Semiconductor coating equipment
By designing a small and manual controlled semiconductor coating equipment, the existing equipment is large and the purchase cost is high, the portability and low purchase price of the equipment are realized, and the quality of the coating is ensured by heating patterns.
Patent Information
- Application Number
- CN202420471478.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-03-12
AI Technical Summary
The existing semiconductor coating equipment is large in size, inconvenient to move, and the purchase cost is high, resulting in insufficient cost-effectiveness when it is not necessary to use it frequently in small workshops.
A smaller semiconductor coating equipment is designed, and manual control is used for coating. The equipment includes boxes, pressure plates, rotating blocks, and heating patterns. Through the cooperation of these components, the coating and heating of semiconductor are achieved.
The portability and low purchase price of the equipment are realized, and the cost -effectiveness of the small workshops is not often used in small workshops, and the coating is fully fitted by heating patterns.
Smart Images
Figure CN222407148U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of semiconductor coating, in particular to semiconductor coating equipment. Background Art
[0002] Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors.
[0003] Most of the semiconductor coating equipment currently on the market are large and not easy to move, and the purchase cost is high. When small workshops do not need to use them frequently, they will be cost-effective. For this reason, we propose a semiconductor coating equipment to solve the above problems. Utility Model Content
[0004] The semiconductor coating equipment proposed by the utility model solves the problem that most of the semiconductor coating equipment currently on the market are large in size and inconvenient to move, and the purchase cost is high, which will cause insufficient cost performance when facing small workshops that do not need to be used frequently.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A semiconductor coating device comprises a box body, a pressure plate is arranged at the upper end of the box body, a circular hole is opened in the middle of the pressure plate, a rotating block is rotatably arranged inside the circular hole, a second heating pattern is arranged at the lower end of the rotating block, two cutting knives are arranged inside the rotating block, a first handle is connected to the upper end of the rotating block, a groove is opened at the upper end of the box body, a placement groove is opened in the middle of the groove, a first heating pattern is arranged on the outer side of the placement groove, and a plurality of positioning blocks are connected to the inner side wall of the first heating pattern.
[0007] Preferably, two arc-shaped rods are provided at the front ends of both sides of the box body, two arc-shaped holes are opened at both sides of the front end of the pressure plate, the arc-shaped rods are slidably connected to the arc-shaped holes, and two baffles are connected to both sides of the rear end of the box body.
[0008] Preferably, two connecting plates are connected to both sides of the rear end of the pressure plate, and connecting rods are connected to the rear ends of both sides of the box body, and the connecting plates are rotatably connected to the connecting rods.
[0009] Preferably, two side panels are connected to the rear ends of both sides of the upper end of the box body, the middle front ends of the two side panels are rotatably connected to the guide rod, the two side panels are connected by a rotating rod, and the outer side of the rotating rod is rotatably sleeved with a material roll.
[0010] Preferably, two second handles are connected to both sides of the front end of the pressing plate, a protrusion is provided at the lower end of the pressing plate, a circular hole is provided in the middle of the protrusion, and a first limiting ring is connected to the inside of the circular hole.
[0011] Preferably, two second limiting rings are connected to the two ends of the outer side of the rotating block, the second limiting rings are rotatably connected to the first limiting rings, the first limiting ring is arranged in the middle of the two first limiting rings, and two extension openings are opened at the lower end of the rotating block.
[0012] Preferably, a circular ring is provided at the middle upper end of the rotating block, a spring is connected to the lower end of the circular ring, and the lower end of the spring is connected to the upper end of the rotating block.
[0013] Preferably, a sliding rod is connected to the lower end of the circular ring, a limiting plate is sleeved on the outer side of the sliding rod, two sliding holes are provided in the middle of the rotating block, and a limiting hole is provided in the middle of the sliding hole.
[0014] Preferably, the lower end of the sliding rod is connected to the cutting knife, the sliding rod is arranged inside the sliding hole in a sliding connection, and the limiting plate is slidably arranged inside the limiting hole.
[0015] The beneficial effects of the utility model are:
[0016] 1. This semiconductor coating device is manually controlled for coating and is small in size, so the purchase price is low. When it is not needed frequently in small workshops, it improves the cost performance and the practicality of this equipment.
[0017] 2. This semiconductor coating device is equipped with heating patterns at the upper end of the box and the lower end of the pressure plate, which can heat the film to achieve the purpose of complete bonding.
[0018] In summary, the device is manually controlled for coating and is small in size, so the purchase price is low. When it is not needed frequently in small workshops, the cost performance is improved, thereby increasing the practicality of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a schematic diagram of the overall viewing angle structure of the utility model.
