Semiconductor carrier plate automatic measuring machine table with automatic material returning function

Abstract

The utility model relates to the technical field of semiconductor carrier plate automatic measuring machine tables, and discloses a semiconductor carrier plate automatic measuring machine table with an automatic material returning function. Comprising a measuring machine, a nozzle and a fan, one side of the measuring machine is welded to one side of the measuring machine through a workbench, a spray head is arranged at the top of the workbench and welded to the top of the workbench through a first supporting plate, the nozzle is arranged at the bottom of the spray head, and the top of the nozzle is in threaded connection with the bottom of the spray head. A fan hanging plate is arranged at the top of the workbench, the bottom of the fan hanging plate is welded to the top of the workbench through a second supporting plate, a first motor is arranged at the bottom of the fan hanging plate, and the top of the first motor is connected to the bottom of the fan hanging plate through a fastener. Cleaning liquid in the cleaning liquid box is pumped by the water suction pump and moved into the spray head from the cleaning liquid pipe in the first supporting plate and then sprayed out of the spray nozzle, and the surface of the semiconductor carrier plate is cleaned.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor carrier automatic measuring machines, in particular to a semiconductor carrier automatic measuring machine with an automatic material-returning function. Background Art

[0002] The semiconductor substrate measuring instrument, also called a flying probe tester, is an instrument for testing semiconductor substrates (printed circuit boards) with high-density component layout, many layers, high wiring density, and small distance between measuring points. The semiconductor substrate circuit board tester mainly tests the insulation and conduction values ​​of the circuit board. The semiconductor substrate tester generally adopts the "true value comparison positioning method" to monitor the test process and fault points in real time to ensure the accuracy of the test. It has the characteristics of fine pitch, no grid restrictions, flexible testing, and fast speed.

[0003] Existing semiconductor substrate measurement machines require manual unloading and picking up after measurement, which is very inconvenient. The manual picking up process not only consumes labor costs, but also may cause circuit boards to be damaged during the process of picking up and picking up, resulting in an increase in the loss rate.

[0004] At the same time, during the measurement and packaging process of semiconductor carriers, it is inevitable that there will be dust and floating dust on them, and even when the air humidity is too high, it will affect the reuse of the semiconductor carriers. Therefore, it is necessary to clean and air-dry the semiconductor carriers after the measurement to improve their utilization rate. Utility Model Content

[0005] The purpose of the present invention is to provide a semiconductor substrate automatic measuring machine with an automatic material removal function to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a semiconductor carrier automatic measuring machine with automatic material stripping function, comprising a measuring machine, a nozzle and a fan, one side of the measuring machine is welded to the other side of the measuring machine through a workbench, a nozzle is provided on the top of the workbench, the nozzle is welded to the top of the workbench through a first support plate, a nozzle is provided at the bottom of the nozzle, the top of the nozzle is threadedly connected to the bottom of the nozzle, a fan hanging plate is provided on the top of the workbench, the bottom of the fan hanging plate is welded to the top of the workbench through a second support plate, a first motor is provided at the bottom of the fan hanging plate, the top of the first motor is connected to the bottom of the fan hanging plate through a fastener, a fan is provided at the bottom of the first motor, the fan is connected to the bottom of the first motor through a fan slot, the first motor is fixedly connected to the top of the fan through an output shaft, the bottom of the fan slot is snap-connected to the slot cover, a glass table is provided on the top of the measuring machine, and the bottom of the glass table is snap-connected to the top of the measuring machine.

[0007] Preferably, one side of the workbench is movably connected to a cleaning liquid tank, a fastener on the top of the cleaning liquid tank is connected to a water pump, a cleaning liquid pipe is provided inside the first support plate, one end of the cleaning liquid pipe passes through and is connected to the bottom of the nozzle, and the end of the cleaning liquid pipe away from the nozzle passes through the water pump and is connected to the top of the cleaning liquid tank.

[0008] Preferably, a mechanical arm is provided on the top of the fixed shaft, one end of the mechanical arm penetrates through and is rotatably connected to the top of the fixed shaft, an exhaust port is provided on the end of the mechanical arm away from the fixed shaft, and the end of the mechanical arm away from the fixed shaft penetrates through and is connected to the exhaust port, and a sponge block is embedded in the exhaust port.

[0009] Preferably, one side of the workbench is movably connected to a cleaning liquid tank, a fastener on the top of the cleaning liquid tank is connected to a water pump, a cleaning liquid pipe is provided inside the first support plate, one end of the cleaning liquid pipe passes through and is connected to the bottom of the nozzle, and the end of the cleaning liquid pipe away from the nozzle passes through the water pump and is connected to the top of the cleaning liquid tank.

