Stable semiconductor material grinding head device

Abstract

The utility model discloses a stable semiconductor material grinding head device which comprises a grinding head body, a connecting rod is in threaded connection with the upper portion of the interior of the grinding head body, a convenient-to-disassemble mechanism is arranged above the grinding head body, and the convenient-to-disassemble mechanism comprises a supporting block, a spring and a buckle. Supporting blocks are fixedly installed on the upper portion of the grinding head body in a bilateral symmetry mode, buckles are connected into the supporting blocks in a clamped mode, springs are fixedly connected into the buckles, and the interiors of the springs are fixedly connected to the outer sides of the lower portions of the connecting rods. According to the stable type semiconductor material grinding head device, by arranging the convenient-to-disassemble mechanism, an operator can disassemble and assemble the grinding head conveniently, so that it is guaranteed that the grinding and polishing efficiency of the grinding head cannot be reduced, meanwhile, by arranging the damping mechanism, the vibration strength of the grinding head during operation is greatly reduced, and the service life of the grinding head can be greatly prolonged; and in addition, a cooling mechanism is arranged, the grinding head is cooled in time, and the grinding precision of the grinding head is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor material processing equipment, in particular to a stable semiconductor material grinding head device. Background Art

[0002] Semiconductor materials are electronic materials with semiconductor properties and can be used to make semiconductor devices and integrated circuits. Generally, the conductivity increases with the increase of temperature. Semiconductor materials are important materials for making transistors, integrated circuits, power electronic devices and optoelectronic devices. Grinding heads are a general term for small shank grinding tools. They are widely used in electric grinders, hanging grinders, hand drills and other machines. There are many kinds of stable semiconductor material grinding head devices on the market, but there are still some disadvantages.

[0003] For example, in actual use, a general stable semiconductor material grinding head device uses a grinding head to grind and polish the material. Generally, the installation between the grinding head and the machine is relatively complicated. Once the grinding head is damaged, it is time-consuming to disassemble and replace it. At the same time, the grinding head will generate strong vibrations during grinding and polishing, which will cause serious damage to the grinding head and reduce its service life. In addition, a large amount of heat will be generated during grinding and polishing. If it is not cooled down, the grinding effect of the grinding head will be affected. Therefore, we propose a stable semiconductor material grinding head device to solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a stable semiconductor material grinding head device to solve the problem that the current stable semiconductor material grinding head device proposed in the above background technology uses a grinding head to grind and polish the material. Generally, the installation between the grinding head and the machine is relatively complicated. Once the grinding head is damaged, it is time-consuming to disassemble and replace it. At the same time, the grinding head will generate strong vibration during grinding and polishing, which will cause serious damage to the grinding head and reduce its service life. In addition, a large amount of heat will be generated during grinding and polishing. If it is not cooled, the grinding effect of the grinding head will be affected.

[0005] To achieve the above purpose, the utility model provides the following technical solution: a stable semiconductor material grinding head device, comprising:

[0006] A grinding head body, wherein a connecting rod is threadedly connected to the upper part of the grinding head body;

[0007] Also includes:

[0008] A disassembly-friendly mechanism is provided above the grinding head body, wherein the disassembly-friendly mechanism comprises a support block, a spring and a buckle, a support block is fixedly installed symmetrically on the upper side of the grinding head body, and the buckle is connected with the inner part of the support block, and the inner part of the buckle is fixedly connected with the spring, and the inner part of the spring is fixedly connected to the lower outer side of the connecting rod;

[0009] A rubber pad, wherein a cooling mechanism is symmetrically arranged on the outer side of the rubber pad, wherein the cooling mechanism includes a fixing plate, a small electric fan and a filter protection shell, a fixing plate is symmetrically mounted on the upper outer side of the rubber pad, and a small electric fan is arranged below the fixing plate, and a filter protection shell is installed on the outer side of the small electric fan, and the filter protection shell is connected by a snap-fit ​​connection with the fixing plate.

[0010] Preferably, a rubber pad is provided on the outer side of the connecting rod, and sliding grooves are provided at the front and rear of the lower inner side of the rubber pad.

[0011] Preferably, a fixed block is slidably installed inside the sliding groove, a rubber pad is installed below the fixed block, and a clamping block is fixedly installed below the rubber pad.

[0012] Preferably, the clamping block and the clamping slot are connected by clamping engagement, and the clamping slot is symmetrically arranged front to back on the upper inner part of the grinding head body.

[0013] Preferably, support rods are rotatably mounted on both sides of the middle of the rubber pad, and mounting holes are provided inside the support rods.

[0014] Preferably, mounting rods are fixedly mounted on the left and right sides above the rubber pad, and mounting holes are opened inside the upper parts of the mounting rods.

