Tool module and welding equipment thereof

Abstract

The utility model relates to a tool module and welding equipment thereof, and the tool module comprises a base and a mounting station; the mounting station is located on the base, the mounting station comprises a supporting surface, a first avoiding part and a second avoiding part, the supporting surface is attached to the mounting surface, the first avoiding part can accommodate warpage and / or burrs on the mounting surface of the ceramic substrate, and the second avoiding part can accommodate a capacitor. The mounting station is used for supporting the mounting surface of the ceramic substrate, warpage, burrs and capacitors on the mounting surface of the ceramic substrate are effectively accommodated through the first avoiding part and the second avoiding part, and the mounting station can better adapt to the assembling and welding process of the flip chip. The problem that in the prior art, due to the fact that warping or burrs are inevitably generated in the production process of the ceramic substrate, the chip yield is affected in the welding process of the ceramic substrate is effectively solved.

Description

Technical Field

[0001] The present application relates to the technical field of tooling and dies, and in particular to a tooling module and welding equipment thereof. Background Art

[0002] Ceramic substrates are essential assembly raw materials in the module flip chip welding process. During the preparation of ceramic substrates, ceramic powder is first added to an organic binder and mixed evenly to form a paste-like ceramic slurry. The ceramic slurry is then scraped into sheets with a scraper, and then the sheet slurry is formed into a green embryo through a drying process. Then, via holes are drilled according to the circuit layer design, and screen-printed metal slurry is used for wiring and hole filling. Finally, the green embryo layers are stacked, sintered in a high-temperature furnace, and undergo a series of processes to become a ceramic substrate.

[0003] At present, ceramic substrates will inevitably have warping or burrs during the production process. In the subsequent welding process, the ceramic substrate needs to be placed on a boss and then welded. The contact between the warping or burrs and the boss plane causes the ceramic substrate to be placed unevenly, affecting the welding effect. At the same time, it is also easy to cause problems such as substrate cracking and metal particles, resulting in the electrical performance of the chip after welding not meeting the requirements and the appearance of foreign matter in the chip. Utility Model Content

[0004] The present application provides a tooling module and a welding device thereof to solve the problem in the prior art that the ceramic substrate affects the chip yield during the welding process due to the inevitable warping or burrs generated during the production process of the ceramic substrate.

[0005] In a first aspect, the present application provides a tooling module for placing a ceramic substrate, wherein a capacitor is arranged on a mounting surface of the ceramic substrate, and the tooling module comprises: a base and a mounting station;

[0006] The installation station is located on the base, and the installation station includes a supporting surface, a first avoidance portion and a second avoidance portion. The supporting surface is in contact with the installation surface, the first avoidance portion can accommodate warping and / or burrs on the installation surface of the ceramic substrate, and the second avoidance portion can accommodate the capacitor.

[0007] According to some embodiments of the present application, the installation station includes a first seat body and a second seat body, the first avoidance portion is arranged on a side of the first seat body away from the base, the second avoidance portion is formed between the first seat body and the second seat body, and the support surface is the end surface of the first seat body and the second seat body away from the base.

[0008] According to some embodiments of the present application, the distance between the support surface and the bottom surface of the first avoidance portion is greater than or equal to 0.05 mm.

[0009] According to some embodiments of the present application, the first seat body is provided with a transition surface for connecting the bottom surface of the first avoidance portion and the support surface, and the transition surface gradually moves away from the bottom surface of the first avoidance portion along a direction perpendicular to the bottom surface of the first avoidance portion and close to the support surface.

[0010] According to some embodiments of the present application, the transition surface is an inclined surface or a curved surface.

[0011] According to some embodiments of the present application, the transition surface is formed on the first seat body by means of an oblique groove.

[0012] According to some embodiments of the present application, a horizontal distance width between the bottom surface of the first avoidance portion and the support surface is greater than or equal to 0.15 mm.

[0013] According to some embodiments of the present application, the distance between the supporting surface and the base is greater than or equal to 1 mm.

[0014] According to some embodiments of the present application, the distance between the first base and the capacitor is greater than or equal to 0.3 mm, and / or the distance between the second base and the capacitor is greater than or equal to 0.3 mm.

[0015] In a second aspect, the present application provides a welding device, which is used for welding the ceramic substrate and the flip chip. The welding device includes a tooling module and a welding module, and the tooling module is the above-mentioned tooling module.

