Wafer laser processing equipment

Abstract

The utility model provides wafer laser processing equipment, and belongs to the technical field of wafer processing. The wafer laser processing equipment comprises a supporting base and a fixing assembly. During use, a wafer is placed in the fixing disc, during cutting, the first electric sliding table drives the connecting plate and the fixing disc to move, then the wafer can be moved to the position below the laser cutting head, the moving part can drive the laser cutting head to move, then the laser generator can conduct laser cutting through the laser cutting head, and after cutting is completed, the wafer is cut through the laser generator. The first electric sliding table drives the connecting plate to move, the cut wafer can be made to be away from the laser cutting head, the uncut wafer can be moved to the position below the laser cutting head to continue to be cut, then the cut wafer can be replaced, in the cutting process, workers can replace the cut wafer, and the cutting efficiency is improved. Therefore, the cutting is in a continuous state, and the cutting processing efficiency of the wafer can be improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing, and in particular, to a wafer laser processing device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. Its raw material is silicon. Various circuit component structures can be processed on the silicon wafer. During the wafer processing process, lasers are required to cut the wafers.

[0003] The wafer needs to be limited during laser cutting, but in related wafer laser cutting processing equipment, the structure of the limited wafer is relatively simple. During the material discharge process before cutting and the material retrieval process after cutting, the cutting is in a paused state, and during the cutting process, the cutting worker is in a waiting state, that is, the cutting process is discontinuous, which makes the wafer cutting processing efficiency low. Utility Model Content

[0004] In order to remedy the above shortcomings, the present application provides a wafer laser processing equipment, which aims to improve the problem of discontinuity in the cutting process and low wafer cutting processing efficiency.

[0005] An embodiment of the present application provides a wafer laser processing device, including a support base and a fixing component.

[0006] A moving part is arranged on the upper surface of the supporting base, and a laser cutting head is arranged at the moving end of the moving part.

[0007] The fixed assembly includes a first electric slide, a connecting plate, a fixed disk and a vacuum generator. The first electric slide is fixedly connected to the upper surface of the support base, the lower surface of the connecting plate is connected to the movable end of the first electric slide, a plurality of fixed disks are provided, and the plurality of fixed disks are slidably inserted into the interior of the connecting plate. A plurality of vacuum generators are provided, and the plurality of vacuum generators are connected to the lower surface of the connecting plate. The suction ports of the plurality of vacuum generators are respectively and one by one connected to the interior of the plurality of fixed disks, and the laser cutting head is correspondingly provided to the plurality of fixed disks.

[0008] In a specific embodiment, the support base includes a bottom plate and legs, and four legs are provided. The four legs are respectively fixedly connected to four corners of the lower surface of the bottom plate.

[0009] In a specific embodiment, the moving part includes a second electric slide, a third electric slide and a fourth electric slide, the bottom end of the second electric slide is fixedly connected to the upper surface of the base plate, one end of the third electric slide is fixedly connected to the moving end of the second electric slide, and the upper surface of the fourth electric slide is fixedly connected to the moving end of the third electric slide.

[0010] In a specific implementation, the laser cutting head is connected to the moving end of the fourth electric slide, and the lower surface of the first electric slide is connected to the upper surface of the base plate.

[0011] In a specific implementation manner, a support block is provided on the lower surface of the connecting plate, and the support block is fixedly connected to the moving end of the first electric slide.

[0012] In a specific implementation, a limiting hole is provided on the upper surface of the connecting plate, and a plurality of the limiting holes are provided and the limiting holes are evenly arranged, and a plurality of the fixing plates are slidably inserted into the interior of the limiting holes in a one-to-one manner.

[0013] In a specific implementation manner, the side walls of the plurality of limiting holes are each provided with an elastic rubber sleeve, and the plurality of fixing plates are respectively and one by one slidably inserted into the interior of the plurality of elastic rubber sleeves.

[0014] In a specific implementation scheme, the lower surfaces of several of the fixed plates are provided with through holes, and several of the through holes are provided, the bottom walls of several of the limiting holes are provided with suction cavities, and several of the through holes are connected to the suction cavities, and the suction port of the vacuum generator is connected to the suction cavity.

[0015] In a specific implementation manner, a limiting plate is fixedly sleeved on the top of several of the fixed disks, and a through groove is provided on the plate body of the limiting plate and the side wall of the fixed disk. There are two through grooves, and the two through grooves are symmetrically arranged.

