Wafer bearing disc

Abstract

The utility model provides a wafer bearing disc which comprises a bearing part, a limiting part and a wafer taking groove, the bearing part is provided with a front face for bearing a wafer, a vacuum vent groove and a vacuum external connection hole, the vacuum vent groove and the vacuum external connection hole are communicated with each other, and the vacuum vent groove is exposed out of the front face of the wafer bearing part. The limiting part is arranged on the edge of the bearing part and protrudes out of the front face, and the wafer taking groove is formed in the edge of the wafer bearing disc. According to the wafer bearing disc provided by the invention, the wafer can be fixed through vacuum adsorption, the problems of wafer warping and wafer breaking can be reduced, and the wafer is limited and protected through the limiting part to reduce wafer slipping, so that the safety of wafer testing is improved. In addition, the edge of the wafer bearing disc is also provided with a wafer taking groove, so that the purpose of easily taking the wafer can be achieved.

Description

Technical Field

[0001] The present application relates to the technical field of wafer fixing, and in particular to a wafer holding plate. Background Art

[0002] In the process of manufacturing integrated circuits, wafer testing or inspection is an essential process. For example, during the microscopic inspection of the wafer, the wafer needs to be fixed by a wafer carrier so that the wafer can be fixed under a microscope for inspection.

[0003] When a conventional wafer tray carries a wafer, the wafer is exposed and is unsafe. Utility Model Content

[0004] The purpose of the present application is to provide a wafer holding plate, which is intended to safely limit and protect the wafer.

[0005] The present application provides a wafer carrier, comprising:

[0006] The bearing part has a front side for bearing the wafer, and a vacuum venting groove and a vacuum external connection hole which are interconnected, wherein the vacuum venting groove is exposed on the front side of the bearing part;

[0007] a limiting portion, disposed at an edge of the bearing portion and protruding from the front surface; and

[0008] The film taking groove is arranged on the edge of the film receiving plate.

[0009] In some embodiments, the vacuum vent slot comprises:

[0010] a first ventilation groove extending to the front side along a first direction, wherein the first direction intersects the front side;

[0011] The second ventilation groove extends along a second direction and connects the first ventilation groove and the vacuum external connection hole, and the second direction is parallel to the front side.

[0012] In some embodiments, the bearing portion includes:

[0013] A first groove is disposed on the front surface and is disposed around the center of the bearing portion;

[0014] The second groove is arranged on the front surface and communicates with the first ventilation groove and the first groove.

[0015] In some embodiments, the second groove includes a first sub-groove and a second sub-groove that are perpendicular to each other, and the first sub-groove is arranged opposite to the film extraction groove.

[0016] In some embodiments, the film taking groove comprises:

[0017] a first film taking groove, the limiting portion is arranged around the edge of the carrying portion, and the first film taking groove is opened in the limiting portion;

[0018] The second film taking groove, the bearing portion includes an edge portion connected to the limiting portion, and the second film taking groove is opened in the edge portion.

[0019] In some embodiments, the limiting portion includes a top surface parallel to the bearing portion, a first side surface close to the center of the bearing portion, and a second side surface away from the center of the bearing portion;

[0020] The limiting portion has at least three chamfered portions at the end portion where the first film-taking groove is formed, and the end portion includes a side wall of the first film-taking groove;

[0021] The at least three chamfered portions include a first chamfered portion, a second chamfered portion and a third chamfered portion, wherein the first chamfered portion is connected between the side wall and the first side surface, the second chamfered portion is connected between the side wall and the top surface, and the third chamfered portion is connected between the side wall and the second side surface.

[0022] In some embodiments, the at least three chamfered portions further include a fourth chamfered portion connected between the second chamfered portion and the third chamfered portion.

[0023] In some embodiments, the sizes of the first groove and the second groove along the first direction are both 0-2 mm.

[0024] In some embodiments, the limiting portion protrudes from the front side along a first direction, and a size of the protruding portion along the first direction is 2.5 to 7.5 mm, and the first direction intersects with the front side.

