Millimeter wave radar antenna module

Abstract

The embodiment of the utility model provides a millimeter wave radar antenna module, which comprises a circuit board, and a radar chip, a microstrip antenna and a shielding cover which are all arranged on the same side board surface of the circuit board, the radar chip is connected with the microstrip antenna through a microstrip line, and the shielding cover correspondingly covers the radar chip and one end of the microstrip line adjacent to the radar chip. The board surface of the circuit board is also provided with a closed annular connecting ring, the connecting ring comprises an insulating section formed by coating an electrical insulating material and a bonding section formed by coating an adhesive conductive material, and the radar chip and the microstrip antenna are respectively located inside and outside the connecting ring. The insulating section is correspondingly coated and formed on the part, provided with the microstrip line, of the circuit board and correspondingly covers the corresponding section of the microstrip line, the shielding cover is correspondingly sealed and bonded with the surface of one side, far away from the circuit board, of the connecting ring, and the shielding cover is correspondingly and electrically connected with a grounding circuit printed on the circuit board through the bonding section. The embodiment of the utility model can effectively ensure the electromagnetic shielding of the millimeter wave radar antenna by the shielding case.

Description

Technical Field

[0001] The embodiment of the utility model relates to the technical field of millimeter wave radar antennas, and in particular to a millimeter wave radar antenna module. Background Art

[0002] An existing millimeter-wave radar antenna generally includes a circuit board, a radar chip (for example, a SOC chip) disposed on the front of the circuit board, and a plurality of microstrip antennas disposed on the front of the circuit board and connected to the radar chip through microstrip lines respectively. When the millimeter-wave radar antenna is working, the circuit inside the radar chip (for example, a DSP data processing circuit and an MCU control circuit) and the microstrip line will generate harmonics and radiate energy to the outside, thereby causing serious electromagnetic radiation to the outside. Therefore, a shielding cover is usually provided on the radar chip and the microstrip line to reduce the electromagnetic radiation of the millimeter-wave radar antenna.

[0003] However, the inventors found in the specific implementation that the existing shielding cover is welded to the PCB board. At the same time, in order to avoid a short circuit caused by contact between the micro-antenna and the shielding cover and enable the millimeter-wave radar antenna to smoothly emit waves to the outside, a sealing opening at the bottom of the shielding cover needs to be provided with a slot for the microstrip line to pass through. The electromagnetic waves generated by the radar chip can still be radiated through the slot, thereby weakening the electromagnetic shielding effect of the shielding cover on the millimeter-wave radar antenna. Utility Model Content

[0004] The technical problem to be solved by the embodiments of the utility model is to provide a millimeter wave radar antenna module that can effectively ensure the electromagnetic shielding of the millimeter wave radar antenna by the shielding cover.

[0005] To solve the above technical problems, the embodiment of the utility model adopts the following technical scheme: a millimeter wave radar antenna module, comprising a circuit board and a radar chip, a microstrip antenna and a shielding cover all arranged on the same side of the circuit board, the radar chip is connected to the microstrip antenna through a microstrip line, the shielding cover correspondingly covers the radar chip and one end of the microstrip line adjacent to the radar chip, a connecting ring in the shape of a closed ring is also provided on the board surface of the circuit board, the connecting ring comprises an insulating section formed by coating an electrically insulating material and a bonding section formed by coating a sticky conductive material, the radar chip and the microstrip antenna are respectively located inside and outside the connecting ring, the insulating section is correspondingly coated and formed on a part of the circuit board where the microstrip line is arranged and correspondingly covers a corresponding section of the microstrip line, the periphery of the opening of the shielding cover is correspondingly sealed and bonded to a surface of the connecting ring on a side away from the circuit board, and the shielding cover is correspondingly electrically connected to a grounding circuit printed on the circuit board through the bonding section.

[0006] Furthermore, the shielding cover is adhered to the connecting ring through SMT patch technology.

[0007] Furthermore, the insulating section and the bonding section are staggered and connected to each other in the circumferential direction of the connecting ring, and the surfaces of the insulating section and the bonding section respectively used to dock with the peripheral edge of the opening of the shielding cover are flush with each other; or, the bonding section is a complete annular structure and corresponds to covering the outer surface of the insulating section, and the peripheral edge of the opening of the shielding cover is only sealed and bonded to the bonding section.

