Semiconductor precision machining die with precise positioning

Abstract

The utility model relates to the field of machining dies, in particular to a semiconductor precision machining die accurate in positioning. Comprising a base, a machining device is installed on the upper surface of the base, a protection structure is arranged on the surface of the base and comprises a connecting frame, the connecting frame is fixedly connected with the base, a protection shell is slidably connected to the inner wall of the connecting frame, and clamping grooves are formed in the two sides of the protection shell correspondingly; notches are formed in the two sides of the inner wall of the connecting frame, clamping blocks are connected to the inner walls of the notches in a sliding mode, springs are arranged in the notches, the two ends of the springs are fixedly connected with the notches and the clamping blocks respectively, the clamping blocks are connected with the clamping grooves in a clamped mode, anti-skid pads are fixedly connected to the inner wall of the connecting frame, and the anti-skid pads are rubber pads. The semiconductor precision machining die capable of achieving accurate positioning has the advantages that the protective shell can be conveniently installed, and then a machining device is protected.

Description

Technical Field

[0001] The utility model relates to the field of processing molds, in particular to a semiconductor precision processing mold with accurate positioning. Background Art

[0002] The processing mold is composed of a base and a processing device. It is a device used to process semiconductor precision parts and is more common in daily life.

[0003] Prior art includes a utility model with publication number CN219294186U, which discloses a semiconductor precision processing mold with precise positioning. The patent adopts a base, and the upper end surface of the base is movably connected to a lower mold. The upper end surface of the lower mold is provided with a mold chamber, and the bottom end of the mold chamber is fixedly connected to a plurality of anti-wear air cushions, which solves the problem that the current semiconductor precision processing mold with precise positioning is prone to serious wear of the bottom end of the internal lower mold during long-term operation during processing, and the maintenance cost is high. When the processing mold is pressed down for processing, the impact force of the pressure plate is likely to cause damage to the semiconductor, which reduces the processing efficiency to a certain extent. During the operation of the processing mold, if someone touches the processing mold, it is easy to cause injury to the person.

[0004] The inventor discovered in his daily work that in the process of using processing molds, there is a problem that because the processing of semiconductor precision parts requires very precise molds, but because the tip of the mold is relatively fragile, it may be damaged by accidental contact.

[0005] Therefore, it is necessary to provide a new semiconductor precision machining mold with accurate positioning to solve the above technical problems. Utility Model Content

[0006] The utility model aims to solve the shortcoming in the prior art that it is difficult to protect the processing mold, and proposes a semiconductor precision processing mold with accurate positioning.

[0007] In order to solve the above technical problems, the utility model provides a semiconductor precision machining mold with accurate positioning, including: a base, a processing device is installed on the upper surface of the base, a protective structure is provided on the surface of the base, the protective structure includes a connecting frame, the connecting frame is fixedly connected to the base, the inner wall of the connecting frame is slidably connected to a protective shell, both sides of the protective shell are provided with card grooves, both sides of the inner wall of the connecting frame are provided with notches, the inner wall of the notch is slidably connected to a card block, a spring is provided inside the notch, the two ends of the spring are fixedly connected to the notch and the card block respectively, and the card block is card-connected to the card groove.

[0008] The effect achieved by the above components is: when the protective shell needs to be installed for protection, pull the protective shell to move, then align the protective shell with the connecting frame, then insert the connecting shell into the connecting frame, then the connecting shell squeezes the card block, and then the card block slides on the inner wall of the slot, the card block squeezes the spring, and then after moving to the appropriate position, the spring resets and drives the card block to be stuck into the card slot for fixation.

[0009] Preferably, an anti-skid pad is fixedly connected to the inner wall of the connecting frame, and the anti-skid pad is a rubber pad.

[0010] The effects achieved by the above components are: the anti-slip pad can increase the friction between the connection frame and the protective shell, and can make the connection between the connection frame and the protective shell more stable.

[0011] Preferably, a limiting rod is fixedly connected inside the notch, the limiting rod is slidably connected to the clamping block, and the spring is sleeved on the arc surface of the limiting rod.