[0016] The above technical solution provided by the embodiment of the present application has the following advantages compared with the prior art:

[0017] An embodiment of the present application provides a tooling module and its welding equipment, wherein the tooling module includes: a base and an installation station; the installation station is located on the base, and the installation station includes a supporting surface, a first avoidance portion and a second avoidance portion, the supporting surface is in contact with the installation surface, the first avoidance portion can accommodate the warping and / or burrs on the installation surface of the ceramic substrate, and the second avoidance portion can accommodate the capacitor. The installation station is used to support the installation surface of the ceramic substrate, and the first avoidance portion and the second avoidance portion effectively accommodate the warping, burrs and capacitors on the installation surface of the ceramic substrate, which can be better adapted to the assembly welding process of the flip chip. The present application effectively solves the problem in the prior art that the ceramic substrate affects the chip yield during the welding process due to the warping or burrs that are inevitably generated in the production process of the ceramic substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0021] Figure 1 A cross-sectional schematic diagram of a tooling module provided in an embodiment of the present application when in use is shown;

[0022] Figure 2 Shows Figure 1 Schematic diagram of the three-dimensional structure of the tooling module;

[0023] Figure 3 Shows Figure 2 A top view of the tooling module;

[0024] Figure 4 Shows Figure 2 The main schematic diagram of the tooling module;

[0025] Figure 5 Shows Figure 2 Schematic diagram of the top view of the installation station of the tooling module.

[0026] The above drawings contain the following reference numerals:

[0027] 10. Base; 11. Positioning column; 12. Mounting countersunk hole; 20. Mounting station; 21. Support surface; 22. First avoidance portion; 23. Second avoidance portion; 24. First seat body; 241. Transition surface; 25. Second seat body; 30. Ceramic substrate; 31. Capacitor; 40. Burr. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] The disclosure below provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention may repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0030] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.

[0031] Reference Figures 1 to 5 In a first aspect, the embodiment of the present application provides a tooling module for placing a ceramic substrate 30, and a capacitor 31 is arranged on the mounting surface of the ceramic substrate 30. The tooling module includes: a base 10 and an installation station 20; the installation station 20 is located on the base 10, and the installation station 20 includes a support surface 21, a first avoidance portion 22, and a second avoidance portion 23. The support surface 21 is attached to the mounting surface, and the first avoidance portion 22 can accommodate the warping and / or burrs 40 on the mounting surface of the ceramic substrate 30, and the second avoidance portion 23 can accommodate the capacitor 31. The installation station 20 is set to support the mounting surface of the ceramic substrate 30, and the first avoidance portion 22 and the second avoidance portion 23 make the warping and / or burrs 40 on the mounting surface of the ceramic substrate 30 and the capacitor 31 effectively accommodated, which can better adapt to the assembly and welding process of the flip chip. The present application effectively solves the problem in the prior art that the ceramic substrate affects the chip yield during the welding process due to the warping or burrs 40 that are inevitably generated in the production process of the ceramic substrate.

[0032] like Figure 1 and Figure 5As shown, in the technical solution of this embodiment, the installation station 20 includes a first seat body 24 and a second seat body 25, the first avoidance portion 22 is arranged on a side of the first seat body 24 away from the base 10, the second avoidance portion 23 is formed between the first seat body 24 and the second seat body 25, and the support surface 21 is the end surface of the first seat body 24 and the second seat body 25 away from the base 10. Such a setting makes it possible for the first avoidance portion 22 and the second avoidance portion 23 to face the installation surface of the ceramic substrate 30 during the installation of the ceramic substrate 30, so that the warping, burr 40 and the capacitor 31 can meet the assembly requirements through one installation, reducing the difficulty of assembly, while simplifying the structure, making it more compact and reliable.

[0033] In the technical solution of this embodiment (not shown in the figure), the distance between the support surface 21 and the bottom surface of the first avoidance portion 22 is greater than or equal to 0.05mm. Such a setting makes the height of the middle hollow after the support surface 21 and the mounting surface of the ceramic substrate 30 cooperate to be more than 0.05mm. In the current process, the control accuracy of the burr 40 is below 0.04mm, which can fully meet the current process requirements. The first avoidance portion 22 can completely accommodate the burr 40, and its bottom surface will not contact the burr 40, thereby avoiding the burr 40 from being pressed, so that the mounting surface contacts the support surface 21, and finally causes the ceramic substrate 30 to be suspended and does not meet the requirements of the subsequent welding process, and finally produces defective products. It should be noted that the setting of the first avoidance portion 22 forms a certain accommodation space, so that the debris and other debris generated by the ceramic substrate 30 during the processing process have a certain position to be accommodated, reducing the risk of debris harming the ceramic substrate 30.

