Single-chip microcomputer controller

Abstract

The utility model provides a single-chip microcomputer controller, which comprises a shell assembly and a modularized mechanism, and is characterized in that the shell assembly comprises a controller shell, a cover plate and a through groove; wherein the cover plate is installed on the upper surface of the controller shell, the through groove is formed in one side of the controller shell, the modular mechanism is installed in the controller shell, and the modular mechanism comprises an interface integration module, a single-chip microcomputer controller module, a heat dissipation module and a temperature control module; according to the utility model, the medium in the water supply mechanism is cooled through the refrigeration mechanism, and then the cooled medium is conveyed into the heat exchange mechanism through the water supply mechanism, so that heat in the controller is absorbed by the heat exchange mechanism through the medium, and the heat-absorbed medium is guided back into the water supply mechanism; therefore, heat can be directly discharged out of the controller through the refrigeration mechanism, dust particles are prevented from entering the controller, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to a controller, in particular to a single chip microcomputer controller, belonging to the technical field of controllers. Background Art

[0002] A microcontroller controller is an integrated circuit that integrates the core functions of a microprocessor, usually including a central processing unit (CPU), memory, and programmable input and output ports (I / O). This device is often used in embedded systems to control the operation of various electronic devices or machines. Microcontroller controllers have the characteristics of high integration, cost-effectiveness, low power consumption, flexible programming, and good stability;

[0003] Patent document CN219042367U discloses a single-chip microcomputer controller, including a box body and a single-chip microcomputer controller body, a connection frame is provided on one side of the box body, and a cooling fan is provided on the other side, characterized in that: a mounting plate is hinged inside the box body, and the single-chip microcomputer controller body is provided on the mounting plate; a support plate is provided at the bottom of the mounting plate, and the support plate is connected to a motor installed on the box body through a lead screw; and a brush plate is provided above the mounting plate. The blowing above the surface of the single-chip microcomputer controller body is increased and the contact with the electrical parts on part of the single-chip microcomputer controller body is increased, and the brush on the brush plate is used to absorb the floating objects near the single-chip microcomputer controller body, so that the single-chip microcomputer controller has a better ventilation effect when in use, and at the same time, when the floating objects are too heavy, the blowing effect is increased and the brush is used to absorb the floating objects near the single-chip microcomputer controller body.

[0004] However, although the single-chip microcomputer controller has added a blowing function to prevent floating objects from entering its interior, its heat dissipation method is the same as that of the traditional controller. Tiny particles can still pass through the filter and enter its interior. Its heat dissipation efficiency is low, and its internal structure is too dispersed, which is not conducive to production assembly and later maintenance. Therefore, a single-chip microcomputer controller is proposed. Utility Model Content

[0005] In view of this, the utility model provides a single chip microcomputer controller to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial choice.

[0006] The technical solution of the embodiment of the utility model is implemented as follows: a single-chip microcomputer controller includes a housing component and a modular mechanism, wherein the housing component includes a controller housing, a cover plate and a through slot;

[0007] Wherein, the cover plate is installed on the upper surface of the controller housing, the through slot is opened on one side of the controller housing, the modular mechanism is installed inside the controller housing, and the modular mechanism includes an interface integration module, a single-chip controller module, a heat dissipation module and a temperature control module; the interface integration module is installed on the inner side wall of the through slot, the single-chip controller module is installed on the bottom of the inner side wall of the controller housing, the heat dissipation module is installed on one side of the inner side wall of the controller housing, and the temperature control module is installed on the upper surface of the single-chip controller module;

[0008] Wherein, the heat dissipation module further includes a heat exchange mechanism, a water supply mechanism and a refrigeration mechanism; the heat exchange mechanism is fixedly connected to one side of the water supply mechanism and is arranged above the single-chip controller module, and the refrigeration mechanism is installed on one side of the water supply mechanism;

[0009] Wherein, the refrigeration mechanism is used to cool down the medium in the water supply mechanism;

[0010] Wherein, the water supply mechanism is used to transport the medium to the interior of the heat exchange mechanism for circulation;

[0011] Wherein, the heat exchange mechanism is used to absorb the heat inside the controller housing by using a medium.

