Circuit board assembly and electronic equipment

Abstract

The embodiment of the utility model provides a circuit board assembly and electronic equipment, and relates to the technical field of chips, the circuit board assembly comprises a circuit board, an electronic device, a shielding structure and a heat dissipation structure, the electronic device is arranged on the circuit board, the shielding structure is arranged on the circuit board, and a through opening is formed in the position, opposite to the circuit board, of the shielding structure; at least part of the heat dissipation structure covers the through opening, the heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover covers the electronic device. According to the circuit board assembly provided by the invention, when the height of the electronic device is increased, the height of the shielding cover does not need to be increased, the height of the shielding cover is reduced, the occupied space in the electronic equipment is reduced, and further thinning of the electronic equipment is facilitated. The heat dissipation structure is used as a part of the shielding cover, so that the heat dissipation structure can dissipate heat of the electronic device and can also achieve the electromagnetic shielding function of the electronic device, and functional diversification of the heat dissipation structure is achieved.

Description

Technical Field

[0001] The present application relates to the field of chip technology, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the continuous development of communication technology, the performance requirements for electronic equipment are getting higher and higher. The good working performance of electronic devices in electronic equipment is one of the important factors to ensure the high performance of electronic equipment. When working, electronic devices will generate mutual electromagnetic interference, which will affect the working performance of electronic devices and electronic equipment. In addition, the heat dissipation performance of electronic devices will also affect the working performance of electronic devices.

[0003] In the related art, in order to provide shielding for electronic devices, a shielding cover is often provided on a circuit board with electronic devices, a shielding space is formed between the shielding cover and the circuit board, and electronic devices that are more sensitive to electromagnetic interference are provided in the shielding space, thereby improving the anti-interference ability of the electronic devices in the shielding space. In addition, a heat dissipation device is provided on the outside of the shielding cover to dissipate heat for the electronic devices.

[0004] However, since the shielding cover is placed on the electronic device, if the height of the electronic device is relatively large, the height of the shielding cover along the thickness direction of the circuit board will be relatively large. In addition, the thickness of the heat dissipation device will occupy a larger space in the electronic device, thereby restricting further thinning of the electronic device. Utility Model Content

[0005] The embodiments of the present application provide a circuit board assembly and an electronic device, which can solve the technical problem that when the height of the electronic device is large, the height of the shielding cover along the thickness direction of the circuit board is large, and the thickness of the heat dissipation device will occupy a large space in the electronic device, thereby restricting the further thinning of the electronic device.

[0006] The first aspect of the present application provides a circuit board assembly, including a circuit board, an electronic device, a shielding structure and a heat dissipation structure; the electronic device is arranged on the circuit board; the shielding structure is arranged on the circuit board, and a through opening is opened on the shielding structure at a position opposite to the circuit board; the heat dissipation structure at least partially covers the through opening, the heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover is arranged on the electronic device.

[0007] The circuit board assembly provided in the embodiment of the present application includes a circuit board, an electronic device arranged on the circuit board and a shielding structure, a through opening is opened on the shielding structure at a position opposite to the circuit board, at least a portion of the heat dissipation structure covers the through opening, so that the heat dissipation structure and the shielding structure together form a shielding cover to cover the electronic device, so that the part of the structure of the electronic device facing the through opening can extend into the through opening to occupy the height of the through opening in the thickness direction of the circuit board, so that when the height of the electronic device increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, reducing the space occupied by the electronic device, and facilitating further thinning of the electronic device.

[0008] Furthermore, by combining at least part of the heat dissipation structure with the shielding structure to form a shielding cover, the heat dissipation structure can not only dissipate heat for electronic devices, but also form a shielding cover together with the shielding structure to achieve electromagnetic shielding function for the electronic devices, thereby realizing the functional diversification of the heat dissipation structure.

[0009] In a possible implementation, the heat dissipation structure includes a metal shell and a heat dissipation medium disposed in the metal shell, the metal shell at least partially covers the through opening, and the metal shell and the shielding structure form a shielding cover.

[0010] The heat dissipation structure includes a metal shell and a heat dissipation medium disposed in the metal shell. The heat generated by the electronic device when working is transferred to the heat dissipation medium through the metal shell to achieve heat exchange with the heat dissipation medium, thereby dissipating the heat of the electronic device through the heat dissipation structure. Electromagnetic shielding is achieved by covering at least part of the metal shell at the opening.

[0011] In one possible implementation, the heat dissipation structure is a vapor chamber heat sink or a liquid cooling heat sink.

[0012] By setting the heat dissipation structure as a vapor chamber radiator, heat exchange with the electronic device can be achieved through the vapor chamber, and by setting the heat dissipation structure as a liquid cooling radiator, liquid cooling of the electronic device can be achieved through the liquid cooling radiator.

[0013] In a possible implementation, a first gap is provided between the end of the shielding structure facing away from the circuit board and the heat dissipation structure. By providing the first gap between the end of the shielding structure facing away from the circuit board and the heat dissipation structure, a buffer space can be formed between the shielding structure and the heat dissipation structure to prevent the heat dissipation structure from directly contacting the shielding structure when the heat dissipation structure is displaced toward the shielding structure by an external force. The first gap can absorb and disperse the impact energy, slow down the transmission of the impact force, and thus reduce the direct damage of the heat dissipation structure to the shielding structure.

[0014] When the heat dissipation structure is impacted, the spacer will play a certain buffering role, reducing the degree to which the impact force is transmitted to the shielding structure. This can reduce the possibility of damage to the shielding structure and protect the heat dissipation structure from damage. The impact force of the heat dissipation structure on the shielding structure is slowed down, the probability of damage to the shielding structure is reduced, and the stability of the circuit board assembly is improved.

[0015] Furthermore, by setting the first interval, the heat dissipation structure can be prevented from directly contacting the shielding structure, thereby reducing the possibility of heat being conducted to the surface of the shielding structure, which helps prevent the shielding structure from overheating and avoids the thermal impact of the shielding structure on the electronic device or other components on the circuit board.

[0016] By setting a first interval between the heat dissipation structure and the shielding structure, a space for airflow can be provided between the heat dissipation structure and the shielding structure, so that the airflow can flow freely between the heat dissipation structure and the shielding structure, which helps to enhance the heat dissipation effect and improve the heat dissipation efficiency of electronic devices.

[0017] In a possible implementation, the first interval is greater than 0 mm and less than or equal to 0.05 mm.

[0018] By setting the spacing distance of the first interval in the thickness direction of the circuit board to be greater than 0mm and less than or equal to 0.05mm, it can be ensured that a buffer space is formed between the heat dissipation structure and the shielding structure, while also avoiding the problem of poor shielding effect of the shielding cover composed of the heat dissipation structure and the shielding structure due to the first interval being too large.

[0019] In one possible implementation, the heat dissipation structure is connected to the circuit board via a fastener.

[0020] By connecting the heat dissipation structure to the circuit board through fasteners, the stability of the heat dissipation structure on the circuit board can be improved, and the connection stability between the circuit board and the heat dissipation structure can be improved, thereby improving the structural stability of the circuit board assembly.

