Level conversion circuit and electronic equipment

By setting the on-power module and diode between the power supply module and the output pin, the output voltage of the on-power module is controlled, which solves the problems of complexity and high power consumption of the existing level conversion circuit, and achieves high efficiency and low power consumption Flat conversion effect.

CN222441687UActive Publication Date: 2025-02-07ZHEJIANG WEIXING INTELLIGENT METER STOCK
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Patent Information

Application Number
CN202420913220.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-29
Publication Date
2025-02-07
Estimated Expiration
2034-04-29

AI Technical Summary

Technical Problem

Existing level conversion circuits are complex and have high power consumption, making it difficult to effectively meet the interface requirements between different circuits or devices.

Method used

A level conversion circuit is designed to control the power module and the output pin by setting up a conduction module between the power module and the output pin, and controlling the power module to output the voltage of the power module, thereby controlling the power module and the output pin. between conduction. At the same time, by setting up a diode in parallel with the conduction module, ensure a stable output of the output pin at different levels of demand.

Benefits of technology

It realizes efficient control of the level output of the output pin at different levels of demand, reducing power consumption and simplifying the design of the level conversion circuit.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the utility model discloses a level conversion circuit and electronic equipment, and the circuit comprises a power module, a conduction module, an output pin, a diode and a conduction power module which are connected in sequence, the negative electrode of the diode is connected with the conduction power module, the positive electrode of the diode is connected with the conduction module and the output pin, and the negative electrode of the diode is connected with the conduction module and the output pin. The conduction power supply module is connected with the conduction module, and the diode is connected with the conduction module in parallel; the power supply module is used for providing given high-level voltage for the circuit; the conduction power supply module is used for outputting a first voltage under the condition that the electric equipment connected with the output pin needs a high level, so that the conduction module is conducted, and the output pin outputs a high-level voltage which is the same as the given voltage; under the condition that the electric equipment connected with the output pin needs low level, the voltage is not output, so that the conduction module is not conducted, and the output pin outputs the low level.
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Description

Technical Field

[0001] One or more embodiments of the present specification relate to the field of communication technology, and in particular to a level conversion circuit and an electronic device. Background Art

[0002] A level conversion circuit is an electronic circuit whose main function is to convert between different levels to meet the interface requirements between different circuits or devices. In the process of product development, two devices with different level requirements are likely to appear. For example, device A needs to be maintained at a high level normally, and device B needs to be maintained at a low level normally. At this time, a level conversion circuit needs to be provided for each device to meet the level requirements of both devices at the same time.

[0003] In the related art, the level conversion circuits are relatively complex and generally consume relatively large power when completing the level conversion, which increases the cost of the level conversion. Utility Model Content

[0004] The embodiments of this specification provide a level conversion circuit and method, and the technical solutions thereof are as follows:

[0005] In a first aspect, an embodiment of the present specification provides a level conversion circuit, comprising a power module, a conduction module, an output pin, a diode, and a conduction power module connected in sequence, wherein the cathode of the diode is connected to the conduction power module, the anode of the diode is respectively connected to the conduction module and the output pin, the conduction power module is connected to the conduction module, and the diode is connected in parallel with the conduction module;

[0006] The power supply module is used to provide a given high-level voltage to the circuit;

[0007] The conductive power supply module is used for:

[0008] When the power-consuming device connected to the output pin requires a high level, a first voltage is output to turn on the conduction module, and the output pin outputs a high level voltage that is the same as the given voltage; wherein the first voltage is higher than the given high level voltage;

[0009] When the electric device connected to the output pin requires a low level, no voltage is output, so that the conduction module is not turned on and the output pin outputs a low level.

[0010] In a second aspect, an embodiment of the present specification provides an electronic device, comprising a first component that is normally maintained at a high level, a second component that is normally maintained at a low level, a first level conversion circuit, and a second level conversion circuit; wherein the first level conversion circuit and the second level conversion circuit adopt the level conversion circuit as described in the first aspect, the first level conversion circuit is connected to the first component, the second level conversion circuit is connected to the second component, the conductive power module of the first level conversion circuit outputs a first voltage, and the conductive power module of the second level conversion circuit does not output a voltage.

[0011] In a third aspect, an embodiment of the present specification provides an electronic device, which adopts the level conversion circuit as described in the first aspect.