[0034] like Figures 1 to 5 As shown, in the technical solution of this embodiment, the first seat body 24 is provided with a transition surface 241 for connecting the bottom surface of the first avoidance portion 22 and the support surface 21. Along the direction perpendicular to the bottom surface of the first avoidance portion 22 and close to the support surface 21, the transition surface 241 gradually moves away from the bottom surface of the first avoidance portion 22. The setting of the transition surface 241 connects the support surface 21 with the bottom surface of the first avoidance portion 22, plays a role of smooth transition, is easy to process, and the transition surface 241 plays a role of strengthening structural support, and the structural strength is higher. The setting of the transition surface 241 makes the cross section of the first avoidance portion 22 gradually decrease in the direction in which the support surface 21 approaches the transition surface 241, which has a guiding effect during the installation process of the ceramic substrate 30. Even if the burr 40 contacts the transition surface 241, the burr 40 will gradually slide in the direction close to the first avoidance portion 22 due to its guiding effect, and finally hang in the accommodation space formed by the first avoidance portion 22.

[0035] Furthermore, in the technical solution of this embodiment, the transition surface 241 is an inclined surface or an arc surface. The setting of the inclined surface or the arc surface has the function of strengthening the structure and facilitating processing. Specifically, it can be processed by numerical control equipment to control the processing accuracy, and after processing, it needs to be polished to meet the requirements of subsequent draft precision processing.

[0036] In the technical solution of this embodiment (not shown in the figure), the transition surface 241 is formed on the first seat body 24 by digging an oblique groove. The oblique groove is directly formed without using a cutting tool to dig vertically. The processing process is directly carried out simultaneously with the processing process of the support surface 21. Such a setting makes the processing surface continuous and maintains the same processing accuracy, with better continuity. In addition, the support surface 21 and the first seat body 24 formed by the vertical digging of the non-cutting tool have a stable support position, which can effectively prevent the deformation or severe wear of the support surface after the use time, thereby increasing the service life. It should be noted that during the processing, since the angle between the tool and the forming surface is consistent, the stress direction of each processing surface is consistent with the angle and size between the processing surfaces, so the force conditions at each position are the same, and the overall stability is better.

[0037] In the technical solution of this embodiment (not shown in the figure), the horizontal distance width between the bottom surface of the first avoidance portion 22 and the support surface 21 is greater than or equal to 0.15 mm. Such a setting can prevent the ceramic substrate 30 from moving during the production process and prevent the burr 40 from scratching the first seat body 24.

[0038] In the technical solution of this embodiment (not shown in the figure), the distance between the support surface 21 and the base 10 is greater than or equal to 1 mm. This arrangement ensures that after the ceramic substrate 30 is installed, the capacitor 31 will not contact the base 10 when it is located in the second avoidance portion 23.

[0039] In the technical solution of this embodiment (not shown in the figure), the distance between the first base 24 and the capacitor 31 is greater than or equal to 0.3 mm, and / or the distance between the second base 25 and the capacitor 31 is greater than or equal to 0.3 mm. Considering that the ceramic substrate is provided with capacitors 31 and resistors, the ceramic substrate 30 is placed on the support surface 21 for operation, and the position where the capacitors are located needs to be kept away to prevent the capacitors 31 or resistors from contacting the edges of the first base 24 or the second base 25 and causing scratches. The above-mentioned setting can be used to avoid contact between the capacitor 31 and the first base 24 and / or the second base 25.

[0040] It should be noted that the present application is to avoid edge warping or burrs 40 of the ceramic substrate 30, and to avoid direct contact with the base of the installation station 20 to generate substrate debris or foreign matter. The specially designed solution with a first avoidance portion 22 and a second avoidance portion 23 greatly improves the generation of substrate debris and substrate cracks during welding, thereby improving product yield.

[0041] The design of the first avoidance portion 22 and the second avoidance portion 23 allows all components such as the capacitor 31 to be avoided, and the appropriate distance between the seat and the capacitor 31 is calculated based on tolerance analysis to prevent the capacitor 31 from scratching the seat and causing product defects.

[0042] The transition surface 241 on the first seat body 24 is processed by an oblique groove, which can reduce the risk of deformation or wear of the seat body after long-term use and increase the service life.

