Liquid cooling heat dissipation device

Abstract

A liquid cooling heat dissipation device comprises a liquid storage tank, a branch pipe seat, at least one first liquid cooling head, at least one second liquid cooling head and a liquid cooling row. The liquid storage tank is provided with a supply pipe and a return pipe; the branch pipe seat is provided with a flow dividing cavity and a flow converging cavity, the supply pipe of the liquid storage tank is communicated to the flow dividing cavity, the flow dividing cavity is provided with a plurality of flow dividing joints, and the flow converging cavity is provided with a plurality of flow converging joints; each first liquid cooling head is provided with a first input pipe communicated with any shunting joint and a first output pipe communicated with any converging joint; each second liquid cooling head is provided with a second input pipe communicated with any shunting joint and a second output pipe communicated with any converging joint; the liquid cooling row is provided with a recovery pipe and a return pipe, the recovery pipe is communicated with the confluence cavity of the branch pipe seat, and the return pipe is communicated with the return pipe of the liquid storage tank; wherein the first liquid cooling head and the second liquid cooling head are both located on one surface of the mainboard, and the liquid cooling row is located on the other surface of the mainboard.

Description

Technical Field

[0001] The utility model relates to a heat dissipation system, in particular to a liquid cooling heat dissipation device which can be applied to the inside of a computer host. Background Art

[0002] Existing liquid cooling or water cooling devices used in desktop computers mainly use a water pump to pump the coolant in the water tank into each water cooling head, and then the plurality of water cooling heads are attached to each heat source to dissipate heat and cool the heat.

[0003] However, a water-cooled heat dissipation device must be equipped with a water-cooling row, through which the cooling liquid with heat is cooled and cooled, so that the cooling liquid can be reused and recycled. However, in existing water-cooled heat dissipation devices, due to the limited space inside the computer case, the water-cooling row is often also arranged near each water cooling head. Therefore, the heat generated by the heat source is easily transmitted through the heat convection effect in the air, so as to affect the temperature of the cooling liquid in the water-cooling row, and thus the low temperature of the cooling liquid cannot be effectively reduced, and the effect of water-cooling heat dissipation is not ideal. Utility Model Content

[0004] The main purpose of the utility model is to provide a liquid cooling device, which can separate the liquid cooling head for cooling the heat source and the liquid cooling radiator for cooling the coolant through the configuration of the motherboard in the computer case, so as to reduce the influence of the liquid cooling radiator on the temperature rise.

[0005] In order to achieve the above-mentioned purpose, the utility model provides a liquid cooling device for cooling a heat source on a motherboard, comprising a liquid storage tank, a branch pipe seat, at least one first liquid cooling head, at least one second liquid cooling head, and a liquid cooling row; the liquid storage tank has at least one water pump, and is provided with a supply pipe and a return pipe; the branch pipe seat has a shunt cavity and a confluence cavity, and the supply pipe of the liquid storage tank is connected to the shunt cavity, the shunt cavity is provided with a plurality of shunt joints, and the confluence cavity is provided with a plurality of confluence joints; each first liquid cooling head Each of the liquid cooling heads has a first input tube connected to any flow branch joint, and a first output tube connected to any flow confluence joint; each second liquid cooling head has a second input tube connected to any flow branch joint, and a second output tube connected to any flow confluence joint; the liquid cooling radiator has a recovery tube and a return tube, the recovery tube is connected to the confluence cavity of the branch pipe seat, and the return tube is connected to the return tube of the liquid storage tank; wherein the first and second liquid cooling heads are both located on one surface of the motherboard, and the liquid cooling radiator is located on the other surface of the motherboard.

[0006] Further preferably, the liquid storage tank is provided with a viewing window.

[0007] Further preferably, the diversion chamber and the confluence chamber are arranged side by side in the branch pipe seat.

[0008] Further preferably, the diverter joint and the converging joint are both quick connectors.

