Ultralow-temperature jacket interlayer structure

Abstract

The utility model provides an ultralow temperature jacket interlayer structure, which comprises a pressure cylinder and a cooling cover sleeved on the pressure cylinder, an annular cooling coil pipe is arranged in the cooling cover, and one end of the cooling coil pipe is fixedly connected with a refrigerant inlet pipe. Compared with the prior art, the cooling device has the advantages that when the temperature in the working cylinder rises sharply, the temperature in the working cylinder is detected through the temperature detector, the refrigerating space is formed between the pressure cylinder and the cooling cover, water is added into the refrigerating space from the water outlet pipe in advance, and the cooling effect is improved. The designed controller controls the cooling assembly to suck water in the refrigeration space, refrigerates the internal water and then discharges the refrigerated water to the refrigeration space again, so that the surface of the cylinder body of the pressure cylinder is refrigerated, refrigeration of the pressure cylinder is achieved, and the controller controls the temperature detector to intelligently detect the internal temperature of the cylinder body. And cooling work is intelligently achieved, and the pressure cylinder is kept to work in a low-temperature state.

Description

Technical Field

[0001] The utility model discloses an ultra-low temperature jacket interlayer structure, belonging to the field of cooling jackets. Background Art

[0002] Traditional devices for conducting experiments on ultra-high pressure and low temperature gas pressure all require the use of a working cylinder, such as an ultra-high pressure and low temperature gas pressure experimental device with patent number CN201721561668.9. The patent proposes that in this experimental device, gas as a pressure transmission medium has not yet been used in the field of cold isostatic pressing technology. This is mainly because the gas will release a large amount of heat when it is compressed, causing the temperature in the working cylinder to rise sharply, and it will be impossible to form a high-pressure and low-temperature working environment. Therefore, when using gas as a pressure transmission medium, it is necessary to consider how to cool the gas when it is compressed to an ultra-high pressure state. On the one hand, high pressure must be achieved, and on the other hand, a low temperature state must be maintained.

[0003] The patent records that the temperature and pressure sensors in the pressure cylinder will detect real-time temperature and pressure parameters as input signals of the PLC controller, and feed the input signals back to the central processing unit (CPU), compare them with the preset parameter values, and finally the CPU controls the boost solenoid valve and flow solenoid valve of the diversion hole and the pressure transmission medium, and respectively controls the flow and temperature of the cooling medium and the flow of the pressure transmission medium to achieve a balanced state of high pressure and low temperature in the cylinder. When the working cylinder needs to be cooled quickly, the temperature in the cylinder can be quickly reduced by lowering the temperature of the cooling medium and increasing the flow rate; when the temperature in the cylinder needs to be fine-tuned, the temperature can be fine-tuned by adjusting the temperature of the cooling medium or the flow rate of the cooling medium separately; when the product is processed at ultra-high pressure and low temperature, the online data monitoring and collection functions can be started at the same time, and the experimental process can be observed online through the information processing system and the experimental parameters under different temperatures and pressures can be recorded.

[0004] According to the above patent, only using a single cooling medium to cool the pressure cylinder will result in a long cooling time. Therefore, the present application proposes a jacket interlayer with multiple cooling methods to perform diversified cooling on the working cylinder and speed up the cooling efficiency of the pressure cylinder. Utility Model Content

[0005] In view of the deficiencies in the prior art, the utility model aims to provide an ultra-low temperature jacket insulation structure.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0007] A super-low temperature jacket interlayer structure, a pressure cylinder and a cooling hood sleeved on the pressure cylinder, an annular cooling coil is arranged inside the cooling hood, one end of the cooling coil is fixedly connected to a refrigerant inlet pipe, and the other end of the cooling coil is fixedly connected to a refrigerant outlet pipe, the cooling hood is provided with a water inlet pipe and a water outlet pipe with a control valve, the water outlet pipe is connected to a cooling assembly, a cylinder cover is installed on the top of the pressure cylinder, a temperature detector is arranged on the cylinder cover, the probe of the temperature detector extends into the pressure cylinder, a controller is installed on the top of the cylinder cover through a bracket, and the controller controls the connection between the cooling assembly and the temperature detector.

[0008] Furthermore, a plurality of supporting feet are fixedly provided at the bottom end of the pressure cylinder, and the supporting feet are fixed to the inner bottom end of the cooling cover. Control valves are provided on the refrigerant inlet pipe and the refrigerant outlet pipe.

