Plasma polishing device for polishing inner cavity of metal pipe fitting

Abstract

The utility model provides a plasma polishing device for polishing an inner cavity of a metal pipe fitting, and belongs to the technical field of pipe fitting polishing. The plasma polishing device for polishing the inner cavity of the metal pipe fitting comprises an objective table, a liquid inlet pump and a liquid collecting tank, and a fixed sliding rail and a supporting seat are fixedly arranged at the upper end of the objective table; a stepping motor is fixedly arranged at the end, away from the supporting base, of the fixed sliding rail, a sliding block is arranged on the fixed sliding rail in a sliding mode, and a first baffle and a second baffle are fixedly arranged at the upper end of the sliding block. According to the plasma polishing device, the polishing solution is directly sprayed to the inner cavity of the metal pipe fitting through the electrode spray head, the precise and uniform polishing effect is achieved, the traditional electrolyte plasma machining technology is optimized, the polishing quality is improved, meanwhile, the problems of overflowing and mixing of the polishing solution are solved, and the more efficient and controllable polishing process is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of pipe polishing, in particular to a plasma polishing device for polishing the inner cavity of a metal pipe. Background Art

[0002] The plasma polishing device is a device used for metal surface treatment, usually used to improve the finish and flatness of the material surface. This device uses the effect of plasma to excite atoms or molecules in gas or liquid into plasma, and uses the high-energy ion beam or active particles generated by the plasma to treat the material surface. The existing patent CN111687692A discloses a flow channel polishing device and polishing method based on electrolyte plasma processing. By fixing a driving slide on the stage, fixing an electrode connected to the negative pole of the power supply at one end of the driving slide, and setting the metal pipe to be polished on the sliding line of the driving slide, the electrode can be extended into the metal pipe to be polished, forming a polishing device in which the metal pipe to be polished and the electrode can move relative to each other. During the polishing process, the electrode of the device is easy to touch the pipe itself to form a short circuit. The coolant sump is located at the other end of the workpiece, and the polishing liquid flows directly from the thin tube of the inner flow channel to be processed to the coolant sump, and the polishing liquid will splash out during the polishing process. Utility Model Content

[0003] The utility model provides a plasma polishing device for polishing the inner cavity of a metal pipe, aiming to improve at least one of the above technical problems.

[0004] The utility model is realized by the following technical scheme: a plasma polishing device for polishing the inner cavity of a metal pipe, comprising a stage, a liquid inlet pump and a liquid collecting tank, wherein a fixed slide rail and a support seat are respectively fixedly arranged on the upper end of the stage;

[0005] A stepper motor is fixedly arranged at one end of the fixed slide rail away from the support seat, a slider is slidably arranged on the fixed slide rail, and a first baffle plate and a second baffle plate are fixedly arranged at the upper end of the slider;

[0006] A No. 2 connection seat and a No. 1 connection seat are fixedly arranged at the upper end surface of the stage near the center and near the fixed slide rail, respectively; an electrode is arranged between the support seat and the No. 2 baffle plate and through the No. 1 baffle plate; a liquid inlet is arranged at one end of the electrode away from the support seat; a liquid inlet hose is arranged at one end of the liquid inlet away from the electrode; a nozzle is arranged at one end of the electrode away from the liquid inlet hose and through the support seat and the No. 1 connection seat;

[0007] A drainage port is arranged at the upper end of the second connecting seat, and a drainage hose is arranged at the upper end of the drainage port.

[0008] Preferably, the support seat is configured to be L-shaped.

[0009] Preferably, support legs are fixedly provided at the four corners of the lower end surface of the loading platform.

[0010] Preferably, the first baffle plate and the second baffle plate are arranged parallel to each other.

[0011] Preferably, a metal pipe to be polished is arranged between the No. 2 connecting seat and the No. 1 connecting seat.

[0012] Preferably, the liquid inlet pump is arranged close to the liquid inlet hose.

