Chip capacitor packaging processing equipment

Abstract

The utility model relates to the field of chip capacitor processing, in particular to chip capacitor packaging processing equipment which is fixedly mounted on a processing table through a support frame, a hydraulic lifting arm is fixedly mounted on the support frame, a suction cup is fixedly mounted on the hydraulic lifting arm, a sliding groove is formed in the processing table, and a limiting block is slidably mounted on the processing table and located in the sliding groove. The adjusting plate is installed on the limiting block through the driving assembly, the fixing cylinders are fixedly installed on the adjusting plate, vertical grooves are formed in the sides, close to the fixing cylinders, of the adjusting plate, the I-shaped block is installed on the adjusting plate in a sliding mode and penetrates through the vertical grooves, and the driving assembly drives the fixing cylinders on the two sides to move oppositely. According to the processing equipment, the adjusting plates on the two sides are driven by the fixing cylinder to move oppositely on the processing table through cooperation of the limiting blocks and the sliding grooves, the bonding pads are limited through cooperation of the adjusting plates and the I-shaped blocks, the horizontal adjusting effect on the adjusting plates is achieved, and then the processing equipment can be suitable for various bonding pads of different sizes.

Description

Technical Field

[0001] The utility model relates to the field of chip capacitor processing, in particular to chip capacitor packaging processing equipment. Background Art

[0002] Conventional chip capacitor packaging processing equipment is prone to damage the pads when soldering the chip capacitors to the pads.

[0003] The existing patent CN213342862U is a chip capacitor packaging and processing equipment. The chip capacitor can be welded to the pad through the operating arm. The turntable is rotated to rotate the threaded rod. Because the threads on the threaded rod are opposite, the slider on the surface slides left and right to lift the buffer plate up and down. The buffer plate is provided with a buffer spring and a T-shaped plate, which can buffer the pad on the top to prevent it from being damaged. The block and the plate spring are convenient for fixing the pad to prevent it from moving.

[0004] However, in the process of using a chip capacitor packaging processing equipment according to an existing patent, since the sizes of pads of different specifications are also different, and the fixed axis of the processing equipment is connected to the T-plate in a fixed manner, it is impossible to adjust the horizontal direction according to the size of the pad. Utility Model Content

[0005] The purpose of the utility model is to provide a chip capacitor packaging processing equipment, aiming to solve the problem that the sizes of pads of different specifications are also different, and the fixed axis of the processing equipment is connected to the T-plate in a fixed manner, which makes it impossible to adjust the horizontal direction according to the size of the pad.

[0006] To achieve the above-mentioned purpose, the utility model provides a chip capacitor packaging processing equipment, including a processing table, a support frame, a hydraulic lifting arm and a suction cup, the support frame is fixedly installed on the processing table, the hydraulic lifting arm is fixedly installed on the support frame, the suction cup is fixedly installed on the hydraulic lifting arm, and also includes an adjustment device, the adjustment device includes an adjustment plate, a fixed cylinder, a limit block, an I-block and a drive assembly, the processing table is provided with a slide groove, the limit block is slidably installed on the processing table and is located in the slide groove, the adjustment plate is installed on the limit block through the drive assembly, the fixed cylinder is fixedly installed on the adjustment plate, the adjustment plate is provided with a vertical groove on the side close to the fixed cylinder, the I-block is slidably installed on the adjustment plate and passes through the vertical groove.

[0007] Wherein, the driving assembly includes a threaded rod, a rotating wheel, a fixed plate and a limiting member, the fixed plate is fixedly installed on the processing table; the threaded rod is threadedly connected to the fixed plate, and the threaded rod is rotationally connected to the fixed cylinder; the rotating wheel is fixedly installed on the threaded rod; the limiting member is installed on the processing table.

[0008] Wherein, the limiting component includes a fixing frame and a limiting bolt, the fixing frame is fixedly installed on the processing table and close to the threaded rod; the limiting bolt is threadedly connected to the fixing frame.

[0009] Wherein, the adjusting device further comprises a buffer block, and the buffer block is fixedly mounted on the I-shaped block.

