Glue dipping device

Abstract

The utility model relates to the technical field of semiconductor packaging, in particular to a glue dipping device which comprises a glue dipping base and a glue dipping carrier plate. A glue dipping groove used for containing glue is formed in a glue dipping base, a plurality of containing hole positions for parts to be dipped with glue are formed in a glue dipping carrier plate, and the containing hole positions comprise first containing through holes close to the glue dipping base and second containing through holes far away from the glue dipping base; based on the first placing through hole and the second placing through hole, the part to be dipped with glue can be partially or completely limited in the placing hole position. On the basis of the glue dipping device, glue dipping operation on a plurality of parts to be dipped with glue can be realized at the same time, the glue dipping efficiency is improved, the consistency of the glue dipping thickness of the plurality of glue dipping parts can be improved, and the stability of the coating effect is improved; while the glue dipping efficiency is improved, the cost in the semiconductor packaging production process is reduced.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to a glue dipping device. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process usually includes: wafer cutting, chip mounting, and welding of chips and substrates. Among them, in the chip mounting process, the chip is usually mounted on the corresponding substrate frame using glue by dipping.

[0003] In the prior art, chips and their components are usually mounted by manually dipping in glue, but the efficiency of dipping in glue is low.

[0004] In addition, manual dipping cannot ensure the consistency of glue thickness over multiple times, resulting in unstable device coating effect, prone to mounting abnormalities, and material waste, which will undoubtedly increase the time and material costs in the semiconductor packaging production process. Utility Model Content

[0005] In view of this, an object of an embodiment of the present application is to provide a dipping device to solve the technical problem that the existing dipping method leads to high cost and low production efficiency of semiconductor packaging production.

[0006] The embodiment of the present application provides a glue dipping device, which includes: a glue dipping base and a glue dipping carrier plate;

[0007] The glue dipping base is provided with a glue dipping groove, and the glue dipping groove is used to hold glue;

[0008] The glue dipping carrier is provided with a plurality of placement holes for the glue-dipping parts, and the placement holes include a first placement through hole close to the glue dipping base and a second placement through hole far away from the glue dipping base;

[0009] Wherein, the first placement through hole is configured to limit the piece to be dipped in glue to a side of the first placement through hole away from the glue dipping base; the second placement through hole is configured to limit part or all of the piece to be dipped in glue within the placement hole.

[0010] In the above implementation process, the glue dipping device includes a glue dipping base and a glue dipping carrier; a glue dipping groove for holding glue is provided on the glue dipping base, and a plurality of placement holes for the parts to be glued are provided on the glue dipping carrier, and the placement holes include a first placement through hole close to the glue dipping base and a second placement through hole away from the glue dipping base, based on the first placement through hole and the second placement through hole, the parts to be glued can be partially or completely restricted in the placement holes. Based on the glue dipping device, the glue dipping operation of multiple parts to be glued can be realized at the same time, which improves the glue dipping efficiency, and can also improve the consistency of the glue dipping thickness of multiple glue dipping parts, and improve the stability of the coating effect; while improving the glue dipping efficiency, the cost in the semiconductor packaging production process is reduced. The technical problem that the existing glue dipping method leads to high cost and low production efficiency in semiconductor packaging production is solved.

[0011] Optionally, in an embodiment of the present application, a first positioning member is further provided on the glue dipping base, and a second positioning member is provided on the glue dipping carrier; the setting position of the second positioning member corresponds to the setting position of the first positioning member; the second positioning member is configured to cooperate with the first positioning member to limit the moving path of the glue dipping carrier to the opening direction of the glue dipping groove.

[0012] In the above implementation process, through the cooperation of the first positioning piece on the glue dipping base and the second positioning piece on the glue dipping carrier, the moving path of the glue dipping carrier can be limited to the opening direction of the glue dipping groove; it can be ensured that the moving direction of the workpiece to be dipped in the glue dipping process is perpendicular to the glue surface in the glue dipping groove, so as to further improve the consistency of the glue thickness of multiple workpieces to be dipped placed on the glue dipping carrier.