[0008] Furthermore, the insulating section is formed by printing solder resist ink on a corresponding section of the microstrip line using a silk screen printing process.

[0009] Furthermore, the shielding cover includes an inner cover and an outer cover both made of conductive materials, a window is formed through the top of the inner cover corresponding to the position of the radar chip and the microstrip line, and the outer cover is assembled outside the inner cover and correspondingly shields the window.

[0010] Furthermore, a first clamping portion is provided on the outer side wall of the inner cover, and a second clamping portion is provided on the inner side wall of the outer cover, and the first clamping portion and the second clamping portion are mutually clamped to fix the outer cover to the inner cover.

[0011] Furthermore, a deformation groove which cooperates with the first clamping portion to elastically clamp is formed on the side wall of the outer cover.

[0012] Further, the first clamping portion is a clamping hole, and the second clamping portion is a clamping protrusion embedded in the clamping hole; or, the first clamping portion is a clamping protrusion, and the second clamping portion is a clamping hole for the clamping protrusion to be embedded in it.

[0013] Furthermore, the millimeter-wave radar antenna module also includes a heat-conducting block, and two opposite side surfaces of the heat-conducting block are respectively attached to the outer surface of the radar chip and the inner wall of the outer cover.

[0014] Furthermore, the peripheral edge of the opening of the shielding cover is folded outward to form a folded edge, and the shielding cover is sealed and bonded to the connecting ring via the folded edge.

[0015] By adopting the above technical scheme, the embodiment of the utility model has at least the following beneficial effects: the embodiment of the utility model seals and connects the shielding cover by setting a connecting ring on the surface of the circuit board, and the connecting ring includes an insulating section formed by coating and molding an electrically insulating material on the part of the circuit board where the microstrip line is arranged, which can prevent the microstrip line from directly contacting the metal shielding cover and causing a short circuit, thereby ensuring the smooth operation of the millimeter wave antenna module. In addition, the connecting ring also includes a bonding section coated and molded on the surface of the circuit board with a viscous conductive material, which can effectively seal and bond the shielding cover to the circuit board, and make the shielding cover electrically connected to the grounding circuit on the circuit board, thereby releasing the static charge generated by the shielding cover due to receiving electromagnetic radiation through the grounding circuit, effectively improving the electromagnetic shielding effect of the shielding cover. In addition, by adopting the above connecting ring including the insulating section and the bonding section, the opening periphery of the shielding cover does not need to be formed with a notch for the microstrip line to pass through, and can also effectively avoid the defect of electromagnetic radiation leaking through the corresponding notch in the traditional millimeter wave radar antenna module. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of a disassembled state of an optional embodiment of the millimeter-wave radar antenna module of the utility model.

[0017] Figure 2 It is a three-dimensional structural schematic diagram of the combined state of an optional embodiment of the millimeter wave radar antenna module of the utility model.

[0018] Figure 3 The figure is a schematic diagram of the cross-sectional structure of a structure in which a connecting ring in an embodiment of a millimeter-wave radar antenna module of the utility model connects a circuit board and a shielding cover at a position corresponding to a microstrip line.

[0019] Figure 4 It is a schematic diagram of the cross-sectional structure of a structure in which a connecting ring connects a circuit board and a shielding cover in another embodiment of the millimeter-wave radar antenna module of the utility model at a position corresponding to a microstrip line.

[0020] Figure 5 The figure is a schematic cross-sectional structure diagram of an embodiment of the millimeter-wave radar antenna module of the present utility model.

[0021] Figure 6 yes Figure 5 Enlarged schematic at C.

[0022] Figure 7 It is a three-dimensional structural schematic diagram of a disassembled state of a shielding cover of an optional embodiment of the millimeter-wave radar antenna module of the utility model. DETAILED DESCRIPTION

[0023] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the following exemplary embodiments and descriptions are only used to explain the present invention and are not intended to limit the present invention. In addition, the embodiments and features in the embodiments of the present invention may be combined with each other without conflict.

