Chip capacitor with support

By designing a patch capacitor with a bracket and using high-temperature welding blocks and metal brackets to elevate the MLCC body, the problem of noise generated by ferroelectric MLCCs under AC electric fields is solved, and the reliability and installation accuracy of the device are improved.

CN222380431UActive Publication Date: 2025-01-21DONGGUAN RUIHANG DIGITAL TECH CO LTD
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Patent Information

Application Number
CN202420144428.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-01-20
Publication Date
2025-01-21
Estimated Expiration
2034-01-20

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  • Figure CN222380431U_ABST
    Figure CN222380431U_ABST
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Abstract

The utility model discloses a chip capacitor with a support, which relates to the field of MLCC supports and comprises an MLCC main body, vertical metal supports are arranged at two ends of the MLCC main body, the MLCC main body is connected with the vertical metal supports through high-temperature welding blocks, transverse metal supports are arranged at the bottom ends of the vertical metal supports, and the transverse metal supports are connected with the MLCC main body through high-temperature welding blocks. A connecting piece is arranged between the two vertical metal brackets; the MLCC main body and the vertical metal bracket are connected together by using the DEG C lead-free high-temperature welding block, so that the MLCC main body is overhead by the vertical metal bracket and the transverse metal bracket, the deformation stress of the MLCC main body can be relieved, and the phenomenon that the MLCC main body is in direct contact with a PCB (Printed Circuit Board) to cause resonance on the PCB when the MLCC main body is deformed and vibrated under the action of voltage is avoided, so that the service life of the MLCC main body is prolonged, and the service life of the MLCC main body is prolonged. Therefore, the generated squeal may cause current fluctuation in the circuit and influence the normal working performance of equipment, and the reliability of the device is improved.
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Description

Technical Field

[0001] The utility model relates to the field of MLCC brackets, in particular to a chip capacitor with a bracket. Background Art

[0002] MLCC, short for chip capacitor, is a ceramic dielectric diaphragm with printed electrodes (inner electrodes) stacked in a dislocated manner, sintered at a high temperature to form a ceramic chip, and then sealed with a metal layer (outer electrode) at both ends of the chip to form a monolithic structure, so it is also called a monolithic capacitor. The ceramic dielectric materials used in the design and manufacture of MLCC mainly include two categories: paraelectric dielectrics and ferroelectric dielectrics. Among them, ferroelectric dielectrics are also called Class II dielectrics, mainly BaTiO3, BaSrTiO3, etc. Ferroelectric dielectrics have strong electrostrictive properties - piezoelectric effect. Therefore, MLCC made of ferroelectric dielectrics (Class II dielectrics), such as X7R / X5R characteristic products, will produce obvious noise howling under the action of a large AC electric field strength. For example, when a large-scale voltage is applied to both ends of the X7R-MLCC, the BaTiO3 ceramic produces an inverse piezoelectric effect, and the MLCC deforms and vibrates and is transmitted to the PCB board to resonate. When the frequency of the voltage signal is within the human hearing range of 20Hz to 20kHz, the capacitor can be heard howling.

[0003] Many mobile electronic devices are close to the human ear, such as laptops, tablets, smartphones, and televisions. Audible noise in the electronic circuits will affect the user experience. In addition to being annoying, the severe howling may also pose a risk of insufficient reliability design.

[0004] To this end, we propose a chip capacitor with a bracket. Utility Model Content

[0005] The utility model provides a chip capacitor with a bracket.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: a chip capacitor with a bracket, comprising an MLCC body, both ends of the MLCC body are provided with vertical metal brackets, the MLCC body and the vertical metal brackets are connected by a high-temperature welding block, the bottom ends of the vertical metal brackets are provided with horizontal metal brackets, and a connecting piece is provided between the two vertical metal brackets.

[0007] Preferably, connecting parts are provided on both sides of the connecting piece, a clamping slot is provided on one side of the connecting part, and a vertical metal bracket is installed on the inner wall of the clamping slot.

[0008] Preferably, a protrusion is provided at the top end of the connector, and the protrusion is placed at the bottom end of the MLCC body and fits with the MLCC body.

[0009] Preferably, a stopper is provided on one side of the protruding portion, and a handle is provided on the top end of the stopper.

[0010] Preferably, a slide groove is provided in the middle of the connecting member, and a support block is slidably mounted on the inner wall of the slide groove.