[0020] Figure 2 It is a schematic diagram of the structure of the expanded viewing angle of the present utility model.
[0021] Figure 3 This is a schematic diagram of the box body perspective structure of the utility model.
[0022] Figure 4 It is a schematic diagram of the viewing angle structure of the pressing plate of the utility model.
[0023] Figure 5It is a schematic diagram of the structure of the pressure plate shell of the utility model.
[0024] Figure 6 It is a schematic diagram of the viewing angle structure of the rotating block of the utility model.
[0025] Figure 7 It is a schematic diagram of the lower structure of the rotating block of the utility model.
[0026] Figure 8 This is a schematic diagram of the viewing angle structure of the cutting knife of the utility model.
[0027] Fig. 9 It is a schematic diagram of the cross-sectional structure of the rotating block of the utility model.
[0028] Numbers in the figure: 1. Box body; 2. Pressing plate; 3. First handle; 4. Second handle; 5. Material roll; 6. Side plate; 7. Rotating rod; 8. Guide rod; 9. Connecting rod; 10. Arc rod; 11. Groove; 12. First heating pattern; 13. Placement slot; 14. Positioning block; 15. Arc hole; 16. Bump; 17. Connecting plate; 18. Baffle; 19. Round hole; 20. First limiting ring; 21. Rotating block; 22. Second limiting ring; 23. Sliding hole; 24. Round ring; 25. Second heating pattern; 26. Extension port; 27. Spring; 28. Sliding rod; 29. Cutting knife; 30. Limiting plate; 31. Limiting hole. DETAILED DESCRIPTION
[0029] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0030] Reference Figure 1-Figure 9 As shown, this embodiment provides a semiconductor coating device, including a box body 1, a pressure plate 2 is arranged at the upper end of the box body 1, a circular hole 19 is opened in the middle of the pressure plate 2, a rotating block 21 is rotatably arranged inside the circular hole 19, a second heating pattern 25 is arranged at the lower end of the rotating block 21, two cutting knives 29 are arranged inside the rotating block 21, and a first handle 3 is connected to the upper end of the rotating block 21, a groove 11 is opened at the upper end of the box body 1, a placement groove 13 is opened in the middle of the groove 11, a first heating pattern 12 is arranged on the outer side of the placement groove 13, and a plurality of positioning blocks 14 are connected to the inner side wall of the first heating pattern 12, and the positioning blocks 14 are used to leave a gap between the semiconductor and the side wall of the placement groove 13 to facilitate the insertion of the cutting knife 29.
[0031] like Figure 1-Figure 3As shown, two arc rods 10 are provided at the front ends of both sides of the box body 1, two arc holes 15 are opened at both sides of the front end of the pressure plate 2, the arc rods 10 are slidably connected to the arc holes 15, two baffles 18 are connected to both sides of the rear end of the box body 1, two connecting plates 17 are connected to both sides of the rear end of the pressure plate 2, connecting rods 9 are connected to the rear ends of both sides of the box body 1, the connecting plates 17 are rotatably connected to the connecting rods 9, two side plates 6 are connected to the rear ends of both sides of the upper end of the box body 1, the middle front ends of the two side plates 6 are rotatably connected to the guide rods 8, the two side plates 6 are connected by a rotating rod 7, the outer rotating sleeve of the rotating rod 7 is provided with a material roll 5, and the baffle 18 is used to limit the rotation angle of the pressure plate 2.
[0032] like Figure 4-Figure 5 As shown, two second handles 4 are connected to both sides of the front end of the pressing plate 2, a protrusion 16 is provided at the lower end of the pressing plate 2, a circular hole 19 is provided in the middle of the protrusion 16, a first limiting ring 20 is connected inside the circular hole 19, two second limiting rings 22 are connected to the outer ends of the rotating block 21, the second limiting ring 22 is rotatably connected to the first limiting ring 20, the first limiting ring 20 is provided in the middle of the two first limiting rings 20, and two extension openings 26 are provided at the lower end of the rotating block 21, and the extension opening 26 is used to extend the cutting knife 29 to achieve the purpose of cutting.
[0033] like Figure 6-Figure 9 As shown, a circular ring 24 is provided at the middle upper end of the rotating block 21, and a spring 27 is connected to the lower end of the circular ring 24. The lower end of the spring 27 is connected to the upper end of the rotating block 21, and a sliding rod 28 is connected to the lower end of the circular ring 24. A limiting plate 30 is sleeved on the outer side of the sliding rod 28. Two sliding holes 23 are provided in the middle of the rotating block 21, and a limiting hole 31 is provided in the middle of the sliding hole 23. The lower end of the sliding rod 28 is connected to the cutting knife 29, and the sliding rod 28 is arranged inside the sliding hole 23 in a sliding connection. The limiting plate 30 is slidably arranged inside the limiting hole 31, and the spring 27 is used to push the cutting knife 29 to reset.