[0010] Among them, the adjustment device also includes a buffer assembly, which includes a buffer spring, a vertical rod and a horizontal plate, the horizontal plate is fixedly mounted on the adjustment plate and is located on the side of the adjustment plate close to the I-block; the vertical rod is fixedly mounted on the horizontal plate; the buffer spring is sleeved on the vertical rod, and the two ends of the buffer spring are respectively fixedly connected to the horizontal plate and the I-block.

[0011] The utility model discloses a chip capacitor packaging processing equipment. When in use, the chip capacitor to be welded is sucked by the suction cup, and then the rotating wheel is rotated to drive the threaded rod to rotate, the threaded rod is threadedly connected to the fixed plate, and the rotation of the threaded rod drives the threaded rod to move on the fixed plate through the threaded connection, and the end of the threaded rod away from the rotating wheel is rotatably connected to the fixed cylinder, and the fixed cylinder is fixedly connected to the adjustment plate, and the adjustment plate is slidably installed on the processing table through the limit block, and the movement of the threaded rod drives the fixed cylinder to move, and the movement of the fixed cylinder drives the The adjusting plate moves on the processing table, and the adjusting plates on both sides are moved toward each other to suitable positions according to the size of the welding pad, and then the welding pad is placed on the I-blocks on both sides, and then the adjusting plates on both sides are driven to abut against the sides of the welding pad by the driving assembly again, and then the limiting bolt is rotated to move the limiting bolt downward and limit the threaded rod, and the hydraulic lifting arm is started to drive the chip capacitor close to the welding pad through the suction cup, and the chip capacitor is welded to the welding pad through the welding equipment, thereby realizing the horizontal adjustment effect of the adjusting plate, and thus the processing equipment can be suitable for welding pads of various sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0013] Figure 1 It is a schematic diagram of the overall structure of a chip capacitor packaging and processing equipment according to the first embodiment of the utility model.

[0014] Figure 2 It is a schematic diagram of the connection between the limit block and the processing table of the first embodiment of the utility model.

[0015] Figure 3 It is a schematic diagram of the overall structure of a chip capacitor packaging and processing equipment according to the second embodiment of the utility model.

[0016] In the figure: 101-processing table, 102-support frame, 103-hydraulic lifting arm, 104-suction cup, 105-adjusting plate, 106-fixed cylinder, 107-limiting block, 108-I-block, 109-slide, 110-vertical groove, 111-threaded rod, 112-rotating wheel, 113-fixed plate, 114-fixed frame, 115-limiting bolt, 116-buffer block, 201-buffer spring, 202-vertical pole, 203-horizontal plate. DETAILED DESCRIPTION

[0017] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0018] See also Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of the overall structure of a chip capacitor packaging and processing device according to the first embodiment of the utility model. Figure 2It is a connection diagram of the limit block and the processing table of the first embodiment of the utility model. The utility model provides a chip capacitor packaging processing equipment: including a processing table 101, a support frame 102, a hydraulic lifting arm 103 and a suction cup 104, and also includes an adjustment device, the adjustment device includes an adjustment plate 105, a fixed cylinder 106, a limit block 107, an I-block 108 and a driving assembly, the driving assembly includes a threaded rod 111, a rotating wheel 112, a fixed plate 113 and a limit member, the limit member includes a fixed frame 114 and a limit bolt 115, and the adjustment device also includes a buffer block 116. The above-mentioned solution solves the problem that the sizes of pads of different specifications are also different, and the fixed axis of the processing equipment is connected to the T-plate in a fixed manner, which leads to the problem that the horizontal direction cannot be adjusted according to the size of the pad. It can be understood that this solution can also be used to solve the problem of pad buffering.

[0019] In this embodiment, the driving assembly drives the adjustment plate 105 to move on the processing table 101 through the cooperation of the fixed cylinder 106 and the limit block 107, thereby achieving a horizontal adjustment effect on the adjustment plate 105, and further enabling the processing equipment to be suitable for a variety of pads of different sizes.

