Drying device for power amplifier chip

Abstract

The utility model discloses a drying device for a power amplifier chip, which comprises a device body, the outer bottom end of the device body is provided with supporting legs, the device body is sequentially provided with a drying fan, an air supply net, a rotating mechanism and a resistance heating piece from top to bottom, and a chip placing frame for installing the power amplifier chip is arranged in the rotating mechanism. According to the device, the power amplifier chip is uniformly heated in the rotating process, the drying efficiency is high, and meanwhile, the clamping stability and the reusability of the device can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a drying device for power amplifier chips. Background Art

[0002] Amplifier chip, also known as digital audio amplifier chip, is an integrated circuit chip that uses digital signal processing technology to amplify audio. It is an important part of modern audio amplification technology and is widely used in audio systems, home theaters, car audio, wireless speakers and other fields to achieve high-quality audio amplification effects.

[0003] In the subsequent processing of existing power amplifier chips, it is often necessary to dry the coating after spraying or the residual moisture after cleaning. However, when using the existing chip drying device, only one side can be dried, and the other side of the chip is always fixed and cannot be dried efficiently. Utility Model Content

[0004] The purpose of the utility model is to provide a drying device for power amplifier chips, which mainly provides a drying fan, a resistance heater and a rotating mechanism. The rotating mechanism is provided with a chip placement frame and a secondary rotating shaft, so that the power amplifier chips are evenly dried during the drying process, thereby solving the above-mentioned problems existing in the prior art.

[0005] In order to solve the above technical problems, the utility model adopts the following solutions:

[0006] A drying device for power amplifier chips comprises a device body, wherein the outer bottom end of the device body is provided with a supporting foot, and the device body is provided with a drying fan, an air supply net, a rotating mechanism and a resistance heating element in sequence from top to bottom, and a chip placement frame for installing the power amplifier chip is provided in the rotating mechanism.

[0007] Preferably, the rotating mechanism includes a bearing and a main shaft, the main shaft is electrically connected to the drive motor, one end of the main shaft away from the drive motor is located in the bearing, a rotating disk is provided on the outer circumference of the main shaft close to the bearing, a first gear and a second gear are provided on the left side of the rotating disk, and the first gear and the second gear are meshed with each other.

[0008] Preferably, the rotating disk is provided with a plurality of through holes, and the plurality of through holes are arranged in a circular array with the center of the rotating disk, a secondary rotating shaft passes through the through holes, and one end of the secondary rotating shaft is fixedly connected to the second gear.

[0009] Preferably, it further comprises an annular limit block arranged on one side of the device body symmetrical to the bearing, the annular limit block is provided with a groove, and the end of the secondary shaft away from the second gear is located in the groove.

[0010] Preferably, the chip placement frame is assembled on the outer circumferential surface of the secondary rotating shaft, and the chip placement frame includes a first clamping plate and a second clamping plate, the first clamping plate is fixedly connected to one side of the chip placement frame, and the second clamping plate is movably connected to the chip placement frame, and the power amplifier chip is placed between the first clamping plate and the second clamping plate.

[0011] Preferably, a sleeve is provided on one side of the chip placement frame adjacent to the second clamping plate, a push rod fixedly connected to the second clamping plate is provided in the sleeve, a spring is fixed at the end of the push rod located in the sleeve, and the other end of the spring is connected to the side wall of the chip placement frame.

[0012] Preferably, an anti-slip layer is provided inside the first clamping plate and the second clamping plate.

[0013] Preferably, two side walls of the device body are provided with sliding grooves, and both ends of the air supply net are located in the sliding grooves.

[0014] The utility model has the beneficial effects as follows: the utility model arranges a rotating mechanism in the middle of the device body, and arranges drying fans and resistance heaters at the top and bottom. The first gear and the second gear in the rotating mechanism are meshed to drive the chip placement frame in the secondary shaft to rotate, so that the power amplifier chip is evenly heated during the rotation process, and the drying efficiency is high. At the same time, the clamping stability and reusability of the device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 A schematic diagram of the structure of the assembly of the first gear and the second gear of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the rotating disk of the utility model;

[0018] Figure 4 This is a schematic diagram of the structure of the annular limiting hole of the utility model;

[0019] Figure 5 It is a structural schematic diagram of the chip placement frame of the utility model.