[0009] Further preferably, there are plural first liquid cooling heads, and a first connecting pipe is provided between each of the first liquid cooling heads for communication.

[0010] Further preferably, the second liquid cooling head has a heat receiving portion, and the heat receiving portion is in a protrusion shape.

[0011] Further preferably, the periphery of the heat receiving portion has a concave-convex surface.

[0012] Further preferably, the second liquid cooling head is additionally provided with a clamping plate.

[0013] Further preferably, a calculator is connected in series to the recovery pipe.

[0014] Further preferably, the calculator is a flow meter or a thermometer, or a calculator having both flow and temperature functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The following will explain the preferred implementation mode in a clear and understandable manner with reference to the accompanying drawings, and further illustrate the above-mentioned characteristics, technical features, advantages and implementation methods of a liquid cooling heat dissipation device.

[0016] Figure 1 It is a three-dimensional appearance diagram of the utility model.

[0017] Figure 2 It is a top view schematic diagram of the utility model applied to a mainboard.

[0018] Figure 3 It is a side view schematic diagram of the utility model applied to a mainboard.

[0019] Figure 4 It is a three-dimensional exploded view of the second liquid cooling head of the utility model.

[0020] Description of Figure Numbers:

[0021] 1: motherboard, 1a: motherboard, 10: first surface, 10a: heat source, 10b: heat source, 11: second surface, 2: liquid storage tank, 20: water pump, 200: supply pipe, 201: return pipe, 21: viewing window, 3: branch pipe seat, 30: shunt chamber, 300: shunt joint, 301: confluence joint; 31: confluence chamber; 4: first liquid cooling head; 40: first input pipe; 41: first output pipe; 42: first connecting pipe; 5: second liquid cooling head; 500: heat receiving part; 50: second input pipe; 51: second output pipe; 52: splint; 6: liquid cooling radiator; 60: recovery pipe; 600: calculator; 61: return pipe. DETAILED DESCRIPTION

[0022] In the following description, specific details such as specific system structures, technologies, etc. are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0023] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections.

[0024] In order to simplify the drawings, only the parts related to the utility model are schematically shown in each figure, and they do not represent the actual structure of the product. In addition, in order to simplify the drawings and facilitate understanding, in some figures, only one of the parts with the same structure or function is schematically drawn or marked. In this article, "one" not only means "only one", but also means "more than one".

[0025] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0026] In order to further disclose the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only provided for reference and description and are not intended to limit the present invention.

[0027] See also Figure 1 , Figure 2 and Figure 3 , which are respectively a three-dimensional appearance diagram of the utility model, a top view schematic diagram applied to a motherboard, and a side view schematic diagram. The utility model provides a liquid cooling device, which is used to dissipate heat from a heat source on a motherboard 1; it includes a liquid storage tank 2, a branch pipe seat 3, at least one first liquid cooling head 4, at least one second liquid cooling head 5, and a liquid cooling row 6; wherein:

[0028] like Figure 2 As shown, the motherboard 1 has a first surface 10 and a second surface 11, wherein the first surface 10 has at least one heat source 10a (such as a CPU), and other boards 1a (such as a display card) can be inserted on the first surface 10 of the motherboard 1 for coordinated operation.

[0029] The liquid storage tank 2 is filled with cooling liquid and is provided with at least one water pump 20 to drive the cooling liquid filled therein to flow. A viewing window 21 is provided on at least one side surface of the liquid storage tank 2, so that the water level of the cooling liquid inside can be identified by human eyes, so that the cooling liquid can be refilled when it is reduced or insufficient. In addition, the liquid storage tank 2 is also provided with a supply pipe 200 and a return pipe 201. The supply pipe 200 is used to connect to the branch pipe seat 3, and the return pipe 201 is used to connect to the liquid cooling radiator 6.

