Rapid positioning device for wafer processing

Abstract

The utility model relates to the technical field of wafer processing, and discloses a wafer processing rapid positioning device which comprises a base, two sliding rails and three sliding pieces, the bottom sides of the two sliding rails are fixedly connected to the top side of the front end and the top side of the rear end of the base respectively, sliding grooves are formed in the sliding rails, and the three sliding pieces are arranged in the sliding grooves. Threaded rods are rotatably connected to the interiors of the sliding grooves, a driving assembly is installed at the left end of the sliding rail, the left ends of the threaded rods are connected with the driving assembly, one sliding piece horizontally slides in the sliding groove in the front end, and the other two threaded rods horizontally slide in the sliding groove in the rear end. Threads are arranged in the sliding piece. According to the utility model, the positioning and feeding stability can be improved and the wafer can be protected from being damaged while the device can carry out rapid feeding and positioning, so that the wafer processing precision is improved, the loss in processing is reduced, and the working precision is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer processing rapid positioning device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its original material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, that is, a wafer. Positioning in wafer processing is a very important step to ensure the accuracy and consistency of the process steps.

[0003] In the prior art, the positioning device for wafer processing lacks a certain stability in the coordination of the two functions of loading and positioning, resulting in insufficient efficiency and precision during production. Therefore, those skilled in the art provide a rapid positioning device for wafer processing to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings existing in the prior art, and to propose a wafer processing rapid positioning device, aiming to improve the problem in the prior art that the wafer processing positioning process lacks a certain stability, thereby causing insufficient efficiency and precision in production.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] The top end of the two guide wheels is fixedly provided with a toothed plate, and the bottom end of the two guide wheels is provided with a toothed plate, and the toothed plate is connected with a toothed plate at a certain position.

[0007] Through the above technical solution, the slide groove and the slide are both inverted T-shaped, which is used to prevent the slide from being affected by the threaded rod and rotating when it is transmitted on the threaded rod, and the slide and its top side structure are more stable during the sliding process. Sliding grooves corresponding to the rolling balls are set on the tops of the front and rear sides of the slide rail, which are used to make the rolling balls roll on the surface of the sliding groove to reduce friction, and at the same time clamp the mounting plate on the front and rear sides of the slide rail, further improving the stability of the sliding structure. Driven by the motor, the threaded rod rotates inside the slide groove and transmits the slide at the same time, so that the slide moves inside the slide groove, and drives the mounting plate on the top side and the structure connected to it to move.

[0008] Furthermore, the positioning mechanism includes a connecting rod, the bottom side of the rear end of the connecting rod is fixedly connected to the top side of the mounting plate at the rear end, a clamping piece is provided on the adjacent side of the two connecting rods, and two sliding rods are fixedly connected to one end of the clamping piece close to the connecting rod, the sliding rod passes through the side of the connecting rod away from the clamping piece, a buffer assembly is provided on the outer wall of the sliding rod, a receiving plate is fixedly connected to the side of the clamping piece away from the connecting rod, and a soft pad is provided inside the clamping piece.

[0009] Through the above technical solution, the clamping piece is a flat U-shape, and together with the soft pad inside the clamping piece, it is used to clamp the edge of the wafer, and at the same time, the soft pad includes the fragile structure of the wafer to prevent the wafer from breaking. A limited portion is provided at the end of the slide bar away from the connecting rod to prevent the slide bar from sliding out of the connecting rod. The receiving plate is used to support the bottom side of the wafer.

[0010] Furthermore, the feeding mechanism includes an electric push rod and a telescopic rod, the bottom sides of the electric push rod and the telescopic rod are fixedly connected to the top side of the mounting plate at the front end, the driving end of the electric push rod is fixedly connected to a feeding plate, the front right side of the feeding plate is fixedly connected to the rear end of the telescopic rod, and a rubber ring is provided at the rear end of the top side of the feeding plate.