[0013] Optionally, in an embodiment of the present application, the first positioning member includes a plurality of positioning pins, and the second positioning member includes a plurality of positioning holes; the direction of the positioning pin body is consistent with the opening direction of the glue dipping groove; the positioning holes are configured to limit the moving path of the glue dipping carrier to the opening direction of the glue dipping groove when the positioning pins are inserted; the number of the positioning pins is less than or equal to the number of the positioning holes.

[0014] In the above implementation process, since the direction of the positioning pin is consistent with the opening direction of the glue dipping groove, when the positioning pin is inserted into the positioning hole, the movement path of the glue dipping carrier can be restricted to the opening direction of the glue dipping groove; thereby ensuring that the movement direction of the workpiece to be dipped in the glue dipping process is perpendicular to the glue surface in the glue dipping groove, so as to further improve the consistency of the glue thickness of multiple workpieces to be dipped placed on the glue dipping carrier.

[0015] Optionally, in an embodiment of the present application, the device further includes: an elastic member, which is arranged on a side of the glue dipping base close to the glue dipping carrier; wherein, when the positioning pin is inserted into the positioning hole and the part to be glued is placed on the glue dipping carrier, the glue dipping carrier is isolated from the glue contained in the glue dipping groove based on the support of the elastic member.

[0016] In the above implementation process, since the workpiece to be dipped in glue is placed on the glue dipping carrier, the glue dipping carrier is isolated from the glue contained in the glue dipping groove based on the support of the elastic part; after the glue dipping operation of the workpiece to be dipped in glue is completed by applying pressure to the glue dipping carrier, the glue dipping carrier can be separated from the glue based on the elastic force of the elastic part, thereby improving the glue dipping efficiency.

[0017] Optionally, in an embodiment of the present application, the device also includes: a glue scraper, the glue scraper including a smooth glue scraper bottom surface and a glue scraper limiting member; the glue scraper limiting member is configured to limit the moving path of the glue scraper in the glue scraping direction; the glue scraper is configured to move along the glue scraping direction to realize the glue scraping operation on the glue in the glue dipping groove based on the glue scraper bottom surface.

[0018] In the above implementation process, the moving path of the scraper part is limited in the scraping direction based on the scraper limit part, and the scraper part is controlled to move along the scraping direction. The scraper part can then be used to scrape the glue in the glue dipping groove to ensure that the glue surface is flat, so as to achieve uniform dipping of multiple parts to be dipped in glue placed on the glue dipping carrier.

[0019] Optionally, in an embodiment of the present application, the depth of the glue dipping groove is consistent with the glue dipping depth of the part to be glued.

[0020] In the above implementation process, the depth of the glue dipping groove is consistent with the glue dipping depth of the workpiece to be dipped in glue. It is only necessary to fill the glue dipping groove with glue, and then press the glue dipping carrier to press the bottom surface of the workpiece to be dipped in glue until it contacts the bottom surface of the glue dipping groove. The glue dipping depth of each workpiece to be dipped in glue can be accurately controlled; it can also reduce the difficulty of the glue dipping operation and improve the glue dipping efficiency.

[0021] Optionally, in an embodiment of the present application, the device further includes: a fixing member, which is arranged on a side of the glue dipping carrier away from the glue dipping base; the fixing member is configured to partially or completely cover each piece to be glued placed in the placement hole to fix the piece to be glued in the placement hole.

[0022] In the above implementation process, the workpiece to be dipped in glue placed in the placement hole can be fixed by the fixing piece, thereby improving the stability of the workpiece to be dipped in glue during the dipping process, reducing the difficulty of the dipping operation, and further improving the dipping efficiency.

[0023] Optionally, in an embodiment of the present application, the manufacturing material of the fixing part includes a magnetic material; the device also includes: at least one magnetic suction unit, the magnetic suction unit is arranged on the side of the glue-dipping carrier away from the glue-dipping base; the magnetic suction unit is configured to fix the fixing part on the side of the glue-dipping carrier away from the glue-dipping base.