[0021] In one possible implementation, the circuit board assembly also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding structure, and the other end of the elastic shielding member is pressed against the heat dissipation structure.

[0022] The circuit board assembly includes an elastic shielding part, and the elastic shielding part is arranged on the outer peripheral side of the shielding structure, and the end of the shielding structure facing away from the circuit board is pressed against the heat dissipation structure, so as to close the first gap between the heat dissipation structure and the shielding structure, thereby preventing the electromagnetic waves emitted by the electronic devices in the shielding structure from leaking from the first gap, thereby improving the shielding effect of the shielding cover formed by the shielding structure and the heat dissipation structure.

[0023] In a possible implementation, in the thickness direction of the circuit board, the height of the elastic shielding component is greater than the height of the shielding structure; in the thickness direction of the circuit board, the compression amount of the elastic shielding component is greater than or equal to 40%.

[0024] By making the height of the elastic shielding part greater than the height of the shielding structure, the elastic shielding part can generate a certain amount of compression when the heat dissipation structure and the elastic shielding part are pressed together, and can have a certain elastic restoring force after being pressed, and can press the heat dissipation structure under the action of the elastic restoring force, thereby improving the contact tightness between the heat dissipation structure and the elastic shielding part, and further improving the shielding effect of the shielding cover.

[0025] In a possible implementation manner, there is a second interval between the elastic shielding component and the shielding structure.

[0026] By providing a second interval between the elastic shielding member and the shielding structure, the convenience of disassembly, assembly and maintenance of the elastic shielding member can be facilitated.

[0027] Furthermore, by setting a second interval, the possibility of the elastic shielding part squeezing the shielding structure and causing deformation of the shielding structure due to its tilt toward the shielding structure during the compression deformation process can be avoided, thereby further reducing the possibility of damaging electronic devices or affecting the shielding effect due to deformation of the shielding structure, thereby improving the stability of the circuit board assembly.

[0028] In a possible implementation, the elastic shielding member is an elastic shielding member made of conductive foam.

[0029] By setting the elastic shielding member to be an elastic shielding member made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval, reduce the leakage of electromagnetic waves at the first interval, and improve the anti-interference ability of the electronic device.

[0030] Furthermore, the conductive foam has a certain degree of softness and elasticity, and can provide good cushioning and protection, reducing the impact of vibration and impact on the shielding structure and electronic devices when the heat dissipation structure is impacted.

[0031] In addition, the conductive foam has good thermal conductivity, which is beneficial to the transfer and heat dissipation of heat generated when the electronic device is working, and helps to maintain the working stability of the electronic device.

[0032] Conductive foam has good processability and cuttability, can be customized as needed, and is suitable for assembly requirements of various shapes and sizes. It improves the processing flexibility and practicality of elastic shielding parts and can reduce the manufacturing cost of elastic conductive parts.

[0033] In a possible implementation, the circuit board assembly further includes an insulating layer, which is disposed on a side of the heat dissipation structure facing the electronic device, and at least a portion of the insulating layer covers the through opening.

[0034] The circuit board assembly includes an insulating layer, the insulating layer is arranged on the side of the heat dissipation structure facing the electronic device, and at least a portion of the insulating layer covers the through opening, so as to avoid electrical contact between the heat dissipation structure and the electronic device, thereby improving the working stability of the electronic device.

[0035] In a possible implementation, the insulating layer is a polyethylene terephthalate layer or a polyimide layer.

[0036] By setting the insulating layer as a polyethylene terephthalate layer or a polyimide layer, the insulation effect between the heat dissipation structure and the electronic device can be improved, electrical contact between the heat dissipation structure and the electronic device can be avoided, and the working stability of the electronic device can be improved.

[0037] In a possible implementation, the shielding structure includes a shielding frame having the through opening, the shielding frame is arranged around the outer periphery of the electronic device, the shielding frame is connected to the circuit board, and the heat dissipation structure covers the through opening.

[0038] The shielding structure includes a shielding frame, and the shielding frame is arranged on the outer peripheral side of the electronic device to electromagnetically shield the electronic device on the peripheral side of the electronic device, and electromagnetically shields the electronic device at the opening through a part of the heat dissipation structure.

[0039] In a possible implementation, the shielding frame has a first flange on a side facing the circuit board, the first flange is arranged around the outer periphery of the shielding frame, and the shielding frame is connected to the circuit board via the first flange.

[0040] By providing a first flange surrounding the outer peripheral side of the shielding frame on the side of the shielding frame facing the circuit board and connecting the shielding frame to the circuit board through the first flange, the contact area between the shielding frame and the circuit board can be increased, thereby improving the connection stability between the shielding frame and the circuit board.

[0041] In a possible implementation, a second flange is provided at one end of the shielding frame facing away from the circuit board, and an inner edge of the second flange forms the through opening.

[0042] By arranging a second flange at the end of the shielding frame facing away from the circuit board and forming a through opening through the inner edge of the second flange, the heat dissipation structure can be brought into contact with the shielding frame through the second flange when the heat dissipation structure is impacted toward the shielding structure, thereby increasing the contact area between the heat dissipation structure and the shielding frame, reducing damage to the heat dissipation structure caused by the shielding frame due to too small a contact area between the heat dissipation structure and the shielding frame, and increasing the service life of the heat dissipation structure.

[0043] The second aspect of the present application provides an electronic device, which includes a rear shell and a circuit board assembly as described above; the circuit board assembly is arranged in the rear shell, and the heat dissipation structure in the circuit board assembly is connected to the circuit board in the circuit board assembly through a fastener; or, the heat dissipation structure is connected to the rear shell; or, the heat dissipation structure is connected to both the rear shell and the circuit board.

[0044] The electronic device provided in the embodiment of the present application arranges a circuit board assembly in a rear shell, opens a through opening on the shielding structure of the circuit board assembly at a position opposite to the circuit board, and forms a shielding cover with the heat dissipation structure and the shielding structure in the circuit board assembly to cover the electronic device. When the height of the electronic device is increased, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, which is conducive to the lightweight design of the electronic device.

[0045] Furthermore, by combining at least part of the heat dissipation structure with the shielding structure to form a shielding cover, the heat dissipation structure can not only dissipate heat for electronic devices, but also form a shielding cover together with the shielding structure to achieve electromagnetic shielding function for the electronic devices, thereby realizing the functional diversification of the heat dissipation structure.

[0046] The third aspect of the present application provides an electronic device, including a back shell, a circuit board, an electronic device and a shielding structure; the electronic device is arranged on the circuit board; the shielding structure is arranged on the circuit board, and a through opening is opened on the shielding structure at a position opposite to the circuit board; a part of the back shell covers the through opening, a part of the back shell and the shielding structure form a shielding cover, and the shielding cover is arranged on the electronic device.

[0047] By setting a through opening on the shielding structure at a position opposite to the circuit board so that part of the electronic device can extend into the through opening, when the height of the electronic device is increased, there is no need to increase the height of the shielding cover, and a part of the back shell is used to cover the through opening on the shielding structure, so that a part of the back shell and the shielding structure together form a shielding cover arranged on the electronic device, it is possible to avoid using other shielding parts to cover the through opening, and the distance from the through opening to the back shell can be shortened, thereby further reducing the occupation of the internal space of the electronic device by the circuit board assembly, which is conducive to further thinning of the electronic device.

