LED packaging support for enhancing pin fixation

Abstract

The utility model relates to the technical field of LED packaging supports, in particular to an LED packaging support for enhancing pin fixation. Comprising a main shell, a plurality of electrode layers are fixedly installed at the bottom of the main shell, the same filling block is fixedly installed on the electrode layers, an installation groove is formed between the top face and the bottom face of the main shell in a penetrating mode, an insulating tape is fixedly installed at the top of the filling block, and the electrode layers make contact with the insulating tape. Pins are arranged at the bottom ends of the electrode layers, reinforcing feet are arranged at the ends, away from the corresponding electrode layers, of the pins, and the top ends of the reinforcing feet extend into the filling blocks. Through the arrangement, the pins and the solidified electrosolder paste can form a stable three-dimensional structure which is interlocked and interlocked, the connection stability of the pins and the filling blocks is enhanced, the problem that the pins are separated from the solidified electrosolder paste can be effectively avoided, good contact between the pins and the solidified electrosolder paste can be effectively guaranteed, and the service life of the LED is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging brackets, in particular to an LED packaging bracket with enhanced pin fixation. Background Art

[0002] LED (semiconductor light emitting diode) packaging refers to the packaging of light-emitting chips, which is quite different from integrated circuit packaging. It is required not only to protect the wick, but also to be able to transmit light. Therefore, LED packaging has special requirements for packaging materials. The LED packaging bracket is usually composed of a shell, a filling block and a conductor arranged between the shell and the filling block, wherein the conductor includes an electrode layer and a pin. The prior art discloses an LED packaging bracket with enhanced pin fixation with an authorization announcement number of CN219321375U, including a main shell, a filling block and a plurality of conductors installed between the main shell and the filling block. A lamp trough for accommodating LED chips is provided on the upper side of the main shell. The conductor includes an electrode layer and a pin, and the electrode layer extends into the lamp trough. The electrode layers of each conductor are isolated from each other by an insulating tape. A round end is provided at the end of the pin, and a pin groove is provided on the bottom surface of the filling block. The round end is horizontally sunken into the pin groove, and a filling reinforcement area for filling conductive solder paste is provided on the bottom surface of the round end. When the pins of the utility model are placed on the electrode plate, the conductive solder paste on the electrode plate can be filled and injected into the filling reinforcement area to strengthen the connection firmness between the pins and the electrode plate, thereby avoiding problems such as light flickering and dead light caused by poor contact of the pins of the LED packaging bracket.

[0003] However, it was found during use that the pins of the above design and the cured solder paste are difficult to form a stable three-dimensional structure that is cross-linked and locked with each other, resulting in limited connection strength. During use, the pins and the cured solder paste are easily detached, making it difficult to ensure good contact between the pins and the cured solder paste. Summary of the invention

[0004] In view of the above problems, the purpose of the utility model is to provide an LED packaging bracket with enhanced pin fixation, which can enable the pins and the cured solder paste to form a stable three-dimensional structure that is cross-linked and locked with each other, thereby enhancing the connection stability between the pins and the filling blocks, and can effectively avoid the problem of the pins and the cured solder paste being detached. It can effectively ensure good contact between the pins and the cured solder paste, improve the service life of the LED, and solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above objectives, the utility model adopts the following technical solution: an LED packaging bracket with enhanced pin fixation, comprising a main shell, a plurality of electrode layers are fixedly installed on the bottom of the main shell, a same filling block is fixedly installed on the plurality of electrode layers, a mounting groove is penetrated between the top surface and the bottom surface of the main shell, an insulating tape is fixedly installed on the top of the filling block, the plurality of electrode layers are in contact with the insulating tape, a pin is provided at the bottom end of the electrode layer, a reinforcing foot is provided at the end of the pin away from the corresponding electrode layer, the top of the reinforcing foot extends into the filling block, a plurality of card slots are provided on the electrode layer and the reinforcing foot, the card slots are adapted to the filling block, a plurality of grooves are provided at the bottom of the filling block, the pin is fixedly installed in the corresponding groove, two first through holes are penetrated on the pin, two filling grooves are provided on the top inner wall of the groove, the filling groove is connected to the corresponding first through hole, and a same second through hole is penetrated between the two filling grooves.

[0006] To facilitate the stable connection between the electrode layer and the reinforcement feet and the filling block:

[0007] As a further improvement of the above technical solution: the electrode layer and the reinforcement foot are both L-shaped structures, and the pin is a circular structure.

[0008] The beneficial effect of this improvement is that, through such an arrangement, the electrode layer and the reinforcing feet are easily connected to the filling block.

[0009] To ensure that multiple electrode layers do not interfere with each other:

[0010] As a further improvement of the above technical solution: the installation groove is a bowl-shaped structure, and the insulating belt isolates multiple electrode layers from each other.

[0011] The beneficial effect of this improvement is that by such an arrangement, it is possible to ensure that multiple electrode layers do not interfere with each other.