[0024] In the above-mentioned implementation process, since the manufacturing material of the fixing part includes magnetic material, by arranging at least one magnetic attraction unit on the side of the glue-dipping carrier away from the glue-dipping base, the fixed connection between the fixing part and the glue-dipping carrier can be achieved based on the magnetic attraction unit; and the fixing part partially or completely covers each part to be dipped in glue placed in the placement hole, thereby achieving fixation of the part to be dipped in glue based on the fixing part.

[0025] Optionally, in an embodiment of the present application, at least one mounting hole is provided on a side of the glue-dipping carrier away from the glue-dipping base, and the number of the mounting holes is consistent with the number of the magnetic units; the hole size of the mounting hole is consistent with the size of the magnetic unit, and the magnetic unit is configured to be installed in the mounting hole.

[0026] In the above implementation process, at least one mounting hole is opened on the side of the dipped glue carrier away from the dipped glue base, and the magnetic unit is installed in the mounting hole; the surface flatness of the side of the dipped glue carrier away from the dipped glue base can be improved, thereby improving the connection stability between the magnetic unit and the fixing part made of magnetic material.

[0027] Optionally, in an embodiment of the present application, the part to be dipped in glue includes a rectangular flow channel; the cross-sections of the first placement through hole and the second placement through hole include rectangular cross-sections; the cross-sectional length of the first placement through hole is smaller than the length of the rectangular flow channel, and / or the cross-sectional width of the first placement through hole is smaller than the width of the rectangular flow channel; the cross-sectional length of the second placement through hole is greater than or equal to the length of the rectangular flow channel, and the cross-sectional width of the second placement through hole is greater than or equal to the width of the rectangular flow channel.

[0028] The beneficial effects of the present application are as follows: providing a glue dipping device, including a glue dipping base and a glue dipping carrier; by providing a glue dipping groove for holding glue on the glue dipping base, and providing a plurality of placement holes for the parts to be dipped in glue on the glue dipping carrier, and the placement holes include a first placement through hole close to the glue dipping base and a second placement through hole away from the glue dipping base, based on the first placement through hole and the second placement through hole, the parts to be dipped in glue can be partially or completely confined within the placement holes. Based on the glue dipping device, the glue dipping operation of multiple parts to be dipped in glue can be realized at the same time, which improves the glue dipping efficiency, and can also improve the consistency of the glue dipping thickness of multiple glue dipping parts, and improve the stability of the coating effect; while improving the glue dipping efficiency, the cost in the semiconductor packaging production process is reduced. The technical problem that the existing glue dipping method leads to high cost and low production efficiency in semiconductor packaging production is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 A schematic diagram of the structure of a glue dipping device provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of the structure of a dipped glue carrier provided in an embodiment of the present application;

[0032] Figure 3 A schematic structural diagram of another glue dipping device provided in an embodiment of the present application.

[0033] Figure markings: 01-glue dipping device; 02-glue dipping device; 10-glue dipping base; 101-glue dipping groove; 102-first positioning member; 20-glue dipping carrier; 201-placement hole; 2011-first placement through hole; 2012-second placement through hole; 202-second positioning member; 203-installation hole; 30-elastic member; 40-glue scraping member; 50-fixing member. DETAILED DESCRIPTION

[0034] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0036] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] Please refer to Figure 1 , Figure 1 The structure diagram of a glue dipping device 01 provided in an embodiment of the present application. The glue dipping device 01 comprises: a glue dipping base 10 and a glue dipping carrier plate 20;

[0038] The glue dipping base 10 is provided with a glue dipping groove 101, and the glue dipping groove 101 is used to hold glue;

[0039] The glue-dipping carrier plate 20 is provided with a plurality of placement holes 201 for the glue-dipping parts, and the placement holes 201 include a first placement through hole 2011 close to the glue-dipping base 10 and a second placement through hole 2012 away from the glue-dipping base 10;

[0040] Among them, the first placement through hole 2011 is configured to limit the piece to be dipped in glue to a side of the first placement through hole 2011 away from the glue dipping base; the second placement through hole 2012 is configured to limit part or all of the piece to be dipped in glue within the placement hole 201.

