Heat conduction cylinder for portable refrigeration device, heat absorption piece and portable refrigeration device

Abstract

The utility model relates to a refrigerating device. In particular to a heat conduction cylinder for a portable refrigerating device and the portable refrigerating device comprising the heat conduction cylinder. The inner diameter of the lower portion of the inner wall of the heat conduction cylinder is smaller than the inner diameter of the upper portion of the inner wall of the heat conduction cylinder. The refrigerating device comprises a container and a cover; a semiconductor refrigeration assembly is arranged in the cover and comprises a semiconductor refrigeration piece, a heat dissipation piece and a heat absorption piece, the hot end face of the semiconductor refrigeration piece is attached to the lower bottom face of the heat dissipation piece, and the cold end face of the semiconductor refrigeration piece is attached to the upper surface of the heat absorption piece; the heat conduction cylinder is arranged in the container, and the upper end face of the heat conduction cylinder is attached to the lower end face of the heat absorption piece after the container is covered with the cover. The inner diameter of the lower part of the heat conduction cylinder is reduced, thereby effectively improving the refrigeration speed of the lower part.

Description

Technical Field

[0001] The utility model relates to a refrigeration device, in particular to a portable refrigeration device. Background Art

[0002] Portable refrigeration devices are in demand in more and more fields, especially for medicines that need to be refrigerated, such as insulin. Existing portable refrigeration devices mostly use semiconductor refrigeration components, which include semiconductor refrigeration sheets, heat sinks and heat absorbers. The heat sinks and heat absorbers are arranged on two opposite sides of the semiconductor refrigeration sheets. The heat sinks constitute the hot end of the semiconductor refrigeration elements, and the heat absorbers constitute the cold end of the semiconductor refrigeration elements. Placing a heat-conducting tube in a container is currently a more optimal heat conduction structure. The heat-conducting tube can conduct the heat in the container through the heat absorber, semiconductor refrigeration sheet, and heat sink. However, the contact surface between the existing heat-conducting tube and the heat absorber is the cross-section of the wall thickness of the heat-conducting tube. The small contact surface results in poor cooling effect, and long-term wear and tear will lead to the inability to fit stably or not fit at all. Utility Model Content

[0003] In view of the deficiencies of the above-mentioned prior art, the utility model provides a portable refrigeration device, a heat-conducting tube, a heat-absorbing element, and a portable refrigeration device comprising the heat-conducting tube and the heat-absorbing element, which have better cooling effect and can ensure that the contact surfaces of the heat-absorbing element and the heat-conducting tube are in complete contact to ensure the cooling effect even after the contact surfaces of the heat-absorbing element and the heat-conducting tube are worn out during long-term use, thereby also improving the service life of the portable refrigeration device.

[0004] The utility model is realized through the following technical solutions;

[0005] A heat-conducting cylinder for a portable refrigeration device, the portable refrigeration device comprising a container and a cover; a semiconductor refrigeration assembly is arranged in the cover, the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet, a heat sink and a heat absorber, the hot end surface of the semiconductor refrigeration sheet is attached to the lower bottom surface of the heat sink, and the cold end surface of the semiconductor refrigeration sheet is attached to the upper surface of the heat absorber; a heat-conducting cylinder capable of conducting heat is arranged in the container; after the cover and the container are closed, the upper part of the heat-conducting cylinder is attached to the lower part of the heat absorber; the heat-conducting cylinder is in the shape of a cylinder with openings at the top and bottom or only the upper end, and an inclined heat absorber attachment surface is arranged on the upper part of the heat-conducting cylinder. The contact surface between the heat-conducting cylinder and the heat absorber is set as an inclined surface, which increases the contact area and makes the contact more stable, thereby improving the refrigeration effect.

[0006] A heat absorbing member used in a portable refrigeration device, the portable refrigeration device comprises a container and a cover; a semiconductor refrigeration assembly is arranged in the cover, the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet, a heat sink and a heat absorbing member, the hot end surface of the semiconductor refrigeration sheet is attached to the lower bottom surface of the heat sink, and the cold end surface of the semiconductor refrigeration sheet is attached to the upper surface of the heat absorbing member; a heat-conducting tube capable of conducting heat is arranged in the container; after the cover and the container are closed, the upper part of the heat-conducting tube is attached to the lower part of the heat absorbing member; the lower part of the heat absorbing member is provided with an inclined heat-conducting tube attachment surface matching the attachment surface of the heat absorbing member. The contact surface between the heat absorbing member and the heat-conducting tube should be adapted to the shape and angle of the contact surface between the heat-conducting tube and the heat absorbing member, so as to achieve the effect of large-area stable contact conduction.