[0012] Further preferably, the heat exchange mechanism comprises a heat-conducting silica gel block and a heat exchange tube;

[0013] Wherein, the heat exchange tube is fixedly connected to the inside of the heat-conducting silica gel block.

[0014] Further preferably, the water supply mechanism includes a storage box, a water collection tank, a micro-circulation pump and a water supply pipe;

[0015] The storage box is installed on one side of the inner wall of the controller housing, the thermal conductive silicone block is fixedly connected to one side of the storage box, the water collecting bin is fixedly connected to one side of the inner wall of the storage box, the micro-circulation pump is installed on the other side of the inner wall of the storage box, and the water inlet of the micro-circulation pump is connected to the bottom of the outer wall of the water collecting bin.

[0016] Further preferably, one end of the water supply pipe is connected to the drain port of the micro-circulation pump, the other end of the micro-circulation pump passes through the storage box and is connected to one end of the heat exchange tube, and the other end of the heat exchange tube passes through the storage box and is connected to the interior of the water collection bin.

[0017] Further preferably, the refrigeration mechanism includes a heat exchange plate, two pipe sleeves, two semiconductor refrigeration sheets, two heat conduction blocks and two fans;

[0018] Among them, the heat exchange plate is fixedly connected to one side of the inner wall of the water collecting bin, the two pipe sleeves pass through the storage box and are fixedly connected to one side of the heat exchange plate, the two semiconductor refrigeration plates are respectively installed on one side of the inner wall of the two pipe sleeves, the two heat conductive blocks are respectively fixedly connected to the middle of the inner wall of the two pipe sleeves, the two fans are respectively installed at one end of the two pipe sleeves, the cold ends of the two semiconductor refrigeration plates are both bonded to one side of the heat exchange plate, and the hot ends of the two semiconductor refrigeration plates are both bonded to one side of the heat conductive block.

[0019] Further preferably, a filter plate is fixedly connected to one side of the inner side wall of the controller housing.

[0020] Further preferably, a plurality of first cables are connected between the interface integration module and the single-chip controller module, and a second cable is connected between the storage box and the temperature control module.

[0021] Further preferably, the electrical output end of the temperature control module is electrically connected to the electrical input ends of the semiconductor refrigeration sheet, the fan and the micro-circulation pump through a second row of wires.

[0022] The embodiment of the utility model has the following advantages due to the adoption of the above technical solution:

[0023] 1. The utility model modularizes the internal structure of the single-chip microcomputer controller so that different modules can be directly assembled during production, thereby improving production efficiency and facilitating later maintenance.

[0024] 2. The utility model cools down the medium in the water supply mechanism through the refrigeration mechanism, and then transports the cooled medium to the inside of the heat exchange mechanism through the water supply mechanism, so that the heat in the controller is absorbed by the medium through the heat exchange mechanism, and the medium after absorbing heat is guided back to the inside of the water supply mechanism, so that the heat is directly discharged to the outside of the controller by the refrigeration mechanism, thereby avoiding dust particles from entering the inside of the controller and improving the heat dissipation efficiency.

[0025] The above summary is for the purpose of description only and is not limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a structural diagram of the utility model;

[0028] Figure 2 This is a schematic diagram of the internal structure of the controller housing of the utility model;

[0029] Figure 3 It is a cross-sectional structural schematic diagram of the utility model;

[0030] Figure 4 This is a schematic diagram of the cross-sectional structure of the thermally conductive silica gel block of the utility model;

[0031] Figure 5 For this utility model Figure 4 A schematic diagram of the enlarged structure of region A;

[0032] Figure 6 It is a schematic cross-sectional structural diagram of the controller housing of the utility model.

