Polishing device

By designing the lean gap flow path on the base of the polishing device, the problem of the existing polishing disk reserved in the polishing process has been solved, and the smoothness and good product rate are improved.

CN222404877UActive Publication Date: 2025-01-28ZIBO NOVELBEAM OPTICS CO LTD
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Patent Information

Application Number
CN202421119487.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-22
Publication Date
2025-01-28
Estimated Expiration
2034-05-22

AI Technical Summary

Technical Problem

During the polishing process, existing polishing discs are prone to retain dirty or removed impurities such as glass powder, resulting in poor finish and affecting the accuracy and yield of optical parts.

Method used

A polishing device is designed. The upper end of the base has multiple raised parts, and the gap between the raised parts forms a gap. At least the bottom surface of the gaps is set to form a fluid flow path, which increases the liquidity of polishing powder. It is easy to take away impurities. Essence

Benefits of technology

By increasing the liquidity of polishing powder, it effectively takes away impurities such as dirt or removal of glass powder reserved during polishing, and improves the smoothness and good product rate.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present disclosure provides a polishing apparatus including: a substrate including an upper end and a lower end opposite to the upper end, and having a center; the seat part is arranged at the lower end of the base; the upper end of the base is provided with a plurality of protruding parts, and the surfaces, away from the lower end, of the protruding parts are located on the same polishing plane or roughly located on the same polishing plane. Gaps are formed between the protruding parts, and the bottom surfaces of at least part of the gaps are closer to the upper end of the substrate in the direction away from the center of the substrate.
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Description

Technical Field

[0001] The present disclosure relates to a polishing device. Background Art

[0002] As optical components are widely and fully used in more and more fields, such as medical systems, military, industrial lasers, aerospace, analytical testing, etc., the requirements for the precision and smoothness of optical parts are getting higher and higher.

[0003] In the prior art, optical lenses are generally processed by a polishing process. Specifically, the optical lens is positioned behind a polishing machine and a rotating polishing disc is used to process the optical lens.

[0004] At present, the polishing discs used for lens polishing are divided into several types, such as circular grooves, square grooves or no grooves. Such polishing discs have good retention of polishing powder, thereby reducing the amount of polishing powder used. However, while retaining polishing powder, it is easy to retain dirt or impurities such as removed glass powder, resulting in poor product finish. For optical parts with increasingly higher precision requirements, this poor finish has affected the required precision and affected the yield rate. Utility Model Content

[0005] In order to solve one of the above technical problems, the present disclosure provides a polishing device.

[0006] According to one aspect of the present disclosure, there is provided a polishing device comprising:

[0007] a base including an upper end and a lower end opposite to the upper end, and having a center; and

[0008] A seat component, the seat component is arranged at the lower end of the base;

[0009] The upper end of the base has a plurality of protrusions, and the surfaces of the protrusions away from the lower end are located on the same polishing plane or approximately on the same polishing plane; there are gaps between the protrusions, and the bottom surfaces of at least part of the gaps are closer to the upper end of the base along a direction away from the center of the base.

[0010] According to the polishing apparatus of at least one embodiment of the present disclosure, a bottom surface of at least part of the gap is disposed obliquely with respect to the polishing plane.

[0011] According to the polishing device of at least one embodiment of the present disclosure, the angle between the bottom surface of at least part of the gap and the polishing plane is 4° to 8°.

[0012] According to the polishing device of at least one embodiment of the present disclosure, the protrusions are formed into multiple rows and columns, and the gaps between at least two adjacent rows of protrusions form a first square groove, and the bottom wall of the first square groove is closer to the lower end of the substrate along the direction from the center to the outside.

[0013] According to the polishing device of at least one embodiment of the present disclosure, the angle between the bottom wall of the first square groove and the polishing plane is 4° to 8°.

[0014] According to the polishing device of at least one embodiment of the present disclosure, the protrusions are formed into multiple rows and columns, and the gaps between at least two adjacent columns of protrusions form a second square groove, and the bottom wall of the second square groove is closer to the lower end of the substrate along the direction from the center to the outside.

[0015] According to the polishing device of at least one embodiment of the present disclosure, the angle between the bottom wall of the second square groove and the polishing plane is 4° to 8°.

[0016] According to the polishing apparatus of at least one embodiment of the present disclosure, at least a portion of the gaps between the protrusions form a fluid flow path through which the fluid flows to the outside of the substrate.

[0017] According to the polishing device of at least one embodiment of the present disclosure, the base and the seat member have the same or substantially the same rotation axis.