[0025] In some embodiments, the angle between the film taking groove and the vacuum external connection hole is 45°.

[0026] The present application provides a wafer holding plate, including a bearing portion, a limiting portion and a wafer taking groove, wherein the bearing portion has a front side for bearing the wafer and a vacuum ventilation groove and a vacuum external connection hole that are interconnected, and the vacuum ventilation groove is exposed on the front side of the bearing portion. The limiting portion is arranged at the edge of the wafer bearing portion and protrudes from the front side, and the wafer taking groove is provided at the edge of the wafer holding plate. The wafer holding plate provided in the present application can fix the wafer by vacuum adsorption to reduce the problems of wafer warping and wafer breakage, and the wafer can be limited and protected by the limiting portion to reduce the wafer from slipping, thereby improving the safety of wafer testing. In addition, a wafer taking groove is also provided on the edge of the wafer holding plate, which can also achieve the purpose of easy wafer taking. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0028] Figure 1 is an oblique view of the main body of a wafer carrier provided in some embodiments of the present application;

[0029] Figure 2 Some embodiments of the present application provide Figure 1 A top view of the wafer tray;

[0030] Figure 3 Some embodiments of the present application provide Figure 2 A cross-sectional view of the middle wafer tray at A-A1;

[0031] Figure 4 Some embodiments of the present application provide Figure 1 A partial enlarged view of the middle wafer tray at B1;

[0032] Figure 5 Some embodiments of the present application provide Figure 1 A side view of the middle wafer tray;

[0033] Figure 6 is an oblique view of the main body of a wafer carrier provided in some embodiments of the present application;

[0034] Figure 7 Some embodiments of the present application provide Figure 6 A top view of the wafer tray;

[0035] Figure 8 Some embodiments of the present application provide Figure 6 A partial enlarged view of the middle wafer tray at B2. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0037] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present application, "plurality" means two or more, unless otherwise clearly and specifically defined.

[0038] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0040] This article uses Cartesian coordinates to represent directions, where "X" represents the first direction, "Y" represents the second direction, and "Z" represents the direction perpendicular to "X" and "Y".

[0041] After the wafer is made, thousands of grains (or chips) are regularly distributed throughout the wafer. Since the cutting and packaging has not yet been performed, these bare wafers only need to be carried by the probe station, and connected to the test machine using probes or probe cards for chip testing, and the wafers are observed through a microscope. The functional test and performance test of the wafer can verify whether each chip meets the product specifications, and screen out the faulty chips in the wafer when they do not meet the product specifications (usually including the verification of voltage, current, timing and function), thereby improving the final test yield and reducing the packaging cost.

[0042] During the wafer testing process, in the prior art, the edge of the wafer is exposed to the outside, which is easy to slip and unsafe. Based on this, the present application provides a wafer carrier to solve this technical problem.

[0043] See also Figure 1 , Figure 1 This is an oblique view of the main body of the wafer carrier provided in some embodiments of the present application. Figure 2 and Figure 3 , Figure 2 Some embodiments of the present application provide Figure 1A top view of the wafer tray 100, Figure 3 Some embodiments of the present application provide Figure 2 The cross-sectional view of the wafer carrier plate 100 at A-A1, that is, Figure 3 Display along Figure 2 The projected structure along the direction of the arrow after cutting open at A-A1.

[0044] The wafer carrier plate 100 is used to carry wafers (not shown), and the wafers may include various semiconductor devices, such as power semiconductor devices, and specifically may include insulated gate bipolar transistors (IGBT), metal oxide semiconductor field effect transistors (MOSFET), etc. Since wafers are generally circular, the wafer carrier plate 100 is designed to be circular according to the shape of the wafer.

