Chip suction nozzle structure and adsorption equipment

Abstract

The utility model relates to the technical field of chips, and discloses a chip suction nozzle structure which is suitable for a chip body, the chip body is provided with a photosensitive area, the periphery of the photosensitive area is a non-photosensitive area, and the chip body is bonded with a covering layer matched with the non-photosensitive area. The covering layer is provided with a groove structure matched with an adsorption device used in the processing process of the chip body. According to the chip suction nozzle structure and the adsorption equipment, the covering layer is arranged on the non-photosensitive area of the chip body, so that the thickness of the whole chip is greatly increased, the overall strength of the chip can be effectively improved on the premise that the photosensitive area is not shielded, when the chip with high strength is adsorbed by the adsorption equipment, the thin chip body is not prone to damage, and the service life of the chip is prolonged. The product yield and the product performance are further improved; the whole chip is adsorbed by embedding the suction head into the suction groove, and the suction head is not in contact with the chip body, so that the chip body is not easily damaged due to adsorption pressure in the adsorption process.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to a chip suction nozzle structure and suction equipment. Background Art

[0002] With the further improvement of semiconductor technology, optoelectronic chips have further reduced the photosensitive area and overall size while maintaining the original chip performance to meet more application needs with requirements on volume and cost.

[0003] However, as the size becomes smaller and the thickness becomes thinner, the strength of the chip is not high enough, so there are further requirements for the chip production and processing technology, especially for optoelectronic sensitive chips, which are more likely to be damaged by adsorption operations during the processing, thereby affecting the product yield and final product performance. Utility Model Content

[0004] The purpose of the utility model is to provide a chip suction nozzle structure and a suction device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip suction nozzle structure, suitable for a chip body, the chip body is provided with a photosensitive area, the photosensitive area is surrounded by a non-photosensitive area, the chip body is bonded with a covering layer adapted to the non-photosensitive area, and the covering layer is provided with a groove structure adapted to an adsorption device used during the processing of the chip body.

[0006] Preferably, the cover layer is provided with a perforation, and the photosensitive area is located at the perforation.

[0007] Preferably, the cover layer is provided with an annular contact area.

[0008] Preferably, the groove structure is located in the contact area.

[0009] Preferably, the groove structure is a suction groove.

[0010] Preferably, the depth of the suction groove is less than the thickness of the covering layer.

[0011] Preferably, a plurality of welding balls are arranged at the bottom of the chip body.

[0012] A suction device comprises a suction nozzle, wherein the suction nozzle is used to suck a chip provided with a suction nozzle structure, and a suction head is provided at the bottom of the suction nozzle.

[0013] Preferably, the suction head is embedded in the suction groove.

[0014] Preferably, the suction head is made of rubber material.

[0015] The chip suction nozzle structure and the suction device have the following beneficial effects:

[0016] 1. The chip suction nozzle structure sets a covering layer on the non-photosensitive area of ​​the chip body, which greatly increases the thickness of the entire chip, thereby effectively increasing the overall strength of the chip without blocking the photosensitive area. When a high-strength chip is adsorbed by the adsorption equipment, the thinner chip body is not easily damaged, thereby improving the product yield and product performance.

[0017] 2. The adsorption device realizes the adsorption of the entire chip by embedding the suction head into the suction groove. The suction head has no contact with the chip body, so that the chip body is not easily damaged by the adsorption pressure during the adsorption process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A top view of a chip body provided in an embodiment of the present application;

[0019] Figure 2 A bottom view of a chip body and a solder ball connected to each other provided in an embodiment of the present application;

[0020] Figure 3 A top view of a chip nozzle structure and an adsorption device provided in an embodiment of the present application;

[0021] Figure 4 A side view of the chip nozzle structure and adsorption device, PCB board and suction head provided in the embodiment of the present application;

[0022] Figure 5 A side cross-sectional view of the chip nozzle structure and adsorption device provided in an embodiment of the present application.

[0023] In the figure: 1. chip body; 11. photosensitive area; 2. solder ball; 3. cover layer; 31. perforation; 32. contact area; 33. suction groove; 4. PCB board; 5. suction nozzle; 51. suction head. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figure 2 , Figure 4As shown, the utility model provides a chip suction nozzle structure, which is suitable for a chip body 1. A plurality of welding balls 2 are arranged at the bottom of the chip body 1 for contacting a PCB board 4.

[0026] Among them, Figure 1 As shown, the chip body 1 is provided with a photosensitive area 11 for receiving light to generate electrons. The photosensitive area 11 is surrounded by a non-photosensitive area in which digital analog circuits and chip pins are arranged.

[0027] The inventors found that since the photosensitive area 11 of the chip body 1 cannot be blocked, the adsorption device cannot come into contact with the sensory area 11 during processing, so that the adsorption point position of the adsorption device needs to be distributed to the non-photosensitive area.