[0015] Compared with the prior art, the utility model has the following beneficial effects: the stable semiconductor material grinding head device is convenient for operators to disassemble and install the grinding head by setting a disassembly mechanism, thereby ensuring that the grinding and polishing efficiency of the grinding head will not be reduced; at the same time, a shock absorbing mechanism is set to greatly reduce the vibration intensity of the grinding head during operation, which will greatly extend the service life of the grinding head; in addition, a cooling mechanism is set to timely cool the grinding head to ensure the grinding accuracy of the grinding head;

[0016] 1. A grinding head body, a support block, a spring and a buckle are provided, which are connected together through the grinding head body and the connecting rod through threads. In order to ensure that the grinding head body and the connecting rod are installed more stably, the support blocks are symmetrically installed on the upper side of the grinding head body, and the springs are symmetrically arranged on the lower side of the connecting rod. Buckles are installed on the outer side of the springs. The buckles are pinched with fingers to shrink the springs, and then the buckles are inserted into the inside of the support block, and then the fingers pinching the buckles are released, so that the buckles and the support block are firmly clamped together. If the grinding head body is damaged, it is only necessary to separate the clamped support block and the buckle, and then twist the grinding head body to separate the grinding head body and the connecting rod, which is convenient for operators to disassemble and install the grinding head body, thereby ensuring that the efficiency of grinding and polishing of the grinding head body will not be reduced;

[0017] 2. A rubber pad, a sliding groove, a fixed block and a clamping block are provided. A rubber pad is provided on the outside of the connecting rod, a sliding groove is provided symmetrically at the bottom of the rubber pad, the fixed block is slidably connected to the inside of the sliding groove, a rubber pad is provided at the bottom of the fixed block, and a clamping block is installed at the bottom of the rubber pad. When the grinding head body and the connecting rod are fixedly connected, the clamping block can be connected and fixed by clamping the clamping groove because the clamping grooves are provided at the top of the grinding head body. The provision of the rubber pad greatly reduces the vibration intensity of the grinding head body during operation, which will greatly extend the service life of the grinding head body.

[0018] 3. A fixing plate, a small electric fan and a filter protective shell are provided. A large amount of heat will be generated by long-term grinding and polishing of the grinding head body, that is, a fixing plate is symmetrically arranged on the upper and outer sides of the rubber pad, and a small electric fan is installed under the fixing plate. When the small electric fan is turned on, the filter protective shell can be quickly cooled down. At the same time, a filter protective shell is provided on the outer side of the small electric fan for dust protection, so that the grinding head body can be cooled down in time to ensure the grinding accuracy of the grinding head body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a perspective structural diagram of the utility model;

[0020] Figure 2 It is a schematic diagram of the side cross-sectional structure of the utility model;

[0021] Figure 3 This is a schematic diagram of the front cross-sectional structure of the utility model;

[0022] Figure 4 The top view of the cross-sectional structure of the utility model shows the support block.

[0023] In the figure: 1. Grinding head body; 2. Connecting rod; 3. Support block; 4. Spring; 5. Buckle; 6. Rubber pad; 7. Sliding groove; 8. Fixed block; 9. Block; 10. Slot; 11. Mounting rod; 12. Mounting hole; 13. Support rod; 14. Fixed plate; 15. Small electric fan; 16. Filter protective shell. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1-4 The utility model provides a technical solution: a stable semiconductor material grinding head device, including: a grinding head body 1, a connecting rod 2, a supporting block 3, a spring 4, a buckle 5, a rubber pad 6, a sliding groove 7, a fixing block 8, a clamping block 9, a clamping groove 10, a mounting rod 11, a mounting hole 12, a supporting rod 13, a fixing plate 14, a small electric fan 15 and a filter protective shell 16;

[0026] like Figure 1 , Figure 2 and Figure 3 As shown in the figure, a rubber pad 6 is arranged on the outside of the connecting rod 2, and mounting rods 11 are installed on the left and right sides above the rubber pad 6. A mounting hole 12 is arranged on the upper part of the mounting rod 11. The mounting hole 12 is aligned with the position where the machine is installed and fixed with bolts. At the same time, a support rod 13 is rotatably installed on the left and right sides of the middle of the rubber pad 6. The support rod 13 also has a mounting hole 12 inside, which can also be connected to the machine. The support rod 13 can play a supporting role for the grinding head body 1 when grinding and polishing.