[0024] like Figure 1-Figure 7 As shown, an optional embodiment of the utility model provides a millimeter wave radar antenna module, including a circuit board 1 and a radar chip 2, a microstrip antenna 3 and a shielding cover 4 all arranged on the same side of the circuit board 1, the radar chip 2 is connected to the microstrip antenna 3 through a microstrip line 5, the shielding cover 4 covers the radar chip 2 and the end of the microstrip line 5 adjacent to the radar chip 2, and a connecting ring 6 in a closed ring shape is also provided on the board surface of the circuit board 1, and the connecting ring 6 includes an insulating section formed by coating an electrically insulating material. 61 and a bonding section 63 formed by coating a sticky conductive material, the radar chip 2 and the microstrip antenna 3 are respectively located inside and outside the connecting ring 6, the insulating section 61 is correspondingly coated and formed on the part where the microstrip line 5 is arranged on the circuit board 1 and covers the corresponding section of the microstrip line 5, the periphery of the opening 40 of the shielding cover 4 is correspondingly sealed and bonded to the surface of the side of the connecting ring 6 away from the circuit board 1, and the shielding cover 4 is electrically connected to the grounding circuit printed on the circuit board 1 through the bonding section 63.

[0025] The embodiment of the utility model seals and connects the shielding cover 4 by setting a connecting ring 6 on the surface of the circuit board 1. The connecting ring 6 includes an insulating section 61 formed by coating and molding an electrically insulating material corresponding to the position where the microstrip line 5 is arranged on the circuit board 1, which can prevent the microstrip line 5 from directly contacting the metal shielding cover 4 and causing a short circuit, thereby ensuring the smooth operation of the millimeter wave antenna module. In addition, the connecting ring 6 also includes a bonding section 63 coated and molded on the surface of the circuit board 1 with a viscous conductive material, which can effectively seal and bond the shielding cover 4 to the circuit board 1, and make the shielding cover 4 and the grounding circuit on the circuit board 1 correspondingly electrically connected, so that the static charge generated by the shielding cover 4 due to receiving electromagnetic radiation is released through the grounding circuit, effectively improving the electromagnetic shielding effect of the shielding cover 4. In addition, by using the connecting ring 6 including the insulating section 61 and the bonding section 63, the peripheral edge of the opening 40 of the shielding cover 4 does not need to be formed with a notch for the microstrip line 5 to pass through, and can also effectively avoid the defect of electromagnetic radiation leaking through the corresponding notch in the traditional millimeter wave radar antenna module.

[0026] In an optional embodiment of the present invention, Figure 1-Figure 7As shown, the shielding cover 4 is pasted on the connecting ring 6 by the SMT patch process. In this embodiment, the shielding cover 4 is pasted on the connecting ring 6 by the SMT patch process with the surface where the opening 40 is located, so that the shielding cover 4 can be assembled together with the electronic components on the circuit board 1 in the patch equipment, with high production consistency and improved assembly efficiency. Compared with other fixing methods such as laser welding, when the electronic components fail, it is also convenient to disassemble and repair the shielding cover 4. In a specific implementation, the viscous conductive material on the bonding section 63 can be selected as solder paste.

[0027] In an optional embodiment of the present invention, Figure 3 As shown, the insulating section 61 and the bonding section 63 are mutually staggered and connected in the circumferential direction of the connecting ring 6, and the surfaces of the insulating section 61 and the bonding section 63 respectively used to connect with the peripheral edge of the opening 40 of the shielding cover 4 are flush with each other; or, as Figure 4 As shown in FIG. 1 , the bonding section 63 is a complete annular structure and covers the outer surface of the insulating section 61. The periphery of the opening 40 of the shielding cover 4 is only sealed and bonded to the bonding section 63. This embodiment provides two structural layouts of the insulating section 61 and the bonding section 63 in the connecting ring 6, which can be flexibly selected according to actual needs. For example, in the embodiment shown in FIG. Figure 3 In the embodiment shown in the figure, the above-mentioned layout mode of staggered arrangement of the bonding section 63 and the insulating section 61 is adopted, and in Figure 4 In the illustrated embodiment, a layout in which the bonding section 63 covers the insulating section 61 accordingly is adopted. Both layouts can effectively ensure the electromagnetic shielding of the millimeter wave radar antenna by the shielding cover 4.