[0033] Figure numerals: 1. Shell assembly; 2. Modular mechanism; 3. Heat exchange mechanism; 4. Water supply mechanism; 5. Refrigeration mechanism; 101. Controller shell; 102. Cover plate; 103. Through groove; 201. Interface integration module; 202. Single chip controller module; 203. Heat dissipation module; 204. Temperature control module; 301. Thermal conductive silicone block; 302. Heat exchange tube; 401. Storage box; 402. Water collection bin; 403. Micro circulation pump; 404. Water supply pipe; 501. Heat exchange plate; 502. Pipe sleeve; 503. Semiconductor refrigeration plate; 504. Thermal block; 505. Fan; 61. Filter plate; 62. First row of wires; 63. Second row of wires. DETAILED DESCRIPTION

[0034] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0035] It should be noted that the terms "first", "second", "symmetrical", "array", etc. are only used to distinguish between description and position description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the definition of "first", "symmetrical", etc. can explicitly or implicitly include one or more of these features; similarly, when the number of certain features is not limited in the form of words such as "two" or "three", it should be noted that this feature also explicitly or implicitly includes one or more feature quantities.

[0036] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0037] like Figure 1-6 As shown, the embodiment of the utility model provides a single-chip microcomputer controller, including a housing component 1 and a modular mechanism 2, wherein the housing component 1 includes a controller housing 101, a cover plate 102 and a through slot 103;

[0038] Wherein, the cover plate 102 is installed on the upper surface of the controller housing 101, the through slot 103 is opened on one side of the controller housing 101, the modular mechanism 2 is installed inside the controller housing 101, and the modular mechanism 2 includes an interface integration module 201, a single-chip controller module 202, a heat dissipation module 203 and a temperature control module 204; the interface integration module 201 is installed on the inner wall of the through slot 103, the single-chip controller module 202 is installed on the bottom of the inner wall of the controller housing 101, the heat dissipation module 203 is installed on one side of the inner wall of the controller housing 101, the temperature control module 204 is installed on the upper surface of the single-chip controller module 202, and a filter plate 61 is fixedly connected to one side of the inner wall of the controller housing 101;

[0039] The heat dissipation module 203 further includes a heat exchange mechanism 3, a water supply mechanism 4 and a refrigeration mechanism 5; the heat exchange mechanism 3 is fixedly connected to one side of the water supply mechanism 4 and is arranged above the single-chip controller module 202, and the refrigeration mechanism 5 is installed on one side of the water supply mechanism 4;

[0040] The refrigeration mechanism 5 is used to cool the medium in the water supply mechanism 4;

[0041] The water supply mechanism 4 is used to transport the medium to the interior of the heat exchange mechanism 3 for circulation;

[0042] The heat exchange mechanism 3 is used to absorb the heat inside the controller housing 101 by using a medium.

[0043] In one embodiment, the heat exchange mechanism 3 includes a heat conductive silica gel block 301 and a heat exchange tube 302;

[0044] The heat exchange tube 302 is fixedly connected to the inside of the heat-conducting silica gel block 301;

[0045] The heat in the controller housing 101 is absorbed by the medium through the heat exchange tube 302 and the heat conductive silica gel block 301 .

[0046] In one embodiment, the water supply mechanism 4 includes a storage box 401, a water collection bin 402, a micro-circulation pump 403 and a water supply pipe 404;

[0047] The storage box 401 is installed on one side of the inner wall of the controller housing 101, the heat-conducting silicone block 301 is fixedly connected to one side of the storage box 401, the water collecting bin 402 is fixedly connected to one side of the inner wall of the storage box 401, and the micro-circulation pump 403 is installed on the other side of the inner wall of the storage box 401. The water inlet of the micro-circulation pump 403 is connected to the bottom of the outer wall of the water collecting bin 402, one end of the water supply pipe 404 is connected to the drain outlet of the micro-circulation pump 403, the other end of the micro-circulation pump 403 passes through the storage box 401 and is connected to one end of the heat exchange tube 302, and the other end of the heat exchange tube 302 passes through the storage box 401 and is connected to the inside of the water collecting bin 402;

[0048] The medium in the water collection tank 402 is pumped out by the micro-circulation pump 403 and discharged into the interior of the heat exchange tube 302 through the water supply pipe 404 .