[0012] To prevent the electrode layer from activating:

[0013] As a further improvement of the above technical solution: the electrode layer is fixedly connected to the filling block through glue, and the filling block is a rectangular structure.

[0014] The beneficial effect of this improvement is that by such an arrangement, the electrode layer can be effectively fixed to prevent the electrode layer from moving.

[0015] In order to facilitate the bending of the bottom end of the electrode layer into the groove:

[0016] As a further improvement of the above technical solution: the plurality of grooves are evenly arranged in a rectangular array, and one side of the groove is an opening.

[0017] The beneficial effect of this improvement is that by setting one side of the groove as an opening, it is convenient for the bottom end of the electrode layer to be bent and inserted into the groove, thereby improving the fitting effect.

[0018] To facilitate solder paste entering the first through hole:

[0019] As a further improvement of the above technical solution: two tapered grooves are provided at the bottom of the pin, and the tapered grooves are connected to the corresponding first through holes.

[0020] The beneficial effect of this improvement is that by providing the tapered groove, it is convenient for the solder paste to enter the first through hole.

[0021] The beneficial effects of the utility model are as follows: through a simple interconnected hole-groove structure, the pin and the solidified solder paste can form a stable three-dimensional structure that is cross-linked and locked with each other, and the connection stability between the pin and the filling block is enhanced, which can effectively avoid the problem of the pin and the solidified solder paste being detached, and then can effectively ensure good contact between the pin and the solidified solder paste, thereby improving the service life of the LED. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the main cross-sectional structure of the utility model.

[0023] Figure 2 It is a schematic diagram of the structure of the utility model when viewed from above.

[0024] Figure 3 It is a bottom view structural schematic diagram of the filling block in the utility model.

[0025] Figure 4 For this utility model Figure 1 Schematic diagram of the enlarged structure of part A.

[0026] Figure 5 It is a schematic diagram of the bottom-up assembly structure of the electrode layer and the pins in the utility model.

[0027] Figure 6 It is a three-dimensional cross-sectional structural schematic diagram of the pin and electrode layer in the utility model.

[0028] In the figure: 1. main shell; 2. electrode layer; 3. filling block; 4. mounting groove; 5. insulating tape; 6. pin; 7. reinforcing foot; 8. card slot; 9. groove; 10. first through hole; 11. filling slot; 12. second through hole. Implementation

[0029] In order to enable those skilled in the art to better understand the technical solution of the utility model, the utility model is described in detail below in conjunction with the accompanying drawings. The description in this part is only exemplary and explanatory and should not have any limiting effect on the protection scope of the utility model.

[0030] like Figure 1-6 As shown, an LED package bracket with enhanced pin fixation includes a main shell 1, a plurality of electrode layers 2 are fixedly installed on the bottom of the main shell 1, a same filling block 3 is fixedly installed on the plurality of electrode layers 2, a mounting groove 4 is penetrated between the top and bottom surfaces of the main shell 1, an insulating tape 5 is fixedly installed on the top of the filling block 3, the plurality of electrode layers 2 are in contact with the insulating tape 5, a pin 6 is provided at the bottom end of the electrode layer 2, a reinforcing foot 7 is provided at one end of the pin 6 away from the corresponding electrode layer 2, the top end of the reinforcing foot 7 extends into the filling block 3, the electrode layer 2 and the reinforcing foot 7 are provided with a plurality of card slots 8, the card slots 8 are adapted to the filling block 3, the bottom of the filling block 3 is provided with a plurality of grooves 9, the pin 6 is fixedly installed in the corresponding groove 9, the pin 6 is penetrated with two first through holes 10, the top inner wall of the groove 9 is provided with two filling slots 11, the filling slots 11 are communicated with the corresponding first through holes 10, and the same second through hole 12 is penetrated between the two filling slots 11, through such an arrangement, the pin 6 and the cured solder paste can form a mutually cross-linked and locked stable three-dimensional structure, and the reinforcing foot 7 is provided with a plurality of card slots 8, the card slots 8 are adapted to the filling block 3, the bottom of the filling block 3 is provided with a plurality of grooves 9, the pin 6 is fixedly installed in the corresponding groove 9, the pin 6 is penetrated with two first through holes 10, the top inner wall of the groove 9 is provided with two filling slots 11, the filling slots 11 are communicated with the corresponding first through holes 10, and the same second through hole 12 is penetrated between the two filling slots 11, through such an arrangement, the pin 6 and the cured solder paste can form a mutually cross-linked and locked stable three-dimensional structure, and the reinforcing The connection stability between the pin 6 and the filling block 3 is strengthened, and the problem of the pin 6 being separated from the solidified solder paste can be effectively avoided, thereby effectively ensuring good contact between the pin 6 and the solidified solder paste, thereby improving the service life of the LED. The electrode layer 2 and the reinforcement foot 7 are both L-shaped structures, and the pin 6 is a circular structure. Through this arrangement, it is convenient to firmly connect the electrode layer 2 and the reinforcement foot 7 with the filling block 3. The mounting groove 4 is a bowl-shaped structure, and the insulating tape 5 isolates the multiple electrode layers 2 from each other. Through this arrangement, it can be ensured that the multiple electrode layers 2 will not interfere with each other. The electrode layer 2 is fixedly connected to the filling block 3 by glue, and the filling block 3 is a rectangular structure. By setting it in this way, the electrode layer 2 can be effectively fixed to prevent the electrode layer 2 from moving. The multiple grooves 9 are evenly arranged in a rectangular array, and one side of the groove 9 is an opening. By setting one side of the groove 9 as an opening, it is convenient for the bottom end of the electrode layer 2 to be bent and inserted into the groove 9, thereby improving the fitting effect. Two conical grooves are provided at the bottom of the pin 6, and the conical grooves are connected to the corresponding first through hole 10. By setting the conical groove, it is convenient for the solder paste to enter the first through hole 10.