[0012] The effect achieved by the above components is that the limiting rod can limit the spring, thereby preventing the spring from being deformed after long-term use, thereby increasing the service life of the spring.

[0013] Preferably, handles are fixedly connected to both sides of the protective shell, and the cross-section of the handles is "U"-shaped.

[0014] The effect achieved by the above components is that when the protective shell needs to be moved, the handle can be directly pulled, and the handle drives the protective shell to move, and the handle can make it more convenient to move the protective shell.

[0015] Preferably, a connecting structure is provided on one side of the base, and the connecting structure includes a plurality of slide grooves, and the plurality of slide grooves are provided on the base. The inner wall of the slide groove is slidably connected with a connecting rod, and the inner wall of the slide groove is provided with two connecting grooves. The arc surface of the connecting rod is fixedly connected with two elastic blocks, and one end of the connecting rod away from the slide groove is fixedly connected with a fixing plate, and the other side of the fixing plate is also fixedly connected with a connecting rod.

[0016] The effect achieved by the above components is: when the two bases need to be connected for use, pull the fixed plate to drive the connecting rod to move, then align the connecting rod with the slide groove, and then insert the connecting rod into the slide groove. The slide groove squeezes and contracts the elastic block. After moving to the appropriate position, the elastic block is snapped into the connecting groove for connection and fixation, and then the two bases are connected.

[0017] Preferably, an auxiliary pad is fixedly connected to the interior of the connecting groove, and the auxiliary pad is a rubber pad.

[0018] The effect achieved by the above components is that the auxiliary pad can increase the friction between the elastic block and the connecting groove, thereby preventing the elastic block from loosening when connected to the connecting groove.

[0019] Preferably, a sliding rod is fixedly connected to the interior of the sliding groove, and the sliding rod is slidably connected to the connecting rod.

[0020] The effect achieved by the above components is that the limiting rod can limit the connecting rod to prevent the limiting rod from deviating when sliding on the inner wall of the sliding groove.

[0021] Compared with the related art, the semiconductor precision machining mold with accurate positioning provided by the utility model has the following beneficial effects:

[0022] The utility model provides a semiconductor precision processing mold with accurate positioning. When a protective shell needs to be installed for protection, the handle is pulled to drive the protective shell to move, and then the protective shell is aligned with the connecting frame, and then the connecting shell is inserted into the connecting frame, and then the connecting shell squeezes the card block, and then the card block slides on the inner wall of the groove, and the card block squeezes the spring, and then after moving to a suitable position, the spring is reset to drive the card block to be clamped into the card slot for fixation, the limit rod can limit the spring to avoid deformation of the spring after long-term use, and improve the service life of the spring, the anti-skid pad can increase the friction between the connecting frame and the protective shell, and can make the connection between the connecting frame and the protective shell more stable, and by setting the protective structure, it is achieved that the protective shell can be easily installed, and then the processing device is protected.

[0023] When the two bases need to be connected for use, pull the fixing plate to drive the connecting rod to move, then align the connecting rod with the slide slot, and then insert the connecting rod into the slide slot. The slide slot squeezes and contracts the elastic block. After moving to the appropriate position, the elastic block is snapped into the connecting slot for connection and fixation, and then the two bases are connected. The auxiliary pad can increase the friction between the elastic block and the connecting slot to avoid looseness when the elastic block is connected to the connecting slot. The limit rod can limit the connecting rod. By setting the connecting structure, the effect of conveniently connecting the two bases is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the structure of a semiconductor precision machining mold with accurate positioning provided by the utility model;

[0025] Figure 2 for Figure 1 The schematic diagram of the protection structure shown;

[0026] Figure 3 for Figure 2 The internal structure diagram shown;

[0027] Figure 4 for Figure 1 The connection structure diagram is shown.

[0028] Numbers in the figure: 1. base; 2. processing device; 3. protective structure; 31. protective shell; 32. handle; 33. connecting frame; 34. anti-slip pad; 35. notch; 36. spring; 37. limit rod; 38. slot; 39. block; 4. connecting structure; 41. fixing plate; 42. connecting rod; 43. elastic block; 44. sliding rod; 45. auxiliary pad; 46. connecting groove; 47. sliding groove. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0030] The specific implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0031] See also Figures 1 to 4 The embodiment of the utility model provides a semiconductor precision processing mold with accurate positioning, including: a base 1, a processing device 2 is installed on the upper surface of the base 1, a protective structure 3 is provided on the surface of the base 1, and a connecting structure 4 is opened on one side of the base 1.