[0048] In one possible implementation, the circuit board assembly also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding frame, and the other end of the elastic shielding member is pressed against the inner wall of the rear shell.

[0049] By arranging an elastic shielding part on the outer peripheral side of the shielding structure, one end of the elastic shielding part is connected to the circuit board or the shielding frame, and the other end of the elastic shielding part is pressed against the inner wall of the rear shell, it is possible to shield the electromagnetic waves leaking through the gap between the rear shell and the shielding structure through the elastic shielding part, thereby improving the shielding performance of the shielding cover.

[0050] In a possible implementation, in the thickness direction of the circuit board, the height of the elastic shielding component is greater than the height of the shielding structure; in the thickness direction of the circuit board, the compression amount of the elastic shielding component is greater than or equal to 40%.

[0051] By making the height of the elastic shielding part greater than the height of the shielding structure, the elastic shielding part can generate a certain amount of compression when the back shell and the elastic shielding part are pressed together, and can have a certain elastic restoring force after being pressed, and can press the back shell under the action of the elastic restoring force, thereby improving the contact tightness between the back shell and the elastic shielding part, and further improving the shielding effect of the shielding cover.

[0052] In a possible implementation manner, there is a second interval between the elastic shielding member and the shielding frame.

[0053] By providing a second interval between the elastic shielding member and the shielding structure, the convenience of disassembly, assembly and maintenance of the elastic shielding member can be facilitated.

[0054] Furthermore, by setting a second interval, the possibility of the elastic shielding part squeezing the shielding structure and causing deformation of the shielding structure due to its tilt toward the shielding structure during the compression deformation process can be avoided, thereby further reducing the possibility of damaging electronic devices or affecting the shielding effect due to deformation of the shielding structure, thereby improving the stability of electronic equipment use.

[0055] In a possible implementation, the elastic shielding member is an elastic shielding member made of conductive foam.

[0056] By setting the elastic shielding member to be an elastic shielding member made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval, reduce the leakage of electromagnetic waves at the first interval, and improve the anti-interference ability of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0058] Figure 2 An exploded diagram of an electronic device provided in an embodiment of the present application;

[0059] Figure 3 It is a structural schematic diagram of a circuit board assembly in the related art;

[0060] Figure 4A An exploded diagram of a circuit board assembly provided in an embodiment of the present application;

[0061] Figure 4B A schematic cross-sectional view of a circuit board assembly provided in an embodiment of the present application;

[0062] Figure 5 A cross-sectional schematic diagram of a second circuit board assembly provided in an embodiment of the present application;

[0063] Figure 6 A schematic cross-sectional view of a third circuit board assembly provided in an embodiment of the present application;

[0064] Figure 7 A schematic cross-sectional view of a fourth circuit board assembly provided in an embodiment of the present application;

[0065] Figure 8 A schematic cross-sectional view of a fifth circuit board assembly provided in an embodiment of the present application;

[0066] Fig. 9 A schematic cross-sectional view of a sixth circuit board assembly provided in an embodiment of the present application;

[0067] Fig.10 A schematic cross-sectional view of a seventh circuit board assembly provided in an embodiment of the present application.

[0068] Description of reference numerals:

[0069] 10-circuit board assembly; 20-display screen; 30-rear housing; 40-middle frame;

[0070] 100-circuit board; 200-electronic device;

[0071] 300-shielded structure;

[0072] 310-through opening; 320-first interval; 330-second interval; 340-shielding frame; 350-first flange; 360-second flange;

[0073] 400-heat dissipation structure; 410-metal shell;

[0074] 500-fastener; 600-elastic shielding; 700-insulating layer;

[0075] 10a-circuit board assembly; 100a-circuit board; 200a-electronic device; 300a-shielding cover; 400a-heat dissipation device. DETAILED DESCRIPTION

[0076] An embodiment of the present application provides an electronic device, which includes but is not limited to a mobile phone (such as a straight-screen mobile phone or a foldable mobile phone), a tablet computer, a laptop computer, an ultra-mobile personal computer (UMPC), a handheld computer, a walkie-talkie, a netbook, a POS machine, a personal digital assistant (PDA), a wearable device (such as a smart watch, a smart wristband, a pedometer, a virtual reality device, and the like) having a circuit board assembly. Mobile or fixed terminals.

[0077] Among them, in the embodiments of the present application, a mobile phone is taken as an example of the above-mentioned electronic device for description. The mobile phone can be a folding mobile phone, or a straight-bar mobile phone, or a sliding mobile phone. The following is a specific description taking a straight-bar mobile phone as an example.

[0078] Figure 1 A three-dimensional diagram of an electronic device provided in this application, Figure 2 An exploded diagram of an electronic device provided in this application.

[0079] refer to Figure 1 and Figure 2 The electronic device may include a display screen 20, a rear shell 30, a middle frame 40 and a circuit board assembly 10, wherein the middle frame 40 is located between the display screen 20 and the rear shell 30. The rear shell 30 may be made of a metal material, such as aluminum, aluminum alloy or aluminum-magnesium alloy.

[0080] refer to Figure 2 The circuit board assembly 10 can be disposed on the display screen 20 , for example, the circuit board assembly 10 can be disposed on a surface of the display screen 20 facing the rear housing 30 , and the circuit board assembly 10 can also be connected to the rear housing 30 .

[0081] Figure 3 It is a cross-sectional schematic diagram of a circuit board assembly in the related art.

[0082] As electronic devices become thinner and lighter, one of the main factors restricting the thickness of electronic devices is that the thickness of the circuit board assembly 10a is thicker at the location of the electronic device 200a that is more sensitive to electromagnetic interference. The electronic device 200a includes but is not limited to a motherboard system on a chip (SoC). The thickness of the area where the electronic device 200a is located is thicker than other areas, which is not conducive to the overall thinning of the electronic device.

[0083] refer to Figure 3 The main reason for this problem is that in the prior art, the electronic device 200a is arranged on the circuit board 100a, the shielding cover 300a is arranged on the electronic device 200a, and the heat dissipation device 400a is arranged on the side of the shielding cover 300a facing away from the circuit board 100a, and is arranged at a distance from the shielding cover 300a. The shielding cover 300a can be provided to achieve electromagnetic shielding of the electronic device 200a, and the heat dissipation device 400a can be provided to achieve heat dissipation of the electronic device 200a.

[0084] In use Figure 3 When the shielding cover 300a and the heat dissipation device 400a in the prior art are used, as the thickness of the electronic device 200a increases, the height of the shielding cover 300a along the thickness direction also increases accordingly, so as to cover the electronic device 200a with increased thickness. Due to the increase in the thickness of the shielding cover 300a and the thickness of the heat dissipation device 400a, the thickness of the circuit board assembly 10a in the area of ​​the electronic device 200a increases, which will occupy a larger space in the thickness direction of the electronic device, thereby restricting the further thinning of the electronic device.