[0041] Among them, the shape of the glue dipping base 10 can be cylindrical, cubic or other reasonable shapes, and the height of the glue dipping base 10 is greater than the glue dipping depth of the part to be dipped in glue. The shape of the glue dipping carrier 20 can also be cylindrical, cubic or other reasonable shapes, and the depth of the glue dipping carrier 20 can be determined according to the type of the actual part to be dipped in glue. The opening direction of the glue dipping groove 101 can be consistent with the actual glue dipping direction of the part to be dipped in glue, and the depth of the glue dipping groove 101 is greater than or equal to the glue dipping depth of the part to be dipped in glue. The glue contained in the glue dipping groove 101 can be glue or solid glue, etc. The number of placement holes 201 on the glue dipping carrier 20 can be 3, 6, 10 or other reasonable values. The shape of the first through hole 2011 can be circular, rectangular or other reasonable shapes, and the shape of the second through hole 2012 can also be circular, rectangular or other reasonable shapes; specifically, the shape of the first through hole 2011 can be determined according to the shape of the area on the part to be dipped in glue, and the shape of the second through hole 2012 can be determined according to the shape of the part to be dipped in glue.

[0042] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of a dipped glue carrier provided in an embodiment of the present application. It should be noted that: Figure 2 Specifically shown is as follows Figure 1 A front view of a glue-dipping carrier plate in the glue-dipping device shown; Figure 1 The example shows that the number of placement holes is 4, and the shapes of the first placement through hole 2011 and the second placement through hole 2012 are both rectangular.

[0043] Wherein, when the through-hole shapes of the first placement through-hole 2011 and the second placement through-hole 2012 are both rectangular, the bottom width of the piece to be glued is greater than the through-hole width of the first placement through-hole 2011, and / or the bottom length of the piece to be glued is greater than the through-hole length of the first placement through-hole 2011; and the bottom width of the piece to be glued is less than the through-hole width of the second placement through-hole 2012, and the bottom length of the piece to be glued is less than the through-hole length of the second placement through-hole 2012. So that the piece to be glued can be inserted into the second placement through-hole 2012, but cannot be inserted into the first placement through-hole 2011, so that the piece to be glued is restricted to the side away from the glue dipping base 10 based on the first placement through-hole 2011, and the piece to be glued is partially or completely restricted to the placement hole position 201 based on the second placement through-hole 2012. In this way, the glue dipping operation of the pieces to be glued in multiple placement hole positions 201 is realized by moving the glue dipping carrier 20.

[0044] It can be seen that the glue dipping device 01 provided in the embodiment of the present application is provided with a glue dipping groove 101 for holding glue on the glue dipping base 10, and a plurality of placement holes 201 for the parts to be glued are provided on the glue dipping carrier 20, and the placement holes 201 include a first placement through hole 2011 close to the glue dipping base 10 and a second placement through hole 2012 away from the glue dipping base 10, and the parts to be glued can be restricted in the placement holes 201 based on the first placement through hole 2011 and the second placement through hole 2012. Based on the glue dipping device, the glue dipping operation of multiple parts to be glued can be realized at the same time, which improves the glue dipping efficiency, and can also improve the consistency of the glue dipping thickness of multiple glue dipping parts, and improve the stability of the coating effect; while improving the glue dipping efficiency, the cost in the semiconductor packaging production process is reduced.

[0045] Please refer to Figure 3 , Figure 3 A schematic structural diagram of another glue dipping device 02 provided in an embodiment of the present application.

[0046] In some optional embodiments, a first positioning member 102 is further provided on the glue dipping base 10, and a second positioning member 202 is provided on the glue dipping carrier 20; the setting position of the second positioning member 202 corresponds to the setting position of the first positioning member 102; the second positioning member 202 is configured to cooperate with the first positioning member 102 to limit the moving path of the glue dipping carrier 20 to the opening direction of the glue dipping groove 101.

