Chip temperature testing device

Abstract

The utility model discloses a chip temperature testing device which comprises a testing bin shell and a temperature testing mechanism, a partition plate is installed in the testing bin shell, the testing bin shell is divided into a front bin and a rear bin through the partition plate, a carrying table and a moving device are installed in the front bin, a lifting device is installed on the moving device, and the lifting device is used for installing the temperature testing mechanism. The temperature testing mechanism comprises a mounting seat, a mounting cavity is formed in the mounting seat, a fixing plate is mounted in the mounting cavity, a fixing rod penetrates through the center of the fixing plate, the upper end of the fixing rod is sleeved with a ring sleeve used for being connected with the fixing plate, the fixing rod is movably connected with a lifting rod, and a spring is arranged between the fixing rod and the lifting rod; a through hole is formed in the top of the fixing rod, a hollow pipe is arranged at the top of the lifting rod, the hollow pipe penetrates through the through hole and abuts against the side wall of the through hole, and a temperature control head is arranged at the bottom of the lifting rod.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip temperature testing device. Background Art

[0002] With the continuous development of electronic technology, chips have become one of the indispensable core components of modern electronic products. However, the quality of the chip directly affects the performance and stability of the entire product, so it needs to be strictly inspected and tested during the production and quality control of the chip. The temperature characteristics of the chip are also very important for its normal operation, so it needs to be accurately tested.

[0003] The utility model patent with authorization announcement number CN212059994U discloses a processor chip surface temperature testing device, which includes: a test chamber, a carrier and a temperature control head robotic arm; the carrier is located at the bottom position in the test chamber; the temperature control head robotic arm is a movable robotic arm, located at the top position in the test chamber, corresponding to the carrier, and is used to fix the temperature control head; by moving the temperature control head robotic arm, the temperature control head can be moved to the surface of the processor chip, so that only the surface of the processor chip can be temperature controlled, thereby facilitating high and low temperature testing of a single processor chip body.

[0004] However, although the test device realizes the refinement and automation of the processor chip surface temperature test in terms of function, the cable layout and connection method of the device may be relatively complicated in actual application, affecting the overall neatness. In addition, in extreme cases, such as when the operator makes a mistake, the temperature control head mechanical arm may accidentally collide with the chip under test, causing damage to the temperature control head mechanical arm itself and damage to the chip under test.

[0005] Therefore, we propose a chip temperature testing device to solve the above problems. Utility Model Content

[0006] In order to solve the deficiencies in the prior art, the utility model provides a chip temperature testing device.

[0007] The technical solution of the utility model is:

[0008] The utility model provides a chip temperature testing device, including a testing chamber shell and a temperature testing mechanism, wherein a partition is installed inside the testing chamber shell and the testing chamber shell is divided into a front chamber and a rear chamber by the partition, and the characteristic is that a carrier and a moving device are installed in the front chamber, a lifting device is installed on the moving device, the lifting device is used to install the temperature testing mechanism and control the lifting and lowering of the temperature testing mechanism, the carrier and the temperature testing mechanism are arranged correspondingly, the temperature testing mechanism includes a mounting seat, a mounting cavity is arranged in the mounting seat, a fixing plate is installed in the mounting cavity, a fixing rod is passed through the center of the fixing plate, a ring sleeve is provided on the upper end of the fixing rod for connecting with the fixing plate, the fixing rod is movably connected with a lifting rod, and a spring is provided between the two, a through hole is provided at the top of the fixing rod, a hollow tube is provided at the top of the lifting rod, the hollow tube passes through the through hole and abuts against the side wall of the through hole, and a temperature control head is installed at the bottom of the lifting rod.

[0009] Preferably, a base is installed at the lower end of the test chamber shell, and a bottom plate is provided between the test chamber shell and the base. Two conveying devices are installed at the lower end of the bottom plate, and a rectangular hole corresponding to the conveying device is provided on the bottom plate. The carrier is installed on the conveying device through the rectangular hole.