[0007] A portable refrigeration device comprises a container and a cover; a semiconductor refrigeration assembly is arranged in the cover, the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet, a heat sink and a heat absorber, the hot end surface of the semiconductor refrigeration sheet is in contact with the lower bottom surface of the heat sink, and the cold end surface of the semiconductor refrigeration sheet is in contact with the upper surface of the heat absorber; the aforementioned heat-conducting tube is arranged in the container, the heat-conducting tube is in the shape of a tube with openings at the top and bottom or only the top end is open, and an inclined heat-absorbing element contact surface is arranged on the upper part of the heat-conducting tube; an inclined heat-conducting tube contact surface matching the aforementioned heat-absorbing element contact surface is arranged on the lower part of the heat absorber; the heat-absorbing element contact surface of the heat-conducting tube has the same inclination angle as the heat-conducting tube contact surface of the heat-absorbing element, and the heat-absorbing element contact surface of the heat-conducting tube contacts the heat-conducting tube contact surface of the heat-absorbing element after the cover and the container are closed.

[0008] Furthermore, the heat absorbing member bonding surface is a sloped surface of the upper inner side of the heat conducting tube that is inclined from top to bottom and inward; the heat conducting tube bonding surface is a sloped surface of the lower outer side of the heat absorbing member that is inclined from top to bottom and inward. This is a preferred way of slope bonding.

[0009] Furthermore, the inner diameter of the upper end of the heat-absorbing element contact surface of the heat-conducting tube is the same as the outer diameter of the upper end of the heat-absorbing element contact surface of the heat-conducting tube, or the inner diameter of the upper end of the heat-absorbing element contact surface of the heat-conducting tube is greater than the outer diameter of the upper end of the heat-absorbing element contact surface of the heat-conducting tube by less than 5 mm. After the lid and the container are closed, the upper end of the heat-absorbing element contact surface of the heat-conducting tube is flush with or slightly lower than the upper end of the heat-absorbing element contact surface of the heat-conducting tube, which is convenient for setting the contact and sealing device.

[0010] Furthermore, the inner diameter of the lower end of the heat-absorbing element contact surface of the heat-conducting tube is smaller than the outer diameter of the lower end of the heat-conducting tube contact surface of the heat-absorbing element. The lower end of the heat-conducting tube contact surface of the heat-absorbing element is lower than the lower end of the heat-conducting tube contact surface of the heat-absorbing element, so as to reserve a space to ensure that the contact surfaces of the heat-absorbing element and the heat-conducting tube are still in complete contact after the height of the contact surface between the heat-absorbing element and the heat-conducting tube decreases due to long-term wear.

[0011] Furthermore, the heat absorbing member bonding surface is an inclined surface of the upper outer side of the heat conducting tube, which is inclined from top to bottom and outward; the heat conducting tube bonding surface is an inclined surface of the lower inner side of the heat absorbing member, which is another preferred way of inclined surface bonding.

[0012] Furthermore, the side of the heat absorbing element extends outward to form a convex edge; the outer edge of the convex edge of the heat absorbing element extends downward to form a heat-conducting tube contact portion, and the inner side surface of the heat-conducting tube contact portion is the heat-conducting tube fitting surface; the outer diameter of the upper end of the heat-conducting tube fitting surface of the heat absorbing element is the same as the inner diameter of the upper end of the heat-conducting tube fitting surface of the heat absorbing element.

[0013] Furthermore, the inner diameter of the lower end of the heat-absorbing part fitting surface of the heat-conducting tube is smaller than the outer diameter of the lower end of the heat-conducting tube fitting surface of the heat-absorbing part. The lower end of the heat-absorbing part fitting surface of the heat-conducting tube is lower than the lower end of the heat-conducting tube fitting surface of the heat-absorbing part, in order to reserve a space to ensure that the fitting surfaces of the two are still in complete contact after the height of the contact surface between the heat-absorbing part and the heat-conducting tube decreases due to long-term wear and tear. The lower end of the heat-absorbing part fitting surface of the heat-conducting tube is lower than the lower end of the heat-conducting tube fitting surface of the heat-absorbing part, in order to reserve a space to ensure that the fitting surfaces of the two are still in complete contact after the height of the contact surface between the heat-absorbing part and the heat-conducting tube decreases due to long-term wear and tear.