[0012] The beneficial effects brought by the technical solutions provided by some embodiments of this specification include at least:

[0013] On the one hand, a conduction module is set between the power module and the output pin, and the conduction module voltage is output by controlling the conduction power module, thereby controlling the conduction condition between the power module and the output pin, so that when the conduction power module outputs the first voltage, the output pin outputs a high level, and when the conduction power module does not output a voltage, the output pin outputs a low level.

[0014] On the other hand, by setting a diode in parallel with the conduction module, not only the conduction power module does not affect the voltage output of the output pin when outputting the first voltage, but also the output pin can be prevented from being in a floating state when the conduction power module does not output voltage. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of a level conversion circuit provided in an embodiment of this specification.

[0017] Figure 2 It is a schematic diagram of another level conversion circuit provided in an embodiment of this specification.

[0018] Figure 3 It is a structural schematic diagram of an electronic device provided in an embodiment of this specification. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of this specification will be described clearly and completely below in conjunction with the drawings in the embodiments of this specification.

[0020] The terms "first", "second", etc. in the description and claims of this specification and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the term "comprising" and any variation thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device comprising a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0021] A level conversion circuit is an electronic circuit whose main function is to convert between different levels to meet the interface requirements between different circuits or devices. In the process of product development, two devices with different level requirements are likely to appear. For example, device A needs to be maintained at a high level normally, and device B needs to be maintained at a low level normally. At this time, a level conversion circuit needs to be provided for each device to meet the level requirements of both devices at the same time.

[0022] In the related art, the level conversion circuits are relatively complex and generally consume relatively large power when completing the level conversion, which increases the cost of the level conversion.

[0023] In order to solve the deficiencies in the related art, this specification proposes a level conversion circuit.

[0024] See also Figure 1 , Figure 1 FIG. 1 is a schematic diagram of a level conversion circuit provided in an embodiment of this specification. Figure 1 As shown, the level conversion circuit includes: a power supply module 11, a conduction module 12, an output pin 15, a diode 14, and a conduction power supply module 13 which are connected in sequence.

[0025] Among them, the cathode of the diode 14 is connected to the conduction power module 13, the anode of the diode 14 is respectively connected to the conduction module 12 and the output pin 15, the conduction power module is connected to the conduction module, and the diode 14 is connected in parallel with the conduction module 12.

[0026] A diode is a semiconductor device that allows current to flow in one direction (positive to negative) but blocks current flow in the other direction.

[0027] The power supply module 11 is used to provide a given high level voltage for the circuit. The given high level voltage may be 1.8V.

[0028] The conduction power supply module 13 is used to: when the electrical device connected to the output pin 15 requires a high level, output a first voltage to turn on the conduction module 12, and the output pin 15 outputs a high level voltage that is the same as the given voltage; wherein the first voltage is higher than the given high level voltage; when the electrical device connected to the output pin 15 requires a low level, no voltage is output, so that the conduction module 12 is not conducted, and the output pin outputs a low level.

[0029] In this embodiment, on the one hand, by arranging a conduction module between the power module and the output pin, and by controlling the conduction power module to achieve the output of the conduction module voltage, and then controlling the conduction between the power module and the output pin, when the conduction power module outputs the first voltage, the output pin outputs a high level, and when the conduction power module does not output a voltage, the output pin outputs a low level. On the other hand, by arranging a diode in parallel with the conduction module, not only the conduction power module does not affect the voltage output of the output pin when outputting the first voltage, but also the output pin can be prevented from being in a suspended state when the conduction power module does not output a voltage.

[0030] In one embodiment, if Figure 2 As shown, the conduction module 12 is an NMOS transistor. NMOS (N-channel metal-oxide-semiconductor) transistor is a semiconductor device mainly used to build digital circuits. NMOS transistors are composed of a channel made of N-type semiconductor material, an oxide insulating layer located on the channel, and a metal or alloy gate located above the oxide.

[0031] In digital circuits, NMOS tubes are usually used to implement logic gates, such as NAND gates, NOR gates, etc. NMOS tubes can control the flow of current. When the gate voltage is higher than the threshold voltage of the charge carriers (electrons) in the channel, the current can flow between the source and the drain; when the gate voltage is lower than the threshold voltage, the current is blocked. In the utility model, when the conduction power module provides a voltage higher than a given high level to the NMOS tube (i.e., the conduction module), the NMOS tube is turned on, so that the output pin outputs the same voltage as the given high voltage. When the conduction power module does not output voltage, the NMOS tube is not turned on, then the output pin outputs a low level, and the low level can flow through the diode to the conduction power module, so that the output pin will not be in a floating state.