[0013] Preferably, the liquid collecting tank is arranged near the liquid discharge hose.

[0014] Working principle: The metal pipe to be polished is fixed on the No. 1 connection seat and the No. 2 connection seat, the electrode is connected to the negative electrode, and the metal pipe to be polished is connected to the positive electrode of the power supply. The stepper motor drives the slider to make the electrode move linearly along the slide rail. This arrangement allows the electrode to extend into the interior of the metal pipe and make uniform linear motion. The polishing liquid is supplied by the liquid inlet pump, transmitted through the liquid inlet hose, and then sent into the liquid inlet inside the electrode. Finally, it is ejected from the nozzle, filling the inner cavity of the metal pipe, forming an electric field between the metal pipe to be polished and the metal pipe to be polished, realizing plasma polishing. The polishing liquid overflowing during the polishing process can be discharged into the collecting tank through the drain port and the drain hose.

[0015] (I) Beneficial effects

[0016] The utility model provides a plasma polishing device for polishing the inner cavity of a metal pipe. It has the following beneficial effects:

[0017] The utility model provides a plasma polishing device for polishing the inner cavity of a metal pipe. The plasma polishing device of the utility model directly injects the polishing liquid into the interior of a workpiece through an electrode nozzle to achieve precise polishing of the inner cavity of the metal pipe, which helps to improve the polishing quality and effect. The nozzle is located inside the workpiece, which can ensure that the polishing liquid evenly covers the inner cavity surface, thereby achieving a more uniform polishing effect. Compared with the prior art, the patent effectively avoids the problem that the electrode may touch the workpiece to form a short circuit, and the difficulty in concentration control caused by overflow and mixing of the polishing liquid by controlling the flow of the electrode and the polishing liquid. The electrode can achieve uniform linear motion and directly spray the polishing liquid to the required position through an internal pipeline. This process simplifies the traditional polishing method and improves the processing speed and efficiency. The design of the equipment in the patent allows the polishing effect to be controlled by adjusting the speed of the electrode and the flow rate of the polishing liquid, so that it is more suitable for the polishing work of the inner cavity of metal pipes of different models and requirements. Therefore, the plasma polishing device of the utility model has the ability to achieve precise and uniform polishing, effectively solves some problems existing in the traditional method, and improves the polishing quality and work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the axial side of the utility model;

[0019] Figure 2 It is a front view schematic diagram of the utility model;

[0020] Figure 3 This is a schematic diagram of the main structure of the electrode of the utility model;

[0021] Figure 4 This is a schematic diagram of the shaft side of the liquid inlet pump of the utility model;

[0022] Figure 5 It is a schematic diagram of the axial side of the liquid collecting tank of the utility model.

[0023] Among them, 1. stage; 2. fixed slide rail; 3. slider; 4. stepper motor; 5. baffle No. 1; 6. baffle No. 2; 7. electrode; 8. support seat; 9. connecting seat No. 1; 10. metal pipe to be polished; 11. connecting seat No. 2; 12. nozzle; 13. drain port; 14. liquid inlet; 15. drain hose; 16. liquid inlet hose; 17. liquid inlet pump; 18. liquid collecting tank. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Example:

[0026] like Figure 1-5 As shown, the embodiment of the utility model provides a plasma polishing device for polishing the inner cavity of a metal pipe, comprising a stage 1, a liquid inlet pump 17 and a liquid collecting tank 18, and a fixed slide rail 2 and a support seat 8 are fixedly arranged on the upper end of the stage 1;

[0027] A stepper motor 4 is fixedly arranged at one end of the fixed slide rail 2 away from the support seat 8, a slider 3 is slidably arranged on the fixed slide rail 2, and a first baffle 5 and a second baffle 6 are fixedly arranged at the upper ends of the slider 3;