[0014] Furthermore, after the cover and the container are closed, the upper surface of the convex edge of the heat absorbing member is lower than the top of the heat-conducting tube. The upper surface of the convex edge is lower than the top of the heat-conducting tube, so that the sealing ring exerts a stronger pressure on the open end of the container and has a better sealing effect.

[0015] Compared with the prior art, the utility model has a better cooling effect, and even after the contact surface of the heat absorbing component and the heat conducting tube is worn out after long-term use, it can still ensure that the two fitting surfaces are in complete contact to ensure the cooling effect, thereby also improving the service life of the portable refrigeration device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 The utility model is a three-dimensional diagram of a heat-conducting tube for a portable refrigeration device.

[0018] Figure 2 The utility model is a cross-sectional view of a heat-conducting tube for a portable refrigeration device.

[0019] Figure 3 for Figure 2 A magnified schematic diagram of center A.

[0020] Figure 4 The utility model is a three-dimensional diagram of a heat absorbing element for a portable refrigeration device.

[0021] Figure 5 The utility model is a cross-sectional view of a heat absorbing element for a portable refrigeration device.

[0022] Figure 6 The utility model is a cross-sectional view of a portable refrigeration device.

[0023] Figure 7 for Figure 6 An enlarged schematic diagram of point A.

[0024] Figure 8 for Figure 6 An enlarged schematic diagram of point B.

[0025] Fig. 9 for Figure 6 An enlarged schematic diagram of point C.

[0026] Fig.10 This is a three-dimensional diagram of another heat-conducting tube for a portable refrigeration device according to the utility model.

[0027] Fig.11 This is a cross-sectional view of another heat-conducting tube for a portable refrigeration device according to the utility model.

[0028] Fig.12 for Fig.11 A magnified schematic diagram of center A.

[0029] Fig.13 This is a three-dimensional diagram of another heat absorbing element for a portable refrigeration device according to the present invention.

[0030] Fig.14 This is a cross-sectional view of another heat absorbing element for a portable refrigeration device according to the utility model.

[0031] Fig.15 This is a cross-sectional view of another portable refrigeration device of the present invention.

[0032] Fig.16 for Fig.15 An enlarged schematic diagram of point A.

[0033] In the figure: 10, cover; 20, container; 21, boss; 201, outer wall of container; 202, interior of container; 31, semiconductor cooling sheet; 32, heat sink; 33, heat absorber; 331, thermal tube fitting surface; 40, thermal tube; 41, upper part of thermal tube; 42, lower part of thermal tube; 401, thermal absorber fitting surface; 402, flat top surface; 404, transition surface; 50, vacuum insulation layer; 70, sealing ring; Specific implementation plan

[0034] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0035] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature. Example 1

[0036] A heat conducting tube for a portable refrigeration device, such as Figure 1-3 As shown, the heat-conducting tube is a tube with openings at the top and bottom or only the top end, and the inner side of the upper portion 41 of the heat-conducting tube is provided with a heat-absorbing component fitting surface 401 which is inclined from top to bottom and inward. Figure 6 As shown, the portable refrigeration device includes a container 20 and a cover 10; a semiconductor refrigeration assembly is arranged in the cover 10, and the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet 31, a heat sink 32 and a heat absorption sheet 33, the hot end surface of the semiconductor refrigeration sheet 31 is in contact with the lower bottom surface of the heat sink 32, and the cold end surface of the semiconductor refrigeration sheet 31 is in contact with the upper surface of the heat absorption sheet 33; the container 20 is provided with the aforementioned heat-conducting tube 40 that can conduct heat; after the cover 10 and the container 20 are covered, the upper part of the heat-conducting tube 40 is in contact with the lower part of the heat absorption sheet 33.

[0037] A heat absorbing member for a portable refrigeration device, such as Figure 4 , 5 As shown, the outer side of the lower part of the heat absorbing member 33 is provided with a heat conducting tube fitting surface 331 which is inclined from top to bottom and inward. Figure 6As shown, the portable refrigeration device includes a container 20 and a cover 10; a semiconductor refrigeration assembly is arranged in the cover 10, and the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet 31, a heat sink 32 and the aforementioned heat absorption member 33, the hot end surface of the semiconductor refrigeration sheet 31 is in contact with the lower bottom surface of the heat sink 32, and the cold end surface of the semiconductor refrigeration sheet 31 is in contact with the upper surface of the heat absorption member 33; a heat-conducting tube 40 capable of conducting heat is arranged in the container 20; after the cover 10 and the container 20 are covered, the upper part of the heat-conducting tube 40 is in contact with the lower part of the heat absorption member 33.