[0032] In the embodiments of the present invention, please refer to Figure 1 and Figure 2The protective structure 3 includes a connecting frame 33, which is fixedly connected to the base 1. The inner wall of the connecting frame 33 is slidably connected to the protective shell 31. Both sides of the protective shell 31 are provided with card slots 38. Both sides of the inner wall of the connecting frame 33 are provided with slots 35. The inner wall of the slot 35 is slidably connected to a card block 39. A spring 36 is arranged inside the slot 35. Both ends of the spring 36 are fixedly connected to the slot 35 and the card block 39 respectively, and the card block 39 is carded with the slot 38. When the protective shell 31 needs to be installed for protection, the protective shell 31 is pulled to move, and then the protective shell 31 is aligned with the connecting frame 33, and then the connecting shell is inserted into the connecting frame 33, and then the connecting shell squeezes the block 39, and then the block 39 slides on the inner wall of the notch 35, and the block 39 squeezes the spring 36, and then after moving to the appropriate position, the spring 36 resets and drives the block 39 to be clamped into the slot 38 for fixing, and the inner wall of the connecting frame 33 is fixedly connected with an anti-skid pad 34, and the anti-skid pad 34 is a rubber pad. The anti-skid pad 34 can increase the friction between the connecting frame 33 and the protective shell 31, and can make the connection between the connecting frame 33 and the protective shell 31 more stable, and the inner part of the notch 35 is fixedly connected with a limit rod 37, and the limit rod 37 is slidably connected with the block 39, and the spring 36 is sleeved on the arc surface of the limit rod 37. The limiting rod 37 can limit the spring 36 to prevent the spring 36 from being deformed after long-term use, thereby increasing the service life of the spring 36. Both sides of the protective shell 31 are fixedly connected with handles 32, and the cross section of the handle 32 is "U"-shaped. When the protective shell 31 needs to be moved, the handle 32 can be directly pulled, and the handle 32 drives the protective shell 31 to move. The handle 32 makes it more convenient to move the protective shell 31;

[0033] In the embodiments of the present invention, please refer to Figure 1 and Figure 4The connection structure 4 includes a plurality of slide grooves 47, which are provided on the base 1. The inner wall of the slide groove 47 is slidably connected with a connecting rod 42, and the inner wall of the slide groove 47 is provided with two connecting grooves 46. The arc surface of the connecting rod 42 is fixedly connected with two elastic blocks 43. The end of the connecting rod 42 away from the slide groove 47 is fixedly connected with a fixing plate 41, and the other side of the fixing plate 41 is also fixedly connected with a connecting rod 42. When the two bases 1 need to be connected for use, the fixing plate 41 is pulled to drive the connecting rod 42 to move, and then the connecting rod 42 is aligned with the slide groove 47, and then the connecting rod 42 is inserted into the slide groove 47. The slide groove 47 squeezes and contracts the elastic block 43. After moving to a suitable position, the elastic block 43 is inserted into the connecting groove 46 for connection and fixing, and then the two bases 1 are connected. The interior of the connecting groove 46 is fixedly connected with an auxiliary pad 45, and the auxiliary pad 45 is a rubber pad. The auxiliary pad 45 can increase the friction between the elastic block 43 and the connecting groove 46 to prevent the elastic block 43 from loosening when connected to the connecting groove 46. The interior of the sliding groove 47 is fixedly connected with a sliding rod 44, and the sliding rod 44 is slidably connected to the connecting rod 42. The sliding rod 44 can limit the connecting rod 42 to prevent the sliding rod 44 from deviating when sliding on the inner wall of the sliding groove 47;