[0020] Figure markings: 1-device body, 10-support foot, 11-sliding groove, 2-rotating mechanism, 20-main rotating shaft, 21-bearing, 22-driving motor, 23-rotating disk, 230-through hole, 24-first gear, 25-second gear, 26-secondary rotating shaft, 260-chip placement frame, 261-sleeve, 262-push rod, 263-spring, 264-first clamping plate, 265-second clamping plate, 266-anti-slip layer, 27-annular limit block, 270-groove, 3-drying fan, 4-air supply net, 5-resistance heating element, 6-power amplifier chip. DETAILED DESCRIPTION

[0021] The present invention will be further described in detail below in conjunction with the embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0022] In the description of the present utility model, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inside", "outside", "front", "back", "top", "bottom", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the utility model product is usually placed when in use. They are only for the convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model.

[0023] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "open", "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] Example

[0025] An embodiment of the utility model is a drying device for power amplifier chips, comprising a device body 1, wherein the outer bottom end of the device body 1 is provided with a supporting foot 10, and the device body 1 is provided with a drying fan 3, an air supply net 4, a rotating mechanism 2 and a resistance heating element 5 in sequence from top to bottom, and the rotating mechanism 2 is provided with a chip placement frame 260 for installing a power amplifier chip 6.

[0026] Reference Figure 1 to Figure 5The device body 1, as the main part of the entire drying device, provides a stable installation foundation for other components. The support foot 10 is located at the outer bottom end of the device body 1, and its main function is to support the entire device and ensure that it is stably placed in the desired position. The drying fan 3 is located at the top of the device body 1. The drying fan 3 mainly generates hot air flow to provide the necessary air flow for the drying process. Through reasonable air flow, the evaporation of water on the power amplifier chip 6 can be accelerated, thereby improving the drying efficiency. The air supply net 4 is located below the drying fan 3, and its main function is to evenly distribute the wind blown out from the drying fan 3, ensuring that the air flow can evenly cover each power amplifier chip 6 in the chip placement frame 260, and achieve a more uniform and efficient drying effect. The resistance heating element 5 provides the necessary temperature for the drying process by generating heat. Used in conjunction with the drying fan 3 and the air supply net 4, the power amplifier chip 6 can be dried quickly, evenly and efficiently.

[0027] The rotating mechanism 2 is located between the air supply network 4 and the resistance heating element 5, and is responsible for driving the chip placement frame 260 to rotate to ensure that the power amplifier chip 6 is evenly heated to avoid local overheating or overcooling; secondly, through rotation, the moisture on the chip can be more easily carried away by the wind flow, further accelerating the drying process.

[0028] In some preferred embodiments, the rotating mechanism 2 includes a bearing 21 and a main shaft 20, the main shaft 20 is electrically connected to a driving motor 22, one end of the main shaft 20 away from the driving motor 22 is located in the bearing 21, a rotating disk 23 is sleeved on the outer circumference of the main shaft 20 close to the bearing 21, a first gear 24 and a second gear 25 are provided on the left side of the rotating disk 23, and the first gear 24 and the second gear 25 are meshed with each other.

[0029] The bearing 21 provides a mounting position for the main shaft 20, ensuring that the main shaft 20 will not be subject to excessive friction or resistance when rotating. The main shaft 20 is responsible for driving the entire rotating mechanism 2 to rotate. The driving motor 22 drives the main shaft 20 to rotate. The rotating disk 23 is sleeved on the outer peripheral surface of the main shaft 20 near the bearing 21, and the rotating disk 23 rotates together with the main shaft 20.

[0030] The first gear 24 and the second gear 25 mesh with each other. When the main shaft 20 rotates, the first gear 24 and the second gear 25 will also rotate, ensuring that the rotation of the rotating disk 23 and the chip placement frame 260 is more stable and accurate. The setting of the rotating mechanism 2 not only improves the drying efficiency, but also ensures that the power amplifier chip 6 is heated evenly during the drying process to avoid local overheating or overcooling.