[0049] In one embodiment, the refrigeration mechanism 5 includes a heat exchange plate 501, two pipe sleeves 502, two semiconductor refrigeration sheets 503, two heat conduction blocks 504 and two fans 505;

[0050] The heat exchange plate 501 is fixedly connected to one side of the inner wall of the water collection bin 402, the two pipe sleeves 502 penetrate the storage box 401 and are fixedly connected to one side of the heat exchange plate 501, the two semiconductor cooling sheets 503 are respectively installed on one side of the inner wall of the two pipe sleeves 502, the two heat conducting blocks 504 are respectively fixedly connected to the middle of the inner wall of the two pipe sleeves 502, the two fans 505 are respectively installed on one end of the two pipe sleeves 502, the cold ends of the two semiconductor cooling sheets 503 are both bonded to one side of the heat exchange plate 501, and the hot ends of the two semiconductor cooling sheets 503 are both bonded to one side of the heat conducting block 504;

[0051] The heat of the medium is absorbed by the heat exchange plate 501 at the cold end of the semiconductor refrigeration plate 503 so as to absorb heat and cool the medium. Then, the heat of the hot end of the semiconductor refrigeration plate 503 is absorbed by the heat conductive block 504, and then the fan 505 is used to dissipate the heat of the heat conductive block 504.

[0052] In one embodiment, a plurality of first cables 62 are connected between the interface integration module 201 and the single-chip controller module 202, a second cable 63 is connected between the storage box 401 and the temperature control module 204, and the electrical output end of the temperature control module 204 is electrically connected to the electrical input end of the semiconductor cooling sheet 503, the fan 505 and the micro-circulation pump 403 through the second cable 63;

[0053] The temperature control module 204 is connected to the semiconductor cooling chip 503 , the fan 505 and the micro-circulation pump 403 by using the second wiring 63 , so that the semiconductor cooling chip 503 , the fan 505 and the micro-circulation pump 403 can be controlled by the temperature control module 204 .

[0054] During operation of the utility model: when the single-chip microcomputer controller needs to be assembled, the interface integrated module 201 is inserted into the through slot 103 and fixed by moving it, and then the single-chip microcomputer controller module 202 is installed and fixed at the bottom of the inner wall of the controller housing 101, and then the first row of wires 62 are used to connect the interface integrated module 201 and the single-chip microcomputer controller module 202, and then the heat dissipation module 203 is installed into one side of the inner wall of the controller housing 101 and fixed, and then the second row of wires 63 are used to connect the heat dissipation module 203 and the temperature control module 204 on the single-chip microcomputer controller module 202, and then the cover plate 102 is fixed on the controller housing 101, and the assembly operation can be completed, thereby modularizing the internal structure of the single-chip microcomputer controller to make it easier to assemble, produce and overhaul in the later stage.

[0055] When the single-chip controller is in use, the temperature inside the controller housing 101 is detected through the temperature control module 204. When the temperature data detected by the temperature control module 204 reaches the threshold, the temperature control module 204 uses the relay installed thereon and the second row of wires 63 to start the semiconductor refrigeration sheet 503, the fan 505 and the micro-circulation pump 403. The working micro-circulation pump 403 extracts the medium in the water collection bin 402 and discharges it to the inside of the heat exchange tube 302 through the water supply pipe 404. Then, the heat inside the controller housing 101 is absorbed by the medium through the heat exchange tube 302 in cooperation with the thermal conductive silicone block 301, and then The medium after absorbing heat is discharged to the interior of the water collection bin 402 through the heat exchange tube 302, so that the medium can be recycled, and then the heat of the medium is absorbed by the heat exchange plate 501 through the cold end of the semiconductor refrigeration plate 503, so as to absorb heat and cool the medium, and then the heat of the hot end of the semiconductor refrigeration plate 503 is absorbed by the heat conductive block 504, and then the heat conductive block 504 is dissipated by the fan 505, and the heat dissipation air is discharged to the outside of the single-chip microcomputer controller, thereby effectively preventing dust particles from entering the interior of the controller housing 101 and affecting the operation of the single-chip microcomputer controller module 202, and improving the heat dissipation efficiency.

[0056] When the temperature data detected by the temperature control module 204 is lower than the threshold value, the temperature control module 204 uses the relay and the second row of wires 63 to turn off the semiconductor cooling plate 503, the fan 505 and the micro circulation pump 403.