[0038] A portable refrigeration device, such as Figure 6 , 7 , 8, comprising a container 20 and a cover 10; the cover 10 is provided with a semiconductor refrigeration assembly, the semiconductor refrigeration assembly comprising a semiconductor refrigeration sheet 31, a heat sink 32 and a heat absorbing member 33, the lower outer side of the heat absorbing member 33 is provided with a heat-conducting tube fitting surface 331 inclined from top to bottom and inward, the hot end surface of the semiconductor refrigeration sheet 31 fits the lower bottom surface of the heat sink 32, and the cold end surface of the semiconductor refrigeration sheet 31 fits the upper surface of the heat absorbing member 33; the container A heat-conducting tube 40 is provided in the container 20, and the heat-conducting tube 40 is in a cylindrical shape with upper and lower openings. A heat-absorbing component fitting surface 401 which is inclined from top to bottom and inward is provided on the inner side of the upper portion 41 of the heat-conducting tube. The heat-absorbing component fitting surface 401 of the heat-conducting tube 40 and the heat-conducting tube fitting surface 331 of the heat-absorbing component 33 have the same inclination angle. After the cover 10 and the container 20 are covered, the heat-absorbing component fitting surface 401 of the heat-conducting tube 40 fits with the heat-conducting tube fitting surface 331 of the heat-absorbing component 33.

[0039] like Figure 7 As shown, the difference between the upper inner diameter of the heat absorbing member contact surface 401 of the heat conducting tube 40 and the upper outer diameter of the heat conducting tube contact surface 331 of the heat absorbing member 33 is less than 5 mm. The upper inner diameter of the heat absorbing member contact surface 401 of the heat conducting tube 40 and the upper outer diameter of the heat conducting tube contact surface 331 of the heat absorbing member 33 may also be the same.

[0040] like Figure 7 As shown, the inner diameter of the lower end of the heat-absorbing member fitting surface 401 of the heat-conducting tube 40 is smaller than the outer diameter of the lower end of the heat-conducting tube fitting surface 331 of the heat-absorbing member 33 .

[0041] like Figure 7 As shown, the upper end surface of the heat-conducting tube 40 also includes an outer flat top surface 402, and the flat top surface 402 of the heat-conducting tube 40 is flush with the top of the open end of the container 20; a sealing ring 70 is sleeved on the outer side of the heat-absorbing member 33, and after the cover 10 and the container 20 are covered, the lower bottom surface of the sealing ring 70 and the flat top surface 402 of the heat-conducting tube 40 are sealed and fitted with the top of the open end of the container 20.

[0042] like Figure 7As shown, the side portion 333 of the heat absorbing member 33 extends outward to form a convex edge 332, and a sealing ring 70 is sleeved on the upper surface of the convex edge. The outer edge of the sealing ring 70 extends out of the convex edge 332, and the extended edge of the sealing ring 70 can be sealed with the upper end surface of the heat conductive tube 40.

[0043] like Figure 7 As shown, after the cover 10 and the container 20 are closed, the upper surface of the convex edge 332 of the heat absorbing member 33 is lower than the top end of the heat-conducting tube 40 .

[0044] like Figure 7 As shown, the outer edge of the heat absorbing member 33 extends downward to form a side wall, and the interior of the side wall forms an auxiliary refrigeration device accommodating chamber; the outer edge of the convex edge 332 of the heat absorbing member 33 extends downward to form a heat-conducting tube contact portion 330, and the outer side surface of the heat-conducting tube contact portion 330 is the heat-conducting tube fitting surface 331.

[0045] The outer diameter of the upper portion of the outer wall of the heat-conducting tube 40 is greater than the outer diameter of the lower portion, and the upper outer wall of the heat-conducting tube 40 is interference-fitted with the upper portion of the container inner wall 202 . Example 2

[0046] A heat conducting tube for a portable refrigeration device, such as Figure 10-12 The portable refrigeration device includes a container 20 and a cover 10; a semiconductor refrigeration assembly is arranged in the cover 10, and the semiconductor refrigeration assembly includes a semiconductor refrigeration sheet 31, a heat sink 32 and a heat absorption sheet 33, the hot end surface of the semiconductor refrigeration sheet 31 is attached to the lower bottom surface of the heat sink 32, and the cold end surface of the semiconductor refrigeration sheet 31 is attached to the upper surface of the heat absorption sheet 33; a heat-conducting tube 40 capable of conducting heat is arranged in the container 20; after the cover 10 and the container 20 are covered, the upper part of the heat-conducting tube 40 is attached to the lower part of the heat absorption sheet 33, the heat-conducting tube is a tube with upper and lower openings or only the upper end opening, and the upper part of the heat-conducting tube is provided with an inclined heat absorption sheet attachment surface 401, and the heat absorption sheet attachment surface 401 is an inclined surface of the upper outer side of the heat-conducting tube that is inclined from top to bottom and outward.