[0028] In an optional embodiment of the present invention, Figure 1-Figure 3 As shown, the insulating section 61 is formed by printing solder resist ink on the corresponding section of the microstrip line 5 using a silk screen process. In this embodiment, the silk screen process is used to form solder resist ink on the corresponding section of the microstrip line 5, so as to facilitate the formation of the insulating section 61 on the corresponding section of the microstrip line 5, avoid the microstrip line 5 and the metal shielding cover 4 from contacting and causing a short circuit, and ensure that the millimeter wave radar antenna can operate smoothly.

[0029] In an optional embodiment of the present invention, Figure 1-Figure 7As shown, the shielding cover 4 includes an inner cover 41 and an outer cover 43 both made of conductive materials, a window 410 is formed through the top of the inner cover 41 at a position corresponding to the position of the radar chip 2 and the microstrip line 5, and the outer cover 43 is assembled outside the inner cover 41 and covers the window 410 accordingly. In this embodiment, the shielding cover 4 adopts a combined design of the inner cover 41 and the outer cover 43, and the inner cover 41 can be firstly bonded and fixed to the bonding section 63 of the circuit board 1, and then the outer cover 43 assembled on the inner cover 41 is disassembled to expose the inner cover 41, so that it is convenient to add thermal conductive materials or replace electronic components through the window 410 at the top of the inner cover 41, which is beneficial to the production and maintenance of the millimeter wave radar antenna module.

[0030] In an optional embodiment of the present invention, Figure 1-Figure 7 As shown, a first clamping portion 411 is provided on the outer side wall of the inner cover 41, and a second clamping portion 431 is provided on the inner side wall of the outer cover 43. The first clamping portion 411 and the second clamping portion 431 are clamped with each other to fix the outer cover 43 to the inner cover 41. In this embodiment, the inner cover 41 and the outer cover 43 can quickly complete the disassembly and installation between the inner cover 41 and the outer cover 43 through the clamping cooperation of the first clamping portion 411 and the second clamping portion 431. In addition, other structural forms such as screw connection, bonding or magnetic attraction structure that can achieve the same fixing effect can be adopted between the inner cover 41 and the outer cover 43, which will not be described in detail here.

[0031] In an optional embodiment of the present invention, Figure 1-Figure 7 As shown, a deformation groove 433 is provided on the side wall of the outer cover 43 to be elastically engaged with the first engaging portion 411. The first engaging portion 411 and the second engaging portion 431 are provided in plural numbers and are correspondingly provided on the side walls around the inner cover 41 and the outer cover 43. In this embodiment, deformation grooves 433 are correspondingly provided on the side walls at the four corners around the outer cover 43, so that each side wall on the outer cover 43 can generate a certain elasticity in the engaging cooperation, thereby effectively elastically engaging the second engaging portion 431 on the outer cover 43 to the first engaging portion 411 of the inner cover 41.

[0032] In an optional embodiment of the present invention, Figure 1-Figure 7 As shown, the first clamping portion 411 is a clamping hole, and the second clamping portion 431 is a clamping protrusion that is clamped into the clamping hole; or, the first clamping portion 411 is a clamping protrusion, and the second clamping portion 431 is a clamping hole for the clamping protrusion to be clamped into. In this embodiment, one of the first clamping portion 411 and the second clamping portion 431 adopts a clamping hole and the other adopts a clamping protrusion, and the two are clamped and matched with each other to effectively fix the outer cover 43 on the inner cover 41.

[0033] In an optional embodiment of the present invention, Figure 1 , Figure 5 and Figure 6 As shown, the millimeter wave radar antenna module further includes a heat conductive block 7, and the opposite side surfaces of the heat conductive block 7 are respectively attached to the outer surface of the radar chip 2 and the inner wall of the outer cover 43. In this embodiment, a heat conductive block 7 (such as heat dissipation silicone grease) is arranged in the interval between the outer cover 43 and the radar chip 2, so as to facilitate the heat generated by the radar chip 2 during operation to be conducted to the outer cover 43, thereby preventing the continuous accumulation of heat from affecting the normal operation of the radar chip 2.

[0034] In an optional embodiment of the present invention, Figure 1-Figure 7 As shown, the periphery of the opening 40 of the shielding cover 4 is folded outward to form a folded edge 401, and the shielding cover 4 is sealed and bonded to the connecting ring 6 by the folded edge 401. In this embodiment, the folded edge 401 formed by the periphery of the opening 40 of the shielding cover 4 being folded outward can effectively increase the area of ​​the surface where the opening 40 of the shielding cover 4 is located, so as to facilitate the effective sealing and fixing of the shielding cover 4 and the connecting ring 6.

