Biodegradable express packaging film for electronic products and express packaging bag
By using a multi -layer structure express packaging material made of the Mother -Mother's inorganic filler with PBAT and PLA mixing, it solves the problem of difficulty in protecting electronic products in existing packaging materials, realized effective impact resistance and buffer protection, and at the same time, it has good good Environment sustainability.
Patent Information
- Application Number
- CN202323351005.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-09
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2033-12-09
AI Technical Summary
Existing express packaging materials are difficult to effectively protect electronic products from impact and wear, and there are problems of environmental pollution.
Bio -degradable materials made of Yunmu inorganic fillers made of PBAT and PLA mixes are designed as courier films and bags with multi -layer structures, including degradable external protective layers, plastic foam buffer layers and internal protective layers. Thermal bonding technology assembly.
The effective anti -impact and buffering protection of electronic products have been achieved, and the risk of damage during transportation is reduced. At the same time, due to the use of biodegradable materials, it reduces the environmental pollution and has sustainability.
Smart Images
Figure CN222407554U_ABST
Abstract
Description
Technical field:
[0002] The utility model relates to a biodegradable express packaging film and an express packaging bag for electronic products. Background technology:
[0004] Against the backdrop of continuous progress in science and technology and materials, new biodegradable materials, such as PBAT (polybutylene adipate / terephthalate) and PLA (polylactic acid), have good biodegradability and sustainability, and are gradually becoming an ideal choice to replace traditional plastic materials.
[0005] Therefore, developing biodegradable express packaging films to meet the needs of protecting electronic equipment has become an important research and development direction. Utility model content:
[0007] The utility model aims to provide a biodegradable express packaging film and an express packaging bag for electronic products.
[0008] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a biodegradable express packaging film for electronic products, comprising a degradable outer protective layer, a degradable plastic foam buffer layer and a degradable inner protective layer arranged in sequence from top to bottom, and the degradable outer protective layer, the degradable plastic foam buffer layer and the degradable inner protective layer are bonded together in sequence by hot melt.
[0009] Furthermore, the degradable outer protective layer and the degradable inner protective layer are both formed by extrusion of a mixture of PBAT and PLA after modification with mica inorganic filler.
[0010] Furthermore, the degradable plastic foam buffer layer is formed by extruding a mixture of PBAT and PLA and a foaming agent.
[0011] Furthermore, the thickness of the degradable outer protective layer is 100 μm.
[0012] Furthermore, the thickness of the degradable plastic foam buffer layer is 200 μm.
[0013] Furthermore, the thickness of the degradable inner protective layer is 50 μm.
[0014] Another technical solution adopted by the utility model is: a biodegradable electronic product express packaging bag, which is composed of two pieces of the above-mentioned biodegradable electronic product express packaging films that are heat-sealed, one of the packaging films is provided with a bag opening, and a degradable plastic zipper is provided at the bag opening.
[0015] Furthermore, the degradable plastic zipper is extruded from a mixture of PBAT and PLA modified with mica inorganic filler.
[0016] Compared with the prior art, the utility model has the following effects: the utility model has a reasonable design, uses relatively low-cost biodegradable materials, and is environmentally friendly and sustainable; at the same time, based on the preciousness and susceptibility of electronic products, the designed multi-layer structure film effectively provides impact resistance and buffering of external impact forces. Description of the drawings:
[0018] Figure 1 It is a schematic diagram of the structure of the first embodiment of the utility model;
[0019] Figure 2 It is a schematic diagram of the structure of the second embodiment of the utility model;
[0020] Figure 3 It is a schematic diagram of the hierarchical structure of the second embodiment of the present utility model. Specific implementation method:
[0022] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods.
[0023] In the description of the present invention, it should be understood that the terms "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0024] Embodiment 1: Figure 1 As shown, the utility model is a biodegradable express packaging film for electronic products, comprising a degradable outer protective layer 1, a degradable plastic foam buffer layer 2 and a degradable inner protective layer 3 arranged in sequence from top to bottom, the degradable outer protective layer 1, the degradable plastic foam buffer layer 2 and the degradable inner protective layer 3 are all made of biodegradable materials, and the degradable outer protective layer, the degradable plastic foam buffer layer and the degradable inner protective layer are bonded together in sequence by hot melt, that is, the degradable outer protective layer 1 is the outermost layer of the film, the degradable inner protective layer 3 is the innermost layer of the film, and the degradable plastic foam buffer layer 2 is sandwiched between the degradable outer protective layer 1 and the degradable inner protective layer 3, which plays a role in buffering and shock absorption. The use of relatively low-cost biodegradable materials is environmentally friendly and sustainable; at the same time, based on the preciousness and susceptibility of electronic products, the designed multi-layer structure film effectively provides the function of impact resistance and buffering external impact force.
[0025] In this embodiment, the thickness of the degradable outer protective layer 1 is 100 μm. The uniformly mixed PBAT and PLA mixture is placed in an extruder after being modified with mica inorganic filler. The mixture is converted into a molten state by heating and melting, and the extruder parameters are adjusted, such as extrusion temperature, speed and pressure, to ensure that the extruder can provide efficient working conditions and suitable extrusion force. After extruding a thicker film-like material, a single-layer or multi-layer composite extruder head is used to increase the thickness. It is placed in a cooling device for rapid cooling to achieve solidification and hardening, and maintain the required thickness of the thicker outer protective layer. After completion, the quality and thickness are checked and squeezed. If necessary, other machines, such as cutting machines, can be used to set corresponding parameters, perform certain trimming and cutting to obtain other shapes. The purpose of setting this layer is to provide a certain wear resistance and physical impact resistance, and to play the role of consumables protecting built-in items during transportation, that is, to provide impact consumption instead of firmness and a certain thickness.
