Full-automatic mould pressing equipment for circuit board

Abstract

The utility model discloses full-automatic mould pressing equipment for circuit boards, which relates to the technical field of circuit board production and comprises a mould pressing equipment body, the top of the mould pressing equipment body is fixedly connected with a fixing frame, the top of the fixing frame is fixedly connected with two hydraulic cylinders, and the telescopic ends of the two hydraulic cylinders penetrate through the top of the fixing frame. The telescopic end of one hydraulic cylinder is fixedly connected with a first connecting plate, and the bottom of the first connecting plate is fixedly connected with a mold pressing plate. According to the utility model, in the demolding process, as the circuit board material is tightly attached to the mold cavity in a mold pressing manner, and the mold pressing equipment is provided with the cutting blade in the cutting adsorption assembly, and the cutting blade is positioned right above the joint of the circuit board material and the mold cavity, when the cutting blade is driven by the hydraulic cylinder to cut the circuit board material, the circuit board material can be separated from the mold cavity; and circuit board materials clamped and embedded in the mold groove can be separated from one another, and the circuit board materials can be conveniently taken out of the mold groove through the suction cups.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board production, in particular to a full-automatic molding device for circuit boards. Background Art

[0002] When traditional fully automatic circuit board molding equipment is automatically demolding, after the circuit board is pressed, the circuit board material is tightly embedded in the mold groove, and it is very difficult to suck it out of the mold groove using a suction cup seat. If the material is not taken out of the mold groove in time, it will affect the pressing of the next batch of circuit boards, thereby reducing the production and processing efficiency of the circuit boards.

[0003] Therefore, it is necessary to invent a fully automatic circuit board molding equipment to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a circuit board fully automatic molding equipment to solve the above-mentioned problems.

[0005] To achieve the above object, the utility model provides the following technical solutions: a fully automatic molding equipment for circuit boards, comprising a molding equipment body, the top of which is fixedly connected to a fixing frame;

[0006] Two hydraulic cylinders are fixedly connected to the top of the fixed frame, and the telescopic ends of the two hydraulic cylinders both pass through the top of the fixed frame. The telescopic end of one of the hydraulic cylinders is fixedly connected to a first connecting plate, and the bottom of the first connecting plate is fixedly connected to a molded plate. The telescopic end of the other hydraulic cylinder is provided with a cutting adsorption assembly, and the cutting adsorption assembly includes a second connecting plate, and the second connecting plate is fixedly connected to the hydraulic cylinder, and the bottom of the second connecting plate is fixedly connected to cutting blades, and the interior of the second connecting plate is fixedly connected to a plurality of cylinders, and the bottoms of the plurality of cylinders are fixedly connected to suction cups.

[0007] Preferably, a motor is fixedly connected to the bottom of the molding equipment body, the rotating shaft of the motor passes through the molding equipment body and is fixedly connected to a rotating circular plate, the rotating circular plate is rotatably connected to the molding equipment body, and two mold bases are fixedly connected to the top of the rotating circular plate, a mold groove is opened inside the mold base, and a pneumatic demolding component is arranged inside the mold groove.

[0008] Preferably, the pneumatic demolding assembly includes a movable plate, which is located in the mold groove. The bottom of the movable plate is fixedly connected to an electric push rod, which is fixedly connected to the rotating circular plate. The bottom of the molding equipment body is fixedly connected to a guide ring body, and an arc groove is opened inside the guide ring body. The electric push rod is slidably connected in the arc groove.

[0009] Preferably, the motor is located at the center of the guide ring body.

[0010] Preferably, the fixing frame is composed of a supporting plate and four supporting legs, the four supporting legs are located at four corners of the bottom of the supporting plate, and a fan is fixedly connected to one side of two supporting legs close to each other.

[0011] Preferably, the die groove is T-shaped.

[0012] Preferably, the cutting blade is in a frame-shaped structure.

[0013] Technical effects and advantages of the utility model:

[0014] 1. The utility model is provided with a cutting adsorption component. During the demolding process, since the circuit board material is tightly fitted to the mold groove by molding, and the molding equipment is provided with a cutting blade in the cutting adsorption component, and the cutting blade is located directly above the connection between the circuit board material and the mold groove, therefore, when the cutting blade cuts the circuit board material under the drive of the hydraulic cylinder, it helps to separate the circuit board materials embedded in the mold groove from each other, and facilitates the removal of the circuit board material from the mold groove by the suction cup, so as to avoid the molding equipment failing to remove the circuit board material in time, affecting the pressing of the next batch of circuit boards.