[0010] Preferably, the lower surface of the base plate is further provided with two device support frames for supporting the conveying device.

[0011] Preferably, the rear bin is provided with a plurality of wire holes, a control device is installed in the rear bin, and connecting wires of the control device are connected with the lifting device, the moving device and the conveying device through the wire holes.

[0012] Preferably, the front compartment is provided with two vertical plates, and the vertical plates are each provided with an ambient temperature sensor.

[0013] Preferably, control switches are respectively provided at both ends of the outer side of the base, a touch operation screen is provided between the two control switches, an emergency stop button is provided above the control switch on one side, and a protective cover is provided around the emergency stop button.

[0014] The beneficial effects achieved by the utility model are:

[0015] The utility model adopts a spring as a buffer component to ensure that the lifting rod plays a buffering role when the temperature control head applies pressure to the chip when it is pushed downward, thereby preventing the chip, the temperature control head and the lifting rod from being damaged by excessive impact force; through the setting of the hollow tube, it is ensured that the lifting rod always remains in a vertical state, and the cables are concealedly passed through the hollow tube, thereby ensuring the reliability of the electrical connection and improving the neatness. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is an exploded view of the utility model;

[0018] Figure 3 This is a schematic diagram of the temperature testing mechanism of the utility model.

[0019] Figure 4 It is a cross-sectional view of the lifting rod and the connecting rod of the utility model;

[0020] Figure 5 This is a bottom view of the base of the utility model;

[0021] Figure 6 It is a rear warehouse structure diagram of the utility model.

[0022] In the figure, 1. test chamber shell; 2. temperature test mechanism; 3. carrier; 4. base; 5. bottom plate; 6. device support frame; 7. front chamber; 8. rear chamber; 11. rectangular hole; 12. conveying device; 13. moving device; 14. lifting device; 15. partition; 16. wire hole; 17. control device; 21. mounting seat; 31. control switch; 32. touch operation screen; 33. emergency stop button; 34. protective cover; 71. vertical plate; 72. ambient temperature sensor; 211. fixing plate; 212. fixing rod; 213. ring sleeve; 214. temperature control head; 215. lifting rod; 216. spring; 217. hollow tube. DETAILED DESCRIPTION

[0023] To facilitate those skilled in the art to understand the present invention, specific implementations of the present invention are described below with reference to the accompanying drawings.

[0024] like Figures 1 to 6As shown, the utility model provides a chip temperature testing device, including a test chamber shell 1 and a temperature testing mechanism 2. The test chamber shell can be a cube or a rectangular parallelepiped shape. A partition 15 is installed inside the test chamber shell 1, and is divided into a front chamber 7 and a rear chamber 8 by the partition 15. A carrier 3 and a moving device 13 are installed in the front chamber 7. A chip placement station (not shown in the figure) is provided on the carrier 3 for carrying the chip to be tested. A lifting device 14 is installed on the moving device 13. The lifting device 14 is used to install the temperature testing mechanism 2 and control the lifting of the temperature testing mechanism 2. The moving device and the lifting device of the utility model can be composed of a combination of a fixed pulley and a conveyor belt, which is not limited here. The carrier 3 is correspondingly arranged with the temperature testing mechanism 2. The temperature testing mechanism 2 includes a mounting seat 21, and a mounting cavity is provided in the mounting seat 21. A fixing plate 211 is installed in the installation cavity, and a fixing rod 212 is passed through the center of the fixing plate 211. A ring sleeve 213 is sleeved on the upper end of the fixing rod 212 for connecting with the fixing plate 211. The fixing rod 212 is locked and fixed to the fixing plate 211 by using the ring sleeve 213. The fixing rod 212 is movably connected with a lifting rod 215, and a spring 216 is provided therebetween. A step is provided at the top of the lifting rod 212. Through the setting of the step, one end of the lifting rod is buckled in the fixing rod 211 to prevent the lifting rod 212 from falling. At the same time, one end of the spring abuts against the fixing rod, and the other end abuts against the top of the lifting rod. A through hole is provided at the top of the fixing rod 212, and a hollow tube 217 is provided at the top of the lifting rod 215. The hollow tube 217 passes through the through hole and abuts against the side wall of the through hole. A temperature control head 214 is installed at the bottom of the lifting rod 215.

