Temperature-adjustable injection pump for preparing constant-temperature microspheres and constant-temperature microsphere preparation instrument

Abstract

The utility model discloses a temperature-adjustable injection pump for preparing constant-temperature microspheres and a constant-temperature microsphere preparation instrument. The injection pump for preparing the constant-temperature microspheres comprises an injector and a driving mechanism and is provided with an installation cavity, the injector is installed in the installation cavity, and the injection pump comprises a temperature adjusting module. The constant-temperature microsphere preparation instrument comprises an injection pump, a microsphere forming device and a curing device, the discharging end of the injection pump is connected with the feeding end of the microsphere forming device, the discharging end of the microsphere forming device is connected with the feeding end of the curing device, and the injection pump is as mentioned above. As the injection pump for preparing the constant-temperature microspheres is provided with the temperature adjusting module, if the environment temperature in the mounting cavity is greatly different from the temperature required for preparing the microspheres; the temperature of the injector in the mounting cavity can be adjusted only by starting the temperature adjusting module to adjust the environment temperature in the mounting cavity, so that the material temperature in the injector is indirectly adjusted, the material temperature meets the temperature requirement of the microsphere preparation process, and the injection pump can pump out the material meeting the temperature requirement for microsphere preparation.

Description

Technical Field

[0001] The utility model relates to the technical field of microsphere preparation, in particular to a thermostatic microsphere preparation injection pump and a thermostatic microsphere preparation instrument. Background Art

[0002] The microsphere preparation apparatus usually includes a syringe pump, a microsphere forming device and a curing device. The discharge end of the syringe pump is connected to the feed end of the microsphere forming device, and the discharge end of the microsphere forming device is connected to the curing device. The syringe pump pumps the microsphere preparation material to the microsphere forming device, and the microsphere forming device makes the material into microspheres, and the microspheres enter the curing device for curing. A conventional syringe pump includes a driving mechanism and a syringe. The material is contained in the syringe. The discharge end of the syringe is connected to the feed end of the microsphere forming device. The driving mechanism drives the piston movement of the syringe to pump the material into the microsphere forming device. The disadvantage of this syringe pump is that the temperature of the pumped material is mainly determined by the environment, and some microsphere preparation processes require the material to have a specific temperature. If the current ambient temperature is too different from the temperature required for microsphere preparation, it is difficult for the syringe pump to pump out the material that meets the temperature requirements, which will affect the microsphere preparation. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a thermostatic microsphere preparation syringe pump, which can pump out materials that meet the temperature requirements for microsphere preparation even if the ambient temperature is significantly different from the temperature required for microsphere preparation. The utility model also provides a thermostatic microsphere preparation instrument, which can pump out materials that meet the temperature requirements for microsphere preparation even if the ambient temperature is significantly different from the temperature required for microsphere preparation.

[0004] In order to solve the above-mentioned technical problems, the utility model provides an adjustable temperature constant temperature injection pump for preparing microspheres, comprising a syringe for injecting microsphere preparation materials and a driving mechanism, wherein the driving mechanism drives the piston of the syringe to move so as to pump out the material in the syringe for microsphere preparation. An installation cavity is provided, and the syringe is installed in the installation cavity. The injection pump comprises a temperature control module for adjusting the ambient temperature in the installation cavity.

[0005] Furthermore, it includes an air pipe, the air inlet end of the air pipe is connected to the installation cavity, and an exhaust fan is installed in the air pipe for drawing the gas in the installation cavity from the air inlet end of the air pipe into the air pipe; the air outlet end of the air pipe is connected to the installation cavity for gas to flow back to the installation cavity, and a temperature control module extends into the air pipe to adjust the temperature of the gas that has been drawn into the air pipe, thereby adjusting the ambient temperature in the installation cavity.

[0006] Furthermore, the temperature regulating module directly / indirectly contacts the gas in the installation cavity so as to directly / indirectly regulate the temperature of the gas in the installation cavity, thereby regulating the ambient temperature in the installation cavity.

[0007] Furthermore, a cavity opening leading to the installation cavity is provided for the syringe to be taken out through the cavity opening.

[0008] Furthermore, a sealing member that can be opened is provided at the cavity opening.