[0010] Preferably, a second motor is provided at one end of the conveyor shaft away from the first support shaft, the second motor is fixedly connected to the end of the conveyor shaft away from the first support shaft via an output shaft, and the conveyor shaft is externally movably connected to the conveyor belt.

[0011] Preferably, a second motor is provided at one end of the conveyor shaft away from the first support shaft, the second motor is fixedly connected to the end of the conveyor shaft away from the first support shaft via an output shaft, and the conveyor shaft is externally movably connected to the conveyor belt.

[0012] Preferably, a liquid flow trough is provided inside the conveyor belt, a second support shaft is provided on one side of the liquid flow trough, one end of the second support shaft is welded to the side of the second support shaft, and the end of the second support shaft away from the liquid flow trough is welded to the side of the workbench, a liquid flow port is provided inside the liquid flow trough, the liquid flow port penetrates and is connected to the bottom of the liquid flow trough, a liquid flow pipe is provided at the bottom of the liquid flow port, and one end of the liquid flow pipe is engaged and connected to the inner wall of the liquid flow port.

[0013] Compared with the prior art, the beneficial effects achieved by the utility model are:

[0014] First, the utility model is provided with an air pump and a sponge block, so that the semiconductor carrier can be automatically unloaded without manual operation. When the measuring machine completes the measurement of the semiconductor carrier on the glass table, the mechanical arm rotates, and the mechanical arm drives the air suction port to rotate. When the air suction port rotates to the top of the glass table, the air pump inside the air suction pump box starts to pump air, and the gas enters the air suction port from the sponge block, and then enters the mechanical arm, and finally reaches the air suction pump box. The semiconductor carrier on the glass table is adsorbed to the bottom of the sponge block by suction, and then the mechanical arm is rotated to move the semiconductor carrier to the conveyor belt and separate from the measuring machine. The semiconductor carrier measuring machine does not need to be manually unloaded and taken after measurement, which is very convenient. It not only reduces labor costs, but also avoids damage to the circuit board during the back and forth picking process, which reflects the high efficiency of this device.

[0015] Secondly, the utility model can clean and air-dry the semiconductor carrier after unloading by arranging a nozzle and a fan. The second motor drives the conveyor belt shaft to rotate, and the rotation of the conveyor belt shaft drives the conveyor belt to rotate. The rotation of the conveyor belt drives the semiconductor carrier on the conveyor belt to move. When the semiconductor carrier moves to the bottom of the nozzle, the water pump draws the cleaning liquid inside the cleaning liquid tank and moves it from the cleaning liquid pipe inside the first support plate to the nozzle, and then sprays it out from the nozzle to clean the surface of the semiconductor carrier. When the semiconductor carrier moves to the bottom of the fan hanging plate, the first motor drives the fan inside the fan slot to rotate, and the air enters the fan slot from the top of the fan slot and is blown out from the slot cover to air-dry the surface of the semiconductor carrier, so that the floating dust on the surface of the semiconductor carrier is cleaned and air-dried, and at the same time, the moisture on the semiconductor carrier is removed to ensure that the semiconductor carrier is in a dry state. The cleaning liquid after cleaning enters the liquid flow tank through the holes and gaps on the conveyor belt, and then flows into the liquid flow pipe from the liquid flow port for discharge. Subsequently, only the inside of the liquid flow tank needs to be cleaned, which reflects the practicality of this device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional diagram of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the suction device of the utility model;

[0018] Figure 3 It is a schematic diagram of the structure of the cleaning and air-drying device of the utility model.

[0019] Figure 4 It is a schematic structural diagram of the transmission and liquid flow port device of the utility model.