[0028] A No. 2 connection seat 11 and a No. 1 connection seat 9 are fixedly arranged near the center and near the fixed slide rail 2 on the upper end surface of the stage 1, respectively; an electrode 7 is arranged between the support seat 8 and the No. 2 baffle plate 6 and through the No. 1 baffle plate 5; a liquid inlet 14 is arranged at one end of the electrode 7 away from the support seat 8; a liquid inlet hose 16 is arranged at one end of the liquid inlet 14 away from the electrode 7; a nozzle 12 is arranged at one end of the electrode 7 away from the liquid inlet hose 16 and through the support seat 8 and the No. 1 connection seat 9;

[0029] The second connection seat 11 is provided with a polishing liquid flow channel that can communicate with the metal pipe 10 to be polished. The upper end of the second connection seat 11 is provided with a drain port 13, and the upper end of the drain port 13 is provided with a drain hose 15. The position of the drain port 13 is higher than the metal pipe 10 to be polished.

[0030] The support seat 8 is arranged in an L shape, and support legs are fixedly provided at the four corners of the lower end surface of the loading platform 1, the No. 1 baffle 5 and the No. 2 baffle 6 are arranged parallel to each other, a metal pipe 10 to be polished is arranged between the No. 2 connecting seat 11 and the No. 1 connecting seat 9, the liquid inlet pump 17 is arranged near the liquid inlet hose 16, and the liquid collecting tank 18 is arranged near the liquid discharge hose 15.

[0031] When polishing is required, the metal pipe 10 to be polished is fixed on the No. 1 connecting seat 9 and the No. 2 connecting seat 11 and connected to the positive pole of the power supply at the same time, and the electrode 7 is connected to the negative pole. The stepper motor 4 drives the slider 3 to drive the electrode 7 to move along the slide rail 2, so that the electrode 7 can extend into the interior of the metal pipe 10 to be polished and make uniform linear motion. The polishing liquid is supplied by the liquid inlet pump 17, enters from the liquid inlet hose 16 and enters the electrode 7 through the liquid inlet port 14 and is ejected from the nozzle 12, so that the inner cavity of the metal pipe 10 to be polished is filled with the polishing liquid, forming a loop with the metal pipe 10 to be polished, generating an electric field, and performing plasma polishing on the inner cavity of the metal pipe. At the same time, the overflowing polishing liquid can flow through the polishing liquid flow channel of the No. 2 connecting seat 11, and then be discharged from the discharge hose 15 to the collecting tank 18 through the discharge port 13.

[0032] In this embodiment, the nozzle is placed on the electrode, moves with the electrode, and sprays the polishing liquid during the movement, which can prevent the electrode from contacting the pipe fitting to form a short circuit, and the discharge port is connected to the hose. After the polishing liquid flows out of the discharge port, it passes through the hose to the liquid collecting tank, which can prevent the polishing liquid from flowing down from a high place. The device of CN111687692A, after the polishing liquid flows into the inlet of the pipe fitting to be processed, it directly flows out from the outlet of the pipe fitting to the liquid collecting tank. The pipe fitting is arranged horizontally. During the horizontal flow of the polishing liquid, it is easy for the upper half of the inner cavity of the pipe fitting to not be filled with the polishing liquid. The discharge port of the present application is arranged at the upper end of the No. 2 connecting seat, forming a height difference with the metal pipe fitting to be polished, which can ensure that the polishing liquid can fill the inner cavity of the pipe fitting before flowing out.

[0033] Stage 1: The base of the device, used to firmly support other components.

[0034] Fixed slide rail 2: installed on the stage 1, allowing the slider 3 to slide accurately along a straight line direction.

[0035] Slider 3: can slide linearly on the fixed slide rail 2, and is responsible for driving the electrode 7 to perform accurate linear motion.

[0036] Stepper motor 4: drives the slider 3 and controls the precise movement of the electrode 7.

[0037] Baffle plate No. 1 5 and baffle plate No. 2 6 are fixed on the slider 3 to stabilize the electrode 7 and prevent the electrode 7 from deviating when moving.