[0032] "Pin floating state" usually refers to the state where a connection point (pin) on a circuit board is not connected to any power or ground line through a resistor, capacitor, wire or other electronic component. In this state, the pin is not connected to any definite potential, which may cause unstable electrical behavior and may even affect the performance or safety of the circuit. On the pins of chips such as integrated circuits (ICs) or microcontrollers (MCUs), the floating state may cause the chip to not work correctly, because these pins need to be configured as input, output or analog functions, etc. If floating, these pins may be subject to external interference, resulting in unstable signals or completely wrong operations. In order to ensure the normal operation of the circuit, designers need to ensure that all pins are properly connected to the power supply (such as 3.3V or 5V) or ground (GND), or connected to other specific reference levels according to the circuit design. In actual operation, the pin floating state is usually avoided. If a pin must remain unconnected, a jumper (jumper) or a protective cap (pull-up / pull-down resistor) is usually used to ensure that the pin is in a known state.

[0033] The conductive power module is equivalent to the ground wire when no voltage is output, and the structure of the diode allows the low level to flow from the positive electrode to the negative electrode, thereby realizing the ground wire of the output pin.

[0034] Specifically, the model of the NMOS tube may be RTR025N03TL.

[0035] In one embodiment, the power supply module 13 is a single chip microcomputer. A single chip microcomputer (MCU) is a microcomputer system that integrates a microprocessor core, a memory, a timer, an input / output (I / O) port, and other auxiliary functions. It is generally used to control and manage various electronic devices or systems. The core of the single chip microcomputer is the microprocessor core, which performs all calculation and control tasks. The memory includes a program memory (for storing program code) and a data memory (for storing temporary data). The timer is used to perform timing and counting tasks, and the I / O port is used to communicate with external devices and connect sensors, actuators, etc.

[0036] The main features of MCU include: High integration: MCU integrates microprocessor, memory, I / O port, etc. on one chip, making the whole system small and light. Low cost: Due to the high integration, the manufacturing cost of MCU is relatively low, which is suitable for mass production. Low power consumption: MCU usually has low power consumption, which is suitable for battery power supply or occasions with strict power consumption requirements. Easy to program: MCU can usually be programmed through programmer or programming interface, which is convenient for users to modify the program as needed. Strong real-time performance: Many MCUs have real-time operation capabilities and can respond quickly to external events.

[0037] In one embodiment, the conduction module 12 can also be a transistor. A transistor is a semiconductor device having three control electrodes, namely a base, an emitter, and a collector. The transistor is the most commonly used amplifier and switch electronic device, which is different according to its working principle and purpose. In this embodiment, the switching function of the transistor is mainly used. The transistor can also be used as a switch, and the transistor can be turned on or off by controlling the base current.

[0038] In one embodiment, a first resistor (R1) is connected between the conduction power module and the conduction module, and a second resistor (R2) is connected between the power module and the conduction module. The first resistor and the second resistor mainly play a role of current limiting, which helps to protect electrical devices.

[0039] In one embodiment, the given high level voltage is 1.8V, and the first voltage is 3.3V.

[0040] In one embodiment, the output pin is a reset pin of the communication module.

[0041] In communication modules, the RST pin usually refers to the reset pin. This pin is used to reset the module to reset its state or start the initialization process. The reset operation can be triggered by an external signal or generated by internal logic. The specific function and operation method of the reset pin depend on the model and design of the communication module. In some cases, the reset pin may be a simple input pin, and the reset operation can be triggered externally by applying a low-level pulse. In other cases, the reset pin may have more control functions, such as requiring a continuous low level or a specific timing signal to trigger the reset.

[0042] Therefore, the reset pins of the communication module may have different requirements, for example, pin A needs to be normally maintained at a high level, and pin B needs to be normally maintained at a low level. In this case, the aforementioned level conversion circuit is required to simultaneously meet the level requirements of the two pins.

[0043] An electronic device comprises a first component which is normally maintained at a high level, a second component which is normally maintained at a low level, a first level conversion circuit and a second level conversion circuit; wherein the first level conversion circuit and the second level conversion circuit adopt the level conversion circuit as described above, the first level conversion circuit is connected to the first component, the second level conversion circuit is connected to the second component, the conductive power module of the first level conversion circuit outputs a first voltage, and the conductive power module of the second level conversion circuit does not output a voltage.

[0044] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the embodiment of the adapter device of the power adapter, since it is basically similar to the embodiment of the level conversion circuit, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0045] See also Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of this specification is shown.

