Planar crystal packaging structure
By designing a planar crystal packaging structure including a cover shell, a support part and a thermal conductive part, the packaging problem of high-purity germanium semiconductor detectors in vacuum and low-temperature environments is solved, the isolation and protection of the crystal electrodes are achieved, and the requirements are met The need for detector replacement is met.
Patent Information
- Application Number
- CN202420279159.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-05
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-02-05
AI Technical Summary
High-purity germanium semiconductor detectors operate in vacuum and low temperature environments. They need a planar crystal packaging structure that can meet these conditions. At the same time, isolation treatment of upper and lower electrodes of the crystal is required to reduce damage to the crystal.
A planar crystal packaging structure is designed, including a crystal, an electrically and thermally conductive cover shell, a support part and a thermal conductive part. The cover shell is connected to the non-electrode position on the top of the crystal through a soft pressing piece, and the crystal is packaged on the thermal conductive part. The support part includes insulating first and second support parts for supporting the crystal and achieving electrode isolation.
It achieves effective packaging of high-purity germanium crystals in vacuum and specific temperature environments, avoids damage to the crystals, and protects electrode safety through isolation treatment. At the same time, the packaging structure is easy to disassemble and assemble, meets the replacement needs of high-purity germanium detectors, and is conducive to modularization.
Smart Images
Figure CN222374837U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a planar crystal packaging structure. Background Art
[0002] High-purity germanium semiconductor detectors are often used in fields such as radioactive detection, and the testing environment is relatively strict. As an important component of high-purity germanium semiconductor detectors, high-purity germanium crystals need to be packaged in a vacuum chamber and work in a low-temperature environment. Therefore, high-purity germanium crystals need to be vacuum-insulated and packaged.
[0003] Therefore, it is necessary to design a planar crystal packaging structure that can meet the working environment of vacuum and specific temperature. Utility Model Content
[0004] In order to solve the above problems, the utility model provides a planar crystal packaging structure, which can meet the working environment of the crystal in vacuum and at a specific temperature, and can also achieve isolation processing of the upper and lower electrodes of the crystal to reduce damage to the crystal.
[0005] The specific technical solutions are as follows:
[0006] The packaging structure includes a crystal, an electrically conductive and heat-conductive sealing shell, a supporting part, and a heat-conducting part; the sealing shell is connected to the non-electrode position on the top of the crystal through a soft pressing sheet, and the crystal is packaged on the heat-conducting part; the sealing shell and the heat-conducting part are connected through a first insulating member; the supporting part includes an insulating first supporting part arranged between the bottom of the crystal and the heat-conducting part; the positive electrode of the crystal is conductively connected to the sealing shell, and the negative electrode lead of the crystal passes through the first supporting part and the heat-conducting part and is led out of the packaging structure.
[0007] Furthermore, the support part also includes a second support part arranged between the crystal and the inner wall of the cover shell; the second support part is connected to the non-electrode position of the crystal, and the connecting part is made of insulating material; a cavity is formed between the second support part and the surface of the crystal.
[0008] Furthermore, the second supporting part includes a second insulating member and an electrically conductive and thermally conductive member connected to the second insulating member; the second insulating member is connected to a non-electrode position of the crystal, and the electrically conductive and thermally conductive member is connected to the cover shell; preferably, the crystal is a crystal with a wing structure, and the second insulating member is used to support the wing structure of the crystal; preferably, the material of the second insulating member is ceramic, and the material of the electrically conductive and thermally conductive member is aluminum.
[0009] Furthermore, the packaging structure also includes a spring; the spring is connected to the cover shell and is conductive with the positive electrode of the crystal.
[0010] Furthermore, the first support part is an insulating platform with a through hole; the heat conducting part is provided with a hollow protruding structure, and the through hole of the first support part is connected with the hollow cavity of the protruding structure; the negative lead of the crystal passes through the through hole of the first support part and the hollow cavity and is led out of the packaging structure.
[0011] Furthermore, the electrically conductive and heat-conducting member is a sink structure; the side of the sink structure is connected to the second insulating member, and the bottom of the sink structure is connected to the heat-conducting part through the first insulating member.
[0012] Furthermore, the electrically conductive and heat-conducting part is a sink structure with a through hole therein; the side of the sink structure is connected to the second insulating part, and the bottom of the sink structure is connected to the heat-conducting part through the first insulating part; an exhaust hole is provided at the bottom of the sink structure; the protruding structure passes through the through hole of the sink structure and is connected to the first supporting part, and a third insulating part is provided between the protruding structure and the through hole wall of the sink structure.