[0011] Preferably, the plane where the top of the slot is located is lower than the plane where the top of the protruding portion is located.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model connects the MLCC body and the vertical metal bracket together by using a ℃ lead-free high-temperature welding block, so that the vertical metal bracket and the horizontal metal bracket suspend the MLCC body, so that the device can relieve the deformation stress of the MLCC body, and avoid the MLCC body directly contacting the PCB board when the MLCC body is deformed and vibrated under the action of voltage, so that resonance occurs on the PCB board, thereby causing the howling to cause current fluctuations in the circuit, affecting the normal working performance of the equipment, and improving the reliability of the device. At the same time, through the set connecting parts, the positions of the vertical metal bracket and the horizontal metal bracket can be fixed when welding the vertical metal bracket and the horizontal metal bracket, thereby avoiding the position change of the vertical metal bracket and the horizontal metal bracket during welding, and no longer being vertically installed at the two ends of the MLCC body, resulting in the change of the position of the MLCC body due to the change of the position of the vertical metal bracket and the horizontal metal bracket when the MLCC body is installed on the PCB board, thereby affecting the installation of the MLCC body and the PCB, and further even affecting the normal use of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the MLCC main body and the vertical metal bracket after installation of the utility model;

[0016] Figure 3 It is a structural schematic diagram of the connecting piece of the utility model.

[0017] In the figure: 1. MLCC body; 2. High-temperature welding block; 3. Vertical metal bracket; 4. Horizontal metal bracket; 5. Connector; 51. Protrusion; 52. Connecting part; 53. Slot; 55. Slide groove; 56. Support block; 57. Stop block; 58. Handle. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] Example 1

[0020] See also Figure 1-3 , a chip capacitor with a bracket is shown in the figure, including an MLCC body 1, both ends of the MLCC body 1 are provided with vertical metal brackets 3, the MLCC body 1 and the vertical metal bracket 3 are connected by a high-temperature welding block 2, the bottom ends of the vertical metal brackets 3 are provided with horizontal metal brackets 4, and a connecting piece 5 is provided between the two vertical metal brackets 3;

[0021] A 380°C lead-free high-temperature soldering block 2 is used to connect the MLCC body 1 and the vertical metal bracket 3 together, so that the vertical metal bracket 3 and the horizontal metal bracket 4 suspend the MLCC body 1, so that the device can relieve the deformation stress of the MLCC body 1, and avoid the MLCC body 1 directly contacting the PCB board when the MLCC body 1 is deformed and vibrated under the action of voltage, so that the PCB board resonates, thereby causing the howling to cause current fluctuations in the circuit, affecting the normal working performance of the equipment, and improving the reliability of the device. At the same time, through the provided connecting piece 5, the position of the vertical metal bracket 3 and the horizontal metal bracket 4 can be fixed when welding the vertical metal bracket 3 and the horizontal metal bracket 4, thereby avoiding the change of the position of the vertical metal bracket 3 and the horizontal metal bracket 4 during welding, and no longer being vertically installed at both ends of the MLCC body 1, resulting in the change of the position of the MLCC body 1 due to the change of the position of the vertical metal bracket 3 and the horizontal metal bracket 4 when the MLCC body 1 is installed on the PCB board, thereby affecting the installation of the MLCC body 1 and the PCB, and further even affecting the normal use of the equipment.

[0022] Working principle: After preparing the MLCC body 1, place the MLCC body 1 between the vertical metal brackets 3 until one side of the bottom end of the MLCC body 1 abuts against the stopper 57, and then use the high-temperature reflow soldering method to weld the MLCC body 1 and the vertical metal bracket 3 together. After the MLCC body 1 and the vertical metal bracket 3 are welded together, pull the handle 58 so that the handle 58 drives the connector 5 to move from the bottom end of the MLCC body 1. When the connector 5 moves, it drives the connecting part 52 to detach from the outer wall of the vertical metal bracket 3 until the connector 5 is completely pulled out from the bottom end of the MLCC body 1. Then install the horizontal metal bracket 4 to the corresponding position on the PCB board. Regarding the installation method between the horizontal metal bracket 4 and the PCB board, methods such as mounting and reflow soldering can be used. The specific installation method depends on the size of the MLLC, the application environment and other factors. These factors should be considered during installation, and appropriate verification and testing should be performed.

[0023] In addition, when the friction between the connector 5 and the MLCC body 1 is large, the support block 56 can be first pulled out from the inner wall of the slide groove 55, and then the connector 5 can be pulled out from between the MLCC body 1 and the horizontal metal bracket 4, and then the above operation can be repeated to install the MLCC body 1.

[0024] Example 2

[0025] See also Figure 3 This embodiment further explains Example 1. In the figure, connecting parts 52 are provided on both sides of the connecting member 5, a slot 53 is provided on one side of the connecting part 52, and a vertical metal bracket 3 is installed on the inner wall of the slot 53.

[0026] In this embodiment: when the vertical metal bracket 3 is welded to the end of the MLCC body 1, the positions of the vertical metal bracket 3 and the horizontal metal bracket 4 can be limited, so that when the vertical metal bracket 3 is welded, the vertical metal bracket 3 is ensured to be always perpendicular to the MLCC body 1, thereby ensuring the positions of the vertical metal bracket 3 and the horizontal metal bracket 4 after welding, which facilitates the subsequent installation of the MLCC body 1 on the PCB board.