[0009] Furthermore, a temperature sensor is included for detecting the ambient temperature in the installation cavity.

[0010] Furthermore, a controller is included, and the controller is connected to the temperature sensor and controls the connection drive mechanism.

[0011] Furthermore, it includes an operation panel for setting the temperature adjustment value, and the operation panel is connected to the controller.

[0012] Furthermore, the temperature control module is specifically a semiconductor temperature control module.

[0013] The utility model provides a constant temperature microsphere preparation device, comprising an injection pump, a microsphere forming device and a curing device, wherein the discharge end of the injection pump is connected to the feed end of the microsphere forming device, the discharge end of the microsphere forming device is connected to the feed end of the curing device, and the injection pump is as described above.

[0014] Since the constant-temperature microsphere preparation injection pump is equipped with a temperature control module, if the ambient temperature in the installation cavity differs greatly from the temperature required for microsphere preparation, the temperature of the syringe in the installation cavity can be adjusted by simply starting the temperature control module to adjust the ambient temperature in the installation cavity, thereby indirectly adjusting the temperature of the material in the syringe so that the material temperature meets the temperature requirements of the microsphere preparation process. The injection pump can then pump out materials that meet the temperature requirements for microsphere preparation. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the microsphere preparation apparatus of the first embodiment.

[0016] Figure 2 yes Figure 1 A partial enlarged picture of Figure 1 The A part.

[0017] Figure 3 yes Figure 1 A partial enlarged picture of Figure 1 In the A position, the screw nut driving mechanism has driven the piston of the syringe to move to the right.

[0018] Figure 4 It is a schematic diagram of the microsphere preparation instrument of the first embodiment after the protective cover is sealed.

[0019] Figure 5 It is a cross-sectional view of the microsphere preparation apparatus of the first embodiment.

[0020] Figure 6It is an exploded view of the semiconductor temperature control module of the microsphere preparation apparatus of the first embodiment.

[0021] Figure 7 Schematic diagram of the microsphere preparation apparatus of the second embodiment. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below in conjunction with specific implementation methods.

[0023] First embodiment:

[0024] Microsphere preparation instrument Figure 1 , including a microsphere preparation injection pump 100, a microsphere forming device 200 and a cross-linking curing device 300. The injection pump 100 Figure 2 and Figure 3 The invention comprises a housing 13, wherein the housing 13 is provided with an installation cavity 131, wherein two cylindrical syringes 11 and 12 are installed in the installation cavity 131, and two screw nut driving mechanisms 21 and 22 are installed in the installation cavity 131. The housing 13 is provided with an opening 132 leading to the installation cavity 131, and a light-transmitting protective cover 133 is provided at the opening 132. The protective cover 133 is used as a sealing member to seal the opening 132 of the installation cavity 131. After sealing, Figure 4 The protective cover 133 is hinged to the housing 13 and can be rotated backward to open. Figure 1 See Figure 2 , the installation cavity 131 is provided with front and rear clamping frames 101, 102, each of the clamping frames 101, 102 includes an upper clamping plate 103, a lower clamping plate 104 and a connecting bolt 105, and the upper clamping plate 103 and the lower clamping plate 104 are connected together by the connecting bolt 105. The front syringe 11 is clamped between the upper and lower clamping plates 103, 104 of the front clamping frame 101, and the rear syringe 12 is clamped between the upper and lower clamping plates 103, 104 of the rear clamping frame 102. The front syringe 11 contains the first type of microsphere preparation material, and the rear syringe 12 contains the second type of microsphere preparation material. The pistons 111, 121 of the front and rear syringes 11, 12 extend to the left, and the screw nuts 211, 221 of the two screw nut driving mechanisms 21, 22 respectively drive the pistons 111, 121 connecting the front and rear syringes 11, 12. See Figure 1 and Figure 2The right ends of the front and rear syringes 11 and 12 are discharge ends, which are respectively connected to the feed end 201 of the microsphere forming device 200, and the discharge end 202 of the microsphere forming device 200 is connected to the feed end 301 of the curing device 300. The housing 13 is provided with an exposed touch panel 18, and the touch panel 18 controls the drive motor (not shown in the figure) connected to the front and rear screw nut driving mechanisms 21 and 22. The touch panel 18 serves as an operation panel. When preparing microspheres, the operator controls the front and rear screw nut driving mechanisms 21 and 22 by operating the touch panel 18 to drive the pistons 111 and 121 of the front and rear syringes 11 and 12 respectively through the screw nuts 211 and 221. Figure 3 As shown, the pistons 111 and 121 of the front and rear syringes 11 and 12 move to the right, and the two microsphere preparation materials in the two syringes 11 and 12 are pumped to the microsphere forming device 200 to inject the two microsphere preparation materials. The microsphere forming device 200 has a forming chip 203, which can make the two microsphere preparation materials into microspheres. The microspheres enter the cross-linking and curing device 300 for curing, and are discharged from the discharge end 302 of the cross-linking and curing device 300 after curing.