[0025] Working principle: The chip to be tested is placed on the carrier 3 manually or automatically installed by external equipment. The carrier 3 transports the chip to be tested to the test station. Then, the lifting device 14 moves to the test station through the moving device 13. When the lifting device arrives at the station, it controls the temperature testing mechanism 2 to descend, so that the temperature control head 214 is close to the surface of the chip to be tested. The surface of the chip to be tested is heated by the temperature control head 214, providing a surface temperature tolerance test for the chip to be tested.

[0026] In this embodiment, the spring 216 has the function of elastic deformation. When the lifting rod 215 moves downward to make the temperature control head 214 apply pressure to the chip, the pressure is evenly dispersed by the spring 216, which effectively plays a buffering role and prevents damage to the chip, the temperature control head 214 and the lifting rod 215 due to excessive instantaneous impact force.

[0027] Furthermore, the hollow tube 217 forms a precise fit with the side wall of the through hole. When the lifting rod 215 moves up and down, the hollow tube 217 can ensure that the lifting rod 215 always remains in a vertical state, effectively preventing deviation or shaking, thereby improving the positioning accuracy and stability during the test process, and the internal space of the hollow tube 217 is used as a passage for the cable, so that the cable is hidden in the hollow tube 217. The wiring ensures a firm connection between the cable and the lifting rod 215, and greatly enhances the neatness and safety of the entire test device, avoiding the device on the equipment accidentally touching the cable during the test and causing the test to be terminated.

[0028] The utility model adopts the spring 216 as a buffer component to ensure that the lifting rod 215 plays a buffering role when the temperature control head 214 applies pressure to the chip downward, thereby preventing the chip, the temperature control head 214 and the lifting rod 215 from being damaged by excessive impact force; the hollow tube 217 is provided to ensure that the lifting rod 215 always remains in a vertical state, and the cables are concealedly passed through the hollow tube, thereby ensuring the reliability of the electrical connection and improving the neatness.

[0029] In this embodiment, a base 4 is installed at the lower end of the test chamber shell 1, and a bottom plate 5 is provided between the test chamber shell 1 and the base 4 to separate them. Two conveying devices 12 are installed at the lower end of the bottom plate 5. A rectangular hole 11 corresponding to the conveying device 12 is provided on the bottom plate 5, and the carrier 3 is installed on the conveying device 12 through the rectangular hole 11.

[0030] Specifically, two carriers 3 are installed, and the two carriers 3 are operated alternately to perform chip testing. When one carrier 3 is testing a chip, the other carrier 3 is simultaneously testing to complete the removal of the chip and the installation of a new chip. The two are executed in turn to ensure the continuity and efficiency of the testing work. In this way, seamless cooperation between the temperature testing mechanism 2 and the carrier 3 is achieved, thereby maximizing the utilization rate of the equipment and the testing efficiency.

[0031] In this embodiment, two device support frames 6 for supporting the conveying device 12 are further provided on the lower surface of the bottom plate 5 .

[0032] In this embodiment, the rear bin 8 is provided with a plurality of wire holes 16, and a control device 17 is installed in the rear bin 8. The connecting wires of the control device 17 are connected to the lifting device 14, the moving device 13 and the conveying device 12 through the wire holes 16, thereby ensuring the transmission of the control signal and the coordinated operation of the devices.