[0047] The first positioning member 102 can be implemented by one of the positioning pin and the positioning hole, or by one of the slide groove and the slider; when the first positioning member 102 is implemented by one of the positioning pin and the positioning hole, the second positioning member 202 is implemented by the other of the positioning pin and the positioning hole; when the first positioning member 102 is implemented by one of the slide groove and the slider, the second positioning member 202 is implemented by the other of the slide groove and the slider. The opening direction of the glue dipping groove 101 refers to the direction perpendicular to the adhesive surface in the glue dipping groove 101. Figure 3 What is shown in FIG. 1 is a situation where the first positioning member 102 is implemented by a positioning nail, and the second positioning member 202 is implemented by a positioning hole.

[0048] In some optional embodiments, the first positioning member 102 includes a plurality of positioning pins, and the second positioning member 202 includes a plurality of positioning holes; the direction of the positioning pin body is consistent with the opening direction of the glue dipping groove 101; the positioning holes are configured to limit the moving path of the glue dipping carrier 20 to the opening direction of the glue dipping groove 101 when the positioning pins are inserted; the number of the positioning pins is less than or equal to the number of the positioning holes.

[0049] Among them, the number of positioning pins can be 2, 4 or other reasonable values, the number of positioning holes is greater than or equal to the number of positioning pins, and the opening position of the positioning holes corresponds to the setting position of the positioning pins. A plurality of positioning pins can be evenly arranged around the glue dipping groove 101 opened on the glue dipping base 10. The direction of the positioning pin body is consistent with the opening direction of the glue dipping groove 101, that is, the direction of the positioning pin body is also perpendicular to the adhesive surface in the glue dipping groove 101; when the positioning pin is inserted into the positioning hole, the moving path of the glue dipping carrier 20 can be limited to the opening direction of the glue dipping groove 101; thereby ensuring that the moving direction of the glued parts to be dipped in the glue dipping process is perpendicular to the glue surface in the glue dipping groove 101, so as to further improve the consistency of the glue thickness of the multiple glued parts to be dipped placed on the glue dipping carrier 20. Figure 3 The illustrated case is one in which the number of positioning pins is 4 and the number of positioning holes is also 4.

[0050] In some optional embodiments, the device also includes: an elastic member 30, which is arranged on one side of the glue dipping base 10 close to the glue dipping carrier 20; wherein, when the positioning pin is inserted into the positioning hole and the glue-dipping part is placed on the glue dipping carrier 20, the glue dipping carrier 20 is isolated from the glue contained in the glue dipping groove 101 based on the support of the elastic member 30.

[0051] The elastic member 30 can be specifically implemented by a plurality of elastic elements, such as metal coil springs or rubber springs. When the workpiece to be dipped is placed on the dipped glue carrier 20, the dipped glue carrier 20 is isolated from the glue contained in the dipped glue tank 101 based on the support of the elastic member 30; the dipped glue operation of the workpiece to be dipped can be completed by applying pressure to the dipped glue carrier 20. After the dipped glue operation is completed, the applied pressure is removed, and the dipped glue carrier 20 can be separated from the glue in the dipped glue tank 101 based on the elastic force of the elastic member 30 or assisted in being separated, thereby improving the dipped glue efficiency.

[0052] In some optional embodiments, the device also includes: a glue scraper 40, the glue scraper 40 includes a smooth glue scraper bottom surface and a glue scraper limiting member; the glue scraper limiting member is configured to limit the moving path of the glue scraper in the glue scraping direction; the glue scraper is configured to move along the glue scraping direction to realize the glue scraping operation on the glue in the glue dipping groove 101 based on the glue scraper bottom surface.