[0043] In the second aspect, the present application provides a welding device, which is used for welding a ceramic substrate 30 and a flip chip, and the welding device includes a tooling module and a welding module, and the tooling module is the tooling module in the above embodiment. By using the tooling module in the above embodiment, the ceramic substrate 30 will not produce defective products due to substrate warping and processing burrs 40 during welding.

[0044] It should be noted that if Figures 2 to 4 As shown, in the technical solution of this embodiment, the base 10 also includes a positioning column 11 for positioning and a mounting countersunk hole 12 for installation. The specific application process is as follows:

[0045] The tooling module is installed in the welding equipment, and fasteners, specifically screws, are inserted into the mounting countersunk holes 12, and then the fasteners are tightened to fix the base 10.

[0046] The ceramic substrate 30 is placed on a conveyor plate of the welding equipment and transported above the base 10 . The positioning holes on the conveyor plate are aligned with the positioning columns 11 of the base 10 . The conveyor plate is then lowered and a plurality of ceramic substrates 30 are placed on the installation station 20 .

[0047] At this time, the ceramic substrate 30 is placed on the supporting surface 21, and the capacitor 31 is located between the second avoidance portion 23 formed by the first seat body 24 and the second seat body 25, and does not contact the two seats. At this time, the burr 40 or warping of the ceramic substrate 30 is located in the first avoidance portion 22, and is also in a suspended state, and will not directly contact the two seats, thereby avoiding the generation of processing debris and metal particles.

[0048] The support surface 21 and the bottom surface of the first avoidance portion 22 form a continuous transition surface 241 by digging oblique grooves. This design enhances the stability of the support surface 21 and simultaneously achieves the purpose of digging grooves to avoid substrate debris.

[0049] After the welding equipment absorbs the chip, the ceramic substrate 30 on the installation station 20 is welded. At this time, the burr 40 will not affect the welding process due to its suspended state, which greatly improves the product yield and can meet the production requirements. After the welding is completed, the ceramic substrate 30 is directly transported to the next station using a transfer carrier for subsequent production processes.

[0050] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0051] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.

[0052] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be obvious to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features applied herein.

Claims

1. A tooling module for placing a ceramic substrate (30), wherein a capacitor (31) is arranged on the mounting surface of the ceramic substrate (30), characterized in that: The tooling module comprises: Base (10); The installation station (20) is located on the base (10), and the installation station (20) comprises a supporting surface (21), a first avoidance portion (22) and a second avoidance portion (23). The supporting surface (21) is in contact with the installation surface, the first avoidance portion (22) can accommodate warping and / or burrs (40) on the installation surface of the ceramic substrate (30), and the second avoidance portion (23) can accommodate the capacitor (31).

2. The tooling module according to claim 1, characterized in that: The installation station (20) comprises a first seat body (24) and a second seat body (25); the first avoidance portion (22) is arranged on a side of the first seat body (24) away from the base (10); the second avoidance portion (23) is formed between the first seat body (24) and the second seat body (25); and the support surface (21) is the end surface of the first seat body (24) and the second seat body (25) away from the base (10).

3. The tooling module according to claim 2, characterized in that: The distance between the supporting surface (21) and the bottom surface of the first avoiding portion (22) is greater than or equal to 0.05 mm.

4. The tooling module according to claim 2, characterized in that: The first seat body (24) is provided with a transition surface (241) for connecting the bottom surface of the first avoidance portion (22) and the support surface (21); along a direction perpendicular to the bottom surface of the first avoidance portion (22) and close to the support surface (21), the transition surface (241) gradually moves away from the bottom surface of the first avoidance portion (22).

5. The tooling module according to claim 4, characterized in that: The transition surface (241) is an inclined surface or an arc-shaped surface.

6. The tooling module according to claim 5, characterized in that: The transition surface (241) is formed on the first seat body (24) by means of an oblique groove.

7. The tooling module according to claim 3, characterized in that: The horizontal distance width between the bottom surface of the first avoidance portion (22) and the support surface (21) is greater than or equal to 0.15 mm.

8. The tooling module according to claim 2, characterized in that: The distance between the support surface (21) and the base (10) is greater than or equal to 1 mm.

9. The tooling module according to claim 2, characterized in that: The distance between the first base (24) and the capacitor (31) is greater than or equal to 0.3 mm, and / or the distance between the second base (25) and the capacitor (31) is greater than or equal to 0.3 mm.

10. A welding device, characterized in that: The welding equipment is used for welding the ceramic substrate (30) and the flip chip, and the welding equipment comprises a tooling module and a welding module, and the tooling module is the tooling module according to any one of claims 1 to 9.

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