Mobile phone mainboard with dustproof and waterproof functions

Abstract

The utility model relates to the technical field of mobile phone accessories, and discloses a mobile phone mainboard with dustproof and waterproof functions, which comprises a mainboard shell, a placement groove is formed in the top of the mainboard shell, a protection plate is arranged outside the placement groove, a dustproof net is fixedly connected to the top of the protection plate, a sealing groove is formed in the placement groove, and the dustproof net is fixedly connected to the top of the protection plate. A sealing groove is formed in the front end of the mainboard shell, a sealing ring is slidably connected into the sealing groove, a connecting port is formed in the front end of the mainboard shell, a dustproof assembly is arranged in the connecting port and comprises a U-shaped groove and a rubber ring, the U-shaped groove is formed in the connecting port, the rubber ring is arranged on the inner wall of the U-shaped groove, and the U-shaped groove is communicated with the rubber ring. And the exterior of the protection plate is slidably connected to the interior of the placement groove. According to the utility model, dust prevention and water prevention can be carried out on joints of the placing groove, the connecting port and the like, and the influence of dust and water vapor on internal components is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of mobile phone accessories, in particular to a mobile phone mainboard with dustproof and waterproof functions. Background Art

[0002] The mobile phone motherboard with dust and water resistance is the core component of the mobile phone, responsible for controlling and coordinating the various components and functions of the mobile phone. Although the mobile phone motherboard itself does not have direct dust and water resistance, the dust and water resistance of the mobile phone can be enhanced through other designs and components.

[0003] After searching, a Chinese patent document with announcement number CN205029714U discloses a mobile phone motherboard, characterized in that it includes a first circuit board, a second circuit board, a third circuit board, and a fourth circuit board, the structures of the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board are all the same, the first circuit board and the second circuit board are engaged, the third circuit board and the fourth circuit board are engaged, the first circuit board is fixed to the third circuit board, and the second circuit board is fixed to the fourth circuit board; the first circuit board, the second circuit board, the third circuit board, and the fourth circuit board all include a first notch, etc. The mobile phone motherboard of the utility model makes full use of space and saves the panel area.

[0004] The above patent specification embodiment mentions that "the shapes of the first positioning hole 13, the second positioning hole 14, and the fourth positioning hole 16 are all circular, and the shape of the third positioning hole 15 is rectangular, which is convenient for positioning, fully utilizes the space, saves the panel area, and reduces costs." Although the above patent can use the positioning holes for positioning and paneling, the motherboard will be affected by external factors when in use, and dust will enter, affecting the connection and use of various components. Therefore, in response to the above shortcomings, a mobile phone motherboard with dustproof and waterproof functions is proposed. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings existing in the prior art, and to propose a mobile phone motherboard with dustproof and waterproof functions, aiming to improve the problem in the prior art that the motherboard is affected by external factors when in use and dust enters, affecting the connection and use of various components.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A mobile phone motherboard with dustproof and waterproof functions comprises a motherboard shell, a placement groove is provided on the top of the motherboard shell, a protective plate is provided outside the placement groove, a dustproof net is fixedly connected to the top of the protective plate, a sealing groove is provided inside the placement groove, a sealing ring is slidably connected inside the sealing groove, a connecting port is provided at the front end of the motherboard shell, and a dustproof component is provided inside the connecting port.

[0008] Furthermore, the dustproof component includes a U-shaped groove and a rubber ring, the U-shaped groove is opened inside the connecting port, and the rubber ring is arranged on the inner wall of the U-shaped groove.

[0009] Furthermore, the outside of the protective plate is slidably connected to the inside of the placement groove, and the outside of the protective plate is in contact with the outside of the sealing ring.

[0010] Furthermore, a camera is fixedly connected to the top rear side of the mainboard housing, and a plurality of heat sinks are fixedly connected to the top left side of the mainboard housing.

[0011] Furthermore, a shielding cover is fixedly connected to the right side of the heat sink, and a microphone pad is fixedly connected to the top front side of the mainboard housing.

[0012] Furthermore, two slots are provided on the left side of the top of the mainboard housing, and baffles are provided on the tops of the slots.

[0013] The utility model has the following beneficial effects:

[0014] In the utility model, through the mutual cooperation of structures such as the mainboard shell, placement groove, protective plate, dustproof net, sealing groove, sealing ring, connection port, U-shaped groove, rubber ring, camera, heat sink, shielding cover, etc., the connection points such as the placement groove and the connection port can be dustproof and waterproof, reducing the influence of dust and water vapor on internal components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of the mobile phone motherboard with dust and water-proof functions proposed by the utility model;

[0016] Figure 2 This is a schematic diagram of the rubber ring structure of the mobile phone motherboard with dust and water proof functions proposed by the utility model;

[0017] Figure 3 The utility model is a schematic diagram of the structure of the protective plate of the mobile phone mainboard with dust and water proof functions.

[0018] Legend:

[0019] 1. Motherboard shell; 2. Placement slot; 3. Protective plate; 4. Dust net; 5. Sealing slot; 6. Sealing ring; 7. Connector; 8. U-shaped slot; 9. Rubber ring; 10. Camera; 11. Heat sink; 12. Shielding cover; 13. Microphone pad; 14. Position; 15. Baffle. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Reference Figure 1-Figure 2 The utility model provides an embodiment: a mobile phone motherboard with dustproof and waterproof functions, including a motherboard shell 1. First, the motherboard shell 1 is placed in a suitable position. A placement groove 2 is opened on the top of the motherboard shell 1. Then the battery is placed in the placement groove 2. A protective plate 3 is arranged on the outside of the placement groove 2. The outside of the protective plate 3 is slidably connected to the inside of the placement groove 2. Then the protective plate 3 is placed on the top of the placement groove 2 to protect the battery.