[0009] Furthermore, the cooling assembly includes a refrigerator connected to the water outlet pipe, the refrigerator is connected to a circulating pump through a pipeline, the circulating pump is provided with a drain pipe connected to the cooling cover, and the circulating pump and the refrigerator are respectively fixed to the outer wall of the cooling cover through a motor frame.

[0010] Furthermore, a through-type through-tube is fixedly provided on the cylinder body of the pressure cylinder, the top of the through-tube is solid, the bottom of the through-tube penetrates the cooling cover, and the bottom is open.

[0011] Furthermore, there are multiple through-tubes in a ring-shaped arrangement; a circular ring is commonly provided on the outer surface of the top of the through-tubes; the interior of the circular ring is hollow; the interior of the circular ring is communicated with the interior of the through-tubes; an air cavity is connected to the circular ring via a docking tube; a fan is installed inside the air cavity; a semiconductor refrigerator is installed below the fan inside the air cavity; a cooling fin is provided at the bottom of the semiconductor refrigerator; a cooling plate is connected to the bottom of the cooling fin; a cooling rod is provided at the bottom of the cooling plate.

[0012] Furthermore, a filter frame is arranged inside the top of the air cavity, and a filter net is arranged inside the filter frame.

[0013] Furthermore, the top of the butt-joint pipe is inserted into the bottom of the air cavity, and a plurality of mounting ears are arranged on the outer surface of the butt-joint pipe, and the mounting ears are fixed to the bottom end surface of the air cavity with screws.

[0014] Furthermore, a T-shaped frustum is installed between the pressure cylinder and the top of the cooling hood, and a secondary mounting ear is provided on the T-shaped frustum. The secondary mounting ear is fixed to the top surface of the cooling hood by mounting fitting screws, and a sealing ring is provided at the bottom of the T-shaped frustum.

[0015] Beneficial effects of the utility model:

[0016] The temperature inside the working cylinder of the present application rises sharply, and the temperature inside the working cylinder is detected by a temperature detector. A refrigeration space is formed between the pressure cylinder and the cooling cover, and water is added to the refrigeration space from the water outlet pipe in advance. The designed controller controls the cooling component to absorb the water inside the refrigeration space and refrigerate the internal water, and then discharges the refrigerated water to the refrigeration space again, thereby cooling the cylinder surface of the pressure cylinder to achieve refrigeration of the pressure cylinder. The controller controls the temperature detector to intelligently detect the internal temperature of the cylinder body, and intelligently realizes cooling work to keep the pressure cylinder working in a low temperature state.

[0017] In actual application, coolant is transported to the interior of the cooling coil through the refrigerant inlet pipe to cool the water in the space formed between the pressure cylinder and the cooling cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a front view of an ultra-low temperature jacket interlayer structure of the utility model;

[0020] Figure 2 This is a schematic diagram of a pressure cylinder with an ultra-low temperature jacket interlayer structure according to the utility model;

[0021] Figure 3 This is a schematic diagram of a cooling cover with an ultra-low temperature jacket interlayer structure according to the utility model;

[0022] Figure 4 This is a schematic diagram of a cooling coil with an ultra-low temperature jacket interlayer structure according to the utility model;

[0023] Figure 5 The utility model is a schematic diagram of the interior of an air cavity of an ultra-low temperature jacket interlayer structure.

[0024] In the figure: 1. pressure cylinder; 2. cooling cover; 3. cooling coil; 4. refrigerant inlet pipe; 5. refrigerant outlet pipe; 6. water inlet pipe; 7. water outlet pipe; 8. refrigerator; 9. circulation pump; 10. drain pipe; 11. cylinder head; 12. temperature detector; 13. controller; 14. through pipe; 15. ring; 16. air cavity; 17. fan; 18. semiconductor refrigerator; 19. cooling plate; 20. cooling plate; 21. cooling rod; 22. filter frame; 23. butt joint; 24. mounting ear; 25. T-type frustum; 26. auxiliary mounting ear; 27. sealing ring. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-5 The utility model provides a technical solution: a super-low temperature jacket interlayer structure, comprising a pressure cylinder 1 and a cooling cover 2 sleeved on the pressure cylinder 1, a ring-shaped cooling coil 3 is arranged inside the cooling cover 2, one end of the cooling coil 3 is fixedly connected to a refrigerant inlet pipe 4, and the other end of the cooling coil 3 is fixedly connected to a refrigerant outlet pipe 5, a water inlet pipe 6 and a water outlet pipe 7 with a control valve are arranged on the cooling cover 2, and the water outlet pipe 7 is connected to a cooling component, a cylinder cover 11 is installed on the top of the pressure cylinder 1, a temperature detector 12 is arranged on the cylinder cover 11, and the probe of the temperature detector 12 extends into the pressure cylinder 1, and a controller 13 is installed on the top of the cylinder cover 11 through a bracket, and the controller 13 controls the connection between the cooling component and the temperature detector 12.

