Laser processing mechanism and laser processing device

Abstract

The utility model relates to the technical field of laser processing, in particular to a laser processing mechanism and a laser processing device. The laser processing mechanism comprises a lathe bed; the cross beam is arranged on the lathe bed; the multiple workbenches are arranged on the lathe bed at intervals in the first direction and used for containing to-be-machined plates, and the workbenches can move in the second direction perpendicular to the first direction; and the multiple galvanometer scanning assemblies are installed on the cross beam, each galvanometer scanning assembly is independently arranged above the corresponding workbench, and each galvanometer scanning assembly can move in the first direction so as to machine the to-be-machined plate on the corresponding workbench. According to the utility model, the plurality of working tables are arranged at intervals, and each working table is correspondingly provided with an independent galvanometer scanning assembly, so that the machining flexibility is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser processing, in particular to a laser processing mechanism and a laser processing device. Background Art

[0002] Printed circuit boards (PCBs) are providers of electrical connections for electronic components. PCBs are mainly sandwich structures consisting of two types of materials: insulating substrates and conductors. Conductor materials usually use copper, and insulating materials include polypropylene (PP), polytetrafluoroethylene (PTFE), hydrocarbon resins, polyphenylene ether (PPO / PPE), resin materials (BT), Ajinomoto deposited film (ABF), ceramics, etc. With the development of circuit boards, high-frequency and high-speed materials are increasingly used, such as millimeter-wave radars, optical communication modules, high-speed servers, etc. Due to the need for high-speed transmission of big data, a lower capacitance (DF) value is required, and the copper surface of the circuit board must be smooth. Therefore, it is necessary to directly open the copper window with ultraviolet laser and then use other equipment to remove the glue in the subsequent process.

[0003] However, in the prior art, the laser device generally connects multiple processing tables together. When moving, each processing table is not independent from the other processing tables, and the flexibility is low. Utility Model Content

[0004] The technical problem to be solved by the utility model is: in view of the problem of low flexibility in connecting a plurality of processing tables in the prior art, a laser processing mechanism and a laser processing device are provided.

[0005] In order to solve the above technical problems, on the one hand, the embodiment of the utility model provides a laser processing mechanism, including: a bed;

[0006] A crossbeam, arranged on the bed;

[0007] A plurality of workbenches, each of which is arranged on the bed at intervals along a first direction, and is used to place a plate to be processed, and each of which can move along a second direction perpendicular to the first direction;

[0008] A plurality of galvanometer scanning assemblies are installed on the crossbeam, each of the galvanometer scanning assemblies is independently arranged above each of the workbenches, and each of the galvanometer scanning assemblies can move along a first direction to process the plate to be processed on the corresponding workbench.

[0009] Optionally, it also includes: a first power assembly arranged on the crossbeam and a plurality of second power assemblies arranged on the bed; wherein the first power assembly is drivingly connected to the galvanometer scanning assembly, and one of the second power assemblies is drivingly connected to one of the workbenches.

[0010] Optionally, there are multiple first power components, and the first power components include a first drive unit and a first guide rail. Multiple groups of the first guide rails are arranged on the side of the beam in sequence along the first direction. A galvanometer scanning component is installed on each group of the first guide rails. Each of the galvanometer scanning components on the first guide rail is connected to a first drive unit, and the first drive unit is used to drive the galvanometer scanning component to slide on the first guide rail.

[0011] Optionally, the laser processing mechanism further includes a focusing mirror and a CCD positioning system, and each of the galvanometer scanning components is provided with a focusing mirror and a CCD positioning system.

[0012] Optionally, a laser is also included, and the galvanometer scanning assembly includes a first galvanometer, a second galvanometer and a mounting base, the mounting base is installed on the crossbeam, the first galvanometer and the second galvanometer are arranged in the mounting base, and the first galvanometer and the second galvanometer form a galvanometer group, and the galvanometer group processes the workpiece to be processed by deflecting the laser beam emitted by the laser.

[0013] Optionally, the laser processing mechanism further includes a laser, and the galvanometer scanning assembly processes the plate to be processed by deflecting laser light emitted by the laser.

[0014] Optionally, a beam splitter is further included, which is arranged on the output light path of the laser and is used to split the laser beam emitted by the laser into multiple beams. Each of the galvanometer scanning components deflects a laser beam split by the beam splitter.

[0015] Optionally, a mirror assembly for reflecting the laser beam is further included, wherein the mirror assembly is suitable for being arranged between the laser and the galvanometer scanning assembly, and the mirror assembly includes a first mirror and a second mirror, wherein the first mirror and the second mirror are arranged at intervals along a third direction, and the laser beam emitted by the laser enters the galvanometer scanning assembly after being reflected by the first mirror and the second mirror in sequence.