[0025] See Figure 1 The microsphere preparation instrument is a constant temperature microsphere preparation instrument, which can be used to prepare constant temperature microspheres. The constant temperature microsphere preparation process requires that the two microsphere preparation materials have a specific temperature. For this reason, the syringe pump 100 of the microsphere preparation instrument adopts a syringe pump 100 for constant temperature microsphere preparation. Even if the current ambient temperature is greatly different from the temperature required for microsphere preparation, this syringe pump 100 can pump out two microsphere preparation materials that meet the temperature requirements for constant temperature microsphere preparation. Figure 5 The injection pump 100 is provided with a "U"-shaped air pipe 15 and a semiconductor temperature control module 14 below the installation cavity 131. The left and right ends 151 and 152 of the air pipe 15 are connected to the installation cavity 131 upwards, and an exhaust fan 16 is installed inside the right section of the air pipe 15. The air inlet end of the exhaust fan 16 faces downwards and the air outlet end faces upwards. Figure 5 and Figure 6, including a mounting plate 141, a semiconductor 142 mounted on the inner side of the mounting plate 141, a heat conducting block 143 mounted on the left side of the semiconductor 142, a heat dissipation portion 144 and a heat dissipation fan 145 mounted on the right side of the semiconductor 142, wherein: the left end surface of the semiconductor 142 contacts the heat conducting block 143, and the right end surface contacts the heat dissipation portion 144; the left part of the heat conducting block 143 extends into the air pipe 15 and is located above the exhaust fan 16; the air inlet end of the heat dissipation fan 145 faces leftward and is aligned with the heat dissipation portion 144, and the air outlet end faces rightward. The bottom wall of the housing 13 is provided with an air inlet 136 aligned with the heat dissipation portion 144, and the right wall of the housing 13 is provided with an air outlet 135, and the air outlet 135 faces leftward and is aligned with the air outlet end of the heat dissipation fan 145. The injection pump 100 is provided with a controller (not shown in the figure) connected to the touch panel 18, and the controller controls the drive motor connected to the front and rear screw nut drive mechanisms 21 and 22, the semiconductor 142 of the semiconductor temperature control module 14, and the heat dissipation fan 145. See Figure 1 The injection pump 100 is provided with a temperature sensor 17 in the installation cavity 131. The temperature sensor 17 detects the ambient temperature in the installation cavity 131 by detecting the gas temperature in the installation cavity 131. In this way, the temperature of the two syringes 11 and 12 located in the installation cavity 131 is indirectly detected, thereby indirectly detecting the temperature of the two materials located in the two syringes 11 and 12. The controller is connected to the temperature sensor 17.