[0085] refer to Figure 4A and Figure 4B In view of the above technical problems, the present application provides a circuit board assembly 10 and an electronic device, wherein the circuit board assembly 10 comprises a circuit board 100, an electronic device 200, a shielding structure 300 and a heat dissipation structure. The electronic device 200 is disposed on the circuit board 100, the shielding structure 300 is disposed on the circuit board 100, a through opening 310 is provided on the shielding structure 300 at a position opposite to the circuit board 100, the heat dissipation structure at least partially covers the through opening 310, the heat dissipation structure and the shielding structure 300 form a shielding cover, and the shielding cover is disposed on the electronic device 200.

[0086] The circuit board assembly 10 provided in the embodiment of the present application includes a circuit board 100, an electronic device 200 arranged on the circuit board 100, and a shielding structure 300, and a through opening 310 is opened on the shielding structure 300 at a position opposite to the circuit board 100, and at least a portion of the heat dissipation structure covers the through opening 310, so that the heat dissipation structure and the shielding structure 300 together form a shielding cover to cover the electronic device 200, so that the partial structure of the electronic device 200 facing the through opening 310 can extend into the through opening 310 to occupy the height of the through opening 310 in the thickness direction of the circuit board 100, so that when the height of the electronic device 200 increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, reducing the space occupied in the electronic device, and facilitating further thinning of the electronic device.

[0087] Furthermore, by combining at least part of the heat dissipation structure with the shielding structure 300 to form a shielding cover, the heat dissipation structure can not only dissipate heat for the electronic device 200, but can also form a shielding cover together with the shielding structure 300 to achieve electromagnetic shielding function for the electronic device 200, thereby realizing the functional diversification of the heat dissipation structure.

[0088] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application.

[0089] refer to Figure 4A and Figure 4B The present application may provide a circuit board assembly, which may include a circuit board 100, an electronic device 200, a shielding structure 300, and a heat dissipation structure 400. The electronic device 200 is disposed on the circuit board 100, the shielding structure 300 is disposed on the circuit board 100, a through opening 310 is provided on the shielding structure 300 at a position opposite to the circuit board 100, the heat dissipation structure 400 at least partially covers the through opening 310, the heat dissipation structure 400 and the shielding structure 300 form a shielding cover, and the shielding cover is disposed on the electronic device 200. Figure 4B Based on the setting orientation in , the through opening 310 is located above the electronic device 200 set on the circuit board 100.

[0090] A circuit board assembly may include multiple electronic devices 200, some of which are sensitive to electromagnetic interference, which may affect the working performance of the electronic device 200. For example, the electronic device 200 may be a storage device, a central processing unit, or a system on chips (SoC). By providing a shielding cover on such electronic devices 200, the influence of electromagnetic interference on the electronic device 200 can be effectively shielded to ensure the working performance of the electronic device 200.

[0091] Among them, in the shielding cover composed of at least part of the shielding structure 300 and the heat dissipation structure 400, the shielding structure 300 can perform electromagnetic shielding on the surrounding side of the electronic device 200, and the part of the heat dissipation structure 400 covering the opening 310 can shield the electromagnetic waves at the opening 310, thereby shielding the influence of electromagnetic interference on the electronic device 200.

[0092] In some embodiments, the shielding structure 300 may be a shielding structure 300 of a conductive material, such as a conductive ceramic or metal. In a specific implementation, the shielding structure 300 may be a shielding structure 300 of a metal material, and the shielding structure 300 and the circuit board 100 may be connected by welding or conductive adhesive bonding. Compared with the conductive adhesive bonding method, connecting the shielding structure 300 to the circuit board 100 by welding can improve the connection stability between the shielding structure 300 and the circuit board 100, and can improve the electromagnetic shielding capability of the connection between the circuit board 100 and the shielding structure 300, thereby preventing electromagnetic interference from affecting the electronic device 200 covered by the shielding structure 300 through the connection between the circuit board 100 and the shielding structure 300.

[0093] In some embodiments, at least part of the heat dissipation structure 400 covering the opening 310 is a conductive structure, or the side of the heat dissipation structure 400 facing the opening 310 is a conductive structure, or the entire external structure of the heat dissipation structure 400 is a conductive structure, for example, the conductive structure can also be a metal structure.

[0094] In some examples, the metal material used to prepare the heat dissipation structure 400 is the same as the metal material used to prepare the shielding structure 300. The heat dissipation structure 400 can directly cover the through opening 310, and the heat dissipation structure 400 is connected to the area near the through opening 310 on the shielding structure 300. For example, the heat dissipation structure 400 can be connected to the shielding structure 300 through a conductive adhesive. Alternatively, the heat dissipation structure 400 and the shielding structure 300 can be spaced apart to form a certain buffer zone between the heat dissipation structure 400 and the shielding structure 300, so as to prevent the heat dissipation structure 400 from directly squeezing the shielding structure 300 when it is impacted toward the shielding structure 300, thereby reducing the probability of damage to the shielding structure 300.

[0095] In some embodiments, the electronic device 200 can be completely located within the shielding cover, or a portion of the structure of the electronic device 200 can extend into the through opening 310, so that the electronic device 200 can utilize the height of the through opening 310 along the thickness direction of the circuit board 100, thereby enabling the electronic device 200 to utilize the height of the through opening 310 along the thickness direction of the circuit board 100, thereby enabling the height of the shielding structure 300 to be increased without increasing the height of the circuit board 100 when the height of the electronic device 200 does not exceed the height of the through opening 310.

[0096] It should be noted that the size of the through opening 310 is at least sufficient to allow the electronic device 200 to pass through, so that the portion of the electronic device 200 facing the through opening 310 can extend into the through opening 310 .

[0097] In some embodiments, the heat dissipation structure 400 can be connected to the circuit board 100, for example, the heat dissipation structure 400 can be connected to the circuit board 100 through a threaded connector. The heat dissipation structure 400 can also be connected to the rear housing 30 of an electronic device using the circuit board assembly, for example, the heat dissipation structure 400 can be connected to the rear housing 30 by gluing.

[0098] In some embodiments, there is a certain distance between the heat dissipation structure 400 and the electronic device 200 , so as to avoid direct contact between the heat dissipation structure 400 and the electronic device 200 , thereby preventing the heat dissipation structure 400 from damaging the electronic device 200 .

[0099] The circuit board assembly provided in the embodiment of the present application is achieved by opening a through opening 310 at a position on the shielding structure 300 opposite to the circuit board 100, and at least partially covering the heat dissipation structure 400 at the through opening 310, so that the heat dissipation structure 400 and the shielding structure 300 together form a shielding cover to cover the electronic device 200, so that part of the structure of the electronic device 200 can be extended into the through opening 310, so that when the height of the electronic device 200 increases, there is no need to increase the height of the shielding cover, thereby reducing the height of the shielding cover, reducing the space occupied by the electronic device, and facilitating further thinning of the electronic device.

[0100] Furthermore, by combining at least a portion of the heat dissipation structure 400 with the shielding structure 300 to form a shielding cover, the heat dissipation structure 400 can not only dissipate heat for the electronic device 200, but can also form a shielding cover together with the shielding structure 300 to achieve electromagnetic shielding function for the electronic device 200, thereby realizing the functional diversification of the heat dissipation structure 400.