[0031] The working principle of the utility model is as follows: when in use, the LED lamp bead is first installed in the installation groove 4, the bottom of the LED lamp bead is electrically contacted with multiple electrode layers 2, and the stability of the connection between the pin 6 and the filling block 3 can be strengthened by setting the reinforcing foot 7, and the card slot 8 is set on the reinforcing foot 7 and the electrode layer 2, so as to facilitate the stable connection between the reinforcing foot 7 and the electrode layer 2 and the filling block 3, and avoid the movement of the electrode layer 2 and the pin 6, and the groove 9 is set to limit the pin 6 to prevent the pin 6 from moving, and the pin 6 is connected to the electric board when the solder paste is used. When the solder paste enters the two filling grooves 11 through the two first through holes 10, the solder paste in the two filling grooves 11 passes through the second through hole 12, so that the pin 6 is fixedly connected to the filling block 3 through the cooled and hardened solder paste. By setting it in this way, the pin 6 and the solidified solder paste can form a stable three-dimensional structure that is cross-linked and locked with each other, and the connection stability between the pin 6 and the filling block 3 is strengthened, which can effectively avoid the problem of the pin 6 being detached from the solidified solder paste, and then can effectively ensure the good contact between the pin 6 and the solidified solder paste, thereby improving the service life of the LED.

[0032] It should be noted that, in this article, the terms "comprises", "includes" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0033] This article uses specific examples to illustrate the principles and implementation methods of the utility model. The above examples are only used to help understand the method and core ideas of the utility model. The above is only the preferred implementation method of the utility model. It should be pointed out that due to the limitations of textual expression, there are objectively infinite specific structures. For ordinary technicians in this technical field, without departing from the principle of the utility model, they can make several improvements, embellishments or changes, and can also combine the above technical features in an appropriate manner; these improvements, embellishments, changes or combinations, or the direct application of the concept and technical solution of the utility model to other occasions without improvement, should be regarded as the protection scope of the utility model.

Claims

1. An LED package bracket with enhanced pin fixation, comprising a main housing (1), characterized in that: A plurality of electrode layers (2) are fixedly mounted on the bottom of the main shell (1), and a same filling block (3) is fixedly mounted on the plurality of electrode layers (2). A mounting groove (4) runs through the top and bottom surfaces of the main shell (1), and an insulating tape (5) is fixedly mounted on the top of the filling block (3). The plurality of electrode layers (2) are in contact with the insulating tape (5). A pin (6) is provided at the bottom end of the electrode layer (2), and a reinforcing foot (7) is provided at one end of the pin (6) away from the corresponding electrode layer (2), and the top end of the reinforcing foot (7) extends into the filling block (3). The electrode layer (2) and the reinforcing foot (7) are both provided with a plurality of slots (8), the slots (8) being compatible with the filling block (3), the bottom of the filling block (3) being provided with a plurality of grooves (9), the pin (6) being fixedly mounted in the corresponding groove (9), the pin (6) being penetrated by two first through holes (10), the top inner wall of the groove (9) being provided with two filling slots (11), the filling slots (11) being connected to the corresponding first through holes (10), and the same second through hole (12) being penetrated between the two filling slots (11).

2. The LED package bracket with enhanced pin fixation according to claim 1, characterized in that: The electrode layer (2) and the reinforcing foot (7) are both L-shaped structures, and the pin (6) is a circular structure.

3. The LED package bracket with enhanced pin fixation according to claim 1, characterized in that: The mounting groove (4) is a bowl-shaped structure, and the insulating tape (5) isolates the multiple electrode layers (2) from each other.

4. The LED package bracket with enhanced pin fixation according to claim 1, characterized in that: The electrode layer (2) is fixedly connected to the filling block (3) via glue, and the filling block (3) is a rectangular structure.

5. The LED package bracket with enhanced pin fixation according to claim 1, characterized in that: The plurality of grooves (9) are evenly arranged in a rectangular array, and one side of the grooves (9) is open.

6. The LED package bracket with enhanced pin fixation according to claim 1, characterized in that: Two tapered grooves are formed at the bottom of the pin (6), and the tapered grooves are connected to the first through hole (10).

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