[0047] A heat absorbing member for a portable refrigeration device, such as Figure 13-14The portable refrigeration device includes a container 20 and a cover 10; a semiconductor refrigeration component is arranged in the cover 10, and the semiconductor refrigeration component includes a semiconductor refrigeration sheet 31, a heat sink 32 and a heat absorption sheet 33, the hot end surface of the semiconductor refrigeration sheet 31 is attached to the lower bottom surface of the heat sink 32, and the cold end surface of the semiconductor refrigeration sheet 31 is attached to the upper surface of the heat absorption sheet 33; a heat-conducting tube 40 capable of conducting heat is arranged in the container 20; after the cover 10 and the container 20 are covered, the upper part of the heat-conducting tube 40 is attached to the lower part of the heat absorption sheet 33, and the lower part of the heat absorption sheet 33 is provided with an inclined heat-conducting tube attachment surface 331 matching the heat absorption sheet attachment surface 401 described in claim 1, and the heat-conducting tube attachment surface 331 is an inclined surface inclined from top to bottom and outward on the inner side of the lower part of the heat absorption sheet 33.

[0048] A portable refrigeration device comprises a container 20 and a cover 10; a semiconductor refrigeration assembly is arranged in the cover 10, and the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet 31, a heat sink 32 and the heat absorption piece 33 mentioned above in this embodiment, the hot end surface of the semiconductor refrigeration sheet 31 is affixed to the lower bottom surface of the heat sink 32, and the cold end surface of the semiconductor refrigeration sheet 31 is affixed to the upper surface of the heat absorption piece 33; the container 20 is provided with the heat conductive tube 40 mentioned above in this embodiment, the heat absorption piece affixing surface 401 of the heat conductive tube 40 and the heat conductive tube affixing surface 331 of the heat absorption piece 33 have the same inclination angle, and after the cover 10 and the container 20 are covered, the heat absorption piece affixing surface 401 of the heat conductive tube 40 is affixed to the heat conductive tube affixing surface 331 of the heat absorption piece 33.

[0049] The side portion 333 of the heat absorbing member 33 extends outward to form a convex edge 332; the outer edge of the convex edge 332 of the heat absorbing member 33 extends downward to form a heat-conducting tube contact portion 330, and the inner side surface of the heat-conducting tube contact portion 330 is the heat-conducting tube fitting surface 331; the outer diameter of the upper end of the heat-absorbing member fitting surface 401 of the heat-conducting tube 40 is the same as the inner diameter of the upper end of the heat-conducting tube fitting surface 331 of the heat absorbing member 33.

[0050] The outer diameter of the lower end of the heat absorbing member contact surface 401 of the heat conducting tube 40 is equal to or greater than the inner diameter of the lower end of the heat conducting tube contact surface 331 of the heat absorbing member 33 .

[0051] After the cover 10 and the container 20 are closed, the upper surface of the convex edge 332 of the heat absorbing member 33 is lower than the top end of the heat conducting tube.

[0052] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A heat-conducting cylinder for a portable refrigeration device, the portable refrigeration device comprising a container (20) and a cover (10); a semiconductor refrigeration assembly is arranged in the cover (10), the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet (31), a heat sink (32) and a heat absorption sheet (33), the hot end surface of the semiconductor refrigeration sheet (31) is in contact with the lower bottom surface of the heat sink (32), and the cold end surface of the semiconductor refrigeration sheet (31) is in contact with the upper surface of the heat absorption sheet (33); a heat-conducting cylinder (40) capable of conducting heat is arranged in the container (20); after the cover (10) and the container (20) are covered, the upper part of the heat-conducting cylinder (40) is in contact with the lower part of the heat absorption sheet (33), characterized in that: The heat-conducting tube is in the shape of a tube with openings at the top and bottom or only the top end being open, and an inclined heat-absorbing component fitting surface (401) is provided on the top of the heat-conducting tube.