[0027] See also Figure 1-2 A plurality of supporting feet are fixedly provided at the bottom end of the pressure cylinder 1, and the supporting feet are fixed to the inner bottom end of the cooling cover 2. Control valves are provided on the refrigerant inlet pipe 4 and the refrigerant outlet pipe 5, and the pressure cylinder 1 is fixed in the cooling cover 2 through the supporting feet.

[0028] See also Figure 1 The cooling assembly includes a refrigerator 8 connected to the water outlet pipe 7, and the refrigerator 8 is connected to a circulation pump 9 through a pipeline. The circulation pump 9 is provided with a drain pipe 10 connected to the cooling cover 2. The circulation pump 9 and the refrigerator 8 are respectively fixed to the outer wall of the cooling cover 2 through a motor frame.

[0029] The circulation pump 9 draws water into the refrigerator 8 for cooling, and then discharges the water from the drain pipe 10 into the cooling space formed between the pressure cylinder 1 and the cooling cover 2.

[0030] See also Figure 5 A through-type through-tube 14 is fixedly provided on the cylinder body of the pressure cylinder 1, the top of the through-tube 14 is solid, the bottom of the through-tube 14 penetrates the cooling cover 2, and the bottom is open, the number of the through-tubes 14 is multiple, and they are arranged in an annular shape, a circular ring 15 is commonly sleeved on the outer surface of the top of the through-tube 14, the inside of the circular ring 15 is cavity-shaped, the inside of the circular ring 15 is communicated with the inside of the through-tube 14, and an air cavity 16 is connected to the circular ring 15 through a butt pipe 23, a fan 17 is installed in the air cavity 16, a semiconductor refrigerator 18 located below the fan 17 is installed in the air cavity 16, a cooling plate 19 is provided at the bottom of the semiconductor refrigerator 18, a cooling plate 20 is connected to the bottom of the cooling plate 20, a cooling rod 21 is provided at the bottom of the cooling plate 20, a filter frame 22 is provided in the top of the air cavity 16, and a filter net is provided on the inner side of the filter frame 22.

[0031] The fan 17 absorbs the outside wind, and by providing a semiconductor refrigerator, a cooling fin, a cooling plate and a cooling rod, it can cool the cooling rod. The fan 17 blows the cold wind into the through-tube 14 to cool the cylinder body.

[0032] See also Figure 5 The top of the butt-joint pipe 23 is inserted into the bottom of the air cavity 16 , and a plurality of mounting ears 24 are provided on the outer surface of the butt-joint pipe 23 , and the mounting ears 24 are fixed to the bottom surface of the air cavity 16 with screws.

[0033] The air chamber 16 is detachably installed, and the subsequent opening of the cylinder cover 11 can be facilitated only by removing the air chamber 16 .

[0034] See also Figure 1 A T-shaped frustum 25 is installed between the pressure cylinder 1 and the top of the cooling cover 2. A secondary mounting ear 26 is provided on the T-shaped frustum 25. The secondary mounting ear 26 is fixed to the top surface of the cooling cover 2 with a mounting screw. A sealing ring 27 is sleeved on the bottom of the T-shaped frustum 25.

[0035] A refrigeration space is formed between the pressure cylinder 1 and the cooling cover 2. The T-shaped frustum 25 just covers the top of the refrigeration space. The sealing ring 27 is installed at the bottom of the T-shaped frustum 25 with screws to ensure the sealing of the subsequent installation.

[0036] During specific operation, the temperature inside the working cylinder of the present application rises sharply. The temperature inside the working cylinder is detected by the temperature detector 12. A refrigeration space is formed between the pressure cylinder 1 and the cooling cover 2. Water is added to the refrigeration space from the water outlet pipe 7 in advance. The designed controller controls the cooling component to absorb the water inside the refrigeration space and refrigerate the internal water, and then discharges the refrigerated water to the refrigeration space again, thereby cooling the cylinder surface of the pressure cylinder 1 to achieve refrigeration of the pressure cylinder 1. The controller 13 controls the temperature detector to intelligently detect the internal temperature of the cylinder body and intelligently realize cooling work to keep the pressure cylinder 1 working in a low temperature state.