[0013] Further, the heat-conducting part is sealed and bonded to the first insulating part; preferably, the cover shell is bolted to the electrically conductive and heat-conducting part; preferably, the first supporting part is connected to the protruding structure by threads.
[0014] Furthermore, the packaging structure also includes an insulating soft protection part, which is arranged below the crystal and located at the periphery of the first support part; preferably, the soft protection part is made of nylon material.
[0015] Furthermore, the heat conducting part and the cover shell are both made of aluminum; the first supporting part is made of plastic; and the first insulating part is made of ceramic.
[0016] Compared with the prior art, one or more of the above technical solutions can achieve at least one of the following beneficial effects:
[0017] (1) This packaging structure meets the vacuum and specific temperature working environment required by the crystal;
[0018] (2) This packaging structure can achieve isolation between the upper and lower electrodes of the crystal, limit the crystal position and provide soft contact to protect the safety of the electrodes;
[0019] (3) This packaging structure is easy to disassemble and assemble, meeting the need to replace the high-purity germanium detector at any time, and is conducive to crystal modularization. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0021] Figure 1 This is a schematic diagram of the appearance of the planar crystal packaging structure of Example 2.
[0022] Figure 2 It is a cross-sectional view of the planar crystal packaging structure of Example 2.
[0023] In the figure, 1, crystal; 2, cover shell; 3, first support part; 31, through hole of the first support part; 4, second insulating part; 5, conductive and heat-conducting part; 51, exhaust hole; 6, heat-conducting part; 61, raised structure; 7, first insulating part; 8, soft protective part; 9, soft pressing sheet; 10, spring. DETAILED DESCRIPTION
[0024] Unless otherwise clearly specified and limited, the terms "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.
[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0026] Example 1
[0027] This embodiment provides a planar crystal packaging structure, which is suitable for planar crystals that work in a vacuum environment and require a specific temperature, wherein the positive electrode of the crystal is located at the top and the negative electrode is located at the bottom.
[0028] The packaging structure includes a crystal, an electrically conductive and thermally conductive cover shell, a supporting part, and a thermally conductive part.
[0029] Specifically, the cover shell is connected to the non-electrode position on the top of the crystal through a soft pressing sheet, and the crystal is encapsulated on the heat conducting part. The positive electrode of the crystal is connected to the cover shell; in specific implementation, a spring sheet can be provided, one end of the spring sheet is connected to the cover shell, and the other end is connected to the positive electrode on the top surface of the crystal, so that the positive electrode and the cover shell are connected through the spring sheet. The cover shell is connected to the heat conducting part through a first insulating member, so as to isolate the positive electrode and the heat conducting part.
[0030] The support part is arranged between the crystal bottom and the heat conducting part, and the support part is made of insulating material. The negative electrode of the crystal bottom is led out of the packaging structure through the negative electrode lead through the first support part and the heat conducting part.
[0031] In a specific implementation, the heat conducting part may be made of a material with high thermal conductivity.
[0032] The packaging structure of this embodiment provides the required temperature environment for the crystal through the heat-conducting part, supports the bottom of the crystal through the first supporting part, and limits the top of the crystal through the sealing shell, thereby achieving packaging and positioning of the crystal while avoiding damage to the crystal; and isolates the sealing shell and the heat-conducting part through the first insulating part, so that the positive and negative poles of the crystal are effectively isolated.
[0033] Example 2
[0034] This embodiment provides a planar crystal packaging structure. This embodiment takes the application to a high-purity germanium crystal with a wing structure as an example.
[0035] like Figure 1 , Figure 2 As shown, the packaging structure includes a crystal 1, a conductive and heat-conducting cover shell 2, a support portion supporting the crystal, and a heat-conducting portion 6. The cover shell 2 packages the crystal 1 on the heat-conducting portion 6, and the cover shell 2 and the heat-conducting portion 6 are connected by a first insulating member 7; the support portion includes a first support portion 3 insulated between the bottom of the crystal 1 and the heat-conducting portion 6, and a second support portion disposed between the crystal 1 and the inner wall of the cover shell 2; a cavity is formed between the second support portion and the surface of the crystal 1; the positive electrode of the crystal 1 is connected to the cover shell 2, and the negative electrode of the crystal 1 is led out of the packaging structure through the first support portion 3 and the heat-conducting portion 6.