[0020] Among them: 1. measuring machine; 2. glass table; 3. workbench; 4. vacuum pump box; 5. vacuum pump; 6. box cover; 7. fixed axis; 8. mechanical arm; 9. vacuum port; 10. sponge block; 11. cleaning liquid box; 12. water pump; 13. cleaning liquid pipe; 14. first support plate; 15. nozzle; 16. nozzle; 17. first motor; 18. fan slot; 19. slot cover; 20. fan; 21. fan hanging plate; 22. second support plate; 23. conveyor belt shaft; 24. conveyor belt; 25. second motor; 26. first support shaft; 27. second support shaft; 28. liquid flow slot; 29. ​​liquid flow port; 30. liquid flow pipeline. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-4A semiconductor substrate automatic measuring machine with automatic material stripping function comprises a measuring machine 1, a nozzle 16 and a fan 20. One side of the measuring machine 1 is welded to the other side of the measuring machine 1 through a workbench 3. A nozzle 15 is arranged on the top of the workbench 3. The nozzle 15 is welded to the top of the workbench 3 through a first support plate 14. A nozzle 16 is arranged at the bottom of the nozzle 15. The top of the nozzle 16 is threadedly connected to the bottom of the nozzle 15. A fan hanging plate 21 is arranged on the top of the workbench 3. The bottom of the fan hanging plate 21 is welded to the top of the workbench 3 through a second support plate 22. A first motor 17 is arranged at the bottom of the fan hanging plate 21. The top of the first motor 17 is connected to the bottom of the fan hanging plate 21 through a fastener. A fan 20 is arranged at the bottom of the first motor 17. The fan 20 is connected to the bottom of the first motor 17 through a fan slot 18. The first motor 17 is fixedly connected to the top of the fan 20 through an output shaft. The bottom of the fan slot 18 is snap-connected to a slot cover 19. A glass table 2 is arranged on the top of the measuring machine 1. The bottom of the glass table 2 is snap-connected to the top of the measuring machine 1. The second motor 25 drives the conveyor belt shaft 23 to rotate. The conveyor shaft 23 rotates to drive the conveyor 24 to rotate, and the conveyor 24 rotates to drive the semiconductor carrier on the conveyor 24 to move. When the semiconductor carrier moves to the bottom of the nozzle 15, the water pump 12 extracts the cleaning liquid in the cleaning liquid tank 11 and moves it from the cleaning liquid pipe 13 in the first support plate 14 to the nozzle 15, and then sprays it from the nozzle 16 to clean the surface of the semiconductor carrier. When the semiconductor carrier moves to the bottom of the fan hanging plate 21, the first motor 17 drives the fan 20 in the fan slot 18 to The fan slot 18 rotates, and air enters the fan slot 18 from the top, and is then blown out from the slot cover 19 to dry the surface of the semiconductor carrier, thereby cleaning and drying the dust on the surface of the semiconductor carrier, and removing moisture from the semiconductor carrier to ensure that the semiconductor carrier is in a dry state. The cleaning liquid after cleaning enters the liquid flow slot 28 through the gaps on the conveyor belt 24, and then flows into the liquid flow pipe 30 from the liquid flow port 29 for discharge. Subsequently, only the inside of the liquid flow slot 28 needs to be cleaned.

[0023] Specifically, a vacuum pump box 4 is provided on one side of the measuring machine 1, and one side of the vacuum pump box 4 is welded to the side of the measuring machine 1. The inside of the vacuum pump box 4 is connected to the vacuum pump 5 through fasteners, and the bottom of the vacuum pump box 4 is connected to the box cover 6 by fasteners. A fixed shaft 7 is provided on the top of the vacuum pump box 4, and the fixed shaft 7 is welded to the top of the vacuum pump box 4.

[0024] Through the above technical solution, the vacuum pump 5 draws air, and the gas enters the vacuum pump box 4 from the fixed shaft 7 .

[0025] Specifically, a mechanical arm 8 is provided on the top of the fixed shaft 7, one end of the mechanical arm 8 penetrates through and is rotatably connected to the top of the fixed shaft 7, an exhaust port 9 is opened on the end of the mechanical arm 8 away from the fixed shaft 7, and the end of the mechanical arm 8 away from the fixed shaft 7 penetrates and is connected to the exhaust port 9, and a sponge block 10 is embedded in the exhaust port 9.

[0026] Through the above technical solution, the interior of the robotic arm 8 is hollow, and the gas enters the robotic arm 8 from the sponge block 10 inside the vacuum port 9, and then enters the fixed shaft 7 from the robotic arm 8. The sponge block 10 is relatively soft and will not cause damage to the semiconductor carrier. A driving device is provided inside the robotic arm 8 to drive the robotic arm 8 to move.

[0027] Specifically, one side of the workbench 3 is movably connected to the cleaning liquid tank 11, and the fasteners on the top of the cleaning liquid tank 11 are connected to the water pump 12. A cleaning liquid pipe 13 is provided inside the first support plate 14, and one end of the cleaning liquid pipe 13 passes through the bottom of the connected nozzle 15, and the end of the cleaning liquid pipe 13 away from the nozzle 15 passes through the water pump 12 and is connected to the top of the cleaning liquid tank 11.

