Novel combined type high-temperature-resistant wave-absorbing silica gel sheet

Abstract

The utility model provides a novel combined type high-temperature-resistant wave-absorbing silica gel sheet which comprises an outer layer group, a silica gel module is detachably installed on the side portion of the outer layer group through a connecting structure, a containing groove is formed in the middle of the silica gel module, and an adhesive layer is arranged on the periphery of the containing groove. Through the arrangement of the detachable silica gel module, installation can be carried out according to the position of the electronic component, the use is more flexible, heat generated by the electronic component can be rapidly transmitted to the outer layer group and then is discharged, rapid and uniform heat dissipation is realized, and the heat dissipation effect is improved while the shielding effect is ensured.

Description

Technical Field

[0001] The utility model relates to the field of electronic products, in particular to a novel combined high-temperature resistant wave-absorbing silica gel sheet. Background Art

[0002] With the development of science and technology, the speed of electronic product updates and iterations is getting faster and faster, and with it comes an explosion of electronic product functions. However, the more feature-rich the electronic products are, the more complex their internal electronic components are. Electronic components will generate a lot of heat while running efficiently. If this heat is not discharged in time, it will seriously affect the operating efficiency of the electronic components. In addition, many electronic components need to be shielded with a shielding layer, which will seriously affect the heat dissipation of the electronic components.

[0003] Therefore, there is an urgent need for a new type of combined high temperature resistant and microwave absorbing silicone sheet that can solve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a novel combined high temperature resistant wave absorbing silica gel sheet to solve the problems existing in the above-mentioned prior art.

[0005] To achieve the above purpose, the utility model provides the following solutions:

[0006] The utility model provides a novel combined high temperature resistant wave absorbing silicone sheet, comprising an outer layer group, a silicone module is detachably mounted on the side of the outer layer group through a connecting structure, a receiving groove is arranged in the middle of the silicone module, and an adhesive layer is arranged around the receiving groove.

[0007] Preferably, the outer layer group includes a heat conducting layer, a wave absorbing shielding layer, an electromagnetic shielding layer and a heat dissipating layer.

[0008] Preferably, the heat-conducting layer and the heat-dissipating layer are both made of silicone.

[0009] Preferably, a heat transfer strip is provided between the heat conductive layer and the heat dissipation layer.

[0010] Preferably, the outer surface of the heat dissipation layer is provided with a honeycomb pattern.

[0011] Preferably, the connection structure comprises a connection hole opened on the outer layer group and a connection protrusion arranged on the silicone module, and the connection hole cooperates with the connection protrusion.

[0012] Compared with the prior art, the utility model has achieved the following beneficial technical effects:

[0013] The utility model provides a novel combined high-temperature resistant and wave-absorbing silicone sheet, comprising an outer layer group, a silicone module is detachably installed on the side of the outer layer group through a connecting structure, a receiving groove is provided in the middle of the silicone module, and an adhesive layer is provided around the receiving groove; by providing a detachable silicone module, it can be installed according to the position of the electronic component, and the use is more flexible, and the heat generated by the electronic component can be quickly transferred to the outer layer group and then discharged, so as to achieve rapid and uniform heat dissipation, and improve the heat dissipation effect while ensuring the shielding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0015] Figure 1 The utility model provides a novel combined high temperature resistant wave absorbing silica gel sheet structure schematic diagram. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] The utility model aims to provide a novel combined high temperature resistant wave absorbing silica gel sheet to solve the problems existing in the prior art.

[0018] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0019] Embodiment 1:

[0020] This embodiment provides a new type of combined high temperature resistant wave absorbing silica gel sheet, such as Figure 1 As shown, it comprises an outer layer group 1 , a silicone module 3 is detachably mounted on the side of the outer layer group 1 through a connecting structure 2 , a receiving groove 31 is arranged in the middle of the silicone module 3 , and an adhesive layer 32 is arranged around the receiving groove 31 .

[0021] Specifically, the outer layer group 1 includes a heat-conducting layer 11, a wave-absorbing shielding layer 12, an electromagnetic shielding layer 13 and a heat-dissipating layer 14, and the above structures are arranged in sequence.

[0022] Furthermore, the heat-conducting layer 11 and the heat-dissipating layer 14 are both made of silicone rubber, so that they have good heat transfer effect.

[0023] Furthermore, a heat transfer strip 15 is provided between the heat conducting layer 11 and the heat dissipating layer 14 so that heat can be transferred quickly and evenly.

[0024] Furthermore, the outer surface of the heat dissipation layer 14 is provided with a honeycomb pattern, thereby increasing the heat dissipation area.

[0025] Furthermore, the connection structure 2 includes a connection hole 21 opened on the outer layer group 1 and a connection protrusion 22 arranged on the silicone module 3. The connection hole 21 cooperates with the connection protrusion 22 so that the two can be quickly connected.

[0026] The utility model provides a novel combined high-temperature resistant and wave-absorbing silicone sheet, and the method of using the silicone sheet is as follows: a suitable silicone module is selected and installed on an outer layer group, and then the silicone module is adhered to the outside of the electronic component, thereby realizing a shielding function. The heat generated by the electronic component can be quickly transferred to the outer layer group and then discharged, thereby realizing rapid and uniform heat dissipation, and improving the heat dissipation effect while ensuring the shielding effect.

[0027] The utility model uses specific examples to illustrate the principle and implementation of the utility model. The above examples are only used to help understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A new type of combined high temperature resistant microwave absorbing silica gel sheet, characterized by: It comprises an outer layer group, a silicone module is detachably mounted on the side of the outer layer group through a connecting structure, a receiving groove is arranged in the middle of the silicone module, and an adhesive layer is arranged around the receiving groove.

2. The novel combined high temperature resistant wave absorbing silica gel sheet according to claim 1 is characterized in that: The outer layer group includes a heat conducting layer, a wave absorbing shielding layer, an electromagnetic shielding layer and a heat dissipation layer.

3. The novel combined high temperature resistant wave absorbing silica gel sheet according to claim 2 is characterized in that: The heat-conducting layer and the heat-dissipating layer are both made of silicone.

4. The novel combined high temperature resistant wave absorbing silica gel sheet according to claim 3 is characterized in that: A heat transfer strip is arranged between the heat conducting layer and the heat dissipating layer.

5. The novel combined high temperature resistant and microwave absorbing silica gel sheet according to claim 3 is characterized in that: The outer surface of the heat dissipation layer is provided with a honeycomb pattern.

6. The novel combined high temperature resistant wave absorbing silica gel sheet according to claim 1 is characterized in that: The connection structure comprises a connection hole opened on the outer layer group and a connection protrusion arranged on the silicone module, and the connection hole matches with the connection protrusion.

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