[0045] The wafer holding plate 100 includes a bearing portion 10, a limiting portion 20 and a wafer taking groove 30. The bearing portion 10 has a front side 11 for bearing the wafer and a vacuum venting groove 12 and a vacuum external connection hole 13 that are interconnected. The vacuum venting groove 12 is exposed on the front side 11 of the bearing portion 10. The limiting portion 20 is arranged at the edge of the bearing portion 10 and protrudes from the front side 11. The wafer taking groove 30 is opened at the edge of the wafer holding plate 100. The wafer holding plate 100 provided in the present application can fix the wafer by vacuum adsorption to reduce the problems of wafer warping and wafer breakage, and the wafer is limited and protected by the limiting portion 20 to reduce the wafer from slipping, thereby improving the safety of wafer testing. In addition, a wafer taking groove 30 is also opened on the edge of the wafer holding plate, which can also achieve the purpose of easy wafer taking.

[0046] Importantly, the wafer tray in the present application is not only suitable for conventional wafers, but also for ultra-thin warped wafers that are prone to breakage during the inspection process. Since the wafer tray in the present application fixes the wafer through vacuum adsorption, its warping problem can be greatly reduced.

[0047] In some embodiments, Figure 3As shown, the vacuum vent groove 12 includes a first vent groove 121 and a second vent groove 122, the first vent groove 121 extends along a first direction (X) to the front surface 11, and the first direction (X) intersects with the front surface 11; the second vent groove 122 extends along a second direction (Y) and connects the first vent groove 121 and the vacuum external connection hole 13, and the second direction (Y) is parallel to the front surface 11. The angle between the first direction (X) and the front surface 11 can be 85° to 95°. In a specific embodiment, the first direction (X) is perpendicular to the front surface 11.

[0048] Specifically, the first vent groove 121 is disposed at the center (i.e., the center of the circle) of the carrier 10, and the first vent groove 121 does not extend to the back side (opposite to the front side 11) of the carrier 10. The second vent groove 122 is connected between the first vent groove 121 and the vacuum external connection hole 13. The vacuum external connection hole 13 can be disposed on the side of the carrier 10 for connecting an external vacuum pumping device, and a vacuum pumping channel can be provided through the vacuum external connection hole 13, the first vent groove 121, and the second vent groove 122.

[0049] In some embodiments, the size of the first vent groove 121 along the first direction (X) is smaller than the size of the bearing portion 10 along the first direction (X), for example, the size of the first vent groove 121 along the first direction (X) may be 9-11 mm; the size of the first vent groove 121 along the second direction (Y) is smaller than the size of the second vent groove 122 along the second direction (Y), for example, the size of the first vent groove 121 along the second direction (Y) may be 2.5-3 mm. The size of the second vent groove 122 along the first direction (X) is smaller than the size of the bearing portion 10 along the first direction (X), for example, the size of the second vent groove 122 along the first direction (X) may be 2.5-3 mm. The size of the vacuum external hole 13 along the first direction (X) is smaller than the size of the bearing portion 10 along the first direction (X), for example, the size of the vacuum external hole 13 along the first direction (X) can be 5-7 mm; the size of the vacuum external hole 13 along the second direction (Y) is smaller than the size of the second ventilation groove 122 along the second direction (Y), for example, the size of the vacuum external hole 13 along the second direction (Y) can be 15-25 mm.

[0050] In some embodiments, Figure 2As shown, the bearing part 10 includes a first groove 111 and a second groove 112, wherein the first groove 111 is arranged on the front side 11 and is arranged around the center of the bearing part 10; the second groove 112 is arranged on the front side 11 and is connected to the first ventilation groove 121 and the first groove 111. Since the second groove 112 is connected to the first ventilation groove 121, and the first groove 111 is connected to the second groove 112, after the vacuum external connection hole 13 is connected to the vacuum equipment, after the wafer with inspection is placed, vacuum adsorption can be formed at the positions of the first groove 111 and the second groove 112, so as to ensure that the wafer is adsorbed inside the platform, and then the focusing and measurement of the inspection part can be performed. After the vacuum is turned off, the limiting part 20 at the edge of the wafer holding plate 100 can play a limiting role to ensure that the wafer will not slide out of the platform after the vacuum disappears. In addition, the wafer is generally circular, and the first groove 111 is arranged to be circular around the center of the bearing part 10, which can make the groove distribution more uniform and reduce the risk of wafer cracking.