[0016] Optionally, it further comprises a galvanometer driving device, which is mounted on the crossbeam, and the galvanometer scanning assembly is arranged on the galvanometer driving device, and the galvanometer driving device can drive the galvanometer scanning assembly to move along a third direction.

[0017] According to the laser processing mechanism of this embodiment, two or more workbenches are arranged on the bed, and a galvanometer scanning assembly is arranged above each workbench, so that each workbench corresponds to a galvanometer scanning assembly. That is, the various workbenches in this embodiment are independent of each other, so that each scanning assembly in this embodiment can simultaneously laser process the plate to be processed on the corresponding workbench. This embodiment improves the flexibility of processing by setting up multiple independent workbenches, and each workbench corresponds to a separate galvanometer scanning assembly, so that different processing contents can be performed on the plates to be processed on different workbenches at the same time, thereby improving the processing (window opening) efficiency.

[0018] On the other hand, an embodiment of the utility model provides a laser processing device, which is used for processing HDI boards, high-frequency boards and high-speed boards, including the above-mentioned laser processing mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a laser processing mechanism provided by an embodiment of the utility model from a first viewing angle;

[0020] Figure 2 It is a structural schematic diagram of a laser processing mechanism provided by an embodiment of the utility model from a second viewing angle;

[0021] Figure 3 It is a structural schematic diagram of the laser processing mechanism provided by one embodiment of the utility model from a third viewing angle.

[0022] The reference numerals in the specification are as follows:

[0023] 1. Bed; 2. Crossbeam; 3. Galvanometer scanning assembly; 4. Workbench; 5. Second power assembly; 6. First power assembly; 7. CCD positioning system; 8. First reflector; 9. Second reflector; 51. Second drive unit; 52. Second guide rail; 61. First drive unit; 62. First guide rail. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects solved by the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] like Figures 1 to 3 As shown, an embodiment of the utility model provides a laser processing mechanism, comprising: a bed 1;

[0026] A crossbeam 2 is arranged on the bed 1;

[0027] A plurality of workbenches 4, each of which is arranged on the bed 1 at intervals along a first direction, and is used to place the plate to be processed, and each of which can move along a second direction perpendicular to the first direction;

[0028] A plurality of galvanometer scanning assemblies 3 are mounted on the crossbeam 2 , and each galvanometer scanning assembly 3 is independently arranged above each workbench 4 . Each galvanometer scanning assembly 3 can move along a first direction to process a plate to be processed on the corresponding workbench 4 .

[0029] In one embodiment, it further includes: a first power assembly 6 disposed on the crossbeam 2 and a plurality of second power assemblies 5 disposed on the bed 1; wherein the first power assembly 6 is driven and connected to the galvanometer scanning assembly 3, and a second power assembly 5 is driven and connected to a workbench 4. In this embodiment, the first direction is preferably the X direction, and the second direction is preferably the Y direction. In this embodiment, the second power assembly 5 includes a second drive unit 51 and a plurality of groups of second guide rails 52, the second drive unit 51 includes a second drive motor, a second connecting member and a second mounting plate, the workbench 4 is slidably mounted on the second guide rail 52 through the second mounting plate, the workbench 4 is connected to the second drive motor through the second connecting member, and the second drive motor drives the workbench 4 to slide on the second guide rail 52. In this embodiment, the number of the second drive units 51 is the same as the number of the second guide rails 52, each group of the second guide rails 52 corresponds to a second drive unit 51, and a second drive unit 51 drives the workstation 4 on a group of the second guide rails 52 to move along the second direction.

[0030] In one embodiment, there are multiple first power assemblies 6, and the first power assemblies 6 include a first drive unit 61 and a first guide rail 62. Multiple groups of first guide rails 62 are sequentially arranged at intervals on the side of the beam 2 along the first direction. A galvanometer scanning assembly 3 is installed on each group of first guide rails 62. The galvanometer scanning assembly 2 on each first guide rail 62 is connected to a first drive unit 61. The first drive unit 61 can drive the galvanometer scanning assembly 3 to slide on the first guide rail 62. In this embodiment, the multiple groups of first guide rails 62 are preferably sequentially arranged at intervals on the beam 2 along the first direction at the same height. At the same time, the first drive unit 61 includes a first drive motor, a first connecting member and a first mounting plate. The galvanometer scanning assembly 3 can be slidably mounted on the first guide rail 62 through the first mounting plate. The galvanometer scanning assembly 3 is connected to the first drive motor through the first connecting member. The first drive motor drives the workbench 4 to slide on the first guide rail 62. In this embodiment, the number of the first drive units 61 is the same as the number of the first guide rails 62, each group of first guide rails 62 corresponds to a first drive unit 61, and one first drive unit 61 drives the galvanometer scanning assembly 3 on a group of first guide rails 62 to move along the first direction. In this embodiment, the number of the first guide rails 62 is preferably the same as the number of the workbenches 4, the distance between adjacent workbenches 4 is the first distance, and the distance between adjacent first guide rails 62 is the second distance, and the first distance is preferably greater than or equal to the second distance, so that each galvanometer scanning assembly 3 can conveniently process the workbench 4 below it. Of course, the different situations between the two are also included in the scope of this embodiment.