[0022] A dustproof net 4 is fixedly connected to the top of the protective plate 3. At the same time, the dustproof net 4 can protect the interior of the placement groove 2 to reduce dust entry and dissipate heat. A sealing groove 5 is opened inside the placement groove 2. A sealing ring 6 is slidably connected inside the sealing groove 5 so that the sealing ring 6 fits tightly with the interior of the sealing groove 5. Then, the sealing ring 6 is placed inside the sealing groove 5. When the battery enters the interior of the placement groove 2, the sealing ring 6 will be squeezed and will also fit tightly with the battery. The outside of the protective plate 3 is in contact with the outside of the sealing ring 6.

[0023] Reference Figure 2-Figure 3 A connection port 7 is provided at the front end of the motherboard housing 1. When the connection line is connected to the connection port 7, the plug will enter the interior of the connection port 7. A dustproof component is provided inside the connection port 7. The dustproof component includes a U-shaped groove 8 and a rubber ring 9, which will squeeze the rubber ring 9 inside the U-shaped groove 8. The U-shaped groove 8 is provided inside the connection port 7. The rubber ring 9 is provided on the inner wall of the U-shaped groove 8, so that the rubber ring 9 fits tightly with the U-shaped groove 8, and at the same time, the gap inside the connection port 7 is reduced to prevent water vapor from entering during use and affecting normal use.

[0024] A camera 10 is fixedly connected to the top rear side of the mainboard housing 1, and the camera 10 can enable the camera to be used normally. A plurality of heat sinks 11 are fixedly connected to the top left side of the mainboard housing 1, and the heat sink 11 also dissipates heat for the mainboard housing 1. The right side of the heat sink 11 is fixedly connected to a shielding cover 12, and the shielding cover 12 can ensure the normal use of the mobile phone signal. A microphone pad 13 is fixedly connected to the top front side of the mainboard housing 1, and the microphone pad 13 can conveniently connect a microphone. Two card positions 14 are provided on the top left side of the mainboard housing 1, and a baffle 15 is provided on the top of the card position 14. The card position 14 and the baffle 15 can connect a storage card, and can prevent dust and water from entering the connection between the placement slot 2 and the connection port 7, thereby reducing the influence of dust and water vapor on internal components.

[0025] Working principle: first place the motherboard housing 1 to a suitable position, then put the sealing ring 6 into the sealing groove 5, and then put the battery into the placement groove 2. When the battery enters the placement groove 2, it will squeeze the sealing ring 6, so that the sealing ring 6 fits tightly with the inside of the sealing groove 5, and also fits tightly with the battery. Then, cover the top of the placement groove 2 with the protective plate 3 to protect the battery. At the same time, the dustproof net 4 can protect the inside of the placement groove 2 to reduce dust entry and dissipate heat. When the connection line is connected to the connection port 7, the plug will enter the inside of the connection port 7, and at the same time, it will squeeze the rubber ring 9 inside the U-shaped groove 8, so that the rubber ring 9 fits tightly with the U-shaped groove 8, and at the same time, the gap inside the connection port 7 is reduced to prevent water vapor from entering during use and affecting normal use. At the same time, the heat sink 11 will also dissipate heat for the motherboard housing 1, the shielding cover 12 can ensure the normal use of the mobile phone signal, the microphone pad 13 can easily connect the microphone, and the storage card is placed in the card position 14. The card position 14 and the baffle 15 can connect the storage card.

[0026] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A mobile phone motherboard with dustproof and waterproof functions, comprising a motherboard housing (1), characterized in that: The top of the mainboard housing (1) is provided with a placement groove (2), the outside of the placement groove (2) is provided with a protective plate (3), the top of the protective plate (3) is fixedly connected with a dustproof net (4), the inside of the placement groove (2) is provided with a sealing groove (5), the inside of the sealing groove (5) is slidably connected with a sealing ring (6), the front end of the mainboard housing (1) is provided with a connecting port (7), and the inside of the connecting port (7) is provided with a dustproof component.

2. The mobile phone motherboard with dustproof and waterproof functions according to claim 1, characterized in that: The dustproof component comprises a U-shaped groove (8) and a rubber ring (9); the U-shaped groove (8) is opened inside the connecting port (7); and the rubber ring (9) is arranged on the inner wall of the U-shaped groove (8).

3. The mobile phone motherboard with dustproof and waterproof functions according to claim 1, characterized in that: The outside of the protective plate (3) is slidably connected to the inside of the placement groove (2), and the outside of the protective plate (3) is in contact with the outside of the sealing ring (6).

4. The mobile phone motherboard with dustproof and waterproof functions according to claim 1, characterized in that: A camera (10) is fixedly connected to the rear side of the top of the mainboard housing (1), and a plurality of heat dissipation plates (11) are fixedly connected to the left side of the top of the mainboard housing (1).

5. The mobile phone motherboard with dustproof and waterproof functions according to claim 4, characterized in that: A shielding cover (12) is fixedly connected to the right side of the heat dissipation plate (11), and a microphone soldering pad (13) is fixedly connected to the top front side of the mainboard housing (1).

6. The mobile phone motherboard with dustproof and waterproof functions according to claim 1, characterized in that: Two latching positions (14) are provided on the left side of the top of the mainboard housing (1), and a baffle (15) is provided on the top of the latching positions (14).

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