[0030] Please also refer to Figures 1 to 3 As shown, the branch pipe seat 3 has a diverter chamber 30 and a confluence chamber 31, and the supply pipe 200 of the above-mentioned liquid storage tank 2 is connected to the diverter chamber 30. The diverter chamber 30 and the confluence chamber 31 can be arranged side by side in the branch pipe seat 3, wherein the diverter chamber 30 is connected with a plurality of diverter joints 300 and respectively connects the above-mentioned first liquid cooling head 4 and the second liquid cooling head 5, and the confluence pipe chamber 31 is connected with a plurality of confluence joints 301. The diverter joints 300 and the confluence joints 301 are both quick joints that can be quickly disassembled and assembled, so as to facilitate connection with the pipelines of the first liquid cooling head 4 or the second liquid cooling head 5.

[0031] As described above, the first liquid cooling head 4 can be attached to the heat source 10a such as the CPU of the motherboard 1, and has a first input pipe 40 connected to the flow diversion joint 300, and a first output pipe 41 connected to the flow confluence joint 301, so that the cooling liquid delivered from the liquid storage tank 2 can be provided by the flow diversion chamber 30 of the branch pipe seat 3, thereby helping the heat source 10a to dissipate heat, and the cooling liquid that takes away the heat can be confluenced to the confluence chamber 31 of the branch pipe seat 3 through the first output pipe 41. In addition, when there are multiple first liquid cooling heads 4, a first connecting pipe 42 can be used to connect between the first liquid cooling heads 4, so that the cooling liquid can pass through the first liquid cooling heads 4 in sequence and then converge to the confluence chamber 31 of the branch pipe seat 3.

[0032] Please also refer to Figure 4As shown, the second liquid cooling head 5 can be attached to the heat source 10b on the other board 1a inserted on the first surface 10 of the motherboard 1. The board 1a can be a display card, and its heat source 10b can be a GPU. The second liquid cooling head 5 also has a second input pipe 50 connected to the above-mentioned shunt joint 300, and a second output pipe 51 connected to the above-mentioned confluence joint 301, so that the cooling liquid transported from the liquid storage tank 2 can be provided by the shunt cavity 30 of the branch pipe seat 3, thereby helping the heat source 10b to dissipate heat, and the cooling liquid that takes away the heat is confluenced to the confluence cavity 31 of the branch pipe seat 3 through the second output pipe 51. In addition, the second liquid cooling head 5 also has a heat receiving portion 500 attached to the heat source 10b. The heat receiving portion 500 can be in a protruding shape, and its surroundings can be in a concave-convex surface that can match the electronic components on the board 1a, thereby reducing the required thickness when stacked with the board 1a. Meanwhile, a clamping plate 52 may be further provided to clamp the board 1a between the second liquid cooling head 5 and the clamping plate 52. The second liquid cooling head 5 may be provided in plural numbers depending on the number of other boards 1a inserted on the first surface 10 of the motherboard 1.

[0033] Please see again Figure 2 As shown, the utility model allows the above-mentioned liquid cooling radiator 6 to be arranged at the second surface 11 of the motherboard 1, so as to avoid the heat sources 10a, 10b on the first surface 10 of the motherboard 1 affecting the cooling effect of the liquid cooling radiator 6 on the coolant, and can effectively utilize the space inside the computer case to achieve a better configuration under limited space. The above-mentioned liquid storage tank 2 can be arranged at one side between the first surface 10 and the second surface 11 of the motherboard 1. The liquid cooling radiator 6 has a recovery pipe 60 and a return pipe 61, wherein the recovery pipe 60 is connected to the confluence cavity 31 of the branch pipe seat 3, so that the coolant that takes away the heat can be collected in the confluence cavity 31 of the branch pipe seat 3 after passing through the first output pipe 41 and the second output pipe 51, and after being transported to the liquid cooling radiator 6 by the recovery pipe 60 for cooling, it is connected to the return pipe 201 of the liquid storage tank 2 by the return pipe 61, so that the cooled coolant is circulated to the above-mentioned liquid storage tank 2 for reuse. In addition, a calculator 600 can be connected in series to the recovery pipe 60. The calculator 600 can be a flow meter or a thermometer, or a calculator that has both flow and temperature functions, so as to measure whether the temperature of the coolant is too high or whether the flow is sufficient.