[0027] A protrusion 51 is provided at the top of the connector 5 , and the protrusion 51 is placed at the bottom of the MLCC body 1 and fits with the MLCC body 1 .

[0028] In the present embodiment, when welding the vertical metal brackets 3, the MLCC body 1 can be placed on the raised portion 51 between the vertical metal brackets 3, and then the vertical metal brackets 3 are welded, thereby avoiding the problem that the welding heights of the vertical metal brackets 3 at both ends of the MLCC body 1 are different during welding, thereby affecting the subsequent installation of the horizontal metal bracket 4 and the PCB board, thereby improving the reliability of the device.

[0029] A stopper 57 is provided on one side of the protruding portion 51 , and a handle 58 is provided on the top end of the stopper 57 .

[0030] In this embodiment: the handle 58 is set to be soft, and the stopper 57 is set to limit the position of the MLCC body 1 when the MLCC body 1 is placed on the top of the protrusion 51, thereby ensuring that the vertical metal bracket 3 after welding is symmetrically placed at both ends of the MLCC body 1. At the same time, through the handle 58, after the horizontal metal bracket 4 is welded to the PCB board, in order to better dissipate the heat of the MLCC body 1, the handle 58 can be pulled so that the handle 58 drives the protrusion 51 to detach from the bottom end of the MLCC body 1, thereby maintaining a certain gap between the MLCC body 1 and the PCB board. At the same time, it can also reduce the stress on the components, thereby reducing the risk of cracks and breakage, and further improving the reliability of the equipment.

[0031] The plane where the top of the slot 53 is located is lower than the plane where the top of the protrusion 51 is located; when the vertical metal bracket 3 is welded to the two ends of the MLCC body 1, the high-temperature welding block 2 will not directly contact the top of the slot 53, so that when the connector 5 is pulled out from the bottom end of the MLCC body 1, it is only necessary to overcome the friction between the MLCC body 1 and the connector 5, and there is no need to overcome the adhesion force between the high-temperature welding block 2 and the slot 53, thereby facilitating the removal of the connector 5 from between the MLCC body 1 and the vertical metal bracket 3.

[0032] Example 3

[0033] See also Figure 3 , this embodiment further explains Example 2. In the figure, a slide groove 55 is opened in the middle position of the connector 5, and a support block 56 is slidably installed on the inner wall of the slide groove 55; through the set slide groove 55 and support block 56, after the MLCC body 1 is welded to the vertical metal bracket 3, the extrusion force applied by the MLCC body 1 to the connector 5 is too large, resulting in that after welding, when the connector 5 is pulled, the extrusion force between the MLCC body 1 and the connector 5 is too large, resulting in an increase in the friction between the MLCC body 1 and the connector 5. Therefore, the support block 56 can be pulled out from the inner wall of the slide groove 55 first, and the pressure applied by the MLCC body 1 to the connector 5 is converted into a deformation of the connector 5, thereby reducing the friction between the MLCC body 1 and the connector 5, and facilitating the removal of the connector 5 from between the MLCC body 1 and the horizontal metal bracket 4, avoiding the problem of directly pulling the connector 5 with force, which is easy to cause defects in the welding between the MLCC body 1 and the vertical metal bracket 3, thereby affecting the use of the equipment, and improving the reliability of the device.

[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include"-"comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process-method-article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process-method-article or device.

[0035] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip capacitor with a bracket, characterized in that: The invention comprises an MLCC body (1), both ends of the MLCC body (1) are provided with vertical metal brackets (3), the MLCC body (1) and the vertical metal brackets (3) are connected via a high-temperature welding block (2), the bottom ends of the vertical metal brackets (3) are provided with horizontal metal brackets (4), and a connecting piece (5) is provided between the two vertical metal brackets (3).

2. A chip capacitor with a bracket according to claim 1, characterized in that: Connecting parts (52) are provided on both sides of the connecting member (5), a clamping slot (53) is provided on one side of the connecting part (52), and a vertical metal bracket (3) is installed on the inner wall of the clamping slot (53).

3. A chip capacitor with a bracket according to claim 2, characterized in that: The top end of the connecting piece (5) is provided with a protruding portion (51), and the protruding portion (51) is placed at the bottom end of the MLCC body (1) and fits with the MLCC body (1).

4. The chip capacitor with a bracket according to claim 3, characterized in that: A stopper (57) is provided on one side of the protruding portion (51), and a handle (58) is provided on the top end of the stopper (57).

5. The chip capacitor with a bracket according to claim 1, characterized in that: A sliding groove (55) is provided in the middle of the connecting member (5), and a supporting block (56) is slidably mounted on the inner wall of the sliding groove (55).

6. The chip capacitor with a bracket according to claim 3, characterized in that: The plane where the top end of the clamping groove (53) is located is lower than the plane where the top end of the protruding portion (51) is located.