[0018] According to the polishing device of at least one embodiment of the present disclosure, a countersunk hole is formed on the seat component along its axial direction, and a friction sleeve is disposed in the countersunk hole. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the description serve to explain the principles of the present disclosure. These drawings are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification.

[0020] Figure 1 It is a schematic structural diagram of a polishing device according to an embodiment of the present disclosure.

[0021] Figure 2 It is a schematic cross-sectional structural diagram of a polishing device according to one embodiment of the present disclosure.

[0022] Figure 3 It is a schematic structural diagram of a first square groove formed by a row of raised portions of a polishing device according to an embodiment of the present disclosure.

[0023] Figure 4 It is a schematic structural diagram of a second square groove formed by a row of raised portions of a polishing device according to an embodiment of the present disclosure.

[0024] The specific reference numerals in the figure are:

[0025] 100 base

[0026] 101 raised part

[0027] 110 first square slot

[0028] 120 Second square slot

[0029] 200 Seat Parts

[0030] 300 friction sleeves. DETAILED DESCRIPTION

[0031] The present disclosure is further described in detail below in conjunction with the accompanying drawings and implementations. It is understood that the specific implementations described herein are only used to explain the relevant content, rather than to limit the present disclosure. It should also be noted that, for ease of description, only the parts related to the present disclosure are shown in the accompanying drawings.

[0032] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in the present disclosure can be combined with each other. The technical solution of the present disclosure will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0033] Unless otherwise specified, the exemplary embodiments / embodiments shown will be understood as providing exemplary features of various details of some ways in which the technical concept of the present disclosure can be implemented in practice. Therefore, unless otherwise specified, the features of the various embodiments / embodiments can be combined, separated, interchanged and / or rearranged without departing from the technical concept of the present disclosure.

[0034] The use of cross-hatching and / or shading in the accompanying drawings is generally used to make the boundaries between adjacent components clear. As such, unless otherwise specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for the specific materials, material properties, dimensions, proportions, commonalities between the components shown, and / or any other characteristics, attributes, properties, etc. of the components. In addition, in the accompanying drawings, the sizes and relative sizes of the components may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed in a different order than described. For example, two successively described processes can be performed substantially simultaneously or in an order opposite to the described order. In addition, the same figure numbers represent the same components.

[0035] When a component is referred to as being "on" or "over," "connected to," or "coupled to" another component, the component may be directly on, directly connected to, or directly coupled to the other component, or intervening components may be present. However, when a component is referred to as being "directly on," "directly connected to," or "directly coupled to" another component, there are no intervening components. For this purpose, the term "connected" may refer to a physical connection, an electrical connection, etc., with or without intervening components.

[0036] For descriptive purposes, the present disclosure may use spatially relative terms such as "under," "beneath," "under," "down," "over," "upper," "above," "higher," and "side (e.g., as in "sidewall")," to describe the relationship of one component to another (other) component as shown in the accompanying drawings. The spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, components described as "under" or "beneath" other components or features would subsequently be positioned "over" the other components or features. Thus, the exemplary term "under" can encompass both the "above" and "below" orientations. Furthermore, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein should be interpreted accordingly.

[0037] The terms used here are for the purpose of describing specific embodiments, and are not intended to be restrictive. As used here, unless the context clearly indicates otherwise, the singular forms "one (kind, person)" and "said (the)" are also intended to include plural forms. In addition, when the terms "comprise" and / or "include" and their variations are used in this specification, it is explained that there are stated features, integral bodies, steps, operations, parts, assemblies and / or their groups, but it is not excluded that there are or add one or more other features, integral bodies, steps, operations, parts, assemblies and / or their groups. It should also be noted that, as used here, the terms "substantially", "approximately" and other similar terms are used as approximate terms and not as degree terms, so that they are used to explain the inherent deviations of the measured values, calculated values ​​and / or the values ​​provided that will be recognized by those of ordinary skill in the art.

[0038] Figure 1 It is a schematic structural diagram of a polishing device according to an embodiment of the present disclosure. Figure 2 It is a schematic cross-sectional structural diagram of a polishing device according to one embodiment of the present disclosure.

[0039] like Figure 1 and Figure 2As shown, the polishing device of the present disclosure may include components such as a substrate 100 , a seat component 200 , and a friction sleeve 300 .

[0040] The substrate 100 disclosed in the present invention can also be called a polishing disk. When performing a polishing operation, the substrate 100 is driven to rotate, and the polishing operation of the optical lens is achieved through frictional contact between a surface of the substrate 100, such as the polishing plane described below, and the optical lens.