[0053] Among them, the smooth bottom surface of the scraper means that the bottom surface of the scraper has no obvious protrusions or depressions. The scraper limiter can be realized by sliders arranged at both ends of the scraper 40, and the connection direction between the sliders at both ends of the scraper 40 is perpendicular to the scraping direction. Based on the scraper limiter, the moving path of the scraper 40 is limited to the scraping direction, and the scraper 40 is controlled to move along the scraping direction. The scraper 40 can be used to scrape the glue in the glue dipping groove 101 to ensure that the glue surface is flat; so as to achieve uniform dipping of multiple glue-to-be-dipped parts placed on the glue dipping carrier 20. Among them, Figure 3 The scraping direction of the scraper 40 shown in FIG. 1 is the left-right direction.

[0054] In the case where the glue dipping is achieved by glue, the glue scraping member 40 may further include a glue scraping groove for holding glue, and a glue filling hole is opened at the bottom of the glue scraping groove. After the glue depth in the glue dipping groove 101 is lower than the target depth, the glue scraping operation can be performed on the glue in the glue dipping groove 101 based on the glue scraping member 40 containing glue in the glue scraping groove by holding glue in the glue scraping groove; and during the execution of the glue scraping operation, the glue in the glue dipping groove 101 is supplemented based on the glue in the glue scraping groove. In this way, after the glue in the glue dipping groove 101 is supplemented, the flatness of the glue surface can also be ensured.

[0055] In some optional embodiments, the depth of the glue dipping groove 101 is consistent with the glue dipping depth of the workpiece to be glued.

[0056] Among them, since the depth of the glue dipping groove 101 is consistent with the glue dipping depth of the workpiece to be dipped in glue, it is only necessary to fill the glue dipping groove 101 with glue, and then press the glue dipping carrier 20 to press the bottom surface of the workpiece to be dipped in glue until it contacts the bottom surface of the glue dipping groove 101, so that each workpiece to be dipped in glue can be accurately dipped in glue, thereby improving the glue dipping efficiency.

[0057] In some optional embodiments, the device also includes: a fixing member 50, which is arranged on a side of the glue dipping carrier 20 away from the glue dipping base 10; the fixing member 50 is configured to partially or completely cover each piece to be glued placed in the placement hole 201, so as to fix the piece to be glued in the placement hole 201.

[0058] Among them, the fixing member 50 can be connected to the glue-dipping carrier plate 20 based on a buckle structure or a bolt connection structure to fix the glue-dipping piece in the placement hole 201. The fixing member 50 can also be made of a magnetic material, and a magnetic unit is provided on the side of the glue-dipping carrier plate 20 away from the glue-dipping base 10, and the fixing member 50 is connected to the glue-dipping carrier plate 20 based on the magnetic unit to fix the glue-dipping piece in the placement hole 201. The fixing member 50 fixes the glue-dipping piece placed in the placement hole 201, improves the stability of the glue-dipping piece during the glue-dipping process, reduces the difficulty of the glue-dipping operation, and further improves the glue-dipping efficiency.

[0059] In some optional embodiments, the manufacturing material of the fixing member 50 includes a magnetic material; the device also includes: at least one magnetic unit, which is arranged on the side of the glue-dipping carrier 20 away from the glue-dipping base 10; the magnetic unit is configured to fix the fixing member 50 on the side of the glue-dipping carrier 20 away from the glue-dipping base 10.

[0060] Among them, the manufacturing material of the fixing part 50 may include magnetic materials such as ferromagnetic material, ferrite material, and perovskite material. The magnetic attraction unit can be realized by a device that can attract ferromagnetic materials, and the number of magnetic attraction units can be 1, 6, 12 or other reasonable values. Since the manufacturing material of the fixing part 50 includes magnetic material, by setting at least one magnetic attraction unit on the side of the dipped glue carrier 20 away from the dipped glue base 10, the fixing part 50 can be fixedly connected to the dipped glue carrier 20 based on the magnetic attraction unit; and the fixing part 50 partially or completely covers each part to be dipped glue placed in the placement hole 201, and then the fixation of the part to be dipped glue is realized based on the fixing part 50.

