Electromagnetic shielding film and circuit board

Abstract

The utility model provides an electromagnetic shielding film and a circuit board, relates to the circuit board technology field, and comprises a flexible circuit board, one end of the flexible circuit board is fixedly connected with a first FPC connector, the surfaces of the two sides of the flexible circuit board are coated with electromagnetic shielding films, and one side of the first FPC connector is fixedly connected with a multilayer circuit board. According to the utility model, the flexible circuit board and the multi-layer circuit board are combined for use, the FPC connector I electrically connected with one side of the flexible circuit board and the FPC connector II electrically connected with the substrate on the surface of one side of the multi-layer circuit board are connected by adopting a pressing process, so that the flexible circuit board is electrically connected with the multi-layer circuit board; a double-sided PI plate copper-clad plate adopted by the flexible circuit board has the advantages of high heat resistance and good dimensional stability, and a substrate and a dielectric layer in the multilayer circuit board are respectively made of an FR-4 material and a glass fiber material, so that the whole device simultaneously has the characteristics of an FPC and the characteristics of a PCB, and the applicability of the device is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to an electromagnetic shielding film and a circuit board. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts.

[0003] In the prior art, with the upgrading of electrical equipment, simple circuit boards or flexible circuit boards are gradually unable to meet the needs. Due to their single functions, their usage scenarios have become fewer and their applicability is low.

[0004] Therefore, an electromagnetic shielding film and a circuit board are proposed to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to solve the problems existing in the prior art.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an electromagnetic shielding film and a circuit board, comprising: a flexible circuit board, one end of which is fixedly connected to an FPC connector 1, the surfaces of both sides of the flexible circuit board are coated with an electromagnetic shielding film, and one side of the FPC connector 1 is fixedly connected to a multilayer circuit board;

[0007] The multilayer circuit board includes multiple substrates, a dielectric layer is fixedly connected between every two of the substrates, multiple plated through holes are opened on the surfaces of the multiple substrates and the dielectric layer, and one side of one of the substrates is connected to FPC connector 2.

[0008] As a preferred implementation, the material used for the flexible circuit board is a double-sided PI copper clad laminate.

[0009] As a preferred embodiment, the electromagnetic shielding film is made of a polyimide film.

[0010] As a preferred implementation, the surface of the second FPC connector is connected to one side of the first FPC connector.

[0011] As a preferred implementation, the substrate is made of FR-4 material.

[0012] As a preferred implementation, the medium layer is made of glass fiber.

[0013] Compared with the prior art, the advantages and positive effects of the utility model are:

[0014] 1. The utility model adopts a flexible circuit board and a multi-layer circuit board for combined use. An FPC connector 1 electrically connected to one side of the flexible circuit board and an FPC connector 2 electrically connected to a substrate on a surface of one side of the multi-layer circuit board are connected by a pressing process, so that the flexible circuit board and the multi-layer circuit board are electrically connected. The double-sided PI board copper clad board adopted by the flexible circuit board has the advantages of high heat resistance and good dimensional stability. The substrate and the dielectric layer in the multi-layer circuit board are respectively made of FR-4 material and glass fiber material, wherein the FR-4 material has good insulation, heat resistance and corrosion resistance, and is suitable for making high-layer and high-density circuit boards. The glass fiber material has strong mechanical strength and electrical properties, and the cost is relatively low. The glass fiber material has excellent mechanical strength, isolation and dimensional stability, can work in high temperature and high humidity environments, and is widely used in the manufacture of single-layer boards and multi-layer boards, so that the overall device has both the characteristics of FPC and PCB, thereby improving the applicability of the device.

[0015] 2. The electromagnetic shielding film coated on both sides of the flexible circuit board of the utility model is made of polyimide film, which is a polymer material characterized by high strength, high temperature stability and good corrosion resistance. Polyimide film is widely used in electronic products and can be used as the substrate of electromagnetic shielding film to play a role of protection and isolation. The electromagnetic shielding film can effectively improve the conductive performance of the flexible circuit board and ensure the stability and reliability of the circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the main body of the electromagnetic shielding film and circuit board provided by the utility model;

[0017] Figure 2 A structural disassembly diagram of the electromagnetic shielding film and circuit board provided by the utility model;

[0018] Figure 3 A cross-sectional view of a multilayer circuit board of an electromagnetic shielding film and a circuit board provided by the utility model;

[0019] Figure 4 This is a cross-sectional view of the electromagnetic shielding film and the flexible circuit board of the circuit board provided by the utility model.

[0020] Legend:

[0021] 1. Flexible circuit board; 101. FPC connector one; 2. Electromagnetic shielding film; 3. Multilayer circuit board; 301. Substrate; 302. Dielectric layer; 303. Plated through hole; 304. FPC connector two. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-4 The utility model provides a technical solution: an electromagnetic shielding film and a circuit board, comprising: a flexible circuit board 1, one end of the flexible circuit board 1 is fixedly connected to an FPC connector 101, the surfaces of both sides of the flexible circuit board 1 are coated with an electromagnetic shielding film 2, and one side of the FPC connector 101 is fixedly connected to a multilayer circuit board 3;

[0024] The multilayer circuit board 3 includes multiple substrates 301, and a dielectric layer 302 is fixedly connected between every two substrates 301. The surfaces of the multiple substrates 301 and the dielectric layer 302 are penetrated with multiple plated through holes 303, and one side of one substrate 301 is connected to an FPC connector 2 304.