[0101] refer to Figure 5In some embodiments, the heat dissipation structure 400 may include a metal shell 410 and a heat dissipation medium disposed in the metal shell 410. The metal shell 410 at least partially covers the through opening 310. The metal shell 410 and the shielding structure 300 form a shielding cover. The metal shell 410 of the heat dissipation structure 400 has a cavity 420 in it, and the heat dissipation medium can be disposed in the cavity 420.

[0102] The heat dissipation structure 400 may include a metal shell 410 and a heat dissipation medium disposed in the metal shell 410. The heat generated by the electronic device 200 during operation is transferred to the heat dissipation medium through the metal shell 410 to achieve heat exchange with the heat dissipation medium, thereby dissipating the heat of the electronic device 200 through the heat dissipation structure 400.

[0103] By at least partially covering the through opening 310 , at least a portion of the metal shell 410 and the shielding structure 300 form a shielding cover to achieve electromagnetic shielding.

[0104] In some embodiments, the metal shell 410 can be connected to the circuit board 100, or the metal shell 410 can be connected to the rear shell 30 of the electronic device on which the circuit board assembly is installed.

[0105] In one possible implementation, the heat dissipation structure 400 is a vapor chamber heat sink or a liquid cooling heat sink.

[0106] By configuring the heat dissipation structure 400 as a vapor chamber radiator, heat exchange with the electronic device 200 can be achieved through the vapor chamber radiator. By configuring the heat dissipation structure 400 as a liquid cooling radiator, liquid cooling of the electronic device 200 can be achieved through the liquid cooling radiator.

[0107] In one example, the vapor chamber heat sink can use a vapor chamber (VC) heat dissipation technology. The heat dissipation structure 400 may include a vacuum-sealed cavity filled with a working fluid (usually liquid metal or other thermally conductive materials). When a heat source acts on one side of the heat sink, the working fluid evaporates and transfers heat in the vacuum chamber. The vapor condenses into liquid in the cooling area, releases heat, and is conducted to the external environment through the wall of the heat pipe.

[0108] The vacuum chamber vapor chamber heat sink has the advantages of high thermal conductivity, good thermal uniformity, simple structure, high reliability, etc. This heat dissipation technology can help the electronic device 200 maintain a stable operating temperature and improve performance and reliability.

[0109] The liquid cooling radiator can be a liquid cold plate radiator, in which cooling liquid (usually water or other coolant) flows through pipes or channels inside the liquid cold plate. When the heat source acts on the surface of the radiator, the cooling liquid absorbs the heat through the pipes, then takes the heat away and finally dissipates it through the surface of the liquid cold plate.

[0110] refer to Figure 5 In some embodiments, a first gap 320 may be provided between an end of the shielding structure 300 facing away from the circuit board 100 and the heat dissipation structure 400 .

[0111] By setting a first spacer 320 between the end of the shielding structure 300 facing away from the circuit board 100 and the heat dissipation structure 400, a buffer space can be formed between the shielding structure 300 and the heat dissipation structure 400, thereby preventing the heat dissipation structure 400 from directly contacting the shielding structure 300 when the heat dissipation structure 400 is displaced toward the shielding structure 300 by an external force. The first spacer 320 can absorb and disperse the impact energy, slow down the transmission of the impact force, and thus reduce the direct damage of the heat dissipation structure 400 to the shielding structure 300.

[0112] When the heat dissipation structure 400 is impacted, the interval will play a certain buffering role, so that the heat dissipation structure 400 has more deformation and energy absorption distance, and reduces the degree of impact force transmitted to the shielding structure 300. In this way, the possibility of damage to the shielding structure 300 can be reduced, and the heat dissipation structure 400 can be protected from damage. The impact force of the heat dissipation structure 400 on the shielding structure 300 is mitigated, the probability of damage to the shielding structure 300 is reduced, and the stability of the use of the circuit board assembly is improved.

[0113] Furthermore, by providing the first spacer 320, the heat dissipation structure 400 can be prevented from directly contacting the shielding structure 300, thereby reducing the possibility of heat being conducted to the surface of the shielding structure 300. This helps prevent the shielding structure 300 from overheating and avoids the thermal impact of the shielding structure 300 on the electronic device 200 or other components on the circuit board 100.

[0114] By setting a first gap 320 between the heat dissipation structure 400 and the shielding structure 300, a space for airflow can be provided between the heat dissipation structure 400 and the shielding structure 300, so that the airflow can flow freely between the heat dissipation structure 400 and the shielding structure 300, which helps to enhance the heat dissipation effect and improve the heat dissipation efficiency of the electronic device 200.

[0115] refer to Figure 5 In an exemplary embodiment, the first interval 320 is greater than 0 mm and less than or equal to 0.05 mm. For example, the first interval 320 may be 0.01 mm, 0.02 mm, 0.03 mm or 0.04 mm.

[0116] By setting the spacing distance of the first spacer 320 in the thickness direction of the circuit board 100 to be greater than 0 mm and less than or equal to 0.05 mm, it can ensure that a buffer space is formed between the heat dissipation structure 400 and the shielding structure 300, while also avoiding the problem of poor shielding effect of the shielding cover composed of the heat dissipation structure 400 and the shielding structure 300 due to the excessive distance of the first spacer 320.

[0117] If the first interval 320 is too large, for example, the first interval 320 is 0.07 mm, the sum of the heights of the heat dissipation structure 400, the shielding structure 300 and the electronic device 200 in the thickness direction of the circuit board 100 will be too large, which is not conducive to further thinning of the electronic device.

[0118] refer to Figure 6 In some embodiments, the heat dissipation structure 400 is connected to the circuit board 100 via a fastener 500 .

[0119] By connecting the heat dissipation structure 400 and the circuit board 100 through the fastener 500, the stability of the heat dissipation structure 400 on the circuit board 100 can be improved, and the connection stability between the circuit board 100 and the heat dissipation structure 400 can be improved, thereby improving the structural stability of the circuit board assembly.

[0120] In some embodiments, the fastener 500 can be a long screw, which has corresponding threaded holes on the heat dissipation structure 400 and the circuit board 100. The long screw passes through the threaded holes on the heat dissipation structure 400 and the circuit board 100 at one time, so that the heat dissipation structure 400 and the circuit board 100 are fastened together by the long screw.

[0121] In some embodiments, the circuit board assembly also includes a supporting structure (not shown in the figure), which is arranged between the circuit board 100 and the heat dissipation structure 400. When the heat dissipation structure 400 is connected to the circuit board 100, the supporting structure can support the heat dissipation structure 400, thereby further improving the connection stability between the heat dissipation structure 400 and the circuit board 100 and avoiding shaking of the heat dissipation structure 400 after being connected to the circuit board 100.

[0122] refer to Figure 2 and Figure 6 On the basis of the above embodiments, when the circuit board assembly of the present application is disposed in an electronic device, the heat dissipation structure 400 in the circuit board assembly and the circuit board 100 in the circuit board assembly can be connected by a fastener 500. Alternatively, the heat dissipation structure 400 can be connected to the rear housing 30. Alternatively, while the heat dissipation structure 400 is connected to the rear housing 30, the heat dissipation structure 400 can also be connected to the circuit board 100.