[0027] like Figure 1 and Figure 3As shown in , the grinding head body 1 and the connecting rod 2 can be rotatably threaded together. In order to ensure that the grinding head body 1 and the connecting rod 2 are installed more stably, the support blocks 3 are symmetrically installed on the upper side of the grinding head body 1, and the springs 4 are symmetrically arranged on the left and right sides of the lower side of the connecting rod 2. Buckles 5 are installed on the outer side of the springs 4. The buckles 5 are pinched with fingers to shrink the springs 4, and then the buckles 5 are inserted into the inside of the support blocks 3, and then the fingers pinching the buckles 5 are released so that the buckles 5 and the support blocks 3 are firmly clamped together. If the grinding head body 1 is damaged, it is only necessary to separate the clamped support blocks 3 and buckles 5, and then twist the grinding head body 1 to separate the grinding head body 1 and the connecting rod 2, so that the operator can disassemble and install the grinding head body 1 conveniently, thereby ensuring that the grinding and polishing efficiency of the grinding head body 1 will not be reduced.

[0028] like Figure 1 and Figure 2 As shown in the figure, a rubber pad 6 is arranged on the outer side of the connecting rod 2, and a sliding groove 7 is symmetrically opened at the lower part of the rubber pad 6. The inner part of the sliding groove 7 is slidably connected to a fixed block 8. A rubber pad 6 is also arranged at the lower part of the fixed block 8. A clamping block 9 is installed at the lower part of the rubber pad 6. When the grinding head body 1 and the connecting rod 2 are fixedly connected, since the clamping groove 10 is opened at the upper part of the inner part of the grinding head body 1, the clamping block 9 can be connected and fixed by clamping with the clamping groove 10. The setting of the rubber pad 6 greatly reduces the vibration intensity of the grinding head body 1 during operation, which will greatly extend the service life of the grinding head body 1.

[0029] like Figure 1 , Figure 3 and Figure 4 As shown in the figure, a large amount of heat will be generated by long-term grinding and polishing of the grinding head body 1, that is, a fixing plate 14 is symmetrically arranged on the upper and outer sides of the rubber pad 6, and a small electric fan 15 is installed under the fixing plate 14. When the small electric fan 15 is turned on, the small electric fan 15 can quickly cool down the grinding head body 1. The grinding accuracy of the grinding head body 1 can be ensured by cooling the grinding head body 1 in time. At the same time, a filter protective shell 16 is arranged on the outer side of the small electric fan 15, and the filter protective shell 16 protects the small electric fan 15 from dust.

[0030] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in the field. The standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the records in the specification and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0031] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A stable semiconductor material grinding head device, comprising: A grinding head body (1), wherein a connecting rod (2) is threadedly connected to the upper part of the interior of the grinding head body (1); It is characterized by further comprising: A disassembly-facilitating mechanism is arranged above the grinding head body (1), wherein the disassembly-facilitating mechanism comprises a support block (3), a spring (4) and a buckle (5); the support block (3) is fixedly mounted on the upper side of the grinding head body (1) in a symmetrical manner, and the buckle (5) is snap-fitted inside the support block (3), and the spring (4) is fixedly connected inside the buckle (5), and the spring (4) is fixedly connected inside to the lower outer side of the connecting rod (2); A rubber pad (6) is provided with a cooling mechanism symmetrically disposed on the outer side of the rubber pad (6), wherein the cooling mechanism comprises a fixing plate (14), a small electric fan (15) and a filter protection shell (16); the fixing plate (14) is symmetrically mounted on the upper outer side of the rubber pad (6), and a small electric fan (15) is disposed below the fixing plate (14); a filter protection shell (16) is mounted on the outer side of the small electric fan (15), and the filter protection shell (16) is connected by a fixing plate (14).

2. The stable semiconductor material grinding head device according to claim 1, characterized in that: A rubber pad (6) is arranged on the outer side of the connecting rod (2), and sliding grooves (7) are provided at the front and rear of the lower inner side of the rubber pad (6).

3. The stable semiconductor material grinding head device according to claim 2, characterized in that: A fixed block (8) is slidably mounted inside the sliding groove (7), a rubber pad (6) is mounted below the fixed block (8), and a clamping block (9) is fixedly mounted below the rubber pad (6).

4. The stable semiconductor material grinding head device according to claim 3, characterized in that: The clamping block (9) and the clamping slot (10) are clamped and connected, and the clamping slot (10) is symmetrically arranged front and back on the upper part of the interior of the grinding head body (1).

5. The stable semiconductor material grinding head device according to claim 1, characterized in that: Support rods (13) are rotatably mounted on the left and right sides of the middle of the rubber pad (6), and mounting holes (12) are provided inside the support rods (13).

6. The stable semiconductor material grinding head device according to claim 5, characterized in that: Mounting rods (11) are fixedly mounted on the left and right sides above the rubber pad (6), and mounting holes (12) are provided inside the upper parts of the mounting rods (11).

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