[0046] like Figure 3 As shown, the electronic device 300 may include: at least one processor 301 , at least one network interface 304 , a user interface 303 , a memory 305 , a level conversion circuit 306 , and at least one communication bus 302 .

[0047] The communication bus 302 may be used to realize the connection and communication among the above-mentioned components.

[0048] The user interface 303 may include buttons, and the optional user interface may also include a standard wired interface or a wireless interface.

[0049] The network interface 304 may include, but is not limited to, a Bluetooth module, an NFC module, a Wi-Fi module, etc.

[0050] Among them, the processor 301 may include one or more processing cores. The processor 301 uses various interfaces and lines to connect various parts within the entire electronic device 300, and executes various functions and processes data of the electronic device 300 by running or executing instructions, programs, code sets or instruction sets stored in the memory 305, and calling data stored in the memory 305. Optionally, the processor 301 can be implemented in at least one hardware form of DSP, FPGA, and PLA. The processor 301 can integrate one or a combination of CPU, GPU, modem, etc. Among them, the CPU mainly processes the operating system, user interface, and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to handle wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 301, and it can be implemented separately through a chip.

[0051] Among them, the memory 305 may include RAM or ROM. Optionally, the memory 305 includes a non-transitory computer-readable medium. The memory 305 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 305 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 305 may also be at least one storage device located away from the aforementioned processor 301. The memory 305 as a computer storage medium may include an operating system, a network communication module, a user interface module and corresponding applications. The processor 301 may be used to call the application stored in the memory 305.

[0052] The level conversion circuit 306 and Figure 3 The level conversion circuit 30 shown is similar and will not be described again here.

[0053] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented by software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function described in the embodiment of this specification is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (Digital Subscriber Line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more available media integrated. The available medium may be a magnetic medium (eg, a floppy disk, a hard disk, a magnetic tape), an optical medium (eg, a digital versatile disc (DVD)), or a semiconductor medium (eg, a solid state drive (SSD)).

[0054] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiments can be implemented by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. The aforementioned storage medium includes: ROM, RAM, magnetic disk or optical disk and other media that can store program codes. In the absence of conflict, the technical features in this embodiment and the implementation scheme can be combined arbitrarily.

[0055] The embodiments described above are merely preferred embodiments of this specification and are not intended to limit the scope of this specification. Without departing from the design spirit of this specification, various modifications and improvements made to the technical solutions of this specification by ordinary technicians in this field should fall within the scope of protection determined by the claims of this specification.

Claims

1. A level conversion circuit, comprising a power module, a conduction module, an output pin, a diode, and a conduction power module connected in sequence, wherein: The cathode of the diode is connected to the conduction power module, the anode of the diode is connected to the conduction module and the output pin respectively, the conduction power module is connected to the conduction module, and the diode is connected in parallel with the conduction module; The power supply module is used to provide a given high-level voltage to the circuit; The conductive power supply module is used for: When the power-consuming device connected to the output pin requires a high level, output a first voltage to turn on the conduction module, and the output pin outputs a high level voltage that is the same as the given high level voltage; wherein the first voltage is higher than the given high level voltage; When the electric device connected to the output pin requires a low level, no voltage is output, so that the conduction module is not turned on and the output pin outputs a low level. 2 . The level conversion circuit according to claim 1 , wherein the conduction module is an NMOS tube.

3. A level conversion circuit according to claim 2, wherein the model of the NMOS tube is RTR025N03TL. 4 . The level conversion circuit according to claim 1 , wherein the power supply module is a single chip microcomputer. 5 . The level conversion circuit according to claim 1 , wherein the conduction module is a triode. 6 . The level conversion circuit according to claim 1 , wherein a first resistor is connected between the conduction power module and the conduction module, and a second resistor is connected between the power module and the conduction module. 7 . The level conversion circuit according to claim 1 , wherein the given high level voltage is 1.8V, and the first voltage is 3.3V. 8 . The level conversion circuit according to claim 1 , wherein the output pin is a reset pin of a communication module.

9. An electronic device, comprising a first component normally maintained at a high level, a second component normally maintained at a low level, a first level conversion circuit and a second level conversion circuit; wherein: The first level conversion circuit and the second level conversion circuit adopt the level conversion circuit as described in any one of claims 1-8, the first level conversion circuit is connected to the first component, the second level conversion circuit is connected to the second component, the conductive power module of the first level conversion circuit outputs a first voltage, and the conductive power module of the second level conversion circuit does not output a voltage.

10. An electronic device, using the level conversion circuit according to any one of claims 1 to 8.