[0034] The working principle of a semiconductor precision machining mold with precise positioning provided by the utility model is as follows: the utility model provides a semiconductor precision machining mold with precise positioning. When the protective shell 31 needs to be installed for protection, the handle 32 is pulled to drive the protective shell 31 to move, and then the protective shell 31 is aligned with the connecting frame 33, and then the connecting shell is inserted into the connecting frame 33, and then the connecting shell squeezes the block 39, and then the block 39 slides on the inner wall of the slot 35, and the block 39 squeezes the spring 36, and then after moving to the appropriate position, the spring 36 is reset to drive the block 39 to be clamped into the slot 38 for fixing, the limiting rod 37 can limit the spring 36 to prevent the spring 36 from deforming after long-term use, thereby increasing the service life of the spring 36, the anti-slip pad 34 can increase the friction between the connecting frame 33 and the protective shell 31, and can make the connection between the connecting frame 33 and the protective shell 31 more stable, and by setting the protective structure 3, the protective shell 31 can be easily installed, thereby protecting the processing device 2.

[0035] When the two bases 1 need to be connected for use, pull the fixing plate 41 to drive the connecting rod 42 to move, then align the connecting rod 42 with the slide groove 47, and then insert the connecting rod 42 into the slide groove 47. The slide groove 47 squeezes and contracts the elastic block 43. After moving to the appropriate position, the elastic block 43 is snapped into the connecting groove 46 for connection and fixation, and then the two bases 1 are connected. The auxiliary pad 45 can increase the friction between the elastic block 43 and the connecting groove 46 to avoid looseness when the elastic block 43 is connected to the connecting groove 46. The limiting rod 37 can limit the connecting rod 42. By setting the connecting structure 4, the effect of conveniently connecting the two bases 1 is achieved.

[0036] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0037] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A semiconductor precision machining mold with accurate positioning, characterized in that: include: A base (1), wherein a processing device (2) is installed on the upper surface of the base (1), a protective structure (3) is provided on the surface of the base (1), and the protective structure (3) comprises a connecting frame (33), wherein the connecting frame (33) is fixedly connected to the base (1), the inner wall of the connecting frame (33) is slidably connected to a protective shell (31), both sides of the protective shell (31) are provided with a card slot (38), both sides of the inner wall of the connecting frame (33) are provided with a notch (35), the inner wall of the notch (35) is slidably connected to a card block (39), a spring (36) is provided inside the notch (35), the two ends of the spring (36) are respectively fixedly connected to the notch (35) and the card block (39), and the card block (39) is card-engaged with the card slot (38).

2. A semiconductor precision machining mold with accurate positioning according to claim 1, characterized in that: An anti-skid pad (34) is fixedly connected to the inner wall of the connection frame (33), and the anti-skid pad (34) is a rubber pad.

3. The semiconductor precision machining mold with accurate positioning according to claim 1, characterized in that: A limiting rod (37) is fixedly connected inside the notch (35), the limiting rod (37) is slidably connected to a clamping block (39), and the spring (36) is sleeved on the arc surface of the limiting rod (37).

4. The semiconductor precision machining mold with accurate positioning according to claim 1, characterized in that: Handles (32) are fixedly connected to both sides of the protective shell (31), and the cross-section of the handles (32) is U-shaped.

5. The semiconductor precision machining mold with accurate positioning according to claim 1, characterized in that: A connecting structure (4) is provided on one side of the base (1), and the connecting structure (4) includes a plurality of slide grooves (47). The plurality of slide grooves (47) are provided on the base (1), and the inner wall of the slide groove (47) is slidably connected to a connecting rod (42). The inner wall of the slide groove (47) is provided with two connecting grooves (46), and the arc surface of the connecting rod (42) is fixedly connected to two elastic blocks (43). One end of the connecting rod (42) away from the slide groove (47) is fixedly connected to a fixing plate (41), and the other side of the fixing plate (41) is also fixedly connected to a connecting rod (42).

6. The semiconductor precision machining mold with accurate positioning according to claim 5, characterized in that: An auxiliary pad (45) is fixedly connected inside the connection groove (46), and the auxiliary pad (45) is a rubber pad.

7. The semiconductor precision machining mold with accurate positioning according to claim 5, characterized in that: A sliding rod (44) is fixedly connected inside the sliding groove (47), and the sliding rod (44) is slidably connected to the connecting rod (42).

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