[0051] In some embodiments, the sizes of the first groove 111 and the second groove 112 along the first direction (X) are both 0-2 mm.

[0052] In some embodiments, the bearing portion 10 may include a plurality of first grooves 111, each of which is disposed around the center of the bearing portion 10, and the spacing between two adjacent first grooves 111 is equal. Specifically, the diameter of each first groove 111 increases from the inside to the outside, for example, the diameter of the first first groove 111 may be 75 mm, the diameter of the second first groove 111 may be 100 mm, and the diameter of the third first groove 111 may be 125 mm.

[0053] In some embodiments, the second groove 112 includes a first sub-groove 1121 and a second sub-groove 1122 that are perpendicular to each other. The first sub-groove 1121 and the second sub-groove 1122 both pass through the center of the bearing portion 10 to communicate with the first ventilation groove 121. The first sub-groove 1121 and the second sub-groove 1122 also pass through all the first grooves 111 to communicate with all the first grooves 111. The distribution of the first groove 111, the first sub-groove 1121 and the second sub-groove 1122 is relatively uniform.

[0054] The first sub-groove 1121 may be arranged opposite to the film taking groove 30. Figure 2 As shown, the two film extraction grooves 30 may be respectively opposite to the two ends of the first sub-groove 1121 .

[0055] In some embodiments, the angle between the film taking groove 30 and the vacuum external hole 13 is 45°, so the angle between the vacuum external hole 13 and the first sub-groove 1121 is also 45°, and the angle between the vacuum external hole 13 and the second sub-groove 1122 is also 45°, so that the arrangement of each component is more uniform and the stress distribution of the entire structure is more uniform.

[0056] In some embodiments, the minimum dimension W1 of the film taking groove 30 along the extension direction of the second groove 112 may be 15-25 mm.

[0057] In some embodiments, the limiting portion 20 is arranged around the edge of the carrying portion 10, which can increase the protection and limiting of the edge of the wafer, and the carrying portion 10 may include an edge portion 110 connected to the limiting portion 20. The provision of the wafer taking groove 30 can expose part of the wafer from the side edge position, which is convenient for taking the wafer. The wafer taking groove 30 can be provided only in the limiting portion 20, or in the limiting portion 20 and the edge portion 110 of the carrying portion 10, and the wafer taking groove 30 can also be provided only in the edge portion 110.

[0058] In some embodiments, the wafer taking groove 30 includes a first wafer taking groove 31 and a second wafer taking groove 32, wherein the first wafer taking groove 31 is provided in the position limiting portion 20, and the second wafer taking groove 32 is provided in the edge portion 110. In other words, the wafer taking groove 30 is provided in the position limiting portion 20 and the edge portion 110 of the carrying portion 10. Since the edge portion 110 is connected to the position limiting portion 20, the provided first wafer taking groove 31 can be connected to the second wafer taking groove 32, thereby increasing the space of the wafer taking groove 30 and further facilitating the wafer taking.

[0059] In some embodiments, the edge portion 110 and the limiting portion 20 are integrally formed, so as to facilitate the opening of the first film-taking groove 31 and the second film-taking groove 32 .