[0061] In some optional embodiments, at least one mounting hole 203 is further provided on a side of the glue-dipping carrier 20 away from the glue-dipping base 10, and the number of the mounting holes 203 is consistent with the number of the magnetic units; the hole size of the mounting hole 203 is consistent with the size of the magnetic unit, and the magnetic unit is configured to be installed in the mounting hole 203.

[0062] The number of the mounting holes 203 may be 1, 6, 18 or other reasonable values. Figure 3 Specifically, the number of mounting holes 203 is 9. By opening at least one mounting hole 203 on the side of the dipped glue carrier 20 away from the dipped glue base 10, the magnetic unit is installed in the mounting hole 203; the surface flatness of the side of the dipped glue carrier 20 away from the dipped glue base 10 can be improved, thereby improving the connection stability between the magnetic unit and the fixing member 50 made of magnetic material.

[0063] Among them, the part to be dipped in glue may include a flow channel, for example, a rectangular flow channel. A rectangular flow channel refers to a rectangular device including a liquid flow path. In biochip packaging, a rectangular flow channel is usually mounted on a chip to detect liquids such as blood or plant juice. A rectangular flow channel is one of the common flow channels in current biochip packaging, and the shape of the flow channel can also be set to a circular, elliptical or polygonal shape according to actual application requirements. It can be understood that in the case where the part to be dipped in glue includes a rectangular flow channel, the cross-section of the first placement through hole 2011 and the second placement through hole 2012 may include a rectangular cross-section; it may also include a circular, convex polygonal or concave polygonal cross-section, etc. As long as the part to be dipped in glue can be limited to the side of the first placement through hole 2011 away from the dipped glue base 10 based on the first placement through hole 2011; for example, in the case where the part to be dipped in glue includes a rectangular flow channel and the cross-section of the first placement through hole 2011 includes a circular cross-section, the diameter of the circular cross-section of the first placement through hole 2011 needs to be smaller than the width of the rectangular flow channel.

[0064] In some optional embodiments, the part to be dipped in glue includes a rectangular flow channel; the cross-sections of the first placement through hole 2011 and the second placement through hole 2012 include rectangular cross-sections; the cross-sectional length of the first placement through hole 2011 is less than the length of the rectangular flow channel, and / or the cross-sectional width of the first placement through hole 2011 is less than the width of the rectangular flow channel; the cross-sectional length of the second placement through hole 2012 is greater than or equal to the length of the rectangular flow channel, and the cross-sectional width of the second placement through hole 2012 is greater than or equal to the width of the rectangular flow channel.

[0065] Wherein, in the case where the cross-sectional length of the first placement through hole 2011 is less than the length of the rectangular flow channel, the cross-sectional width of the first placement through hole 2011 may be less than the width of the rectangular flow channel, or may be greater than or equal to the width of the rectangular flow channel; in the case where the cross-sectional width of the first placement through hole 2011 is less than the width of the rectangular flow channel, the cross-sectional length of the first placement through hole 2011 may be greater than or equal to the length of the rectangular flow channel. Specifically, the cross-sectional length of the first placement through hole 2011 may be 1 / 2, 4 / 5 or other reasonable values ​​of the length of the rectangular flow channel, and the cross-sectional width of the first placement through hole 2011 may be 2 / 3, 5 / 6 or other reasonable values ​​of the width of the rectangular flow channel, and this application does not make specific limitations on this.

[0066] In the several embodiments provided in the embodiments of the present application, it should be understood that the disclosed device can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices according to the multiple embodiments of the embodiments of the present application. In this regard, each box in the block diagram can represent a module or a part of a module. It should also be noted that each box in the block diagram, and the combination of boxes in the block diagram, can be implemented with a dedicated hardware-based system that performs a specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0067] In addition, the functional modules in each embodiment of the present application can be integrated together to form an independent part, or each module can exist separately, or two or more modules can be integrated to form an independent part.