[0016] The beneficial effect of the utility model is as follows: the utility model obtains a wafer laser processing equipment through the above design. When in use, the wafer is placed in the fixed plate, and then the wafer is limited and fixed by the fixed plate and the vacuum generator. During cutting, the first electric slide drives the connecting plate and the fixed plate to move, so that the wafer can be moved to the bottom of the laser cutting head, the moving part can drive the laser cutting head to move, and then the laser generator can perform laser cutting through the laser cutting head. After the cutting is completed, the first electric slide drives the connecting plate to move, so that the cut wafer can be kept away from the laser cutting head, and the uncut wafer can be moved to the bottom of the laser cutting head to continue cutting, and then the cut wafer can be replaced, and then during the cutting process, the worker can replace the cut wafer, so that the cutting is in a continuous state, thereby improving the wafer cutting processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the implementation methods of the present application, the drawings required for use in the implementation methods will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a schematic diagram of the structure of a wafer laser processing equipment provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of the structure of the support base and the moving parts provided in the embodiment of the present application;

[0020] Figure 3 A schematic diagram of the structure of the connecting plate and the fixing plate provided in the embodiment of the present application;

[0021] Figure 4 A schematic diagram of a partial cross-sectional structure of a connecting plate and an elastic rubber sleeve provided in an embodiment of the present application;

[0022] Figure 5 A schematic diagram of the fixed disk structure provided in an embodiment of the present application.

[0023] In the figure: 100-support base; 101-bottom plate; 102-leg; 110-moving part; 111-second electric slide; 112-third electric slide; 113-fourth electric slide; 120-laser cutting head; 200-fixing component; 210-first electric slide; 220-connecting plate; 221-support block; 222-limiting hole; 2221-suction cavity; 223-elastic rubber sleeve; 230-fixing plate; 231-through hole; 232-limiting plate; 233-through groove; 240-vacuum generator. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0025] In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in conjunction with the drawings in the implementation methods of this application. Obviously, the described implementation methods are part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0026] See also Figure 1 The present application provides a wafer laser processing device, including a support base 100 and a fixing component 200.

[0027] See also Figure 1 and 2 The support base 100 includes a bottom plate 101 and legs 102. There are four legs 102, which are respectively fixedly connected to the four corners of the lower surface of the bottom plate 101. A moving part 110 is provided on the upper surface of the support base 100. The moving part 110 includes a second electric slide 111, a third electric slide 112 and a fourth electric slide 113. The bottom end of the second electric slide 111 is fixedly connected to the upper surface of the bottom plate 101, one end of the third electric slide 112 is fixedly connected to the moving end of the second electric slide 111, and the upper surface of the fourth electric slide 113 is fixedly connected to the moving end of the third electric slide 112.

[0028] In the specific configuration, the moving end of the moving member 110 is provided with a laser cutting head 120 , the laser cutting head 120 is connected to the moving end of the fourth electric slide 113 , and the laser cutting head 120 is connected to an external laser generator.

[0029] See also Figure 1-5 The fixed assembly 200 includes a first electric slide 210, a connecting plate 220, a fixed disk 230 and a vacuum generator 240. The first electric slide 210 is fixedly connected to the upper surface of the support base 100, the lower surface of the first electric slide 210 is connected to the upper surface of the base plate 101, the lower surface of the connecting plate 220 is connected to the moving end of the first electric slide 210, and a support block 221 is provided on the lower surface of the connecting plate 220, and the support block 221 is fixedly connected to the moving end of the first electric slide 210.

[0030] In the specific setting, a plurality of fixing disks 230 are provided, and the plurality of fixing disks 230 are slidably inserted into the interior of the connecting plate 220. A limiting hole 222 is provided on the upper surface of the connecting plate 220. A plurality of limiting holes 222 are provided, and the limiting holes 222 are evenly arranged. The plurality of fixing disks 230 are respectively and one by one slidably inserted into the interior of the plurality of limiting holes 222. The side walls of the plurality of limiting holes 222 are respectively and one by one slidably inserted into the interior of the plurality of elastic rubber sleeves 223.

[0031] In the present application, a through hole 231 is provided on the lower surface of several fixed disks 230, and several through holes 231 are provided. An air suction cavity 2221 is provided on the bottom wall of several limiting holes 222, and several through holes 231 are connected with the air suction cavity 2221. A limiting plate 232 is fixedly sleeved on the top of several fixed disks 230, and a through groove 233 is provided on the plate body of the limiting plate 232 and the side wall of the fixed disk 230. Two through grooves 233 are provided, and the two through grooves 233 are symmetrically arranged. The through groove 233 makes it convenient for workers to place wafers into the fixed disk 230.

[0032] In this embodiment, a plurality of vacuum generators 240 are provided, and the plurality of vacuum generators 240 are connected to the lower surface of the connecting plate 220. The suction ports of the plurality of vacuum generators 240 are respectively and one by one connected to the interior of the plurality of fixed disks 230. The suction ports of the vacuum generators 240 are connected to the suction cavity 2221, and the laser cutting head 120 is correspondingly provided to the plurality of fixed disks 230.