[0038] The electrode 7 passes through the first baffle plate, the second baffle plate 6 and the support seat 8, directly enters the interior of the metal pipe 10 to be polished, and performs the polishing operation.

[0039] Support base 8: combined with the stage 1 to support and fix the slide rail 2 and other components to ensure the stability of the overall structure of the equipment.

[0040] The No. 1 connecting seat 9 and the No. 2 connecting seat 11 are used to fix and support the metal pipe 10 to be polished, so as to ensure its stable position and facilitate the polishing operation.

[0041] Metal pipe 10 to be polished: The workpiece to be polished is located on the No. 1 connecting seat 9 and the No. 2 connecting seat 11.

[0042] The drain port 13 is disposed at the upper end of the second connecting seat 11 and is used to discharge the polishing liquid overflowed during the polishing process.

[0043] Liquid inlet 14 : located at the rear end of the electrode 7 , through which the polishing liquid is transported into the interior of the electrode 7 and finally ejected from the nozzle 12 .

[0044] Drain hose 15 : connected to the drain port 13 , used for draining the overflowed polishing liquid to the liquid collecting tank 18 .

[0045] Liquid inlet hose 16 is responsible for transporting the polishing liquid from the liquid supply source to the liquid inlet 14 .

[0046] Liquid inlet pump 17 supplies polishing liquid to the liquid inlet hose 16 and maintains the pressure of the polishing liquid for use by the nozzle 12.

[0047] The liquid collecting tank 18 is used to collect the polishing liquid discharged from the liquid drain hose 15 to prevent the polishing liquid from overflowing in the working area.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plasma polishing device for polishing the inner cavity of a metal pipe, comprising a stage (1), a liquid inlet pump (17) and a liquid collecting tank (18), characterized in that: A fixed slide rail (2) and a support seat (8) are respectively fixedly arranged on the upper end of the loading platform (1); A stepping motor (4) is fixedly arranged at one end of the fixed slide rail (2) away from the support seat (8), a slider (3) is slidably arranged on the fixed slide rail (2), and a first baffle (5) and a second baffle (6) are fixedly arranged at the upper end of the slider (3); A No. 2 connection seat (11) and a No. 1 connection seat (9) are fixedly arranged near the center and near the fixed slide rail (2) on the upper end surface of the stage (1), respectively; an electrode (7) is arranged between the support seat (8) and the No. 2 baffle plate (6) and passes through the No. 1 baffle plate (5); a liquid inlet (14) is arranged at one end of the electrode (7) away from the support seat (8); a liquid inlet hose (16) is arranged at one end of the liquid inlet (14) away from the electrode (7); and a nozzle (12) is arranged at one end of the electrode (7) away from the liquid inlet hose (16) and passes through the support seat (8) and the No. 1 connection seat (9); The upper end of the No. 2 connecting seat (11) is provided with a liquid discharge port (13), and the upper end of the liquid discharge port (13) is provided with a liquid discharge hose (15).

2. The plasma polishing device for polishing the inner cavity of a metal pipe according to claim 1, characterized in that: The support seat (8) is configured to be L-shaped.

3. The plasma polishing device for polishing the inner cavity of a metal pipe according to claim 1, characterized in that: Support legs are fixedly arranged at the four corners of the lower end surface of the loading platform (1).

4. The plasma polishing device for polishing the inner cavity of a metal pipe according to claim 1, characterized in that: The first baffle plate (5) and the second baffle plate (6) are arranged parallel to each other.

5. The plasma polishing device for polishing the inner cavity of a metal pipe according to claim 1, characterized in that: A metal pipe (10) to be polished is arranged between the second connecting seat (11) and the first connecting seat (9).

6. The plasma polishing device for polishing the inner cavity of a metal pipe according to claim 1, characterized in that: The liquid inlet pump (17) is arranged close to the liquid inlet hose (16).

7. The plasma polishing device for polishing the inner cavity of a metal pipe according to claim 1, characterized in that: The liquid collecting tank (18) is arranged near the liquid discharge hose (15).

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