[0020] Among them, the processing table 101 is provided with a slide groove 109, the limit block 107 is slidably installed on the processing table 101 and is located in the slide groove 109, the adjustment plate 105 is installed on the limit block 107 through the driving assembly, the fixed cylinder 106 is fixedly installed on the adjustment plate 105, and the side of the adjustment plate 105 close to the fixed cylinder 106 is provided with a vertical groove 110, the I-shaped block 108 is slidably installed on the adjustment plate 105 and passes through the vertical groove 110, the number of the adjustment device is two groups, the two groups of the adjustment device are symmetrically distributed along the center line of the processing table 101, and each group of the adjustment device is provided with two The two limit blocks 107 are respectively located on both sides of the adjustment plate 105, the fixed cylinder 106 is welded on the adjustment plate 105, the cross-section of the I-block 108 is I-shaped, and the driving component enables the fixed cylinder 106 to have a better movement effect. The driving component drives the fixed cylinder 106 to move, and the movement of the fixed cylinder 106 drives the adjustment plate 105 and the I-block 108 to move on the processing table 101 through the limit blocks 107, thereby realizing the horizontal adjustment effect of the adjustment plate 105, and thus the processing equipment can be suitable for a variety of pads of different sizes.

[0021] Secondly, the fixing plate 113 is fixedly mounted on the processing table 101; the threaded rod 111 is threadedly connected to the fixing plate 113, and the threaded rod 111 is rotatably connected to the fixing cylinder 106; the rotating wheel 112 is fixedly mounted on the threaded rod 111; the limiting member is mounted on the processing table 101, the fixing plate 113 is a plate-shaped structure, the rotating wheel 112 is welded on the threaded rod 111, the axis of the rotating wheel 112 coincides with the axis of the threaded rod 111, and the limiting member enables the threaded rod 111 to have a better limiting effect, and the threaded rod 111 is driven to rotate by rotating the rotating wheel 112, and the rotation of the threaded rod 111 drives the threaded rod 111 to move on the fixing plate 113 through the threaded connection, and the movement of the threaded rod 111 drives the fixing cylinder 106 to move, thereby achieving the movement effect of the fixing cylinder 106.

[0022] Again, the fixing frame 114 is fixedly installed on the processing table 101 and is close to the threaded rod 111; the limiting bolt 115 is threadedly connected to the fixing frame 114, and a threaded hole is provided on the fixing frame 114. The limiting bolt 115 passes through the fixing frame 114. The limiting bolt 115 is moved downward by rotating the limiting bolt 115 until one end of the limiting bolt 115 abuts against the threaded rod 111, thereby achieving a limiting effect on the threaded rod 111.

[0023] Finally, the buffer block 116 is fixedly installed on the I-shaped block 108. The buffer block 116 is made of sponge material. The setting of the buffer block 116 can prevent the I-shaped block 108 from directly contacting the pad and causing damage to the pad.

[0024] In this embodiment, when in use, the chip capacitor to be welded is sucked by the suction cup 104, and then the rotating wheel 112 is rotated to drive the threaded rod 111 to rotate, and the threaded rod 111 is threadedly connected to the fixed plate 113. The rotation of the threaded rod 111 drives the threaded rod 111 to move on the fixed plate 113 through the threaded connection, and the end of the threaded rod 111 away from the rotating wheel 112 is rotationally connected to the fixed cylinder 106, and the fixed cylinder 106 is fixedly connected to the adjustment plate 105, and the adjustment plate 105 is slidably installed on the processing table 101 through the limit block 107. The movement of the threaded rod 111 drives the fixed cylinder 106 to move, and the movement of the fixed cylinder 106 is driven by the limit block 107 drives the adjustment plate 105 to move on the processing table 101, and according to the size of the pad, the adjustment plates 105 on both sides are moved toward each other to suitable positions, and then the pad is placed on the I-blocks 108 on both sides, and then the adjustment plates 105 on both sides are driven by the driving assembly to abut against the side of the pad, and then the limiting bolt 115 is rotated to move the limiting bolt 115 downward and limit the threaded rod 111, and the hydraulic lifting arm 103 is started to drive the chip capacitor close to the pad through the suction cup 104, and the chip capacitor is welded to the pad through the welding equipment, thereby achieving the horizontal adjustment effect of the adjustment plate 105, so that the processing equipment can be suitable for pads of various sizes.