[0031] In one embodiment, the laser processing mechanism further includes a focusing mirror and a CCD positioning system 7, and each galvanometer scanning assembly 3 is provided with a focusing mirror and a CCD positioning system 7. In this embodiment, the CCD positioning system 7 includes a CCD camera and a CCD fixing device, and the CCD lens fixing device includes a fixing block for fixing the CCD camera, and also includes a lens positioning assembly for positioning the CCD camera lens, and the lens positioning assembly is fixedly connected to the fixing block. In this embodiment, visual positioning can be performed through the CCD positioning system 7, which is convenient for laser processing of the device. At the same time, in this embodiment, the focusing mirror includes a focusing lens barrel, and an adjustment module movably connected to the focusing lens barrel; the adjustment module adjusts the focal position of the laser converged by the focusing lens barrel, and adjusts the coaxiality of the focusing lens barrel and the laser. The focusing mirror in this embodiment can adjust the position of the laser focus and the coaxiality, which can facilitate the device to perform laser processing better.

[0032] In one embodiment, the laser processing mechanism also includes a laser, and the galvanometer scanning assembly 3 includes a first galvanometer, a second galvanometer and a mounting seat, the mounting seat is installed on the crossbeam, the first galvanometer and the second galvanometer are arranged in the mounting seat, and the first galvanometer and the second galvanometer form a galvanometer group, and the galvanometer group processes the workpiece to be processed by deflecting the laser beam emitted by the laser.

[0033] In one embodiment, the laser processing mechanism further includes a laser, and each galvanometer scanning assembly 3 emits laser to process the plate to be processed by deflecting the laser. When the laser emits a beam of laser, the number of lasers is the same as the number of galvanometer scanning assemblies 3, and the beam emitted by each laser enters a corresponding galvanometer scanning assembly 3. Preferably, the number of workbenches in this embodiment is 2, the number of corresponding galvanometer scanning assemblies 3 is two, and the number of lasers is two. The laser includes a laser body and a shell structure; the shell structure includes a U-shaped shell body, a first side plate and a second side plate arranged on opposite sides of the shell body, and a cover plate installed above the shell body, the first side plate and the second side plate; wherein the shell body, the first side plate, the second side plate and the cover plate form a sealed cavity for accommodating the laser body, and the first side plate is provided with an inflation check valve port and an exhaust check valve port.

[0034] In one embodiment, a beam splitter is further included, and the beam splitter is arranged on the output light path of the laser. The beam splitter is used to split the laser beam emitted by the laser into multiple beams, and each galvanometer scanning assembly 3 deflects a laser beam split by the beam splitter. In this embodiment, when the beam splitter splits multiple laser beams, the number of lasers is preferably one, and the laser emits a laser beam, which is split into multiple beams after passing through the beam splitter. The number of laser beams split by the beam splitter is the same as the number of galvanometer scanning assemblies 3, and each laser beam split by the beam splitter enters each galvanometer scanning assembly 3 accordingly.

[0035] In one embodiment, the number of the workbenches 4 is two, and the two workbenches 4 are spaced apart along the first direction.

[0036] In one embodiment, a reflector assembly for reflecting the laser beam is also included. The reflector assembly is suitable for being arranged between the laser and the galvanometer scanning assembly 3. The reflector assembly includes a first reflector 8 and a second reflector 9. The first reflector 8 and the second reflector 9 are arranged at intervals along the third direction. The laser beam emitted by the laser enters the galvanometer scanning assembly 3 after being reflected by the first reflector 8 and the second reflector 9 in sequence. In this embodiment, the laser is installed on the side of the beam, and the first reflector 8 is arranged relative to the laser. At the same time, the first reflector 8 and the second reflector 9 are inclined at a certain angle. By arranging the first reflector 8 and the second reflector 9, the laser beam emitted by the laser can be easily transmitted to the galvanometer scanning assembly 3. In this embodiment, the third direction is perpendicular to the plane where the first direction and the second direction are located. The first direction is preferably the X direction, and the second direction is preferably the Y direction. The third direction is preferably the Z direction.