[0011] Through the above technical solution, the top sides of the loading plate and the receiving plate are at the same horizontal height, so that when the loading plate is loading, there will not be too large a height difference when the wafer is handed over to the receiving plate, so that the loading accuracy of the wafer is higher. The softness of the rubber ring is used to protect the bottom side of the wafer and provide a certain amount of friction. The telescopic rod cooperates with the electric push rod to provide support and stability for the loading plate. When loading, driven by the displaced mounting plate, the telescopic rod, the electric push rod and the loading plate connected to the two components are displaced toward the middle end of the device, and then driven by the driving end of the electric push rod, the loading plate is displaced to the rear end, and the telescopic part of the connected telescopic rod is extended to continuously support the loading plate.

[0012] Furthermore, adsorption components are installed on the bottom sides of the two receiving plates and the bottom side of the loading plate.

[0013] Through the above technical solution, when the wafer is placed on the top side of the receiving plate and the top side of the loading plate, the wafer is adsorbed and fixed to prevent the wafer from shifting.

[0014] Furthermore, the adsorption assembly includes an air pump, and rubber sleeves are installed inside the two receiving plates and inside the loading plate, and the output end of the air pump is fixedly connected to the input end of the rubber sleeve.

[0015] Through the above technical solution, the top side of the rubber sleeve and the bottom side of the wafer are fitted together to form a cavity, and the opening on the bottom side of the rubber sleeve is connected to the output end of the vacuum pump, so that the vacuum pump can extract the air in the cavity. The vacuum pump uses a turbine or a nozzle to generate a high-speed airflow, and the airflow extracts the gas in the cavity generated by the rubber sleeve and the wafer on the top side of the rubber sleeve through the nozzle, so that the inside of the cavity becomes a vacuum, and the wafer is adsorbed on the top side of the rubber sleeve under the action of atmospheric pressure, thereby fixing the wafer.

[0016] Furthermore, the driving assembly includes a motor, which is installed on the left end of the outer wall of the slide rail, and the driving end of the motor is fixedly connected to the left end of the threaded rod.

[0017] Through the above technical solution, the motor is used as a power source to drive the threaded rod to rotate.

[0018] Furthermore, the buffer assembly includes a spring, two ends of which are respectively connected to the clamping member and a proximal side of the connecting rod, and the spring is sleeved on the outer wall of the sliding rod.

[0019] Through the above technical solution, while the left and right end clamps move toward each other to clamp the wafer, the clamps drive the sliding rod to slide inside the connecting rod and compress the spring, thereby reducing the force generated when the clamps contact the edge of the wafer, further buffering the clamping of the wafer and protecting the wafer.

[0020] Furthermore, the directions of the two threads at the rear end are opposite to each other.

[0021] Through the above technical solution, by setting threads in opposite directions, when the rear threaded rod transmits the two rear slides, the two slides move towards or away from each other, thereby controlling the clamping and release of the wafer by the positioning mechanism.

[0022] The utility model has the following beneficial effects:

[0023] 1. In the utility model, through the mutual cooperation of the slide groove, the slide, the slide rail, the screw and the ball, the device can be quickly loaded and positioned, while improving the stability of positioning and loading, protecting the wafer from damage, so as to improve the accuracy of wafer processing, thereby reducing the loss during processing and improving the accuracy of work.

[0024] 2. In the utility model, by the cooperation of the slide, threaded rod, clamp, spring and slide rod, wafers of different sizes can be positioned and fixed, while the force applied to the wafer during positioning can be reduced by buffering, thereby protecting the fragile structure of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A three-dimensional diagram of a wafer processing rapid positioning device proposed by the utility model;

[0026] Figure 2 This is a schematic diagram of the structure of a slide rail of a wafer processing rapid positioning device proposed by the utility model;

[0027] Figure 3 This is a schematic diagram of the structure of a slide rail and a slide member of a wafer processing rapid positioning device proposed by the utility model;

[0028] Figure 4 This is a structural schematic diagram of a loading plate of a wafer processing rapid positioning device proposed by the utility model;

[0029] Figure 5 This is a structural schematic diagram of a receiving plate of a wafer processing rapid positioning device proposed by the utility model;

[0030] Figure 6 The utility model provides a schematic structural diagram of an adsorption component of a wafer processing rapid positioning device.