[0025] Specifically: the flexible circuit board 1 and the multilayer circuit board 3 are pressed and connected to form a whole through the FPC connector 101 and the FPC connector 2 304, so that the device has the characteristics of both FPC and PCB, improving the applicability of the device, and the electromagnetic shielding film 2 shields the flexible circuit board 1 from electromagnetic waves and improves flexibility and durability.

[0026] In one embodiment, the material used for the flexible circuit board 1 is a double-sided PI copper clad laminate.

[0027] Specific: Double-sided PI copper-clad board has the advantages of high heat resistance and good dimensional stability.

[0028] In one embodiment, the material used for the electromagnetic shielding film 2 is a polyimide film.

[0029] Specific: Polyimide film is a polymer material, which is characterized by high strength, high temperature stability and good corrosion resistance, and plays an isolation and protection role.

[0030] In one embodiment, a surface of the second FPC connector 304 is connected to a side of the first FPC connector 101 .

[0031] Specifically: the second FPC connector 304 is connected to the first FPC connector 101 , so that the flexible circuit board 1 and the multi-layer circuit board 3 are electrically connected.

[0032] In one embodiment, the substrate 301 is made of FR-4 material.

[0033] Specifically: FR-4 material has good insulation, heat resistance and corrosion resistance, and is suitable for making high-layer, high-density circuit boards.

[0034] In one embodiment, the dielectric layer 302 is made of fiberglass.

[0035] Specific: It has strong mechanical strength and electrical properties, and the cost is relatively low. Glass fiber material has excellent mechanical strength, isolation and dimensional stability, can work in high temperature and high humidity environments, and is widely used in the manufacture of single-layer boards and multi-layer boards.

[0036] Working principle: This device uses a flexible circuit board 1 and a multilayer circuit board 3 for combined use. The FPC connector 101 electrically connected to one side of the flexible circuit board 1 and the FPC connector 2 304 electrically connected to the substrate 301 on the surface of one side of the multilayer circuit board 3 are connected by a pressing process to electrically connect the flexible circuit board 1 and the multilayer circuit board 3. The double-sided PI copper-clad board used in the flexible circuit board 1 has the advantages of high heat resistance and good dimensional stability. The substrate 301 and the dielectric layer 302 in the multilayer circuit board 3 are made of FR-4 material and glass fiber material respectively, among which FR-4 material has good insulation properties. , heat resistance and corrosion resistance, suitable for making high-layer and high-density circuit boards, with strong mechanical strength and electrical properties, and relatively low cost. The glass fiber material has excellent mechanical strength, isolation and dimensional stability, can work in high temperature and high humidity environments, and is widely used in the manufacture of single-layer boards and multi-layer boards, so that the device as a whole has both the characteristics of FPC and PCB, improving the applicability of the device; the electromagnetic shielding film 2 coated on both sides of the surface of the flexible circuit board 1 is made of polyimide film material. Polyimide film is a polymer material characterized by high strength, high temperature stability and good corrosion resistance. Polyimide film is widely used in electronic products and can be used as a substrate for electromagnetic shielding film, which plays a role of protection and isolation. The electromagnetic shielding film 2 can effectively improve the conductive performance of the flexible circuit board 1 and ensure the stability and reliability of the circuit.

[0037] The above description is only a preferred embodiment of the present invention and does not limit the present invention in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes and apply it to other fields. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims

1. An electromagnetic shielding film and a circuit board, characterized in that: include: A flexible circuit board (1), one end of the flexible circuit board (1) being fixedly connected to an FPC connector (101), surfaces on both sides of the flexible circuit board (1) being coated with an electromagnetic shielding film (2), and one side of the FPC connector (101) being fixedly connected to a multilayer circuit board (3); The multilayer circuit board (3) comprises a plurality of substrates (301), a dielectric layer (302) being fixedly connected between every two of the substrates (301), a plurality of plated through holes (303) being provided through the surfaces of the plurality of substrates (301) and the dielectric layer (302), and a second FPC connector (304) being connected to one side of one of the substrates (301).

2. The electromagnetic shielding film and circuit board according to claim 1, characterized in that: The material used for the flexible circuit board (1) is a double-sided PI copper-clad board.

3. The electromagnetic shielding film and circuit board according to claim 1, characterized in that: The material used for the electromagnetic shielding film (2) is a polyimide film.

4. The electromagnetic shielding film and circuit board according to claim 1, characterized in that: The surface of the second FPC connector (304) is connected to one side of the first FPC connector (101).

5. The electromagnetic shielding film and circuit board according to claim 1, characterized in that: The substrate (301) is made of FR-4 material.

6. The electromagnetic shielding film and circuit board according to claim 1, characterized in that: The medium layer (302) is made of glass fiber.

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