[0035] In an optional embodiment of the present invention, Figure 1 As shown, the number of the microstrip lines 5 is multiple, and the microstrip lines 5 drawn from the circuit board 1 are arranged toward the same side of the radar chip 2. In this embodiment, by arranging the microstrip lines 5 toward the same side of the radar chip 2, the wiring difficulty of the microstrip antenna 3 can be effectively reduced. In addition, it is convenient to form the insulating section 61 on the same side of the radar chip 2, optimize the layout design of the insulating section 61 on the circuit board 1, and the structure is more compact.

[0036] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the present invention, ordinary technicians in this field can also make many variations without departing from the scope of protection of the purpose of the present invention and the claims, which all fall within the scope of protection of the present invention.

Claims

1. A millimeter wave radar antenna module, comprising a circuit board and a radar chip, a microstrip antenna and a shielding cover all arranged on the same side of the circuit board, wherein the radar chip is connected to the microstrip antenna through a microstrip line, and the shielding cover covers the radar chip and one end of the microstrip line adjacent to the radar chip, characterized in that: A connecting ring in the shape of a closed ring is also provided on the surface of the circuit board, and the connecting ring includes an insulating section formed by coating an electrically insulating material and a bonding section formed by coating a sticky conductive material. The radar chip and the microstrip antenna are respectively located inside and outside the connecting ring. The insulating section is correspondingly coated and formed on the part of the circuit board where the microstrip line is arranged and correspondingly covers the corresponding section of the microstrip line. The periphery of the opening of the shielding cover is correspondingly sealed and bonded to the surface of the connecting ring on the side away from the circuit board, and the shielding cover is correspondingly electrically connected to the grounding circuit printed on the circuit board through the bonding section.

2. The millimeter wave radar antenna module according to claim 1, characterized in that: The shielding cover is adhered to the connecting ring through SMT patch process.

3. The millimeter wave radar antenna module according to claim 1, characterized in that: The insulating section and the bonding section are staggered and connected with each other in the circumferential direction of the connecting ring, and the surfaces of the insulating section and the bonding section respectively used to dock with the peripheral edge of the opening of the shielding cover are flush with each other; or, the bonding section is a complete annular structure and corresponds to covering the outer surface of the insulating section, and the peripheral edge of the opening of the shielding cover is only sealed and bonded to the bonding section.

4. The millimeter wave radar antenna module according to claim 1, characterized in that: The insulating section is formed by printing solder resist ink on a corresponding section of the microstrip line using a silk screen printing process.

5. The millimeter wave radar antenna module according to claim 1, characterized in that: The shielding cover includes an inner cover and an outer cover both made of conductive materials, a window is formed through the top of the inner cover corresponding to the position of the radar chip and the microstrip line, and the outer cover is assembled outside the inner cover and covers the window accordingly.

6. The millimeter wave radar antenna module according to claim 5, characterized in that: A first clamping portion is provided on the outer side wall of the inner cover, and a second clamping portion is provided on the inner side wall of the outer cover. The first clamping portion and the second clamping portion are mutually clamped to fix the outer cover on the inner cover.

7. The millimeter wave radar antenna module according to claim 6, characterized in that: The side wall of the outer cover is provided with a deformation groove which is elastically engaged with the first engaging portion.

8. The millimeter wave radar antenna module according to claim 6 or 7, characterized in that: The first clamping portion is a clamping hole, and the second clamping portion is a clamping protrusion embedded in the clamping hole; or, the first clamping portion is a clamping protrusion, and the second clamping portion is a clamping hole for the clamping protrusion to be embedded in it.

9. The millimeter wave radar antenna module according to claim 5, characterized in that: The millimeter wave radar antenna module also includes a heat conductive block, and two opposite side surfaces of the heat conductive block are respectively attached to the outer surface of the radar chip and the inner wall of the outer cover.

10. The millimeter wave radar antenna module according to claim 1, characterized in that: The peripheral edge of the opening of the shielding cover is folded outward to form a folded edge, and the shielding cover is sealed and bonded to the connecting ring via the folded edge.

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