[0031] Legend:

[0032] 1. Base; 2. Slide rail; 3. Threaded rod; 4. Motor; 5. Mounting plate; 6. Slide; 7. Roller ball; 8. Electric push rod; 9. Telescopic rod; 10. Loading plate; 11. Rubber ring; 12. Connecting rod; 13. Adapter plate; 14. Clamping part; 15. Slide rod; 16. Spring; 17. Rubber sleeve; 18. Vacuum pump. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] Reference Figure 1-3The utility model provides an embodiment: a wafer processing rapid positioning device, comprising a base 1, two slide rails 2 and three slides 6, the bottom sides of the two slide rails 2 are respectively fixedly connected to the top side of the front end and the top side of the rear end of the base 1, a slide groove is provided inside the slide rail 2, a threaded rod 3 is rotatably connected inside the slide groove, a driving assembly is installed at the left end of the slide rail 2, and the left end of the threaded rod 3 is connected to the driving assembly, one of the slides 6 slides horizontally inside the front end slide groove, and the other two threaded rods 3 slide horizontally inside the rear end slide groove, and the interior of the slide 6 is provided with a The slide 6 is provided with threads, the interior of the slide 6 is connected to the outer wall of the threaded rod 3 by threads, the top side of the slide 6 is fixedly connected with a mounting plate 5, the mounting plate 5 is arranged on the top side of the base 1, the front and rear ends of the mounting plate 5 are rotatably connected with rolling balls 7, the outer wall of the rolling ball 7 rolls and contacts the top ends of the front and rear sides of the outer wall of the slide rail 2, the top side of the front mounting plate 5 is installed with a feeding mechanism, and the top sides of the two rear mounting plates 5 are installed with positioning mechanisms; the driving assembly includes a motor 4, the motor 4 is installed at the left end of the outer wall of the slide rail 2, and the driving end of the motor 4 is fixedly connected to the left end of the threaded rod 3;

[0035] Specifically, the slide groove and the slide 6 are both inverted T-shaped, which is used to prevent the slide 6 from being affected by the threaded rod 3 and rotating when it is transmitted on the threaded rod 3, and the slide 6 and its top side structure are more stable during the sliding process. The top ends of the front and rear sides of the slide rail 2 are provided with slide grooves corresponding to the rolling balls 7, which are used to make the rolling balls 7 roll on the surface of the slide groove to reduce friction, and at the same time, the mounting plate 5 is clamped on the front and rear sides of the slide rail 2, further improving the stability of the sliding structure. Driven by the motor 4, the threaded rod 3 rotates inside the slide groove, and at the same time, the slide 6 is transmitted, so that the slide 6 is displaced inside the slide groove, and the top side mounting plate 5 and the structure connected thereto are displaced.

[0036] Reference Figure 1 and Figure 5 The positioning mechanism includes a connecting rod 12, the bottom side of the rear end of the connecting rod 12 is fixedly connected to the top side of the rear end mounting plate 5, a clamping member 14 is provided on the adjacent side of the two connecting rods 12, and two sliding rods 15 are fixedly connected to one end of the clamping member 14 close to the connecting rod 12, and the sliding rod 15 passes through the side of the connecting rod 12 away from the clamping member 14, and a buffer assembly is provided on the outer wall of the sliding rod 15, and a receiving plate 13 is fixedly connected to the side of the clamping member 14 away from the connecting rod 12, and a soft cushion is provided inside the clamping member 14; the buffer assembly includes a spring 16, and the two ends of the spring 16 are respectively connected to the clamping member 14 and the adjacent side of the connecting rod 12, and the spring 16 is sleeved on the outer wall of the sliding rod 15;

[0037] The specific clamping member 14 is a flat U-shaped, together with the soft pad inside the clamping member 14, used to clamp the edge of the wafer, and at the same time, the soft pad includes the fragile structure of the wafer to prevent the wafer from breaking. The sliding rod 15 is provided with a limited portion at one end away from the connecting rod 12 to prevent the sliding rod 15 from sliding out of the connecting rod 12. The receiving plate is used to support the bottom side of the wafer. By setting the threads in opposite directions, when the rear end threaded rod 3 transmits the two rear end slides 6, the two slides 6 move toward each other or away from each other, thereby driving the corresponding mounting plate 5 together with the connecting rod 12 and its attached structure to move in the same direction as the slide 6, so that the left and right end clamping members 14 move toward each other to clamp and fix the wafer, realize positioning, and can position wafers of different sizes. At the same time, the clamping member 14 drives the sliding rod 15 to slide inside the connecting rod 12, and compresses the spring 16 to reduce the force generated when the clamping member 14 contacts the edge of the wafer, further buffering the clamping of the wafer and protecting the wafer.