[0028] Through the above technical solution, the cleaning liquid tank 11 is filled with special cleaning liquid for semiconductor substrates. The cleaning liquid is pumped from the cleaning liquid tank 11 into the cleaning liquid pipe 13 through the pump 12, and then enters the nozzle 15 through the cleaning liquid pipe 13.

[0029] Specifically, a second motor 25 is provided at one end of the conveyor shaft 23 away from the first support shaft 26 . The second motor 25 is fixedly connected to the end of the conveyor shaft 23 away from the first support shaft 26 via an output shaft. The conveyor shaft 23 is externally movably connected to the conveyor belt 24 .

[0030] Through the above technical solution, two first support shafts 26 are provided for supporting the conveyor belt shaft 23 .

[0031] Specifically, a second motor 25 is provided at one end of the conveyor shaft 23 away from the first support shaft 26 . The second motor 25 is fixedly connected to the end of the conveyor shaft 23 away from the first support shaft 26 via an output shaft. The conveyor shaft 23 is externally movably connected to the conveyor belt 24 .

[0032] Through the above technical solution, the second motor 25 drives the conveyor shaft 23 to rotate, the rotation of the conveyor shaft 23 drives the conveyor 24 to rotate, and the rotation of the conveyor 24 drives the semiconductor carrier on the conveyor 24 to move. The conveyor 24 is provided with a hole, and the liquid can pass through the gap.

[0033] Specifically, a liquid flow trough 28 is provided inside the conveyor belt 24, a second support shaft 27 is provided on one side of the liquid flow trough 28, one end of the second support shaft 27 is welded to one side of the second support shaft 27, and the end of the second support shaft 27 away from the liquid flow trough 28 is welded to one side of the workbench 3, a liquid flow port 29 is provided inside the liquid flow trough 28, the liquid flow port 29 passes through and is connected to the bottom of the liquid flow trough 28, a liquid flow pipe 30 is provided at the bottom of the liquid flow port 29, and one end of the liquid flow pipe 30 is engaged and connected to the inner wall of the liquid flow port 29.

[0034] Through the above technical solution, the cleaning liquid after cleaning enters the liquid flow trough 28 through the gaps on the conveyor belt 24, and then flows into the liquid flow pipe 30 from the liquid flow port 29 for discharge. The surface of the conveyor belt 24 is grid-shaped, which will not affect the cleaning liquid dripping downward.

[0035] During use, after the measuring machine 1 has finished measuring the semiconductor carrier on the glass table 2, the mechanical arm 8 rotates, and the mechanical arm 8 drives the air extraction port 9 to rotate. When the air extraction port 9 rotates to the top of the glass table 2, the air extraction pump 5 inside the air extraction pump box 4 starts to extract air, and the gas enters the air extraction port 9 from the sponge block 10, and then enters the mechanical arm 8, and finally reaches the air extraction pump box 4. The semiconductor carrier on the glass table 2 is adsorbed to the bottom of the sponge block 10 by suction. Then the mechanical arm 8 is rotated to move the semiconductor carrier to the conveyor belt 24 and separate from the measuring machine 1. The second motor 25 drives the conveyor belt shaft 23 to rotate. The rotation of the conveyor belt shaft 23 drives the conveyor belt 24 to rotate. The rotation of the conveyor belt 24 drives the semiconductor carrier on the conveyor belt 24 to move. When the semiconductor carrier moves to the bottom of the nozzle 15, the water pump 12 extracts the cleaning liquid The cleaning liquid inside the box 11 is moved from the cleaning liquid pipe 13 inside the first support plate 14 to the nozzle 15, and then sprayed out from the nozzle 16 to clean the surface of the semiconductor carrier. When the semiconductor carrier moves to the bottom of the fan hanging plate 21, the first motor 17 drives the fan 20 inside the fan slot 18 to rotate, and the air enters the fan slot 18 from the top of the fan slot 18, and then blows out from the slot cover 19 to air-dry the surface of the semiconductor carrier, so as to clean and dry the floating dust on the surface of the semiconductor carrier, and at the same time remove the moisture on the semiconductor carrier to ensure that the semiconductor carrier is in a dry state. The cleaning liquid after cleaning enters the liquid flow tank 28 through the gap on the conveyor belt 24, and then flows into the liquid flow pipe 30 from the liquid flow port 29 for discharge. Subsequently, only the inside of the liquid flow tank 28 needs to be cleaned.