[0123] By connecting the heat dissipation structure 400 to the rear housing 30 and also connecting the heat dissipation structure 400 to the circuit board 100 , the connection stability of the heat dissipation structure 400 can be improved.

[0124] refer to Figure 7 and Figure 8 In some embodiments, the circuit board assembly may further include an elastic shielding member 600, which is disposed on the outer peripheral side of the shielding structure 300, one end of the elastic shielding member 600 is connected to the circuit board 100 or the shielding structure 300, and the other end of the elastic shielding member 600 is pressed against the heat dissipation structure 400.

[0125] In some embodiments, one end of the elastic shielding member 600 can be connected to the shielding structure 300, and the other end of the elastic shielding member 600 can be pressed against the heat dissipation structure 400. In another implementation, one end of the elastic shielding member 600 can be connected to the circuit board 100, and the other end of the elastic shielding member 600 can be pressed against the heat dissipation structure 400.

[0126] It is understandable that when there is a first gap 320 between the heat dissipation structure 400 and the shielding structure 300, electromagnetic waves will leak at the first gap 320, affecting the electromagnetic shielding performance of the shielding cover formed by the heat dissipation structure 400 and the shielding structure 300. Alternatively, when the heat dissipation structure 400 and the shielding structure 300 are connected, if the connection is not handled properly, for example, not connected by conductive glue or welding, a certain amount of electromagnetic waves will also leak, which will also affect the electromagnetic shielding performance of the shielding cover.

[0127] The circuit board assembly may include an elastic shielding member 600, and the elastic shielding member 600 is arranged on the outer peripheral side of the shielding structure 300, and the end of the shielding structure 300 facing away from the circuit board 100 is pressed against the heat dissipation structure 400, so as to close the first gap 320 between the heat dissipation structure 400 and the shielding structure 300, thereby preventing the electromagnetic waves emitted by the electronic device 200 in the shielding structure 300 from leaking from the first gap 320, thereby improving the shielding effect of the shielding cover formed by the shielding structure 300 and the heat dissipation structure 400.

[0128] In some embodiments, the elastic shielding member 600 and the heat dissipation structure 400 can be connected by bonding, or the elastic shielding member 600 can be in abutment contact with the heat dissipation structure 400 by abutment.

[0129] In a possible implementation, in the thickness direction of the circuit board 100, when the heat dissipation structure 400 is pressed against the elastic shielding member 600, the height of the elastic shielding member 600 is greater than the height of the shielding structure 300, and the compression amount of the elastic shielding member 600 is greater than or equal to 40% in the thickness direction of the circuit board 100. It can be understood that during the assembly process of the heat dissipation structure 400 and the elastic shielding member 600, the heat dissipation structure 400 applies a squeezing force toward the circuit board 100 to the elastic shielding member 600, so that the elastic shielding member 600 can be compressed and deformed in the thickness direction of the circuit board 100.

[0130] By making the height of the elastic shielding member 600 greater than the height of the shielding structure 300 , when the heat dissipation structure 400 and the elastic shielding member 600 are pressed tightly, the elastic shielding member 600 can generate a certain amount of compression and form the first space 320 .

[0131] After the heat dissipation structure 400 and the elastic shielding component 600 are pressed together, the elastic shielding component 600 can have a certain elastic restoring force after being pressed, and the heat dissipation structure 400 is pressed together under the action of the elastic restoring force, thereby improving the contact tightness between the heat dissipation structure 400 and the elastic shielding component 600, and further improving the shielding effect of the shielding cover.

[0132] If the compression amount of the elastic shielding component 600 is too small, for example, the compression amount of the elastic shielding component 600 is 30%, the elastic restoring force generated after the elastic shielding component 600 is compressed and deformed will be small, resulting in low contact tightness between the elastic shielding component 600 and the heat dissipation structure 400, and further causing electromagnetic waves to leak from the contact between the elastic shielding component 600 and the heat dissipation structure 400, thereby reducing the shielding effect of the shielding cover.

[0133] refer to Figure 7 In some embodiments, a second gap 330 may be provided between the elastic shielding member 600 and the shielding structure 300. The elastic shielding member 600 is spaced apart from the shielding structure 300 at the outer peripheral side of the shielding structure 300.

[0134] By providing the second spacer 330 between the elastic shielding member 600 and the shielding structure 300 , the convenience of disassembly, assembly and maintenance of the elastic shielding member 600 can be facilitated.

[0135] Furthermore, by setting the second spacer 330, the probability of the elastic shielding member 600 squeezing the shielding structure 300 and causing deformation of the shielding structure 300 due to its tilt toward the shielding structure 300 during the compression deformation process can be avoided, thereby further reducing the probability of damaging the electronic device 200 or affecting the shielding effect due to the deformation of the shielding structure 300, thereby improving the stability of the circuit board assembly.

[0136] In a possible implementation, the elastic shielding member 600 is an elastic shielding member 600 made of conductive foam. The conductive foam includes a foam body and a conductive layer coated on the outer surface of the foam body, and the conductive layer can be a conductive metal layer.

[0137] By setting the elastic shielding member 600 to be an elastic shielding member 600 made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval 320, reduce the leakage of electromagnetic waves at the first interval 320, and improve the anti-interference ability of the electronic device 200.

[0138] Furthermore, the conductive foam may have certain softness and elasticity, and can provide good buffering and protection, thereby reducing the impact of vibration and impact on the shielding structure 300 and the electronic device 200 when the heat dissipation structure 400 is impacted.

[0139] In addition, the conductive foam may have good thermal conductivity, which is beneficial to the transfer and heat dissipation of heat generated when the electronic device 200 is working, and helps to maintain the working stability of the electronic device 200.

[0140] The conductive foam has good processability and cuttability, can be customized as needed, and is suitable for assembly requirements of various shapes and sizes, thereby improving the processing flexibility and practicality of the elastic shielding component 600 and reducing the manufacturing cost of the elastic conductive component.

[0141] In some embodiments, the elastic shielding member 600 may be a frame-shaped elastic shielding member 600 which is sleeved on the outer peripheral side of the shielding structure 300. The frame-shaped elastic shielding member 600 includes a frame-shaped foam body and a conductive layer completely covering the outer surface of the foam body.

[0142] In one possible implementation, the elastic shielding member 600 may be formed by splicing a plurality of strip-shaped conductive foams, the head ends and tail ends of the plurality of strip-shaped conductive foams overlap with each other to form a frame-shaped elastic shielding member 600, and the frame-shaped elastic shielding member 600 is disposed around the outer peripheral side of the shielding structure 300.

[0143] The strip-shaped conductive foam contains a foam body, and the outer periphery of the foam body in the length direction is coated with a conductive layer, while the two ends of the strip-shaped conductive foam in the axial direction are not coated with a conductive layer. By overlapping and connecting the head ends and tail ends of multiple strip-shaped conductive foams, it is possible to avoid reducing the electromagnetic shielding effect of the elastic shielding member 600 due to the lack of a conductive layer at the two ends of the strip-shaped conductive foam in the axial direction when forming a frame-shaped elastic shielding member 600.

[0144] refer to Fig. 9In some embodiments, the circuit board assembly may further include an insulating layer 700 , which is disposed on a side of the heat dissipation structure 400 facing the electronic device 200 , and at least a portion of the insulating layer 700 covers the through opening 310 .