[0036] The cover shell 2 is connected to the non-electrode part of the top of the crystal 1 through the soft pressing sheet 9; the packaging structure also includes a spring sheet 10, which is connected to the cover shell 2 and is connected to the positive electrode of the crystal 1. The cover shell 2 avoids the electrode part and does not affect the performance of the crystal 1. In this embodiment, the soft pressing sheet 9 is a Teflon pressing sheet. The non-electrode part of the top of the crystal is limited by the Teflon pressing sheet, and a soft connection is used to prevent damage to the crystal.
[0037] The second supporting part includes a second insulating member 4 and an electrically conductive and heat-conductive member 5 connected to the second insulating member 4. The second insulating member 4 is used to support the wing structure of the germanium crystal. In the present embodiment, the second insulating member 4 is a ceramic ring, the upper part of which supports the wing structure of the germanium crystal, and the lower part is connected to the electrically conductive and heat-conductive member 5; as a specific implementation, the lower part of the ceramic ring and the electrically conductive and heat-conductive member 5 can be connected in a shape-matching manner. As a specific implementation, the electrically conductive and heat-conductive member 5 is a sink structure with a through hole therein, the side end face of the sink structure is adaptively connected to the lower end of the ceramic ring, and the side wall of the sink structure is connected to the cover shell 2; the bottom of the sink structure is also provided with an exhaust hole 51; the bottom of the sink structure is connected to the heat-conductive part 6 through the first insulating member 7.
[0038] The first supporting portion 3 is an insulating platform with a through hole 31 ; as a preferred embodiment, the first supporting portion 3 is made of plastic.
[0039] The heat conducting part 6 is provided with a hollow protruding structure 61, which passes through the through hole of the sink structure and is connected to the first supporting part 3, and is separated from the through hole wall of the sink structure by the third insulating member; the through hole 31 of the first supporting part 3 is connected to the hollow cavity of the protruding structure 61. Specifically, the first supporting part 3 is inserted into the hollow cavity of the protruding structure 61 and is threadedly connected to the protruding structure 61. The negative lead of the crystal 1 is led out of the packaging structure through the through hole 31 and the hollow cavity.
[0040] The packaging structure also includes an insulating soft protective part 8, which is arranged below the crystal 1 and located on the periphery of the first support part 2. As a preferred embodiment, the soft protective part 8 is a nylon protective ring, which includes a large ring end and a small ring end. The large ring end is arranged on the sinking structure to protect the crystal, and the small ring end is inserted into the sinking structure as a third insulating member to isolate the bottom of the conductive and thermal conductive member 5 from the raised structure 61 of the thermal conductive part 6. It can be understood that in a specific implementation, the third insulating member can also be replaced by other insulating members. The provision of the soft protective part 8 avoids damage caused by contact with hard materials due to the tilt of the crystal when installing the crystal.
[0041] As a preferred embodiment, the heat conducting part 6 is sealed and bonded to the first insulating part 7. The cover shell 2 is bolted to the conductive and heat conducting part 5. The heat conducting part 6, the cover shell 2 and the conductive and heat conducting part 5 are all made of aluminum.
[0042] As a preferred embodiment, the materials of the first insulating member 7 and the second insulating member 4 are thermally conductive ceramics. The thermally conductive ceramics are used to achieve heat conduction of the product and perform insulation treatment at the same time.
[0043] The planar crystal packaging structure of this embodiment is easy to install and disassemble, the overall assembly relationship is compact and reliable, and safety can be guaranteed. During assembly, the first insulating member 7 and the heat-conducting part 6 are bonded with a low degassing rate sealant; the second insulating member 4, the conductive and heat-conducting member 5, the soft protective part 8, and the first support part 3 are placed in a fixed position as required; the crystal 1 is placed so that the wing structure of the crystal 1 is supported by the second insulating member 4, and the bottom of the crystal 1 is supported by the first support part 3; the negative lead of the crystal 1 is passed through the through hole 21 of the first support part 3 to the hollow cavity of the convex structure, and is led out through the lead hole provided on the heat-conducting part 6 and connected to the hollow cavity; the soft pressing sheet 9 is provided on the non-electrode part of the top of the crystal 1, the spring 10 is screwed to the cover shell 2, and the cover shell 2 is buckled onto the crystal 1 and screwed.
[0044] The planar crystal packaging structure of this embodiment contacts the wing structure of the crystal through the second insulating part 4, the first support part 3 contacts the bottom of the crystal, and the cover shell 2 is connected to the wing structure through the soft pressing piece 9, which ensures the positioning of the crystal package while minimizing the contact surface between each component and the crystal. For example, there is a hollow cavity between the second support part and the surface of the crystal; and soft connections are mostly used at the joints, such as the soft pressing piece, the material of the first support part 3 and the setting of the nylon protection ring, which effectively avoids damage to the crystal.