[0060] In some embodiments, Figure 3 As shown, the edge portion 110 may include a recessed portion 1101, that is, the front side of the edge portion 110 is lower than other front positions of the supporting portion 10. Specifically, the size of the recessed portion 1101 along the first direction (X) is greater than or equal to the size of the first groove 111 or the second groove 112 along the first direction (X). In other words, the degree to which the recessed portion 1101 is recessed toward the back side is equal to or greater than the degree to which the first groove 111 or the second groove 112 is recessed. The provision of the recessed portion 1101 enables the wafer carrier plate 100 to carry wafers with edge chips, the edge thickness of which is greater than the thickness of the middle portion, and the recessed portion is used to accommodate the edge of the wafer with edge chips, which can reduce the problem of edge chip breakage. Please refer to Figure 4 , Figure 4Some embodiments of the present application provide Figure 1 A partial enlarged view of the middle wafer tray at B1.

[0061] In some embodiments, the limiting portion 20 includes a top surface 21 parallel to the carrying portion 10, a first side surface 22 close to the center of the carrying portion 10, and a second side surface 23 away from the center of the carrying portion 10. The limiting portion 20 has at least three chamfered portions at the end 24 where the first wafer taking groove 31 is opened, and the end 24 includes the side wall 311 of the first wafer taking groove 31. The at least three chamfered portions include a first chamfered portion R1, a second chamfered portion R2, and a third chamfered portion R3, wherein the first chamfered portion R1 is connected between the side wall 311 and the first side surface 22, the second chamfered portion R2 is connected between the side wall 311 and the top surface 21, and the third chamfered portion R3 is connected between the side wall 311 and the second side surface 23. Forming at least three chamfered portions at the end 24 can reduce the risk of damage to the wafer during the taking process.

[0062] See also Figure 5 , Figure 5 Some embodiments of the present application provide Figure 1 In the side view of the middle wafer holding plate, the limiting portion 20 protrudes from the front side 11 along the first direction (X), and the dimension W2 of the protruding portion along the first direction (X) can be 2.5 to 7.5 mm, and the first direction (X) intersects with the front side 11.

[0063] See also Figure 6 and Figure 7 , Figure 6 is an oblique view of the main body of a wafer carrier provided in some embodiments of the present application, Figure 7 Some embodiments of the present application provide Figure 6 For ease of understanding and brief description, the same reference numerals are used for the same structures in this embodiment as in the above embodiment, and the same structures are not described in detail again. Only the different structures are described in detail in this embodiment.

[0064] The wafer carrier plate 200 includes a carrier portion 10, a limiting portion 20a and a wafer taking groove 30. The carrier portion 10 has a front surface 11 for carrying the wafer and a vacuum venting groove 12 and a vacuum external connection hole 13 that are interconnected. The vacuum venting groove 12 is exposed at the front surface 11 of the carrier portion 10. The limiting portion 20a is disposed at the edge of the carrier portion 10 and protrudes from the front surface 11. The wafer taking groove 30 is opened at the edge of the wafer carrier plate 200.

[0065] The limiting portion 20a includes a top surface 21 parallel to the carrying portion 10, a first side surface 22 close to the center of the carrying portion 10, and a second side surface 23 away from the center of the carrying portion 10. The limiting portion 20a has at least three chamfered portions at the end 24a where the first film-taking groove 31 is opened, and the end 24a includes the side wall 311 of the first film-taking groove 31. The at least three chamfered portions include a first chamfered portion R1, a second chamfered portion R2, and a third chamfered portion R3. The first chamfered portion R1 is connected between the side wall 311 and the first side surface 22, the second chamfered portion R2 is connected between the side wall 311 and the top surface 21, and the third chamfered portion R3 is connected between the side wall 311 and the second side surface 23.

[0066] Please combine Figure 8 , Figure 8 Some embodiments of the present application provide Figure 6 A partial enlarged view of the middle wafer tray at B2.

[0067] The difference between the wafer holding plate 200 and the wafer holding plate 100 provided in the above embodiment is that the at least three chamfered portions also include a fourth chamfered portion R4, and the fourth chamfered portion R4 is connected between the second chamfered portion R2 and the third chamfered portion R3. The setting of the fourth chamfer can facilitate fingers to pick up the wafer holding plate 200.