[0068] The above description is only an optional implementation manner of the embodiments of the present application, but the protection scope of the embodiments of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or replacements within the technical scope disclosed in the embodiments of the present application, which should be covered within the protection scope of the embodiments of the present application.

Claims

1. A glue dipping device, characterized in that: The device comprises: a glue dipping base and a glue dipping carrier plate; The glue dipping base is provided with a glue dipping groove, and the glue dipping groove is used to hold glue; The glue dipping carrier is provided with a plurality of placement holes for the glue-dipping parts, and the placement holes include a first placement through hole close to the glue dipping base and a second placement through hole far away from the glue dipping base; Wherein, the first placement through hole is configured to limit the piece to be dipped in glue to a side of the first placement through hole away from the glue dipping base; the second placement through hole is configured to limit part or all of the piece to be dipped in glue within the placement hole.

2. The device according to claim 1, characterized in that The glue dipping base is also provided with a first positioning piece, and the glue dipping carrier is provided with a second positioning piece; The setting position of the second positioning member corresponds to the setting position of the first positioning member; the second positioning member is configured to cooperate with the first positioning member to limit the moving path of the glue dipping carrier to the opening direction of the glue dipping groove.

3. The device according to claim 2, characterized in that The first positioning member includes a plurality of positioning pins, and the second positioning member includes a plurality of positioning holes; The direction of the positioning pin is consistent with the opening direction of the glue dipping groove; the positioning hole is configured to limit the moving path of the glue dipping carrier to the opening direction of the glue dipping groove when the positioning pin is inserted; The number of the positioning pins is less than or equal to the number of the positioning holes.

4. The device according to claim 3, characterized in that The device further comprises: an elastic member, the elastic member being arranged on a side of the glue dipping base close to the glue dipping carrier; Wherein, when the positioning pin is inserted into the positioning hole and the workpiece to be dipped in glue is placed on the glue-dipping carrier, the glue-dipping carrier is isolated from the glue contained in the glue-dipping groove based on the support of the elastic member.

5. The device according to claim 1, characterized in that The device further comprises: a rubber scraping member, wherein the rubber scraping member comprises a smooth rubber scraping bottom surface and a rubber scraping limiting member; The scraping limiter is configured to limit the moving path of the scraping member to the scraping direction; The scraper is configured to move along the scraper direction to implement a scraper operation on the glue in the glue dipping groove based on the scraper bottom surface.

6. The device according to claim 1, characterized in that The depth of the glue dipping groove is consistent with the glue dipping depth of the workpiece to be glued.

7. The device according to claim 1, characterized in that The device further comprises: a fixing member, the fixing member being arranged on a side of the glue dipping carrier away from the glue dipping base; The fixing member is configured to partially or completely cover each piece to be dipped in glue placed in the placement hole, so as to fix the piece to be dipped in glue in the placement hole.

8. The device according to claim 7, characterized in that The fixing member is made of a material including a magnetic material; The device also includes: at least one magnetic unit, which is arranged on a side of the glue-dipping carrier away from the glue-dipping base; the magnetic unit is configured to fix the fixing component on a side of the glue-dipping carrier away from the glue-dipping base.

9. The device according to claim 8, characterized in that The side of the glue-dipping carrier away from the glue-dipping base is also provided with at least one mounting hole, and the number of the mounting holes is consistent with the number of the magnetic suction units; The size of the installation hole is consistent with the size of the magnetic unit, and the magnetic unit is configured to be installed in the installation hole.

10. The device according to any one of claims 1 to 9, characterized in that: in, The part to be dipped in glue comprises a rectangular flow channel; The cross-sections of the first placement through-hole and the second placement through-hole include rectangular cross-sections; The cross-sectional length of the first placement through hole is smaller than the length of the rectangular flow channel, and / or the cross-sectional width of the first placement through hole is smaller than the width of the rectangular flow channel; the cross-sectional length of the second placement through hole is greater than or equal to the length of the rectangular flow channel, and the cross-sectional width of the second placement through hole is greater than or equal to the width of the rectangular flow channel.

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