[0057] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A single-chip microcomputer controller, comprising a housing component (1) and a modular structure (2), characterized in that: The housing assembly (1) comprises a controller housing (101), a cover plate (102) and a through slot (103); The cover plate (102) is mounted on the upper surface of the controller housing (101); the through slot (103) is opened on one side of the controller housing (101); the modular structure (2) is mounted inside the controller housing (101); the modular structure (2) comprises an interface integration module (201), a single-chip controller module (202), a heat dissipation module (203) and a temperature control module (204); the interface integration module (201) is mounted on the inner side wall of the through slot (103); the single-chip controller module (202) is mounted on the bottom of the inner side wall of the controller housing (101); the heat dissipation module (203) is mounted on one side of the inner side wall of the controller housing (101); and the temperature control module (204) is mounted on the upper surface of the single-chip controller module (202); The heat dissipation module (203) further comprises a heat exchange mechanism (3), a water supply mechanism (4) and a refrigeration mechanism (5); the heat exchange mechanism (3) is fixedly connected to one side of the water supply mechanism (4) and is arranged above the single-chip controller module (202); and the refrigeration mechanism (5) is installed on one side of the water supply mechanism (4); Wherein, the refrigeration mechanism (5) is used to cool down the medium in the water supply mechanism (4); The water supply mechanism (4) is used to transport the medium to the interior of the heat exchange mechanism (3) for circulation; The heat exchange mechanism (3) is used to absorb the heat inside the controller housing (101) using a medium.

2. The single chip microcomputer controller according to claim 1, characterized in that: The heat exchange mechanism (3) comprises a heat-conducting silica gel block (301) and a heat exchange tube (302); Wherein, the heat exchange tube (302) is fixedly connected to the inside of the heat-conducting silica gel block (301).

3. The single chip microcomputer controller according to claim 2, characterized in that: The water supply mechanism (4) comprises a storage box (401), a water collection bin (402), a micro-circulation pump (403) and a water supply pipe (404); The storage box (401) is installed on one side of the inner wall of the controller housing (101), the thermal conductive silicone block (301) is fixedly connected to one side of the storage box (401), the water collecting bin (402) is fixedly connected to one side of the inner wall of the storage box (401), the micro-circulation pump (403) is installed on the other side of the inner wall of the storage box (401), and the water inlet of the micro-circulation pump (403) is connected to the bottom of the outer wall of the water collecting bin (402).

4. The single chip microcomputer controller according to claim 3, characterized in that: One end of the water supply pipe (404) is connected to the drain outlet of the micro-circulation pump (403), the other end of the micro-circulation pump (403) passes through the storage box (401) and is connected to one end of the heat exchange tube (302), and the other end of the heat exchange tube (302) passes through the storage box (401) and is connected to the interior of the water collection bin (402).

5. The single chip microcomputer controller according to claim 4, characterized in that: The refrigeration mechanism (5) comprises a heat exchange plate (501), two pipe sleeves (502), two semiconductor refrigeration sheets (503), two heat conduction blocks (504) and two fans (505); The heat exchange plate (501) is fixedly connected to one side of the inner wall of the water collecting bin (402), the two pipe sleeves (502) both penetrate the storage box (401) and are fixedly connected to one side of the heat exchange plate (501), the two semiconductor cooling plates (503) are respectively installed on one side of the inner wall of the two pipe sleeves (502), the two heat conducting blocks (504) are respectively fixedly connected to the middle of the inner wall of the two pipe sleeves (502), the two fans (505) are respectively installed on one end of the two pipe sleeves (502), the cold ends of the two semiconductor cooling plates (503) are both bonded to one side of the heat exchange plate (501), and the hot ends of the two semiconductor cooling plates (503) are both bonded to one side of the heat conducting block (504).

6. The single chip microcomputer controller according to claim 1, characterized in that: A filter plate (61) is fixedly connected to one side of the inner side wall of the controller housing (101).

7. The single chip microcomputer controller according to claim 5, characterized in that: A plurality of first cables (62) are connected between the interface integration module (201) and the single-chip controller module (202), and a second cable (63) is connected between the storage box (401) and the temperature control module (204).

8. The single chip microcomputer controller according to claim 7, characterized in that: The electrical output end of the temperature control module (204) is electrically connected to the electrical input ends of the semiconductor refrigeration sheet (503), the fan (505) and the micro-circulation pump (403) through the second wiring (63).

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