[0038] Reference Figure 1 and Figure 4 The feeding mechanism includes an electric push rod 8 and a telescopic rod 9. The bottom sides of the electric push rod 8 and the telescopic rod 9 are fixedly connected to the top side of the front mounting plate 5. The driving end of the electric push rod 8 is fixedly connected to a feeding plate 10. The front right side of the feeding plate 10 is fixedly connected to the rear end of the telescopic rod 9. A rubber ring 11 is provided at the top rear end of the feeding plate 10.

[0039] Specifically, the top sides of the loading plate 10 and the receiving plate 13 are at the same horizontal height, so that when the loading plate 10 hands over the wafer to the receiving plate 13 during loading, there will not be too large a height difference, so that the loading accuracy of the wafer is higher. The softness of the rubber ring 11 is used to protect the bottom side of the wafer and provide a certain amount of friction. The telescopic rod 9 cooperates with the electric push rod 8 to provide support and stability for the loading plate 10. When loading, driven by the displaced mounting plate 5, the telescopic rod 9, the electric push rod 8 and the loading plate 10 connected to the two components are displaced toward the middle end of the device, and then, driven by the driving end of the electric push rod 8, the loading plate 10 is displaced to the rear end, and the telescopic part of the connected telescopic rod 9 is extended to continuously support the loading plate 10.

[0040] Reference Figure 4-6 The bottom sides of the two receiving plates 13 and the bottom side of the loading plate 10 are both installed with adsorption components; the adsorption components include an air pump 18, and the insides of the two receiving plates 13 and the loading plate 10 are both installed with rubber sleeves 17, and the output end of the air pump 18 is fixedly connected to the input end of the rubber sleeve 17;

[0041] Specifically, the adsorption assembly is used to adsorb and fix the wafer when the wafer is placed on the top side of the receiving plate 13 and the top side of the loading plate 10, so as to prevent the wafer from shifting. The top side of the rubber sleeve 17 fits with the bottom side of the wafer to form a cavity, and the opening on the bottom side of the rubber sleeve 17 is connected to the output end of the vacuum pump 18, so that the vacuum pump 18 can extract the air in the cavity. The vacuum pump 18 uses a turbine or a nozzle to generate a high-speed airflow. The airflow extracts the gas in the cavity generated by the rubber sleeve 17 and the wafer on the top side of the rubber sleeve 17 through the nozzle, making the inside of the cavity a vacuum. The wafer is adsorbed on the top side of the rubber sleeve 17 under the action of atmospheric pressure to fix the wafer.

[0042] Working principle: First, the wafer is loaded and placed on the top side of the loading plate 10. At this time, the vacuum pump 18 on the loading plate 10 is used to extract air and adsorb the bottom side of the wafer to fix it. Then, under the drive of the motor 4 at the rear end, the threaded rod 3 rotates inside the slide slot and drives the slide 6 at the same time, so that the slide 6 moves inside the slide slot, and drives the mounting plate 5 on the top side and its connected telescopic rod 9, the electric push rod 8 and the loading plate 10 connected to the two components to move toward the middle end of the device. Then, under the drive of the driving end of the electric push rod 8, the loading plate 10 moves to the middle end of the device. The rear end is displaced, and the telescopic part of the connected telescopic rod 9 is extended, and the loading plate 10 is continuously supported until the wafer is sent to the center of the two clamping members 14. Under the drive of the motor 4 at the rear end, by setting the threads in the opposite direction, the threaded rod 3 at the rear end drives the two slides 6 at the rear end, so that the two slides 6 move toward each other, drive the corresponding mounting plate 5 together with the connecting rod 12 and its attached structure to move in the same direction as the slide 6, so that the left and right clamping members 14 move toward each other to clamp and fix the wafer, realize positioning, and can position wafers of different sizes. At the same time, the clamping member 14 drives the slide 15 to slide inside the connecting rod 12, and compresses the spring 16 to reduce the force generated when the clamping member 14 contacts the edge of the wafer, further buffers the clamping of the wafer, and protects the wafer. Then the vacuum pump 18 on the loading plate 10 is turned off, and the bottom side of the wafer of the loading plate 10 is released. The vacuum pump 18 on the receiving plate 13 is evacuated to adsorb the bottom side of the wafer for fixing.