[0034] Therefore, by means of the above-mentioned structure, the liquid cooling heat dissipation device of the present invention can be obtained.

[0035] Therefore, by using the liquid cooling heat dissipation device of the present invention, the first liquid cooling head 4 and the second liquid cooling head 5 can be arranged on the first surface 10 of the motherboard 1 having the heat sources 10a and 10b, and the liquid cooling radiator 6 can be arranged on the second surface 11 opposite to the first surface 10 of the motherboard 1, so that the liquid cooling radiator 6 is separated from the heat sources 10a and 10b on the motherboard 1 under the limited available space, so as to reduce the influence of heat convection in the air on the liquid cooling radiator 6. At the same time, there is no need to extend the pipeline setting due to increasing the distance between the liquid storage tank 2 and the liquid cooling radiator 6, thereby reducing the length of the pipelines and the transmission path between each other, and also reducing the risk of liquid leakage.

[0036] In summary, the above is only the preferred feasible embodiment of the utility model, and it does not limit the patent scope of the utility model. Therefore, all equivalent structural changes made by using the description and drawings of the utility model are also included in the scope of the utility model. In addition, the utility model can of course have other unlisted embodiments. Without departing from the spirit and essence of the utility model, technicians familiar with the field should be able to evolve various corresponding changes and deformations based on the utility model, but these corresponding changes and deformations should all fall within the scope of protection of the patent applied for the utility model.

Claims

1. A liquid cooling device, characterized in that: Used to dissipate heat from a heat source on a motherboard, including: A liquid storage tank having at least one water pump and provided with a supply pipe and a return pipe; A branch pipe seat, having a flow-dividing chamber and a flow-collecting chamber, wherein the supply pipe of the liquid storage tank is connected to the flow-dividing chamber, the flow-dividing chamber is provided with a plurality of flow-dividing joints, and the flow-collecting chamber is provided with a plurality of flow-collecting joints; At least one first liquid cooling head has a first input pipe connected to any of the flow diverter joints, and a first output pipe connected to any of the flow converging joints; At least one second liquid cooling head has a second input pipe connected to any of the flow diverter joints, and a second output pipe connected to any of the flow converging joints; and A liquid cooling row, having a recovery pipe and a return pipe, the recovery pipe is connected to the confluence cavity of the branch pipe seat, and the return pipe is connected to the return pipe of the liquid storage tank; The first and second liquid cooling heads are both located on one surface of the motherboard, and the liquid cooling radiator is located on the other surface of the motherboard.

2. The liquid cooling device according to claim 1, characterized in that: The liquid storage box is provided with a viewing window.

3. The liquid cooling device according to claim 1, characterized in that: The flow-dividing chamber and the flow-collecting chamber are arranged in parallel in the branch pipe seat.

4. The liquid cooling device according to claim 1, characterized in that: The diverter joint and the converging joint are both quick connectors.

5. The liquid cooling device according to claim 1, characterized in that: There are plural first liquid cooling heads, and a first connecting pipe is provided between each of the first liquid cooling heads for connection.

6. The liquid cooling device according to claim 1, characterized in that: The second liquid cooling head has a heat receiving portion, and the heat receiving portion is in a protrusion shape.

7. The liquid cooling device according to claim 6, characterized in that: The heat receiving part has a concavo-convex surface around it.

8. The liquid cooling device according to claim 1, 6 or 7, characterized in that: The second liquid cooling head is additionally provided with a clamping plate.

9. The liquid cooling device according to claim 1, characterized in that: A calculator is serially connected to the recovery pipe.

10. The liquid cooling device according to claim 9, characterized in that: The calculator is a flow meter or a thermometer, or a calculator that measures both flow and temperature.

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