[0026] In this embodiment, the thickness of the degradable inner protective layer 3 is 50 μm, and its manufacturing method is similar to that of the degradable outer protective layer, but the thickness is changed. The design purpose of this layer is to achieve a thin and light protective film that fits the surface of the electronic product, to provide the last layer of protection, to stabilize the position of the electronic product during transportation, and to stabilize the state of its outer surface.
[0027] In the present embodiment, the thickness of the degradable plastic foam buffer layer 2 is 200 μm, which is formed by extrusion after mixing PBAT and PLA with a foaming agent. A physical foaming agent such as a bubble agent, or a chemical foaming agent such as a foaming agent powder, etc., can adjust the amount of the foaming agent according to actual conditions. During production, it is placed in an extruder, heated and melted, and the material is formed into a foam by an extruder head. The molten plastic is foamed by airflow or vacuum, and then the plastic foam is placed in a cooling device for rapid cooling, and solidification and hardening are completed to maintain the desired buffer layer shape and structure. If necessary, other machines, such as a cutting machine, etc., can be used to set corresponding parameters, perform certain trimming and cutting, and obtain other shapes. The design purpose of this layer is to provide additional protection to prevent external impacts from causing irreversible wear and tear on electronic products.
[0028] In this embodiment, each layer of the structure is heat-melted and bonded together by heat-sealing technology. Each layer of the film structure is placed on a heating plate or a heat-sealing machine, and the film surface is melted by heating, and then pressurized to bond them together.
[0029] The film is mainly made of a mixture of PBAT (polybutylene adipate / terephthalate) and PLA (polylactic acid), which has good biodegradability and sustainability. The structure of the packaging film is carefully designed to provide sufficient wear resistance, impact resistance and cushioning properties to protect the packaged electronic instruments from damage.
[0030] Embodiment 2: Figure 2-3 As shown, the utility model is a biodegradable electronic product express packaging bag, which is composed of two pieces of biodegradable electronic product express packaging films of the above embodiment that are heat-sealed together, one of the packaging films is provided with a bag opening, and a degradable plastic zipper 4 is provided at the bag opening, and the degradable plastic zipper is used to seal the bag opening.
[0031] In this embodiment, the degradable plastic zipper 1 is a mixture of PBAT and PLA combined with mica inorganic filler, which is melted at high temperature and injected into a rice-tooth plastic zipper mold through an extruder. The extruder is operated to extrude the mixture so that it passes through the outlet of the mold, and a plastic zipper is formed according to the mold, which is placed in a cooling device to complete solidification and hardening, maintaining the required shape and structure, and the chain links are connected by hot blanching to form a complete zipper product. The purpose of the zipper is to enhance the sealing of express packaging bags, prevent the intrusion of moisture, dust or other external substances, and provide protection measures for the transportation of goods.
[0032] The utility model is made of a mixture of PBAT and PLA, has good biodegradability and sustainability, can effectively protect electronic instruments and other items in express delivery, and reduce pollution to the environment. This implementation is simple, practical, and suitable for large-scale production. The outer protective layer is used to connect the degradable zipper and fits tightly with the buffer layer. The buffer layer close to its inner side is heat-sealed to the inner protective layer, and the multi-layer tightly fitting membrane structure ensures the precise transportation of electronic products. At the same time, they are all made of biodegradable materials, are sustainable, do not pollute the environment, and meet the requirements of international environmental protection initiatives.
[0033] If the present invention discloses or involves components or structures that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, connection using bolts or screws), and can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by one-piece molding using a casting process) (except where it is obviously impossible to use an one-piece molding process).
[0034] In addition, unless otherwise stated, the terms used to indicate positional relationships or shapes in any of the technical solutions disclosed in the above utility model include states or shapes that are approximate, similar or close thereto.
[0035] Any component provided by the utility model can be assembled from multiple separate components, or can be a separate component manufactured by an integrated forming process.
[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the relevant field should understand that the specific implementation methods of the utility model can still be modified or some technical features can be replaced by equivalents without departing from the spirit of the technical solution of the utility model, which should be included in the scope of the technical solution for protection of the utility model.
Claims
1. A biodegradable express packaging film for electronic products, characterized in that: It comprises a degradable outer protective layer, a degradable plastic foam buffer layer and a degradable inner protective layer which are sequentially arranged from top to bottom, wherein the degradable outer protective layer, the degradable plastic foam buffer layer and the degradable inner protective layer are sequentially bonded together by hot-melt bonding; The degradable outer protective layer and the degradable inner protective layer are both formed by extrusion of a mixture of PBAT and PLA after modification with mica inorganic filler; The degradable plastic foam buffer layer is formed by mixing PBAT and PLA with a foaming agent and then extruding; The thickness of the degradable outer protective layer is 100 μm; The thickness of the degradable plastic foam buffer layer is 200 μm; The thickness of the degradable inner protective layer is 50 μm.
2. A biodegradable express packaging bag for electronic products, characterized by: The invention is composed of two pieces of heat-sealed biodegradable express packaging films for electronic products as claimed in claim 1, wherein one piece of the packaging films is provided with a bag opening, and a degradable plastic zipper is provided at the bag opening.
3. The biodegradable express packaging bag for electronic products according to claim 2, characterized in that: The degradable plastic zipper is formed by extrusion of a mixture of PBAT and PLA after being modified with a mica inorganic filler.