[0145] The circuit board assembly may include an insulating layer 700. The insulating layer 700 is disposed on the side of the heat dissipation structure 400 facing the electronic device 200, and at least a portion of the insulating layer 700 covers the through opening 310. This can avoid electrical contact between the heat dissipation structure 400 and the electronic device 200, thereby improving the working stability of the electronic device 200.

[0146] In some embodiments, the insulating layer 700 can be disposed on the side of the heat dissipation structure 400 facing the through opening 310 in an attached form, for example, the insulating layer 700 can be attached to the surface of the heat dissipation structure 400 by an adhesive. The insulating layer 700 can also be disposed on the side of the heat dissipation structure 400 facing the through opening 310 by spraying, for example, insulating paint can be directly sprayed on the heat dissipation structure 400 to serve as the insulating layer 700.

[0147] In a possible implementation, the insulating layer 700 is a polyethylene terephthalate (PET) layer or a polyimide (PI) layer.

[0148] By setting the insulating layer 700 as a polyethylene terephthalate layer or a polyimide layer, the insulation effect between the heat dissipation structure 400 and the electronic device 200 can be improved, electrical contact between the heat dissipation structure 400 and the electronic device 200 can be avoided, and the working stability of the electronic device 200 can be improved.

[0149] In a specific implementation, the insulating layer 700 may be polyimide, which has high temperature resistance of 400°C or higher, and a long-term use temperature range of greater than or equal to -200°C and less than or equal to 300°C. Polyimide has high insulation performance, and its dielectric constant is 4.0 at 103 Hz. By setting the insulating layer 700 to polyimide, the thermal conductivity of the heat dissipation structure 400 can be improved, so as to accelerate the heat dissipation of the electronic device 200.

[0150] refer to Figure 7 and Fig. 9 In some embodiments, the shielding structure 300 may include a shielding frame 340 , which may have a through opening 310 . The shielding frame 340 is arranged around the outer periphery of the electronic device 200 . The shielding frame 340 is connected to the circuit board 100 , and the heat dissipation structure 400 covers the through opening 310 .

[0151] The shielding structure 300 may include a shielding frame 340 , and the shielding frame 340 is disposed on the outer peripheral side of the electronic device 200 to electromagnetically shield the electronic device 200 on the peripheral side of the electronic device 200 , and electromagnetically shield the electronic device 200 at the opening 310 through a portion of the heat dissipation structure 400 .

[0152] refer to Figure 7 and Fig. 9 In some embodiments, the side of the shielding frame 340 facing the circuit board 100 may have a first flange 350, the first flange 350 is arranged around the outer peripheral side of the shielding frame 340, the shielding frame 340 is connected to the circuit board 100 through the first flange 350, and the side of the first flange 350 facing the circuit board 100 is used for connection with the circuit board 100.

[0153] By providing a first flange 350 surrounding the outer peripheral side of the shielding frame 340 on the side of the shielding frame 340 facing the circuit board 100, and connecting the shielding frame 340 to the circuit board 100 through the first flange 350, the contact area between the shielding frame 340 and the circuit board 100 can be increased, thereby improving the connection stability between the shielding frame 340 and the circuit board 100.

[0154] In some embodiments, the first flange 350 can be connected to the circuit board 100 via a connector, the first flange 350 can also be connected to the circuit board 100 via a conductive adhesive, or the first flange 350 can be directly welded to the circuit board 100 .

[0155] Compared with the first flange 350 being connected to the circuit board 100 through a connector or conductive adhesive, the first flange 350 is welded to the circuit board 100 by welding, which can improve the connection stability between the first flange 350 and the circuit board 100 and prevent electromagnetic waves from leaking through the connection between the first flange 350 and the circuit board 100. On the basis of improving the connection stability between the shielding frame 340 and the circuit board 100, the electromagnetic shielding performance can also be improved.

[0156] Continue to refer Figure 7 and Fig. 9 In some embodiments, a second flange 360 ​​is disposed at one end of the shielding frame 340 facing away from the circuit board 100 , and the inner edge of the second flange 360 ​​forms a through opening 310 .

[0157] By providing a second flange 360 ​​at the end of the shielding frame 340 facing away from the circuit board 100 and forming a through opening 310 through the inner edge of the second flange 360, when the heat dissipation structure 400 is impacted toward the shielding structure 300, the heat dissipation structure 400 can contact the shielding frame 340 through the second flange 360, thereby increasing the contact area between the heat dissipation structure 400 and the shielding frame 340, reducing damage to the heat dissipation structure 400 caused by the shielding frame 340 due to excessive pressure when the shielding frame 340 contacts the heat dissipation structure due to the small contact area between the heat dissipation structure 400 and the shielding frame 340, and increasing the service life of the heat dissipation structure 400.

[0158] In one possible implementation, when the heat dissipation requirement of the electronic device 200 of the electronic device is relatively low, heat can be dissipated directly through the rear shell 30 of the electronic device without the need to additionally provide a heat dissipation structure 400. Since the thickness of the heat dissipation structure 400 is omitted, the thickness of the electronic device can be further reduced.

[0159] refer to Fig.10 The present application also provides an electronic device, which may include a rear shell 30, a circuit board 100, an electronic device 200, and a shielding structure 300. The electronic device 200 is disposed on the circuit board 100, the shielding structure 300 is disposed on the circuit board 100, a through opening 310 is provided on the shielding structure 300 at a position opposite to the circuit board 100, a portion of the rear shell 30 covers the through opening 310, a portion of the rear shell 30 and the shielding structure 300 form a shielding cover, and the shielding cover is disposed on the electronic device 200.

[0160] It is understandable that the rear shell 30 can be made of a conductive metal material so as to form a shielding cover together with the shielding structure 300 .

[0161] When the rear shell 30 and the shielding structure 300 form a shielding cover, the rear shell 30 can directly contact the side of the shielding structure 300 facing away from the circuit board 100, or a gap can be set between the rear shell 30 and the shielding structure 300 so that there is no direct contact between the rear shell 30 and the shielding structure 300. A buffer space is formed by the gap. When the rear shell 30 is impacted, the impact force is directly transferred to the shielding structure 300, reducing the probability of damage to the shielding structure 300.

[0162] By setting a through opening 310 on the shielding structure 300 at a position opposite to the circuit board 100, so that part of the electronic device 200 can extend into the through opening 310, when the height of the electronic device 200 is increased, there is no need to increase the height of the shielding cover, and a part of the back shell 30 is used to cover the through opening 310 on the shielding structure 300, so that a part of the back shell 30 and the shielding structure 300 together form a shielding cover provided on the electronic device 200, which can avoid using other shielding parts to cover the through opening 310 and can shorten the distance from the through opening 310 to the back shell 30, thereby further reducing the internal space occupied by the circuit board 100, the electronic device 200 shielding structure 300, etc., which is conducive to further thinning the electronic device.

[0163] refer to Fig.10 In some embodiments, the electronic device may further include an elastic shielding member 600, which is disposed on the outer peripheral side of the shielding structure 300, one end of the elastic shielding member 600 is connected to the circuit board 100 or the shielding frame 340, and the other end of the elastic shielding member 600 is pressed against the inner wall of the rear shell 30.