[0028] Specifically, Figure 3-Figure 4 As shown, the chip body 1 is bonded with a covering layer 3 that is compatible with the non-photosensitive area. The covering layer 3 is made of non-transparent material, which can absorb natural light and block photons from reaching the non-photosensitive area of ​​the chip body 1, thereby suppressing parasitic light sensitivity. At the same time, the thickness of the chip can be increased to improve the chip's own strength. Specifically, the thickness of the covering layer 3 is 300um to 310um. Preferably, the thickness of the covering layer 3 is 305um, while the thickness of the commonly used chip body 1 is 80um. The covering layer 3 is bonded to the chip body 1, which can greatly increase the overall thickness of the chip, thereby increasing the overall strength of the chip.

[0029] In this embodiment, a covering layer 3 is provided on the non-photosensitive area of ​​the chip body 1, so that the thickness of the entire chip is greatly increased, thereby effectively increasing the overall strength of the chip without blocking the photosensitive area 11. When a chip with higher strength is adsorbed by the adsorption equipment, the thinner chip body 1 is less likely to be damaged, thereby improving the product yield and product performance.

[0030] Further, such as Figure 5 As shown, the covering layer 3 is provided with a perforation 31, the photosensitive area 11 is located at the perforation 31, the covering layer 3 is provided with an annular contact area 32, and the covering layer 3 is also provided with a groove structure adapted to the adsorption device used in the processing of the chip body 1, the groove structure is located in the contact area 32, the groove structure is a suction groove 33, the depth of the suction groove 33 is less than the thickness of the covering layer 3, preferably, the depth of the suction groove 33 is half the thickness of the covering layer 3, so that the adsorption point is located in the covering layer 3, and the external adsorption device has no direct contact with the chip body 1, so as to avoid the chip body 1 from being damaged due to the adsorption pressure.

[0031] In this embodiment, if Figure 3 As shown, eight suction grooves 33 are provided, four of which are distributed in the upper non-photosensitive area of ​​the cover layer 3 of the chip body 1, and four are distributed in the lower non-photosensitive area, so that the chip is subjected to more uniform force when being adsorbed.

[0032] like Figure 4-Figure 5 As shown, an adsorption device includes a suction nozzle 5, which is used to adsorb a chip with a suction nozzle structure. A suction head 51 is arranged at the bottom of the suction nozzle 5, and the suction head 51 is embedded in the suction groove 33. The suction head 51 is made of rubber material, which is conducive to not easily damaging the chip when in contact with the chip. The suction head 51 is embedded in the suction groove 33 to achieve adsorption of the entire chip. The suction head 51 has no contact with the chip body 1, so that the chip body 1 is not easily damaged due to the adsorption pressure during the adsorption process. The number of suction heads 51 matches the suction groove 33.

[0033] Working principle: A covering layer 3 is provided on the non-photosensitive area of ​​the chip body 1, so that the thickness of the entire chip is greatly increased, thereby effectively increasing the overall strength of the chip without blocking the photosensitive area 11. When a chip with higher strength is adsorbed by the adsorption nozzle 5, the suction head 51 has no contact with the chip body 1, so that the chip body 1 is not easily damaged due to the adsorption pressure during the adsorption process.

[0034] In summary, although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip suction nozzle structure, suitable for a chip body (1), wherein the chip body (1) is provided with a photosensitive area (11), and the photosensitive area (11) is surrounded by a non-photosensitive area, characterized in that: The chip body (1) is bonded with a covering layer (3) that matches the non-photosensitive area, and the covering layer (3) is provided with a groove structure that matches an adsorption device used in the processing of the chip body (1).

2. A chip suction nozzle structure according to claim 1, characterized in that: The cover layer (3) is provided with a perforation (31), and the photosensitive area (11) is located at the perforation (31).

3. A chip nozzle structure according to claim 2, characterized in that: The cover layer (3) is provided with an annular contact region (32).

4. A chip suction nozzle structure according to claim 3, characterized in that: The groove structure is located in the contact area (32).

5. The chip nozzle structure according to claim 4, characterized in that: The groove structure is a suction groove (33).

6. A chip suction nozzle structure according to claim 5, characterized in that: The depth of the suction groove (33) is less than the thickness of the covering layer (3).

7. The chip suction nozzle structure according to claim 1, characterized in that: A plurality of welding balls (2) are arranged at the bottom of the chip body (1).

8. An adsorption device, characterized in that: It comprises a suction nozzle (5), wherein the suction nozzle (5) is used to adsorb a chip provided with a suction nozzle structure as described in any one of claims 1 to 7; A suction head (51) is arranged at the bottom of the suction nozzle (5).

9. An adsorption device according to claim 8, characterized in that: The suction head (51) is embedded in the suction groove (33).

10. An adsorption device according to claim 9, characterized in that: The suction head (51) is made of rubber material.

Images