[0025] The second embodiment of the present application is:

[0026] See also Figure 3 ,in Figure 3 It is a schematic diagram of the overall structure of a chip capacitor packaging and processing equipment of the second embodiment of the utility model. On the basis of the first embodiment, the chip capacitor packaging and processing equipment of this embodiment also includes a buffer component, and the buffer component includes a buffer spring 201, a vertical rod 202 and a horizontal plate 203.

[0027] In this embodiment, the I-shaped block 108 and the buffer spring 201 cooperate with each other to achieve a buffering effect on the pad, thereby preventing the pad from being damaged.

[0028] Among them, the cross plate 203 is fixedly installed on the adjustment plate 105 and is located on the side of the adjustment plate 105 close to the I-block 108; the vertical pole 202 is fixedly installed on the cross plate 203; the buffer spring 201 is sleeved on the vertical pole 202, and the two ends of the buffer spring 201 are respectively fixedly connected to the cross plate 203 and the I-block 108, the cross plate 203 is welded on the adjustment plate 105, and the axis of the vertical pole 202 coincides with the axis of the buffer spring 201. When the hydraulic lifting arm 103 drives the suction cup 104 and the chip capacitor to push downward, the pad moves downward through the I-block 108, the buffer spring 201 is subjected to pressure, and generates a reverse thrust on the I-block 108, thereby achieving a buffering effect on the pad and avoiding damage to the pad.

[0029] In this embodiment, when the hydraulic lifting arm 103 drives the suction cup 104 and the chip capacitor downward, the pad moves downward through the I-block 108. The I-block 108 is fixedly connected to one end of the buffer spring 201. The buffer spring 201 is subjected to pressure and generates a reverse thrust on the I-block 108, thereby achieving a buffering effect on the pad and avoiding damage to the pad.

[0030] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Ordinary technicians in this field can understand that all or part of the processes of the above embodiment and equivalent changes made according to the claims of the present invention still fall within the scope covered by the utility model.

Claims

1. A chip capacitor packaging processing equipment, comprising a processing table, a support frame, a hydraulic lifting arm and a suction cup, wherein the support frame is fixedly mounted on the processing table, the hydraulic lifting arm is fixedly mounted on the support frame, and the suction cup is fixedly mounted on the hydraulic lifting arm, characterized in that: Also includes an adjustment device; The adjusting device comprises an adjusting plate, a fixed cylinder, a limit block, an I-block and a driving assembly. A slide groove is provided on the processing table. The limit block is slidably mounted on the processing table and is located in the slide groove. The adjusting plate is mounted on the limit block through the driving assembly. The fixed cylinder is fixedly mounted on the adjusting plate. A vertical groove is provided on one side of the adjusting plate close to the fixed cylinder. The I-block is slidably mounted on the adjusting plate and passes through the vertical groove.

2. The chip capacitor packaging processing equipment according to claim 1, characterized in that: The driving assembly includes a threaded rod, a rotating wheel, a fixed plate and a limiting member. The fixed plate is fixedly mounted on the processing table; the threaded rod is threadedly connected to the fixed plate, and the threaded rod is rotationally connected to the fixed cylinder; the rotating wheel is fixedly mounted on the threaded rod; and the limiting member is mounted on the processing table.

3. The chip capacitor packaging processing equipment according to claim 2, characterized in that: The limiting component includes a fixing frame and a limiting bolt. The fixing frame is fixedly installed on the processing table and is close to the threaded rod. The limiting bolt is threadedly connected to the fixing frame.

4. The chip capacitor packaging processing equipment according to claim 1, characterized in that: The adjusting device further comprises a buffer block, and the buffer block is fixedly mounted on the I-shaped block.

5. The chip capacitor packaging processing equipment according to claim 1, characterized in that: The adjustment device also includes a buffer assembly, which includes a buffer spring, a vertical rod and a horizontal plate. The horizontal plate is fixedly mounted on the adjustment plate and is located on a side of the adjustment plate close to the I-block; the vertical rod is fixedly mounted on the horizontal plate; the buffer spring is sleeved on the vertical rod, and both ends of the buffer spring are fixedly connected to the horizontal plate and the I-block respectively.

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