2. A heat absorbing member for a portable refrigeration device, the portable refrigeration device comprising a container (20) and a cover (10); a semiconductor refrigeration assembly is arranged in the cover (10), the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet (31), a heat sink (32) and a heat absorbing member (33), the hot end surface of the semiconductor refrigeration sheet (31) is in contact with the lower bottom surface of the heat sink (32), and the cold end surface of the semiconductor refrigeration sheet (31) is in contact with the upper surface of the heat absorbing member (33); a heat-conducting tube (40) capable of conducting heat is arranged in the container (20); after the cover (10) and the container (20) are covered, the upper part of the heat-conducting tube (40) is in contact with the lower part of the heat absorbing member (33); an inclined heat-absorbing member contacting surface (401) is arranged on the upper part of the heat-conducting tube, characterized in that: The lower part of the heat absorbing component (33) is provided with an inclined heat-conducting tube fitting surface (331) matching the heat absorbing component fitting surface (401).

3. A portable refrigeration device, comprising a container (20) and a cover (10); a semiconductor refrigeration assembly is arranged in the cover (10), the semiconductor refrigeration assembly comprises a semiconductor refrigeration sheet (31), a heat sink (32) and a heat absorbing element (33) according to claim 2, the hot end surface of the semiconductor refrigeration sheet (31) is in contact with the lower bottom surface of the heat sink (32), and the cold end surface of the semiconductor refrigeration sheet (31) is in contact with the upper surface of the heat absorbing element (33); a heat conductive tube (40) according to claim 1 is arranged in the container (20), the heat absorbing element contact surface (401) of the heat conductive tube (40) and the heat conductive tube contact surface (331) of the heat absorbing element (33) have the same inclination angle, and when the cover (10) and the container (20) are covered, the heat absorbing element contact surface (401) of the heat conductive tube (40) is in contact with the heat conductive tube contact surface (331) of the heat absorbing element (33).

4. A portable refrigeration device according to claim 3, characterized in that: The heat absorbing component fitting surface (401) is an inclined surface on the inner side of the upper portion of the heat conducting tube, which is inclined from top to bottom and inward; the heat conducting tube fitting surface (331) is an inclined surface on the outer side of the lower portion of the heat absorbing component (33), which is inclined from top to bottom and inward.

5. A portable refrigeration device according to claim 4, characterized in that: The inner diameter of the upper end of the heat absorbing member fitting surface (401) of the heat conductive tube (40) is the same as the outer diameter of the upper end of the heat conductive tube fitting surface (331) of the heat absorbing member (33), or the inner diameter of the upper end of the heat conductive tube fitting surface (401) of the heat conductive tube (40) is greater than the outer diameter of the upper end of the heat conductive tube fitting surface (331) of the heat absorbing member (33) by less than 5 millimeters.

6. A portable refrigeration device according to claim 4, characterized in that: The inner diameter of the lower end of the heat-absorbing component fitting surface (401) of the heat-conducting tube (40) is smaller than the outer diameter of the lower end of the heat-conducting tube fitting surface (331) of the heat-absorbing component (33).

7. A portable refrigeration device according to claim 3, characterized in that: The heat absorbing component fitting surface (401) is an inclined surface on the upper outer side of the heat conducting tube, which is inclined from top to bottom and outward; and the heat conducting tube fitting surface (331) is an inclined surface on the lower inner side of the heat absorbing component (33), which is inclined from top to bottom and outward.

8. A portable refrigeration device according to claim 7, characterized in that: The side portion (333) of the heat absorbing member (33) extends outward to form a convex edge (332); the outer edge of the convex edge (332) of the heat absorbing member (33) extends downward to form a heat-conducting tube contact portion (330); the inner side surface of the heat-conducting tube contact portion (330) is the heat-conducting tube fitting surface (331); the outer diameter of the upper end of the heat-conducting tube fitting surface (401) of the heat-conducting tube (40) is the same as the inner diameter of the upper end of the heat-conducting tube fitting surface (331) of the heat-conducting tube (33).

9. A portable refrigeration device according to claim 7, characterized in that: The outer diameter of the lower end of the heat-absorbing component fitting surface (401) of the heat-conducting tube (40) is equal to or greater than the inner diameter of the lower end of the heat-conducting tube fitting surface (331) of the heat-absorbing component (33).

10. A portable refrigeration device according to claim 4 or 7, characterized in that: After the cover (10) and the container (20) are closed, the upper surface of the convex edge (332) of the heat absorbing element (33) is lower than the top end of the heat-conducting tube.

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