[0037] In one embodiment, a galvanometer drive device is further included, the galvanometer drive device is mounted on the crossbeam 2, a galvanometer scanning assembly 3 is provided on the galvanometer drive device, and the galvanometer drive device can drive the galvanometer scanning assembly 3 to move along a third direction. In this embodiment, the galvanometer drive device can be a cylinder, a screw or other device. In this embodiment, the third direction is perpendicular to the plane where the first direction and the second direction are located. The first direction is preferably the X direction, and the second direction is preferably the Y direction. The third direction is preferably the Z direction. In this embodiment, the galvanometer scanning assembly 3 cooperates with the first power assembly 6 and the second power assembly 5 to effectively improve the processing efficiency.

[0038] According to the laser processing mechanism of the present embodiment, two or more workbenches 4 are arranged on the bed 1, and a galvanometer scanning assembly 3 is arranged above each workbench 4, so that each workbench 4 corresponds to a galvanometer scanning assembly 3. That is, the workbenches 4 in the present embodiment are independent of each other, so that the scanning assemblies in the present embodiment can simultaneously laser process the plate to be processed on the corresponding workbench 4. The present embodiment improves the flexibility of processing by setting a plurality of independent workbenches 4, and each workbench 4 corresponds to a separate galvanometer scanning assembly 3, and can simultaneously perform different processing contents on the plates to be processed on different workbenches 4, thereby improving the processing (window opening) efficiency. Preferably, the plate to be processed in the present application can be a PCB board or other plate parts. At the same time, the number of workbenches 4 in the present application is preferably two, so that the problem of mismatch with the double-beam double-table CO2 drilling machine process of the post-laser degumming process can be well avoided.

[0039] In addition, an embodiment of the present invention provides a laser processing device, which is used to process HDI boards, high-frequency boards and high-speed boards, and includes the laser processing mechanism of the above embodiment.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser processing mechanism, characterized in that: include Bed; A crossbeam, arranged on the bed; A plurality of workbenches, each of which is arranged on the bed at intervals along a first direction, and is used to place a plate to be processed, and each of which can move along a second direction perpendicular to the first direction; A plurality of galvanometer scanning assemblies are installed on the crossbeam, and each of the galvanometer scanning assemblies is independently arranged above each of the workbenches; each of the galvanometer scanning assemblies can move along a first direction to process a plate to be processed on the corresponding workbench.

2. The laser processing mechanism according to claim 1, characterized in that: Also includes: A first power assembly disposed on the crossbeam and a plurality of second power assemblies disposed on the bed; The first power assembly is drivingly connected to the galvanometer scanning assembly, and one of the second power assemblies is drivingly connected to one of the workbenches.

3. The laser processing mechanism according to claim 2, characterized in that: There are multiple first power components, which include a first driving unit and a first guide rail. Multiple groups of the first guide rails are arranged on the side of the beam in sequence along the first direction. A galvanometer scanning component is installed on each group of the first guide rails. The galvanometer scanning component on each group of the first guide rails is connected to a first driving unit, and the first driving unit is used to drive the galvanometer scanning component to slide on the first guide rail.

4. The laser processing mechanism according to claim 1, characterized in that: It also includes a focusing mirror and a CCD positioning system. Each of the galvanometer scanning components is provided with a focusing mirror and a CCD positioning system.

5. The laser processing mechanism according to claim 1, characterized in that: It also includes a laser, and the galvanometer scanning assembly includes a first galvanometer, a second galvanometer and a mounting base, the mounting base is mounted on the crossbeam, the first galvanometer and the second galvanometer are arranged in the mounting base, and the first galvanometer and the second galvanometer form a galvanometer group, and the galvanometer group processes the workpiece to be processed by deflecting the laser beam emitted by the laser.

6. The laser processing mechanism according to claim 1, characterized in that: It also includes a laser, which is arranged on the crossbeam, and the galvanometer scanning assembly processes the plate to be processed by deflecting the laser emitted by the laser.

7. The laser processing mechanism according to claim 6, characterized in that: It also includes a beam splitter, which is arranged on the outgoing light path of the laser and is used to split the laser beam emitted by the laser into multiple beams. Each of the galvanometer scanning components deflects a laser beam split by the beam splitter.

8. The laser processing mechanism according to claim 1, characterized in that: It also includes a mirror assembly for reflecting the laser beam, the mirror assembly is suitable for being arranged between the laser and the galvanometer scanning assembly, the mirror assembly includes a first mirror and a second mirror, the first mirror and the second mirror are arranged at intervals along a third direction, and the laser beam emitted by the laser is reflected by the first mirror and the second mirror in sequence and then enters the galvanometer scanning assembly.

9. The laser processing mechanism according to claim 1, characterized in that: It also includes a galvanometer driving device, which is installed on the crossbeam. The galvanometer scanning assembly is provided on the galvanometer driving device, and the galvanometer driving device can drive the galvanometer scanning assembly to move along the third direction.

10. A laser processing device, used for processing HDI boards, high-frequency boards and high-speed boards, characterized in that: A laser processing mechanism comprising any one of claims 1-9.

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