[0068] In some embodiments, the size of the wafer tray 200 may be larger than Figure 1 The size of the wafer tray 100, for example, the size of the wafer tray 200 may be 8 inches. Figure 1 The size of the middle wafer tray 100 may be 6 inches.

[0069] The wafer holding plate 100 / 200 provided in the embodiment of the present application includes a bearing portion 10, a limiting portion 20 / 20a and a wafer taking groove 30, wherein the bearing portion 10 has a front side 11 for bearing the wafer and a vacuum venting groove 12 and a vacuum external connection hole 13 which are interconnected, wherein the vacuum venting groove 12 is exposed to the front side 11 of the bearing portion 10. The limiting portion 20 / 20a is arranged at the edge of the bearing portion 10 and protrudes from the front side 11, and the wafer taking groove 30 is provided at the edge of the holding plate. The wafer holding plate 100 / 2200 provided in the present application can fix the wafer by vacuum adsorption to reduce the problems of wafer warping and wafer breakage, and the wafer is limited and protected by the limiting portion 20 / 20a to reduce the wafer from slipping, thereby improving the safety of wafer testing. In addition, a wafer taking groove 30 is also provided at the edge of the wafer holding plate, which can also achieve the purpose of easy wafer taking.

[0070] The description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application. Ordinary technical personnel in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A wafer carrier, characterized in that: include: The bearing part has a front side for bearing the wafer, and a vacuum venting groove and a vacuum external connection hole which are interconnected, wherein the vacuum venting groove is exposed on the front side of the bearing part; A limiting portion, arranged at an edge of the bearing portion and protruding from the front surface; as well as The wafer taking groove is arranged on the edge of the wafer holding plate.

2. The wafer carrier according to claim 1, characterized in that: The vacuum venting slot comprises: a first ventilation groove extending to the front side along a first direction, wherein the first direction intersects the front side; The second ventilation groove extends along a second direction and connects the first ventilation groove and the vacuum external connection hole, and the second direction is parallel to the front side.

3. The wafer carrier according to claim 2, characterized in that: The bearing portion comprises: A first groove is disposed on the front surface and is disposed around the center of the bearing portion; The second groove is arranged on the front surface and communicates with the first ventilation groove and the first groove.

4. The wafer carrier according to claim 3, characterized in that: The second groove includes a first sub-groove and a second sub-groove that are perpendicular to each other, and the first sub-groove is arranged opposite to the film extraction groove.

5. The wafer carrier according to claim 1, characterized in that: The film taking groove comprises: a first film taking groove, the limiting portion is arranged around the edge of the carrying portion, and the first film taking groove is opened in the limiting portion; The second film taking groove, the bearing portion includes an edge portion connected to the limiting portion, and the second film taking groove is opened in the edge portion.

6. The wafer carrier according to claim 5, characterized in that: The limiting portion includes a top surface parallel to the bearing portion, a first side surface close to the center of the bearing portion, and a second side surface away from the center of the bearing portion; The limiting portion has at least three chamfered portions at the end portion where the first film-taking groove is formed, and the end portion includes a side wall of the first film-taking groove; The at least three chamfered portions include a first chamfered portion, a second chamfered portion and a third chamfered portion, wherein the first chamfered portion is connected between the side wall and the first side surface, the second chamfered portion is connected between the side wall and the top surface, and the third chamfered portion is connected between the side wall and the second side surface.

7. The wafer carrier according to claim 6, characterized in that: The at least three chamfered portions further include a fourth chamfered portion connected between the second chamfered portion and the third chamfered portion.

8. The wafer carrier according to claim 3, characterized in that: The sizes of the first groove and the second groove along the first direction are both 0-2 mm.

9. The wafer carrier according to claim 1, characterized in that: The limiting portion protrudes from the front side along a first direction, and a size of the protruding portion along the first direction is 2.5-7.5 mm, and the first direction intersects with the front side.

10. The wafer carrier according to claim 1, characterized in that: The included angle between the film taking groove and the vacuum external connection hole is 45°.

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