[0026] Before the constant temperature microsphere preparation, if the current ambient temperature is significantly different from the temperature required for microsphere preparation, for example, the operator feels that the current ambient temperature is high, Figure 4 The operator first sets the temperature value on the touch panel 18, which is the temperature adjustment value. The touch panel 18 sends the temperature value to the controller. Figure 1 , Figure 5 , the controller detects through the temperature sensor 17 that the temperature of the materials in the two syringes 11 and 12 is higher than the temperature set by the operator, and then controls the exhaust fan 16 to be energized to draw the gas in the installation cavity 131 from the left end 151 of the air pipe 15 into the air pipe 15, and the left end 151 of the air pipe 15 is the air inlet end. The controller controls the semiconductor 142 of the semiconductor temperature control module 14 to be energized to cool the left end surface of the semiconductor 142, so that the left end surface of the semiconductor 142 is used as a temperature control surface, and the heat of the gas drawn into the air pipe 15 is indirectly taken away through the heat conductive block 143, thereby cooling the gas. The right end 152 of the air pipe 15 is the air outlet end, and the cooled gas flows back from the right end 152 of the air pipe 15 into the installation cavity 131, reducing the ambient temperature in the installation cavity 131, indirectly reducing the temperature of the two syringes 11 and 12 located in the installation cavity 131, and thus indirectly reducing the temperature of the two materials in the two syringes 11 and 12. The controller detects through the temperature sensor 137 that the ambient temperature in the installation cavity 131 has dropped to the temperature set by the operator, and accordingly determines that the temperature of the two materials in the two syringes 11 and 12 has dropped to the temperature set by the operator. Figure 2 The controller controls the front and rear screw nut driving mechanisms 21 and 22 to drive the pistons 111 and 121 of the front and rear syringes 11 and 12 respectively through the screw nuts 211 and 221. Figure 3 As shown, the front and rear syringes 11 and 12 move to the right to pump out two materials that meet the temperature requirements. Figure 5 The controller adjusts the power of the semiconductor 142 according to the temperature measured by the temperature sensor 17, so that the temperature of the two materials in the front and rear syringes 11 and 12 can be maintained near the temperature set by the operator to achieve constant temperature. When the left end face of the semiconductor 142 is cooled down, the right end face of the semiconductor 142 will heat up, and the right end face will dissipate heat through the heat dissipation part 144. The controller controls the heat dissipation fan 145 to start working. The heat dissipation fan 145 draws air from left to right. The external gas enters the shell from the air inlet 136, absorbs the heat of the heat dissipation part 144, and then heats up. The heated hot air is drawn to the right by the heat dissipation fan 145 and then discharged from the air outlet 135. In this way, the heat dissipation part 144 and the right end face of the semiconductor 142 can be cooled down. See Figure 1 and Figure 5 If the operator feels that the current ambient temperature is low, a higher temperature is set on the touch panel 18. The controller detects through the temperature sensor 17 that the ambient temperature in the installation cavity 131 is lower than the temperature set by the operator, and controls the semiconductor 142 of the semiconductor temperature control module 14 to indirectly heat the two materials in the front and rear syringes 11 and 12 so that the two materials in the front and rear syringes 11 and 12 are heated. This is not described in detail. The semiconductor temperature control module 14 can be changed to be located at the rear side of the air pipe 15, the heat conducting block 143 can be changed to extend forward into the air pipe 15 for temperature control, the cooling fan 145 can be changed to have the air inlet end facing backward and the air outlet end facing forward to align with the heat dissipation part 144, and the air outlet 135 of the shell 13 can be correspondingly changed to be opened on the rear wall of the shell 136, so as to prevent the hot air leaving from the air outlet 135 from affecting the normal operation of the formed chip 203.

[0027] See Figure 1 and Figure 2 After the materials in the front and rear syringes 11 and 12 are consumed, the operator first rotates the protective cover 133 backward to open the cavity opening 132 of the installation cavity 131, and then unscrews the connecting bolt 105 of the front clamping frame 101 to release the fixation of the front clamping frame 101 to the front syringe 11, and unscrews the connecting bolt 105 of the rear clamping frame 102 to release the fixation of the rear clamping frame 102 to the rear syringe 12, and then the front and rear syringes 11 and 12 can be taken out from the cavity opening 132 of the installation cavity 131 upwards, and after taking them out, new front and rear syringes 11 and 12 can be installed, and then microsphere preparation can be carried out again.