[0041] Moreover, since the base 100 is a rotating component and has a rotation axis, the rotation axis is also the axial direction of the base 100. At the same time, in the axial direction, the base 100 has an upper end and a lower end opposite to the upper end, and the upper end and the lower end are not the upper end and the lower end actually used, but the two ends corresponding to the upper and lower ends shown in the drawings.

[0042] Meanwhile, the base 100 has a center, which is a point on the rotation axis. Of course, the center may not be located on the rotation axis, but near the rotation axis. In another implementation form, the center may also be a region.

[0043] The seat component 200 is disposed at the lower end of the base 100; preferably, the base 100 and the seat component 200 have the same or substantially the same rotation axis, so that when the seat component 200 is driven to rotate, the seat component 200 rotates together with the base 100. In a preferred embodiment, the seat component 200 can be made of aluminum alloy material.

[0044] In the present disclosure, a countersink is provided on the seat component 200 along its axial direction, and a friction sleeve 300 is provided in the countersink. Thus, the base 100, the seat component 200 and the friction sleeve 300 of the present disclosure are separately provided, so that the base 100 and the friction sleeve 300 can be easily replaced. Specifically, when the disclosed polishing device is in use, the friction sleeve 300 often rubs against the ejector pin, and the base 100 is in direct contact with the workpiece being processed, and these two components are prone to wear. Accordingly, since the three components of the present disclosure are separately provided, these two components are relatively easy to replace.

[0045] The structure of the substrate 100 of the present disclosure will be described in detail below.

[0046] Specifically, if Figure 1 and Figure 2 As shown, the upper end of the base 100 has a plurality of protrusions 101, and the surfaces of the protrusions 101 away from the lower end are located on the same polishing plane or approximately on the same polishing plane; wherein the polishing plane is the surface that contacts the workpiece to be processed during the polishing operation.

[0047] There are gaps between the protrusions 101 , and the bottom surfaces of at least some of the gaps are located away from the center of the base 100 and closer to the upper end of the base 100 .

[0048] In other words, the upper end of the substrate 100 of the present disclosure has an upper surface, and correspondingly, the lower end of the substrate 100 has a lower surface, and the protrusion 101 can be considered as a block component formed by extending upward from the upper surface of the substrate 100 along the axial direction of the substrate 100. In a preferred embodiment, the surface of the protrusion 101 away from the lower end of the substrate 100 can be quadrilateral, preferably square, and at this time, at least part of the protrusion 101 can be formed in the shape of a regular quadrangular prism.

[0049] Moreover, the bottom surface of these gaps is the upper surface of the substrate 100. In the present disclosure, "the bottom surface of at least part of the gaps is closer to the upper end of the substrate 100 along a direction away from the center of the substrate 100" means that the upper surface of the substrate 100 can be formed into a layout with a high center and low surroundings; at this time, at least part of the gaps between the protrusions 101 form a fluid flow path, and the fluid flows to the outside of the substrate 100 through the fluid flow path.

[0050] Therefore, when the substrate 100 of the present disclosure is used, the fluidity of the polishing powder is increased, and it is easy to take away the dirt remaining during polishing or impurities such as glass powder removed, thereby improving the yield rate.

[0051] In the present disclosure, the bottom surface of at least part of the gap is inclined relative to the polishing plane. That is, based on the above-mentioned layout of the upper surface of the substrate 100 being high in the center and low around, the upper surface of the substrate 100 is further formed into a substantially conical surface.

[0052] More preferably, the angle between the bottom surface of at least part of the gap and the polishing plane is 4° to 8°, preferably about 6°, so that the substrate 100 disclosed in the present invention has a groove structure, and because the angle is not large, the function of retaining polishing powder to increase polishing efficiency can also be retained.

[0053] Figure 3 1 is a schematic structural diagram of a first square groove 110 formed by a row of raised portions 101 of a polishing device according to an embodiment of the present disclosure.

[0054] In a preferred embodiment, the protrusions 101 are formed in multiple rows and columns, and the gap between at least two adjacent rows of protrusions (i.e., each row of protrusions) forms a first square groove 110, and the bottom wall of the first square groove 110 is closer to the lower end of the substrate 100 along the direction from the center to the outside. More preferably, the angle between the bottom wall of the first square groove 110 and the polishing plane is 4° to 8°, preferably about 6°.

[0055] That is to say, the above-mentioned raised portion can be formed on the substrate 100 of the present invention by grooving, and the bottom wall of the first square groove 110 has an angle of about 6° from the center to the surrounding area. The existence of the first square groove 110 increases the fluidity of the polishing powder, making it easy to take away dirt remaining during polishing or impurities such as glass powder removed, and the angle is not too large, so the function of retaining polishing powder and increasing polishing efficiency can be retained.