[0031] In some preferred embodiments, the rotating disk 23 is provided with a plurality of through holes 230 , and the plurality of through holes 230 are arranged in a circular array with the center of the rotating disk 23 . A secondary rotating shaft 26 passes through the through hole 230 , and one end of the secondary rotating shaft 26 is fixedly connected to the second gear 25 .

[0032] Specifically, the secondary shaft 26 is located in the through hole 230 , and under the connection of the second gear 25 , it can be ensured that the secondary shaft 26 does not shake or deviate during the rotation process, so as to achieve uniform drying.

[0033] In some preferred embodiments, an annular limit block 27 is further provided on one side of the device body 1 symmetrical to the bearing 21 , the annular limit block is provided with a groove 270 , and the end of the secondary shaft 26 away from the second gear 25 is located in the groove 270 .

[0034] like Figure 4 As shown, the annular limit block 27 provides an assembly space for the secondary shaft 26 , thereby ensuring the stability of rotation and preventing the secondary shaft 26 from being separated during rotation, thereby affecting the drying effect of the power amplifier chip 6 .

[0035] In some preferred embodiments, the chip placement frame 260 is assembled on the outer peripheral surface of the secondary rotating shaft 26, and the chip placement frame 260 includes a first clamping plate 264 and a second clamping plate 265, the first clamping plate 264 is fixedly connected to one side of the chip placement frame 260, and the second clamping plate 265 is movably connected to the chip placement frame 260, and the power amplifier chip 6 is placed between the first clamping plate 264 and the second clamping plate 265.

[0036] Specifically, Figure 5 As shown, the chip placement frame 260 rotates with the rotation of the secondary shaft 26. This ensures that the chips can be evenly heated during the drying process, thereby improving the drying efficiency and uniformity. At the same time, the second clamping plate 265 is movably connected to the chip placement frame 260, so that the chip placement frame 260 can adapt to the drying of power amplifier chips 6 of different specifications. During the drying process, the power amplifier chip 6 is stably clamped between the first clamping plate 264 and the second clamping plate 265 to avoid falling off, and the clamping will not cause damage or scratches to the power amplifier chip 6.

[0037] In some preferred embodiments, a sleeve 261 is provided on one side of the chip placement frame 260 adjacent to the second clamping plate 265, and a push rod 262 fixedly connected to the second clamping plate 265 is provided in the sleeve 261. The push rod 262 is located at the end of the sleeve 261 and is fixed with a spring 263, and the other end of the spring 263 is connected to the side wall of the chip placement frame 260.

[0038] Specifically, the second clamping plate 265 is movably connected with the chip placement frame 260 through the sleeve 261 and the push rod 262, and a spring 263 is provided at one end of the push rod 262 to connect the two. First, the second clamping plate 265 is pushed to the left, and then the power amplifier chip 6 is placed. Under the elastic action of the spring 263, the second clamping plate 265 cooperates with the first clamping plate 264 to firmly clamp and prevent the power amplifier chip 6 from being separated during the rotation process.

[0039] In some preferred embodiments, an anti-skid layer 266 is provided inside the first clamping plate 264 and the second clamping plate 265. The anti-skid layer 266 further increases the friction between the power amplifier chip 6 to prevent it from falling off. The material of the anti-skid layer 266 is specifically set according to the actual situation to ensure that the surface of the power amplifier chip 6 is not damaged under the friction.

[0040] In some preferred embodiments, two side walls of the device body 1 are provided with sliding grooves 11, and the two ends of the air supply net 4 are located in the sliding grooves 11. The air supply net 4 may accumulate dust or other impurities during the drying process and needs to be cleaned regularly. Through the sliding grooves 11, the air supply net 4 is taken out for cleaning and maintenance, which simplifies the cleaning process. The sliding grooves 11 also enhance the connection stability between the air supply net 4 and the device body 1. When the air supply net 4 is placed in the sliding grooves 11, it will be supported and restricted by the side walls, thereby reducing the shaking or displacement that may occur during the drying process. Ensure the stability of the airflow and the consistency of the drying effect.