[0043] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer processing rapid positioning device, comprising a base (1), two slide rails (2) and three slide members (6), characterized in that: The bottom sides of the two slide rails (2) are respectively fixedly connected to the top sides of the front end and the rear end of the base (1); a slide groove is provided inside the slide rail (2); a threaded rod (3) is rotatably connected inside the slide groove; a driving assembly is installed at the left end of the slide rail (2); the left end of the threaded rod (3) is connected to the driving assembly; one of the slide members (6) slides horizontally inside the slide groove at the front end; the other two threaded rods (3) slide horizontally inside the slide groove at the rear end; the slide member (6) is provided with a The slide member (6) has threads, the interior of the slide member (6) is connected to the outer wall of the threaded rod (3) through threads, the top side of the slide member (6) is fixedly connected to a mounting plate (5), the mounting plate (5) is arranged on the top side of the base (1), the front and rear ends of the mounting plate (5) are rotatably connected to roller balls (7), the outer wall of the roller balls (7) rolls in contact with the top ends of the front and rear sides of the outer wall of the slide rail (2), a feeding mechanism is installed on the top side of the front mounting plate (5), and a positioning mechanism is installed on the top sides of the two rear mounting plates (5).

2. A wafer processing rapid positioning device according to claim 1, characterized in that: The positioning mechanism comprises a connecting rod (12), the bottom side of the rear end of the connecting rod (12) is fixedly connected to the top side of the mounting plate (5) at the rear end, a clamping member (14) is provided on the adjacent side of the two connecting rods (12), and two sliding rods (15) are fixedly connected to one end of the clamping member (14) close to the connecting rod (12), and the sliding rod (15) passes through the side of the connecting rod (12) away from the clamping member (14), a buffer assembly is provided on the outer wall of the sliding rod (15), and a receiving plate (13) is fixedly connected to the side of the clamping member (14) away from the connecting rod (12), and a soft pad is provided inside the clamping member (14).

3. A wafer processing rapid positioning device according to claim 2, characterized in that: The feeding mechanism comprises an electric push rod (8) and a telescopic rod (9), the bottom sides of the electric push rod (8) and the telescopic rod (9) are fixedly connected to the top side of the front mounting plate (5), the driving end of the electric push rod (8) is fixedly connected to a feeding plate (10), the front right side of the feeding plate (10) is fixedly connected to the rear end of the telescopic rod (9), and a rubber ring (11) is provided at the rear end of the top side of the feeding plate (10).

4. The wafer processing rapid positioning device according to claim 3, characterized in that: Adsorption components are installed on the bottom sides of the two receiving plates (13) and the bottom side of the loading plate (10).

5. The wafer processing rapid positioning device according to claim 4, characterized in that: The adsorption assembly comprises an air pump (18), and rubber sleeves (17) are installed inside the two receiving plates (13) and inside the loading plate (10), and the output end of the air pump (18) is fixedly connected to the input end of the rubber sleeve (17).

6. The wafer processing rapid positioning device according to claim 1, characterized in that: The driving assembly comprises a motor (4), which is mounted on the left end of the outer wall of the slide rail (2), and the driving end of the motor (4) is fixedly connected to the left end of the threaded rod (3).

7. The wafer processing rapid positioning device according to claim 2, characterized in that: The buffer assembly comprises a spring (16), the two ends of which are respectively connected to the clamping member (14) and the adjacent side of the connecting rod (12), and the spring (16) is sleeved on the outer wall of the sliding rod (15).

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