[0036] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0037] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A semiconductor substrate automatic measuring machine with automatic material removal function, comprising a measuring machine (1), a nozzle (16) and a fan (20), characterized in that: One side of the measuring machine (1) is welded to the other side of the measuring machine (1) through a workbench (3); a nozzle (15) is provided on the top of the workbench (3); the nozzle (15) is welded to the top of the workbench (3) through a first support plate (14); a nozzle (16) is provided at the bottom of the nozzle (15); the top of the nozzle (16) is threadedly connected to the bottom of the nozzle (15); a fan hanging plate (21) is provided on the top of the workbench (3); the bottom of the fan hanging plate (21) is welded to the top of the workbench (3) through a second support plate (22); the bottom of the fan hanging plate (21) is A first motor (17) is provided at the top of the first motor (17) and is connected to the bottom of the fan hanging plate (21) via a fastener; a fan (20) is provided at the bottom of the first motor (17); the fan (20) penetrates and is connected to the bottom of the first motor (17) via a fan slot (18); the first motor (17) is fixedly connected to the top of the fan (20) via an output shaft; the bottom of the fan slot (18) is snap-connected to a slot cover (19); a glass table (2) is provided at the top of the measuring machine (1); the bottom of the glass table (2) is snap-connected to the top of the measuring machine (1).

2. The semiconductor substrate automatic measuring machine with automatic material removal function according to claim 1, characterized in that: A vacuum pump box (4) is provided on one side of the measuring machine (1), one side of the vacuum pump box (4) is welded to the side of the measuring machine (1), the interior of the vacuum pump box (4) is connected to a vacuum pump (5) via fasteners, the bottom of the vacuum pump box (4) is connected to a box cover (6) via fasteners, and a fixed shaft (7) is provided on the top of the vacuum pump box (4), and the fixed shaft (7) is welded to the top of the vacuum pump box (4).

3. The semiconductor substrate automatic measuring machine with automatic material removal function according to claim 2, characterized in that: A mechanical arm (8) is provided at the top of the fixed shaft (7), one end of the mechanical arm (8) penetrates through and is rotatably connected to the top of the fixed shaft (7), an air suction port (9) is provided at one end of the mechanical arm (8) away from the fixed shaft (7), one end of the mechanical arm (8) away from the fixed shaft (7) penetrates through and is connected to the air suction port (9), and a sponge block (10) is embedded in the air suction port (9).

4. The semiconductor substrate automatic measuring machine with automatic material removal function according to claim 1, characterized in that: One side of the workbench (3) is movably connected to a cleaning liquid tank (11); a fastener on the top of the cleaning liquid tank (11) is connected to a water pump (12); a cleaning liquid pipe (13) is provided inside the first support plate (14); one end of the cleaning liquid pipe (13) passes through and is connected to the bottom of the nozzle (15); and the end of the cleaning liquid pipe (13) away from the nozzle (15) passes through the water pump (12) and is connected to the top of the cleaning liquid tank (11).

5. The semiconductor substrate automatic measuring machine with automatic material removal function according to claim 1, characterized in that: A first support shaft (26) is welded to one side of the workbench (3); a conveyor belt shaft (23) is provided at one end of the first support shaft (26) away from the workbench (3); and the end of the first support shaft (26) away from the workbench (3) is rotatably connected to one end of the conveyor belt shaft (23).

6. The semiconductor substrate automatic measuring machine with automatic material removal function according to claim 5, characterized in that: A second motor (25) is provided at one end of the conveyor shaft (23) away from the first support shaft (26); the second motor (25) is fixedly connected to the end of the conveyor shaft (23) away from the first support shaft (26) via an output shaft; and the conveyor shaft (23) is externally movably connected to a conveyor belt (24).

7. The semiconductor substrate automatic measuring machine with automatic material removal function according to claim 6, characterized in that: A liquid flow trough (28) is provided inside the conveyor belt (24), a second support shaft (27) is provided on one side of the liquid flow trough (28), one end of the second support shaft (27) is welded to one side of the second support shaft (27), and one end of the second support shaft (27) away from the liquid flow trough (28) is welded to one side of the workbench (3), a liquid flow port (29) is provided inside the liquid flow trough (28), the liquid flow port (29) penetrates and connects to the bottom of the liquid flow trough (28), a liquid flow pipe (30) is provided at the bottom of the liquid flow port (29), and one end of the liquid flow pipe (30) is snap-fitted and connected to the inner wall of the liquid flow port (29).

Images