[0034] The working principle of the utility model is as follows: when in use, the semiconductor is placed inside the placement groove 13, the position of the semiconductor is fixed by the positioning block 14, the material roll 5 is pulled to drive it to rotate with the rotating rod 7, so that the material roll 5 covers the upper end of the semiconductor, the second handle 4 is pulled to drive the pressure plate 2 to rotate, the pressure plate 2 drives the connecting plate 17 to rotate with the connecting rod 9, the protrusion 16 is inserted into the inside of the groove 11, and pressed on the upper end of the material roll 5, the first heating pattern 12 and the second heating pattern 25 are started to heat the material roll 5, the first handle 3 is pulled to drive the rotating block 21 to rotate, and the rotating block 21 is rotated to smooth the material roll 5 to achieve the purpose of complete fitting, the ring 24 is pressed down to drive the sliding rod 28 to move with the sliding hole 23, the sliding rod 28 drives the cutting knife 29 to extend from the extension port 26, and the first handle 3 is pulled to drive the cutting knife 29 to rotate, so as to achieve the purpose of cutting the material roll 5 and complete the coating effect.
[0035] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A semiconductor coating device, comprising a housing (1), characterized in that: A pressing plate (2) is arranged at the upper end of the box body (1), a circular hole (19) is provided in the middle of the pressing plate (2), a rotating block (21) is rotatably arranged inside the circular hole (19), a second heating pattern (25) is arranged at the lower end of the rotating block (21), two cutting knives (29) are arranged inside the rotating block (21), a first handle (3) is connected to the upper end of the rotating block (21), a groove (11) is provided at the upper end of the box body (1), a placement groove (13) is provided in the middle of the groove (11), a first heating pattern (12) is arranged on the outer side of the placement groove (13), and a plurality of positioning blocks (14) are connected to the inner side wall of the first heating pattern (12).
2. A semiconductor coating device according to claim 1, characterized in that: Two arc-shaped rods (10) are arranged at the front ends of both sides of the box body (1), two arc-shaped holes (15) are opened at both sides of the front end of the pressure plate (2), the arc-shaped rods (10) are slidably connected to the arc-shaped holes (15), and two baffles (18) are connected to both sides of the rear end of the box body (1).
3. A semiconductor coating device according to claim 1, characterized in that: Two connecting plates (17) are connected to both sides of the rear end of the pressure plate (2), and connecting rods (9) are connected to both sides of the rear end of the box body (1), and the connecting plates (17) are rotatably connected to the connecting rods (9).
4. The semiconductor coating device according to claim 1, characterized in that: Two side plates (6) are connected to the rear ends of both sides of the upper end of the box body (1); the middle front ends of the two side plates (6) are rotatably connected to a guide rod (8); the two side plates (6) are connected by a rotating rod (7); and a material roll (5) is rotatably sleeved on the outer side of the rotating rod (7).
5. The semiconductor coating device according to claim 1, characterized in that: Two second handles (4) are connected to both sides of the front end of the pressing plate (2), a convex block (16) is provided at the lower end of the pressing plate (2), a circular hole (19) is provided in the middle of the convex block (16), and a first limiting ring (20) is connected inside the circular hole (19).
6. The semiconductor coating device according to claim 5, characterized in that: Two second limiting rings (22) are connected to the two ends of the outer side of the rotating block (21), the second limiting ring (22) is rotatably connected to the first limiting ring (20), the first limiting ring (20) is arranged in the middle of the two first limiting rings (20), and the lower end of the rotating block (21) is provided with two extension openings (26).
7. The semiconductor coating device according to claim 1, characterized in that: A circular ring (24) is arranged at the middle upper end of the rotating block (21), a spring (27) is connected to the lower end of the circular ring (24), and the lower end of the spring (27) is connected to the upper end of the rotating block (21).
8. The semiconductor coating device according to claim 7, characterized in that: The lower end of the circular ring (24) is connected to a sliding rod (28), the outer side of the sliding rod (28) is sleeved with a limiting plate (30), the middle of the rotating block (21) is provided with two sliding holes (23), and the middle of the sliding hole (23) is provided with a limiting hole (31).
9. The semiconductor coating device according to claim 8, characterized in that: The lower end of the sliding rod (28) is connected to the cutting knife (29), the sliding rod (28) is arranged inside the sliding hole (23) in a sliding connection, and the limiting plate (30) is slidably arranged inside the limiting hole (31).