at the same time, the heating tube 703 can be started to heat the water tank 71, which is used for the effect of preheating the mold body 3, thereby realizing the dual use of cooling and preheating.

[0031] In order to control and adjust the conveying mechanism 7 , a battery 8 and a controller 9 are provided for use together. The battery 8 and the controller 9 are installed on the top of the base plate 5 .

[0032] A heat dissipation fin plate 10 is fixedly mounted on the top of the semiconductor cooling plate 701, and a fan 11 is mounted on the top of the water tank 71 through a connecting plate. The fan 11 is configured as an inclined surface.

[0033] Specifically, the heat dissipation fin 10 is arranged on the heating surface of the semiconductor refrigeration plate 701 to ensure that the semiconductor refrigeration plate 701 can be in a normal working state. At the same time, the fan 11 is arranged with a certain inclination angle, and the air outlet direction of the fan 11 is toward the heat dissipation fin 10. The heat dissipation fin 10 is made of aluminum. Aluminum has good heat dissipation ability and light weight, and the price is relatively low.

[0034] A support ring 12 is fixedly mounted on the inner wall of the circular groove 2, and the top of the support ring 12 fits with the bottom of the spiral tube 4;

[0035] It is worth noting that the support ring body 12 is disposed in the circular groove 2 , and the support ring body 12 plays a certain auxiliary supporting role for the spiral tube 4 .

[0036] The lower end of the spiral tube 4 near the water pump 72 is connected to a filter valve 13;

[0037] Specifically, the filter valve 13 is used to eliminate impurities in the medium and prevent granular impurities from entering the channel and causing blockage, so as to protect the accessories on the equipment pipeline from wear and blockage.

[0038] The water tank 71 is configured as a heat preservation box, and support legs are installed at the four corners of the bottom of the bottom plate 5;

[0039] Furthermore, the water tank 71 is set as a heat preservation box, so as to have a heat preservation effect on the temperature inside the water tank 71, and also play a role in avoiding external interference.

[0040] In order to facilitate observation of the volume of water in the water tank 71 , a transparent scale bar 14 is embedded in the front of the water tank 71 .

[0041] When the device cools the mold body 3, the semiconductor refrigeration plate 701 is started, wherein the cooling surface of the semiconductor refrigeration plate 701 is located in the water tank 71, and the heating surface is located outside, so as to realize cooling treatment in the box body, and at the same time, the water pump 72 is started to input the cooled water in the water tank 71 into the spiral tube 4, and the spiral tube 4 is wound around the surface of the mold body 3, wherein the spiral tube 4 is a metal tube and fits with the surface of the mold body 3, so as to realize faster cooling of the mold body 3, and the water will be discharged from the lower end of the spiral tube 4 into the water tank 71 for cooling treatment again, wherein the water inlet end and the discharge end below the spiral tube 4 are spaced relatively large, so as to avoid the discharged hot water affecting the temperature at the water inlet end, and the larger interval can reserve space for cooling the discharged hot water, and at the same time, the heating tube 703 can be started to heat the water tank 71, so as to achieve the effect of preheating the mold body 3, so as to realize the dual use of cooling and preheating.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mold heat dissipation device, characterized in that: include: A table top (1), and a circular groove (2) formed on the top of the table top (1); A mold body (3) installed inside the circular groove (2), and a spiral tube (4) wound around the surface of the mold body (3); A bottom plate (5) is mounted on the bottom of the table top (1) via four support columns (6); A conveying mechanism (7) disposed on the top of the bottom plate (5) and used for conveying liquid in the spiral tube (4); The conveying mechanism (7) comprises a water tank (71) connected to the lower end of the spiral tube (4), the other end of the spiral tube (4) extending below the liquid level inside the water tank (71), and the interior of the spiral tube (4) is connected to a water pump (72), the water pump (72) is fixedly mounted on the top of the water tank (71) via a mounting seat (702), and a temperature control unit (70) for regulating the temperature of the liquid in the water tank (71) is arranged inside the water tank (71), and a water inlet valve pipe (73) and a water discharge valve pipe (74) are installed on the surface of the water tank (71).

2. A mold heat dissipation device according to claim 1, characterized in that: The temperature control unit (70) comprises a semiconductor cooling plate (701), a mounting seat (702) and a heating tube (703); the semiconductor cooling plate (701) is embedded in the top of the water tank (71); the mounting seat (702) is embedded in the interior of the water tank (71); and a heating tube (703) is provided on one side of the mounting seat (702).

3. A mold heat dissipation device according to claim 2, characterized in that: A storage battery (8) and a controller (9) are installed on the top of the base plate (5).

4. A mold heat dissipation device according to claim 2, characterized in that: A heat dissipation fin plate (10) is fixedly mounted on the top of the semiconductor refrigeration plate (701), and a fan (11) is mounted on the top of the water tank (71) via a connecting plate, wherein the fan (11) is arranged in an inclined plane.

5. A mold heat dissipation device according to claim 1, characterized in that: A supporting ring body (12) is fixedly mounted on the inner wall of the circular groove (2), and the top of the supporting ring body (12) fits with the bottom of the spiral tube (4).

6. A mold heat dissipation device according to claim 1, characterized in that: A side of the lower end of the spiral tube (4) close to the water pump (72) is connected to a filter valve (13).

7. A mold heat dissipation device according to claim 1, characterized in that: The water tank (71) is configured as a heat preservation box, and support legs are installed at the four corners of the bottom of the bottom plate (5).

8. A mold heat dissipation device according to claim 1, characterized in that: A transparent scale bar (14) is embedded in the front of the water tank (71).

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