[0164] By arranging an elastic shielding component 600 on the outer peripheral side of the shielding structure 300, one end of the elastic shielding component 600 is connected to the circuit board 100 or the shielding frame 340, and the other end of the elastic shielding component 600 is pressed against the inner wall of the rear shell 30, it is possible to shield the electromagnetic waves leaked from the gap between the rear shell 30 and the shielding structure 300 through the elastic shielding component 600, thereby improving the shielding performance of the shielding cover.

[0165] In some embodiments, in the thickness direction of the circuit board 100, when the heat dissipation structure 400 is pressed against the elastic shielding component 600, the height of the elastic shielding component 600 is greater than the height of the shielding structure 300, and in the thickness direction of the circuit board 100, the compression amount of the elastic shielding component 600 is greater than or equal to 40%.

[0166] By making the height of the elastic shielding part 600 greater than the height of the shielding structure 300, the elastic shielding part 600 can generate a certain amount of compression when the rear shell 30 and the elastic shielding part 600 are pressed together, and the elastic shielding part 600 can have a certain elastic restoring force after being pressed, and press the rear shell 30 under the action of the elastic restoring force, thereby improving the contact tightness between the rear shell 30 and the elastic shielding part 600, and further improving the shielding effect of the shielding cover.

[0167] refer to Fig.10 In some embodiments, a second gap 330 may be provided between the elastic shielding member 600 and the shielding frame 340 .

[0168] By providing the second spacer 330 between the elastic shielding member 600 and the shielding structure 300 , the convenience of disassembly, assembly and maintenance of the elastic shielding member 600 can be facilitated.

[0169] Furthermore, by setting the second spacer 330, the probability of the elastic shielding member 600 squeezing the shielding structure 300 and causing deformation of the shielding structure 300 due to its tilt toward the shielding structure 300 during the compression deformation process can be avoided, thereby further reducing the probability of damaging the electronic device 200 or affecting the shielding effect due to the deformation of the shielding structure 300, thereby improving the stability of the electronic device.

[0170] In some embodiments, the elastic shielding member 600 is an elastic shielding member 600 made of conductive foam.

[0171] By setting the elastic shielding member 600 to be an elastic shielding member 600 made of conductive foam, since the conductive foam has good electrical conductivity, it can effectively shield the electromagnetic waves at the first interval 320, reduce the leakage of electromagnetic waves at the first interval 320, and improve the anti-interference ability of the electronic device 200.

[0172] The various embodiments or implementation methods in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referenced to each other.

[0173] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0174] It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).

[0175] In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0176] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A circuit board assembly, characterized in that: Including circuit boards, electronic components, shielding structures and heat dissipation structures; The electronic device is arranged on the circuit board; The shielding structure is arranged on the circuit board, and a through opening is provided on the shielding structure at a position opposite to the circuit board; The heat dissipation structure at least partially covers the through opening. The heat dissipation structure and the shielding structure form a shielding cover, and the shielding cover is arranged on the electronic device.

2. The circuit board assembly according to claim 1, characterized in that: The heat dissipation structure comprises a metal shell and a heat dissipation medium arranged in the metal shell. At least a part of the metal shell covers the through opening. The metal shell and the shielding structure form a shielding cover.

3. The circuit board assembly according to claim 1, characterized in that: The heat dissipation structure is a vapor chamber radiator or a liquid cooling radiator.

4. The circuit board assembly according to claim 1, characterized in that: A first gap is formed between an end of the shielding structure facing away from the circuit board and the heat dissipation structure.

5. The circuit board assembly according to claim 4, characterized in that: The first interval is greater than 0 mm and less than or equal to 0.05 mm.

6. The circuit board assembly according to claim 1, characterized in that: The heat dissipation structure is connected to the circuit board via fasteners.

7. The circuit board assembly according to claim 1, characterized in that: The circuit board assembly also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding structure, and the other end of the elastic shielding member is pressed against the heat dissipation structure.

8. The circuit board assembly according to claim 7, characterized in that: In the thickness direction of the circuit board, the height of the elastic shielding member is greater than the height of the shielding structure; In the thickness direction of the circuit board, the compression amount of the elastic shielding component is greater than or equal to 40%.

9. The circuit board assembly according to claim 7, characterized in that: A second interval is provided between the elastic shielding member and the shielding structure.

10. The circuit board assembly according to claim 7, characterized in that: The elastic shielding member is an elastic shielding member made of conductive foam.

11. The circuit board assembly according to any one of claims 1 to 10, characterized in that: The circuit board assembly further comprises an insulating layer, which is arranged on a side of the heat dissipation structure facing the electronic device, and at least a portion of the insulating layer covers the through opening.

12. The circuit board assembly according to claim 11, characterized in that: The insulating layer is a polyethylene terephthalate layer or a polyimide layer.

13. The circuit board assembly according to any one of claims 1 to 10, characterized in that: The shielding structure comprises a shielding frame having the through opening, the shielding frame is arranged around the outer peripheral side of the electronic device, the shielding frame is connected to the circuit board, and the heat dissipation structure is covered on the through opening.

14. The circuit board assembly according to claim 13, characterized in that: The shielding frame has a first flange on one side facing the circuit board. The first flange is arranged around the outer peripheral side of the shielding frame. The shielding frame is connected to the circuit board via the first flange.

15. The circuit board assembly according to claim 13, characterized in that: A second flange is arranged at one end of the shielding frame facing away from the circuit board, and the inner edge of the second flange forms the through opening.

16. An electronic device, characterized in that: comprising a rear housing and a circuit board assembly as claimed in any one of claims 1 to 15; The circuit board assembly is arranged in the rear housing, and the heat dissipation structure in the circuit board assembly is connected to the circuit board in the circuit board assembly via a fastener; Alternatively, the heat dissipation structure is connected to the rear housing; Alternatively, the heat dissipation structure is connected to both the rear housing and the circuit board.

17. An electronic device, characterized in that: Including back shell, circuit board, electronic components and shielding structure; The electronic device is arranged on the circuit board; The shielding structure is arranged on the circuit board, and a through opening is provided on the shielding structure at a position opposite to the circuit board; A portion of the rear shell covers the through opening, and a portion of the rear shell and the shielding structure form a shielding cover, which is disposed on the electronic device.

18. The electronic device according to claim 17, characterized in that: The electronic device also includes an elastic shielding member, which is arranged on the outer peripheral side of the shielding structure, one end of the elastic shielding member is connected to the circuit board or the shielding structure, and the other end of the elastic shielding member is pressed against the inner wall of the rear shell.

19. The electronic device according to claim 18, characterized in that: In the thickness direction of the circuit board, the height of the elastic shielding member is greater than the height of the shielding structure; In the thickness direction of the circuit board, the compression amount of the elastic shielding component is greater than or equal to 40%.

20. The electronic device according to claim 19, characterized in that: A second interval is provided between the elastic shielding member and the shielding structure.

21. The electronic device according to claim 20, characterized in that: The elastic shielding member is an elastic shielding member made of conductive foam.

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