[0028] Second embodiment:

[0029] The second embodiment is substantially the same as the first embodiment, except that: the injection pump 100 of the first embodiment is Figure 5 , an air pipe 15, an exhaust fan 16 and a semiconductor temperature control module 14 are provided below the installation cavity 131. The exhaust fan 16 draws the gas in the installation cavity 131 into the air pipe 15. The heat conducting block 143 of the semiconductor temperature control module 14 extends into the air pipe 15 to adjust the temperature of the gas drawn into the air pipe 15, thereby adjusting the ambient temperature in the installation cavity 131. The injection pump 100 of the second embodiment is shown in FIG. Figure 7 The air pipe and the exhaust fan are cancelled, and a temperature adjustment hole 130 is opened on the bottom wall of the installation cavity 131. The heat conduction block 143 of the semiconductor temperature adjustment module 14 is located at the temperature adjustment hole 130 and the shape is changed to a flat type. The lower end surface of the heat conduction block 143 contacts the semiconductor temperature adjustment surface (see Figure 6 The upper end surface of the semiconductor 142 is directly in contact with the air in the installation cavity 131, thereby directly adjusting the temperature of the gas in the installation cavity 131, and thus adjusting the ambient temperature in the installation cavity 131. The upper end surface of the heat-conducting block 143 of the semiconductor temperature-adjusting module 14 can be preferably changed to be close to the bottom wall of the installation cavity 131 below the bottom wall of the installation cavity 131, and indirectly contact the gas in the installation cavity 131 through the bottom wall of the installation cavity 131, thereby indirectly adjusting the temperature of the gas in the installation cavity 131, and thus adjusting the ambient temperature in the installation cavity 131. In this way, there is no need to open the temperature-adjusting hole 130 in the bottom wall of the installation cavity 131, but because the upper end surface of the heat-conducting block 143 indirectly contacts the gas in the installation cavity 131, the heat conduction efficiency is relatively slow.

[0030] The above is only an implementation method of the invention, and does not limit the scope of patent protection. Those skilled in the art can make non-substantial changes or substitutions based on the invention, which still fall within the scope of patent protection.

Claims

1. A thermostatically adjustable syringe pump for preparing microspheres, comprising a syringe for injecting microsphere preparation materials and a driving mechanism, wherein the driving mechanism drives the piston of the syringe to move so as to pump out the material in the syringe for preparing microspheres, characterized in that: An installation cavity is provided, and the syringe is installed in the installation cavity. The injection pump comprises a temperature regulating module for regulating the ambient temperature in the installation cavity.

2. The isothermal microsphere preparation syringe pump according to claim 1, characterized in that: It includes an air pipe, the air inlet end of the air pipe is connected to the installation cavity, and an exhaust fan is installed in the air pipe for drawing the gas in the installation cavity from the air inlet end of the air pipe into the air pipe; the air outlet end of the air pipe is connected to the installation cavity, and the gas flows back to the installation cavity. The temperature control module extends into the air pipe to adjust the temperature of the gas drawn into the air pipe, so as to adjust the ambient temperature in the installation cavity.

3. The isothermal microsphere preparation syringe pump according to claim 1, characterized in that: The temperature regulating module directly / indirectly contacts the gas in the installation cavity so as to directly / indirectly regulate the temperature of the gas in the installation cavity, thereby regulating the ambient temperature in the installation cavity.

4. The isothermal microsphere preparation syringe pump according to claim 1, characterized in that: A cavity opening leading to the installation cavity is provided for the syringe to be taken out through the cavity opening.

5. The isothermal microsphere preparation syringe pump according to claim 4, characterized in that: A sealing member which can be operated to be opened is arranged at the cavity opening.

6. The isothermal microsphere preparation syringe pump according to claim 1, characterized in that: Includes a temperature sensor for detecting the ambient temperature within the mounting cavity.

7. The isothermal microsphere preparation syringe pump according to claim 6, characterized in that: The invention comprises a controller which is connected to a temperature sensor and controls a connection driving mechanism.

8. The isothermal microsphere preparation syringe pump according to claim 7, characterized in that: The utility model comprises an operation panel for setting the temperature adjustment value, and the operation panel is connected to the controller.

9. The isothermal microsphere preparation syringe pump according to any one of claims 1 to 8, characterized in that: The temperature control module is specifically a semiconductor temperature control module.

10. A constant temperature microsphere preparation apparatus, comprising a syringe pump, a microsphere forming device and a curing device, wherein the discharge end of the syringe pump is connected to the feed end of the microsphere forming device, and the discharge end of the microsphere forming device is connected to the feed end of the curing device, characterized in that: The injection pump as claimed in any one of claims 1 to 9.

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