[0033] Specifically, the working principle of the wafer laser processing equipment is as follows: when in use, several fixed disks 230 can be pulled out of the limiting hole 222, and then the wafer can be placed in the fixed disk 230, and then the several fixed disks 230 can be reinserted into the elastic rubber sleeve 223, and then the vacuum generator 240 can absorb the air inside the fixed disk 230 through the through hole 231 and the suction cavity 2221, and then the wafer can be limited and fixed by the fixed disk 230 and the vacuum generator 240. When cutting, open the first electric slide 210, the first electric slide 210 drives the connecting plate 220 and the fixed disk 230 to move, and then the wafer can be moved to the bottom of the laser cutting head 120, the second electric slide 111 can drive the laser cutting head 120 to move up and down, and the third electric slide 112 and the fourth electric slide 113 can drive the laser cutting head 120 to move forward, backward, left and right, and then the laser generator can perform laser cutting through the laser cutting head 120. After the cutting is completed, the first electric slide 210 drives the connecting plate 220 to move, so that the cut wafer can be kept away from the laser cutting head 120, and the uncut wafer can be moved to the bottom of the laser cutting head 120 to continue cutting. Then the cut wafer and the fixed plate 230 can be pulled out of the limiting hole 222, and the wafer can be poured out from the fixed plate 230, and then a new wafer can be placed, and then the next round of cutting can be carried out. During the cutting process, workers can replace the cut wafer to make the cutting continuous, thereby improving the wafer cutting processing efficiency.

[0034] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0035] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A wafer laser processing device, characterized in that: include A support base (100), wherein a moving part (110) is disposed on an upper surface of the support base (100), and a laser cutting head (120) is disposed at a moving end of the moving part (110); A fixing assembly (200), wherein the fixing assembly (200) comprises a first electric slide (210), a connecting plate (220), a fixing disk (230) and a vacuum generator (240), wherein the first electric slide (210) is fixedly connected to the upper surface of the supporting base (100), and the lower surface of the connecting plate (220) is connected to the movable end of the first electric slide (210), and a plurality of fixing disks (230) are provided, and the plurality of fixing disks (230) are slidably inserted into the interior of the connecting plate (220), and a plurality of vacuum generators (240) are provided, and the plurality of vacuum generators (240) are connected to the lower surface of the connecting plate (220), and the air suction ports of the plurality of vacuum generators (240) are respectively and one by one connected to the interior of the plurality of fixing disks (230), and the laser cutting head (120) and the plurality of fixing disks (230) are correspondingly provided.

2. The wafer laser processing equipment according to claim 1, characterized in that: The support base (100) comprises a bottom plate (101) and supporting legs (102), four supporting legs (102) are provided, and the four supporting legs (102) are respectively fixedly connected to four corners of the lower surface of the bottom plate (101).

3. The wafer laser processing equipment according to claim 2, characterized in that: The moving part (110) comprises a second electric slide (111), a third electric slide (112) and a fourth electric slide (113); the bottom end of the second electric slide (111) is fixedly connected to the upper surface of the base plate (101); one end of the third electric slide (112) is fixedly connected to the moving end of the second electric slide (111); and the upper surface of the fourth electric slide (113) is fixedly connected to the moving end of the third electric slide (112).

4. The wafer laser processing equipment according to claim 3, characterized in that: The laser cutting head (120) is connected to the moving end of the fourth electric slide (113), and the lower surface of the first electric slide (210) is connected to the upper surface of the base plate (101).

5. The wafer laser processing equipment according to claim 1, characterized in that: A support block (221) is provided on the lower surface of the connecting plate (220), and the support block (221) is fixedly connected to the moving end of the first electric slide (210).

6. The wafer laser processing equipment according to claim 1, characterized in that: The upper surface of the connecting plate (220) is provided with a limiting hole (222), a plurality of the limiting holes (222) are provided, the plurality of the limiting holes (222) are evenly arranged, and the plurality of the fixing plates (230) are slidably inserted into the interior of the plurality of the limiting holes (222) in a one-to-one corresponding manner.

7. The wafer laser processing equipment according to claim 6, characterized in that: The side walls of the plurality of limiting holes (222) are each provided with an elastic rubber sleeve (223), and the plurality of fixing plates (230) are respectively and one-to-one slidably inserted into the interior of the plurality of elastic rubber sleeves (223).

8. The wafer laser processing equipment according to claim 7, characterized in that: The lower surfaces of the plurality of fixed plates (230) are provided with through holes (231), and a plurality of the through holes (231) are provided. The bottom walls of the plurality of limiting holes (222) are provided with suction cavities (2221), and the plurality of the through holes (231) are connected to the suction cavities (2221). The suction port of the vacuum generator (240) is connected to the suction cavity (2221).

9. The wafer laser processing equipment according to claim 1, characterized in that: A limiting plate (232) is fixedly sleeved on the top of a plurality of the fixing plates (230), and a through groove (233) is provided on the plate body of the limiting plate (232) and the side wall of the fixing plate (230), and two through grooves (233) are provided, and the two through grooves (233) are symmetrically arranged.

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