[0056] along Figure 3 In the direction, each through first square groove 110 has the highest bottom wall in the middle area of ​​the first square groove 110, thereby forming a fluid flow path from the center of the first square groove 110 to the two ends of the first square groove 110 through the first square groove 110.

[0057] Figure 4 1 is a schematic structural diagram of a second square groove 120 formed by a row of protrusions 101 of a polishing device according to an embodiment of the present disclosure.

[0058] like Figure 4 As shown, the protrusions 101 are formed into multiple rows and columns, and the gaps between at least two adjacent columns of protrusions 101 form a second square groove 120, the bottom wall of which is closer to the lower end of the base 100 along the direction from the center to the outside.

[0059] The angle between the bottom wall of the second square groove 120 and the polishing plane is 4° to 8°, preferably about 6°.

[0060] That is to say, the above-mentioned raised portion 101 can be formed on the base 100 of the present invention by grooving, and the bottom wall of the second square groove 120 has an angle of about 6° from the center to the surrounding area. The existence of the second square groove 120 increases the fluidity of the polishing powder, and it is easy to take away the dirt remaining during polishing or impurities such as glass powder removed, and the angle is not too large, and the function of retaining polishing powder and increasing polishing efficiency can be retained.

[0061] along Figure 3 In the direction, each through second square groove 120 has the highest bottom wall in the middle area of ​​the second square groove 120, thereby forming a fluid flow path from the center of the second square groove 120 to the two ends of the second square groove 120 through the second square groove 120.

[0062] The polishing device disclosed in the present invention is formed by a split structure, which is convenient for replacing easily worn parts and reduces losses. In addition, due to the presence of the first square groove and the second square groove, the fluidity of the polishing liquid on the polishing disk during the optical glass polishing process is increased. The angle of the polishing disk groove increases the fluidity of the polishing powder, making it easy to take away dirt remaining during polishing or impurity products such as glass powder removed, and the processed product has a good finish.

[0063] In the description of this specification, the description with reference to the terms "one embodiment / method", "some embodiments / methods", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment / method or example are included in at least one embodiment / method or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment / method or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments / methods or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments / methods or examples described in this specification and the features of the different embodiments / methods or examples, unless they are contradictory.

[0064] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0065] Those skilled in the art should understand that the above embodiments are only for the purpose of clearly illustrating the present disclosure, and are not intended to limit the scope of the present disclosure. For those skilled in the art, other changes or modifications may be made based on the above disclosure, and these changes or modifications are still within the scope of the present disclosure.

Claims

1. A polishing device, characterized in that: include: a base including an upper end and a lower end opposite to the upper end, and having a center; and A seat component, the seat component is arranged at the lower end of the base; The upper end of the base has a plurality of protrusions, and the surfaces of the protrusions away from the lower end are located on the same polishing plane or approximately on the same polishing plane; there are gaps between the protrusions, and the bottom surfaces of at least part of the gaps are closer to the upper end of the base along a direction away from the center of the base.

2. The polishing device according to claim 1, characterized in that: A bottom surface of the at least partial gap is disposed obliquely with respect to the polishing plane.

3. The polishing device according to claim 2, characterized in that: The angle between the bottom surface of at least part of the gap and the polishing plane is 4° to 8°.

4. The polishing device according to claim 1, characterized in that: The protrusions are formed in multiple rows and columns, and the gaps between at least two adjacent rows of protrusions form a first square groove, the bottom wall of which is closer to the lower end of the base in a direction from the center to the outside.

5. The polishing device according to claim 4, characterized in that: The included angle between the bottom wall of the first square groove and the polishing plane is 4° to 8°.

6. The polishing device according to claim 1, characterized in that: The protrusions are formed in multiple rows and columns, and the gaps between at least two adjacent columns of protrusions form a second square groove, the bottom wall of which is closer to the lower end of the base along the direction from the center to the outside.

7. The polishing device according to claim 6, characterized in that: The included angle between the bottom wall of the second square groove and the polishing plane is 4° to 8°.

8. The polishing device according to claim 1, characterized in that: At least a portion of the gaps between the protrusions form a fluid flow path through which the fluid flows to the outside of the substrate.

9. The polishing device according to claim 1, characterized in that: The base and the seat member have the same or substantially the same axis of rotation.

10. The polishing device according to claim 1, characterized in that: The seat component is provided with a countersunk hole along its axial direction, and a friction sleeve is arranged in the countersunk hole.