[0037] In actual application, the coolant is transported to the interior of the cooling coil 3 through the refrigerant inlet pipe 4 to cool the water in the space formed between the pressure cylinder 1 and the cooling cover 2 .

[0038] Although this specification is described according to implementation modes, not every implementation mode includes only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An ultra-low temperature jacket interlayer structure, characterized in that: The invention comprises a pressure cylinder (1) and a cooling hood (2) sleeved on the pressure cylinder (1), wherein an annular cooling coil (3) is arranged inside the cooling hood (2), one end of the cooling coil (3) is fixedly connected to a refrigerant inlet pipe (4), and the other end of the cooling coil (3) is fixedly connected to a refrigerant outlet pipe (5), the cooling hood (2) is provided with a water inlet pipe (6) and a water outlet pipe (7) with a control valve, the water outlet pipe (7) is connected to a cooling assembly, a cylinder cover (11) is installed at the top end of the pressure cylinder (1), a temperature detector (12) is arranged on the cylinder cover (11), a probe of the temperature detector (12) extends into the pressure cylinder (1), a controller (13) is installed at the top end of the cylinder cover (11) through a bracket, and the controller (13) controls the connection between the cooling assembly and the temperature detector (12).

2. The ultra-low temperature jacket interlayer structure according to claim 1, characterized in that: A plurality of supporting feet are fixedly provided at the bottom end of the pressure cylinder (1), and the supporting feet are fixed to the inner bottom end of the cooling cover (2). Control valves are provided on the refrigerant inlet pipe (4) and the refrigerant outlet pipe (5).

3. The ultra-low temperature jacket interlayer structure according to claim 2, characterized in that: The cooling assembly comprises a refrigerator (8) connected to the water outlet pipe (7), the refrigerator (8) being connected to a circulation pump (9) via a pipeline, the circulation pump (9) being provided with a drainage pipe (10) connected to the cooling hood (2), the circulation pump (9) and the refrigerator (8) being respectively fixed to the outer wall of the cooling hood (2) via a motor frame.

4. The ultra-low temperature jacket interlayer structure according to claim 3, characterized in that: A through-type through-tube (14) is fixedly provided on the cylinder body of the pressure cylinder (1), the top of the through-tube (14) is solid, the bottom of the through-tube (14) penetrates the cooling cover (2), and the bottom is open.

5. The ultra-low temperature jacket interlayer structure according to claim 4, characterized in that: The number of the through-tubes (14) is multiple and they are arranged in a ring shape. A circular ring (15) is commonly sleeved on the outer surface of the top of the through-tubes (14). The interior of the circular ring (15) is in a cavity shape. The interior of the circular ring (15) is communicated with the interior of the through-tube (14). The circular ring (15) is connected to an air cavity (16) via a butt joint (23). A fan (17) is installed inside the air cavity (16). A semiconductor refrigerator (18) located below the fan (17) is installed inside the air cavity (16). A cooling fin (19) is arranged at the bottom end of the semiconductor refrigerator (18). A cooling plate (20) is connected to the bottom of the cooling fin (19). A cooling rod (21) is arranged at the bottom of the cooling plate (20).

6. The ultra-low temperature jacket interlayer structure according to claim 5, characterized in that: A filter frame (22) is arranged inside the top of the air cavity (16), and a filter net is arranged inside the filter frame (22).

7. The ultra-low temperature jacket interlayer structure according to claim 6, characterized in that: The top of the butt-joint pipe (23) is inserted into the bottom of the air cavity (16), and a plurality of mounting ears (24) are provided on the outer surface of the butt-joint pipe (23), and the mounting ears (24) are fixed to the bottom end surface of the air cavity (16) with screws.

8. The ultra-low temperature jacket interlayer structure according to claim 7, characterized in that: A T-shaped frustum (25) is installed between the pressure cylinder (1) and the top of the cooling hood (2), and a secondary mounting ear (26) is provided on the T-shaped frustum (25). The secondary mounting ear (26) is fixed to the top surface of the cooling hood (2) by mounting fitting screws, and a sealing ring (27) is sleeved on the bottom of the T-shaped frustum (25).

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