[0015] 2. Considering that the circuit board material needs to be lifted up by the demoulding plate for contact demoulding after cutting, the lower surface of the circuit board material may be worn during the demoulding process. Therefore, before cutting the circuit board material, the moving plate is driven by the electric push rod to move the air pressure in the mold groove. When the cutting blade cuts the circuit board material, the air pressure will automatically lift up the circuit board material, and after lifting up, the circuit board material is adsorbed by the suction cup.

[0016] 3. Furthermore, the molding equipment is provided with a molding mechanism and a demolding mechanism, which are used separately. When the demolding mechanism fails to demold the circuit board material immediately, the molding equipment also has a molding time adjustment to enable the demolding mechanism to demold the circuit board material. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the structure of the molding equipment of the utility model.

[0018] Figure 2 It is a schematic diagram of the internal structure of the mold base of the utility model.

[0019] Figure 3 This is a schematic diagram of the structure of the cutting adsorption component of the utility model.

[0020] Figure 4 For this utility model Figure 3 Enlarged structural diagram at A in the middle.

[0021] In the figure: 1. Molding equipment body; 2. Fixed frame; 3. Fan; 4. Hydraulic cylinder; 5. First connecting plate; 6. Second connecting plate; 7. Rotating circular plate; 8. Die base; 9. Moving plate; 10. Electric push rod; 11. Guide ring body; 12. Motor; 13. Molding plate; 14. Cutting disc; 15. Cylinder; 16. Suction cup. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] The utility model provides Figure 1-Figure 4 A fully automatic molding device for a circuit board shown in the figure comprises a molding device body 1, a fixing frame 2 is fixedly connected to the top of the molding device body 1, the fixing frame 2 is composed of a support plate and four support legs, the four support legs are located at the four corners of the bottom of the support plate, and a fan 3 is fixedly connected to the side where two support legs are close to each other;

[0024] The molding equipment body 1 performs molding processing on the circuit board, and the fan 3 performs cooling processing on the heat generated during the molding processing.

[0025] Two hydraulic cylinders 4 are fixedly connected to the top of the fixed frame 2, and the telescopic ends of the two hydraulic cylinders 4 both pass through the top of the fixed frame 2. The telescopic end of one of the hydraulic cylinders 4 is fixedly connected to the first connecting plate 5, and the bottom of the first connecting plate 5 is fixedly connected to the molded plate 13. The telescopic end of the other hydraulic cylinder 4 is provided with a cutting adsorption assembly, and the cutting adsorption assembly includes a second connecting plate 6, and the second connecting plate 6 is fixedly connected to the hydraulic cylinder 4. The bottom of the second connecting plate 6 is fixedly connected with a cutting blade 14, and the cutting blade 14 is a frame-shaped structure. The inside of the second connecting plate 6 is fixedly connected with a plurality of cylinders 15, and the bottom of the plurality of cylinders 15 is fixedly connected with a suction cup 16.

[0026] The utility model is provided with a cutting and adsorption component. During the demolding process, since the circuit board material is tightly fitted to the mold groove by molding, and the molding equipment is provided with a cutting blade 14 in the cutting and adsorption component, and the cutting blade 14 is located directly above the connection between the circuit board material and the mold groove, therefore, when the cutting blade 14 cuts the circuit board material under the drive of the hydraulic cylinder 4, it helps to separate the circuit board materials embedded in the mold groove from each other, and facilitates the removal of the circuit board material from the mold groove through the suction cup 16, so as to avoid the molding equipment failing to remove the circuit board material in time, affecting the pressing of the next batch of circuit boards.

[0027] Furthermore, the cutting and adsorption component performs a cutting and adsorption process on the circuit board material. Specifically, the circuit board material is first placed in the mold base 8, and then the hydraulic cylinder 4 is electrically connected to the power supply. The hydraulic cylinder 4 drives the first connecting plate 5 and the molding plate 13 to move, so that the molding plate 13 performs a molding process on the circuit board material. After the circuit board material is molded, the rotating circular plate 7 is rotated by the motor 12, and the molded circuit board material is located below the cutting blade 14. At this time, the hydraulic cylinder 4 is electrically connected to the power supply again, and the hydraulic cylinder 4 drives the second connecting plate 6 and the cutting blade 14 to move vertically downward. The cutting blade 14 is lower than the suction cup 16. Therefore, the cutting blade 14 first cuts the circuit board material, and after the cutting process, the circuit board material is adsorbed by the suction cup 16.

[0028] A motor 12 is fixedly connected to the bottom of the molding equipment body 1. The rotating shaft of the motor 12 passes through the molding equipment body 1 and is fixedly connected to a rotating circular plate 7. The rotating circular plate 7 is rotatably connected to the molding equipment body 1. Two mold bases 8 are fixedly connected to the top of the rotating circular plate 7. A mold groove is opened inside the mold base 8, and the mold groove is T-shaped.