[0033] In this embodiment, the front compartment 7 is provided with two vertical plates 71, and each of the vertical plates 71 is provided with an ambient temperature sensor 72. The ambient temperature sensor 72 is used to detect and monitor the temperature of the test environment. By detecting and monitoring the temperature of the test environment in real time, the tester can timely understand the temperature changes and take corresponding control measures to ensure the reliability and consistency of the test.

[0034] In this embodiment, control switches 31 are respectively provided at both ends of the outer side of the base 4, a touch operation screen 32 is provided between the two control switches 31, an emergency stop button 33 is provided above the control switch 31 on one side, and a protective cover 34 is provided around the emergency stop button 33.

[0035] Specifically, through the touch operation screen 32, the operator can monitor and adjust the temperature testing mechanism 2 conveniently. By setting the emergency stop button 33, when an emergency occurs, only the emergency stop button 33 needs to be pressed and the equipment will stop running immediately to ensure the safety of personnel and equipment. In order to prevent the operator from accidentally touching the emergency stop button, a protective cover 34 higher than the emergency stop button 33 is set around the emergency stop button 33.

[0036] The above-described implementation methods of the utility model do not constitute a limitation on the protection scope of the utility model. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model shall be included in the protection scope of the claims of the utility model.

Claims

1. A chip temperature testing device, comprising a testing chamber housing (1) and a temperature testing mechanism (2), wherein a partition (15) is installed inside the testing chamber housing (1) and the testing chamber housing is divided into a front chamber (7) and a rear chamber (8) by the partition (15), characterized in that: The front compartment (7) is provided with a carrier (3) and a moving device (13), the moving device (13) being provided with a lifting device (14), the lifting device (14) being used to install a temperature testing mechanism (2) and to control the lifting of the temperature testing mechanism (2), the carrier (3) being provided corresponding to the temperature testing mechanism (2), the temperature testing mechanism (2) comprising a mounting seat (21), a mounting cavity being provided in the mounting seat (21), a fixing plate (211) being installed in the mounting cavity, and a fixing plate (211) being provided in the fixing plate (211). A fixing rod (212) is provided through the center, and a ring sleeve (213) is sleeved on the upper end of the fixing rod (212) for connecting with the fixing plate (211). The fixing rod (212) is movably connected with a lifting rod (215), and a spring (216) is provided between the two. A through hole is provided at the top of the fixing rod (212), and a hollow tube (217) is provided at the top of the lifting rod (215). The hollow tube (217) passes through the through hole and abuts against the side wall of the through hole. A temperature control head (214) is provided at the bottom of the lifting rod.

2. A chip temperature testing device according to claim 1, characterized in that: A base (4) is installed at the lower end of the test chamber housing (1); a bottom plate (5) is provided between the test chamber housing (1) and the base (4); two conveying devices (12) are installed at the lower end of the bottom plate (5); a rectangular hole (11) corresponding to the conveying device (12) is provided on the bottom plate (5); and the carrier (3) passes through the rectangular hole (11) and is installed on the conveying device (12).

3. A chip temperature testing device according to claim 2, characterized in that: The lower surface of the bottom plate (5) is also provided with two device support frames (6) for supporting the conveying device (12).

4. A chip temperature testing device according to claim 1, characterized in that: The rear bin (8) is provided with a plurality of wire holes (16), a control device (17) is installed in the rear bin (8), and connecting wires of the control device (17) are connected to the lifting device (14), the moving device (13) and the conveying device (12) through the wire holes (16).

5. A chip temperature testing device according to claim 1, characterized in that: The front bin (7) is provided with two vertical plates (71), and each of the vertical plates (71) is provided with an ambient temperature sensor (72).

6. A chip temperature testing device according to claim 2, characterized in that: Control switches (31) are respectively provided at both ends of the outer side of the base (4), a touch operation screen (32) is provided between the two control switches (31), an emergency stop button (33) is provided above the control switch (31) on one side, and a protective cover (34) is provided around the emergency stop button (33).

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