[0045] The crystal packaging structure of this embodiment is suitable for packaging planar crystals in a vacuum insulation working environment, and is particularly suitable for packaging high-purity germanium crystals with wing structures.
[0046] It can be understood that although Example 2 takes the packaging structure of a high-purity germanium crystal with a wing structure as an example, other crystals with a wing structure are also possible; the packaging structure shape of the embodiment diagram takes a cylinder as an example, and correspondingly each component takes a ring shape as an example. In actual applications, corresponding changes can also be made according to the different shapes of the planar crystal.
[0047] Obviously, the above embodiments are merely examples for clearly illustrating the technical solution of the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection of the claims of the utility model.
Claims
1. A planar crystal packaging structure, characterized in that: The packaging structure includes a crystal, a conductive and heat-conducting cover shell, a support part, and a heat-conducting part; the cover shell is connected to the non-electrode position on the top of the crystal through a soft pressing sheet, and the crystal is packaged on the heat-conducting part; the cover shell is connected to the heat-conducting part through a first insulating member; the support part includes a cover provided on the An insulating first support portion is provided between the bottom of the crystal and the heat conducting portion; the positive electrode of the crystal is connected to the cover shell, and the negative electrode lead of the crystal passes through the first support portion and the heat conducting portion and is led out of the packaging structure.
2. The planar crystal packaging structure according to claim 1, characterized in that: The support part also includes a second support part arranged between the crystal and the inner wall of the cover shell; the second support part is connected to the non-electrode position of the crystal, and the connecting part is made of insulating material; a cavity is formed between the second support part and the surface of the crystal.
3. The planar crystal packaging structure according to claim 2, characterized in that: The second supporting part comprises a second insulating member and an electrically conductive and thermally conductive member connected to the second insulating member; the second insulating member is connected to a non-electrode position of the crystal, and the electrically conductive and thermally conductive member is connected to the cover shell.
4. The planar crystal packaging structure according to claim 3, characterized in that: The crystal is a crystal with a wing structure, and the second insulating member is used to support the wing structure of the crystal.
5. The planar crystal packaging structure according to claim 3, characterized in that: The material of the second insulating member is ceramic, and the material of the conductive and thermal conductive member is aluminum.
6. The planar crystal package structure according to claim 1, characterized in that: The packaging structure also includes a spring sheet; the spring sheet is connected to the cover shell and is in conduction with the positive electrode of the crystal.
7. The planar crystal packaging structure according to claim 3, characterized in that: The first support part is an insulating platform with a through hole; the heat conducting part is provided with a hollow protruding structure, and the through hole of the first support part is connected with the hollow cavity of the protruding structure; the negative lead of the crystal passes through the through hole of the first support part and the hollow cavity and is led out of the packaging structure.
8. The planar crystal packaging structure according to claim 3, characterized in that: The conductive and heat-conducting member is a sink structure; the side of the sink structure is connected to the second insulating member, and the bottom of the sink structure is connected to the heat-conducting part through the first insulating member.
9. The planar crystal package structure according to claim 7, characterized in that: The conductive and heat-conducting member is a sink structure with a through hole inside; the side of the sink structure is connected to the second insulating member, and the bottom of the sink structure is connected to the heat-conducting part through the first insulating member; the bottom of the sink structure is provided with an air extraction hole; the protruding structure passes through the through hole of the sink structure and connects to the first supporting part A third insulating member is provided between the protruding structure and the through hole wall of the sinking structure.
10. The planar crystal package structure according to claim 1, characterized in that: The heat conducting part is sealed and bonded to the first insulating member.
11. The planar crystal package structure according to claim 3, characterized in that: The sealing cover shell is connected with the conductive and heat conductive member by bolts.
12. The planar crystal package structure according to claim 7, characterized in that: The first supporting portion is connected to the protruding structure via threads.
13. The planar crystal package structure according to claim 1, characterized in that: The packaging structure also includes an insulating soft protection portion, which is arranged below the crystal and located at the periphery of the first supporting portion.
14. The planar crystal package structure according to claim 13, characterized in that: The soft protection part is made of nylon material.
15. The planar crystal package structure according to any one of claims 1 to 14, characterized in that: The heat conducting part and the cover shell are made of aluminum; the first supporting part is made of plastic; and the first insulating part is made of ceramic.