[0029] When in use, the motor 12 is electrically connected to a power source, the motor 12 drives the rotating circular plate 7 to rotate, and the mold base 8 rotates following the direction of the rotating circular plate 7, which helps the mold base 8 to change its position.

[0030] Furthermore, the molding equipment is respectively provided with a molding mechanism and a demolding mechanism, which are used separately. When the demolding mechanism fails to demold the circuit board material immediately, the molding equipment also has a molding time adjustment to enable the demolding mechanism to demold the circuit board material.

[0031] A pneumatic demoulding assembly is arranged inside the mold groove, and the pneumatic demoulding assembly includes a movable plate 9, which is located in the mold groove. An electric push rod 10 is fixedly connected to the bottom of the movable plate 9, and the electric push rod 10 is fixedly connected to the rotating circular plate 7. A guide ring body 11 is fixedly connected to the bottom of the molding equipment body 1, and an arc groove is opened inside the guide ring body 11. The electric push rod 10 is slidably connected in the arc groove, and the motor 12 is located at the center of the guide ring body 11.

[0032] Before demoulding, the electric push rod 10 is electrically connected to the power source, and the electric push rod 10 drives the moving plate 9 to move to increase the air pressure in the mold cavity.

[0033] Taking into account that the circuit board material needs to be lifted up by the demolding plate for contact demolding after cutting, the lower surface of the circuit board material may be worn during the demolding process. Therefore, before cutting the circuit board material, the movable plate 9 is moved by the electric push rod 10 to increase the air pressure in the mold groove. When the cutting blade 14 cuts the circuit board material, the air pressure will automatically lift up the circuit board material, and after lifting up, the circuit board material is adsorbed by the suction cup 16.

Claims

1. A fully automatic circuit board molding device, comprising a molding device body (1), characterized in that: The top of the molding equipment body (1) is fixedly connected with a fixing frame (2); Two hydraulic cylinders (4) are fixedly connected to the top of the fixed frame (2), and the telescopic ends of the two hydraulic cylinders (4) both pass through the top of the fixed frame (2), the telescopic end of one of the hydraulic cylinders (4) is fixedly connected to a first connecting plate (5), and the bottom of the first connecting plate (5) is fixedly connected to a molded plate (13), and the telescopic end of the other hydraulic cylinder (4) is provided with a cutting adsorption component, and the cutting adsorption component comprises a second connecting plate (6), the second connecting plate (6) is fixedly connected to the hydraulic cylinder (4), and the bottom of the second connecting plate (6) is fixedly connected to a cutting blade (14), and the inside of the second connecting plate (6) is fixedly connected to a plurality of cylinders (15), and the bottoms of the plurality of cylinders (15) are fixedly connected to suction cups (16).

2. The fully automatic molding equipment for circuit boards according to claim 1, characterized in that: The bottom of the molding equipment body (1) is fixedly connected to a motor (12), the rotating shaft of the motor (12) passes through the molding equipment body (1) and is fixedly connected to a rotating circular plate (7), the rotating circular plate (7) is rotatably connected to the molding equipment body (1), the top of the rotating circular plate (7) is fixedly connected to two mold bases (8), the mold base (8) is provided with a mold groove inside, and a pneumatic demoulding component is arranged inside the mold groove.

3. The fully automatic molding equipment for circuit boards according to claim 2, characterized in that: The pneumatic demoulding assembly comprises a movable plate (9), the movable plate (9) is located in the mold groove, the bottom of the movable plate (9) is fixedly connected to an electric push rod (10), the electric push rod (10) is fixedly connected to the rotating circular plate (7), the bottom of the molding equipment body (1) is fixedly connected to a guide ring body (11), the guide ring body (11) has an arc groove inside, and the electric push rod (10) is slidably connected in the arc groove.

4. The fully automatic molding equipment for circuit boards according to claim 3, characterized in that: The motor (12) is located at the center of the guide ring body (11).

5. The fully automatic molding equipment for circuit boards according to claim 1, characterized in that: The fixing frame (2) is composed of a supporting plate and four supporting legs. The four supporting legs are located at four corners of the bottom of the supporting plate. A fan (3) is fixedly connected to one side of two supporting legs that are close to each other.

6. The fully automatic molding equipment for circuit boards according to claim 2, characterized in that: The die groove is T-shaped.

7. The fully automatic molding equipment for circuit boards according to claim 1, characterized in that: The cutting blade (14) is in a frame-shaped structure.

Images