[0041] When the utility model is used, the second clamping plate 265 in the chip placement frame 260 is first pushed to the left, and then the power amplifier chip 6 is placed. Under the elastic action of the spring 263, the second clamping plate 265 cooperates with the first clamping plate 264 to firmly clamp. The drying fan 3, the resistance heater and the drive motor 22 are started, and the main shaft 20 rotates the rotating disk 23, thereby rotating the meshing first gear 24 and the second gear 25, and the second gear 25 drives the chip placement frame 260 on the outer peripheral surface of the secondary shaft 26 to rotate, so that during the rotation of the internal power amplifier chip 6, the power amplifier chip 6 is evenly heated to avoid local overheating or overcooling; and the moisture on the chip can be more easily taken away by the wind flow, which speeds up the drying efficiency. The utility model arranges a rotating mechanism 2 in the middle of a device body 1, and arranges drying fans 3 and resistance heaters at the top and bottom. The first gear 24 and the second gear 25 in the rotating mechanism 2 are engaged with each other to drive the chip placement frame 260 in the secondary rotating shaft 26 to rotate, so that the power amplifier chip 6 is evenly heated during the rotation process, and the drying efficiency is high. At the same time, the clamping stability and reusability of the device can be improved.

[0042] The above is only a preferred embodiment of the utility model and does not limit the utility model in any form. According to the technical essence of the utility model, within the spirit and principles of the utility model, any simple modification, equivalent replacement and improvement made to the above embodiment still falls within the protection scope of the technical solution of the utility model.

Claims

1. A drying device for power amplifier chips, comprising a device body (1), characterized in that: The outer bottom end of the device body (1) is provided with a supporting foot (10), and the device body (1) is provided with a drying fan (3), an air supply net (4), a rotating mechanism (2) and a resistance heating element (5) in sequence from top to bottom, and a chip placement frame (260) for installing a power amplifier chip (6) is provided in the rotating mechanism (2).

2. A drying device for power amplifier chips according to claim 1, characterized in that: The rotating mechanism (2) comprises a bearing (21) and a main rotating shaft (20), wherein the main rotating shaft (20) is electrically connected to a driving motor (22), and one end of the main rotating shaft (20) away from the driving motor (22) is located in the bearing (21), and a rotating disk (23) is sleeved on the outer peripheral surface of the main rotating shaft (20) close to the bearing (21), and a first gear (24) and a second gear (25) are provided on the left side of the rotating disk (23), and the first gear (24) and the second gear (25) are meshed with each other.

3. A drying device for power amplifier chips according to claim 2, characterized in that: The rotating disk (23) is provided with a plurality of through holes (230), and the plurality of through holes (230) are arranged in a circular array with the center of the rotating disk (23). A secondary rotating shaft (26) passes through the through hole (230), and one end of the secondary rotating shaft (26) is fixedly connected to the second gear (25).

4. A drying device for power amplifier chips according to claim 3, characterized in that: It also includes an annular limit block (27) arranged on one side of the device body (1) symmetrical to the bearing (21), the annular limit block being provided with a groove (270), and the end of the secondary rotating shaft (26) away from the second gear (25) being located in the groove (270).

5. The drying device for power amplifier chip according to claim 3, characterized in that: The chip placement frame (260) is mounted on the outer peripheral surface of the secondary rotating shaft (26), and the chip placement frame (260) comprises a first clamping plate (264) and a second clamping plate (265), wherein the first clamping plate (264) is fixedly connected to one side of the chip placement frame (260), and the second clamping plate (265) is movably connected to the chip placement frame (260), and the power amplifier chip (6) is placed between the first clamping plate (264) and the second clamping plate (265).

6. A drying device for power amplifier chips according to claim 5, characterized in that: A sleeve (261) is provided on one side of the chip placement frame (260) adjacent to the second clamping plate (265), and a push rod (262) fixedly connected to the second clamping plate (265) is provided in the sleeve (261). The push rod (262) is located at the end of the sleeve (261) and is fixedly connected to a spring (263), and the other end of the spring (263) is connected to the side wall of the chip placement frame (260).

7. A drying device for power amplifier chips according to claim 5, characterized in that: An anti-slip layer (266) is provided inside the first clamping plate (264) and the second clamping plate (265).

8. The drying device for power amplifier chip according to claim 5, characterized in that: The two side walls of the device body (1) are provided with sliding grooves (11), and the two ends of the air supply net (4) are located in the sliding grooves (11).

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