Illumination module heat dissipation assembly, vehicle lamp and vehicle

By using insulating thermal gaskets and thermal glue between the multi-layer lamp plate and the radiator, the problem of insulation and heat dissipation on the back of the multi-layer lamp plate is solved, and effective insulation and heat dissipation effects are achieved.

CN222459282UActive Publication Date: 2025-02-11MIND ELECTRONICS APPLIANCE CO LTD
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Patent Information

Application Number
CN202421088852.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-17
Publication Date
2025-02-11
Estimated Expiration
2034-05-17

AI Technical Summary

Technical Problem

The prior art is difficult to achieve both insulation and heat dissipation when the back of the multi-layer lamp plate is fitted with the radiator, and it is unable to effectively meet the insulation and heat dissipation needs of the multi-layer lamp plate.

Method used

The combination of insulating thermal gasket and thermal glue is adopted. The insulating thermal gasket is bonded to the radiator through the through hole, and the thermal glue is connected to the radiator through the through hole, realizing insulation and heat conduction between the lamp plate and the radiator.

Benefits of technology

The insulation and heat dissipation requirements of multi-layer board lamp panels are realized. Through the combination of insulating thermal gaskets and thermal glue, the heat dissipation and insulation requirements in different areas are met, and the overall performance of the lamp panel is improved.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an illumination module heat dissipation assembly, a vehicle lamp and a vehicle, the illumination module heat dissipation assembly comprises a lamp panel which is a multi-layer plate, and the first side face of the lamp panel is provided with lamp beads; the second side face of the lamp panel is connected with the radiator in an attached mode through an insulating heat-conducting gasket, the insulating heat-conducting gasket is provided with a through hole, the through hole is opposite to the lamp bead, the position, opposite to the lamp bead, of the second side face of the lamp panel is attached to the radiator through heat-conducting glue, and the heat-conducting glue penetrates through the through hole. The insulated heat-conducting gasket is arranged between the lamp panel and the radiator to realize insulated connection between the lamp panel and the radiator, and the insulated heat-conducting gasket also has a heat-conducting function, so that heat dissipation of the lamp panel can be realized; in addition, the position, opposite to the lamp beads, of the second side face of the lamp panel is connected with the radiator through the heat-conducting glue, and therefore heat dissipation of the lamp beads can be achieved. The heat dissipation requirement and the insulation requirement of different areas of the second side face of the lamp panel can be met by adopting the mode of combining the insulating heat-conducting gasket and the heat-conducting glue.
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Description

Technical Field

[0001] The utility model relates to the technical field of vehicle lamps, and in particular to a lighting module heat dissipation component, a lamp and a vehicle. Background Art

[0002] Light board usually refers to a special type of circuit board used for lighting fixtures, also known as printed circuit board (PCB), which is a support for electronic components, used for electrical connection and support, and widely used in various electronic products. Light board is usually made of aluminum substrate or fiberglass substrate, and has a thermal conductive layer and circuit layer to support and power LED lamp beads. On the PCB board, LED lamp beads are usually soldered using surface mount technology (SMT).

[0003] Single-layer light boards are usually made of single-layer boards bonded with copper plates. However, in view of the current industry demand and the continuous increase in density, single-layer light boards can no longer meet the market demand. Therefore, multi-layer copper substrates are designed to install multiple electronic components, forming multi-layer light boards that are developing rapidly.

[0004] In order to ensure the normal use of the light board, the light board needs to be cooled. Usually, the back of the light board is attached to the heat sink. However, when attaching the light board to the heat sink, it is necessary to ensure that the back of the light board is insulated.

[0005] Therefore, how to provide a lighting module heat dissipation component that meets the insulation and heat dissipation requirements of the multilayer board is a technical problem that needs to be urgently solved by skilled technicians. Utility Model Content

[0006] In view of this, the utility model provides a lighting module heat dissipation component to meet the insulation and heat dissipation requirements of the multilayer board. In addition, the utility model also provides a vehicle lamp and a vehicle having the lighting module heat dissipation component.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A lighting module heat dissipation component, comprising:

[0009] A lamp board, wherein the lamp board is a multi-layer board, and a lamp bead is provided on a first side surface of the lamp board;

[0010] The heat sink, the second side of the lamp board is bonded to the heat sink through an insulating thermally conductive gasket, the insulating thermally conductive gasket has a through hole, and the through hole is opposite to the lamp bead, and the position on the second side of the lamp board opposite to the lamp bead is bonded to the heat sink through thermally conductive adhesive, and the thermally conductive adhesive passes through the through hole.

[0011] Preferably, in the above-mentioned lighting module heat dissipation assembly, the radiator includes a heat dissipation panel and heat dissipation fins, the lamp board is detachably connected to the first surface of the heat dissipation panel, the heat dissipation fins are arranged at least on the second surface of the heat dissipation panel, and the first surface and the second surface are opposite.

[0012] Preferably, in the above-mentioned lighting module heat dissipation assembly, the thermally conductive adhesive is adhesively connected to the first surface of the heat dissipation panel;

[0013] and / or,

[0014] The insulating thermally conductive gasket is adhesively connected to the first surface of the heat dissipation panel.

[0015] Preferably, in the above-mentioned lighting module heat dissipation assembly, the first surface of the heat dissipation panel has a boss, at least a portion of the boss can extend into the through hole, and the thermal conductive adhesive is filled in the through hole and contacts both the lamp board and the boss.

[0016] Preferably, in the above-mentioned lighting module heat dissipation assembly, the insulating thermally conductive gasket has a avoidance area for avoiding the mounting hole on the lamp board and / or the mounting hole on the heat sink;

[0017] The mounting holes on the lamp board and the mounting holes on the heat sink can be used to achieve the connection between the lamp board and the heat sink.

[0018] Preferably, in the above-mentioned lighting module heat dissipation assembly, the thickness of the insulating thermally conductive gasket is greater than the thickness of the thermally conductive adhesive.

[0019] Preferably, in the above-mentioned lighting module heat dissipation assembly, the thickness of the insulating thermally conductive gasket is 0.2mm-0.4mm.

[0020] and / or,

[0021] The thickness of the thermal conductive adhesive in the through hole is 0.04 mm-0.06 mm.

[0022] Preferably, in the above-mentioned lighting module heat dissipation assembly, the insulating thermally conductive gasket is a silicone pad or a rubber pad.

[0023] A vehicle lamp comprises a lighting module heat dissipation assembly, wherein the lighting module heat dissipation assembly is any one of the lighting module heat dissipation assemblies described above.

[0024] A vehicle comprises a headlight, wherein the headlight is the headlight described above.

[0025] The utility model discloses a lighting module heat dissipation component, in which an insulating connection between the lamp board and the radiator is achieved by arranging an insulating thermally conductive gasket between the lamp board and the radiator, and the insulating thermally conductive gasket also has a heat-conducting function, thereby achieving heat dissipation of the lamp board; in addition, the second side surface of the lamp board opposite to the lamp beads is connected to the radiator through a thermally conductive adhesive, thereby achieving heat dissipation of the lamp beads; the combination of the insulating thermally conductive gasket and the thermally conductive adhesive can meet the heat dissipation requirements and insulation requirements of different areas on the second side surface of the lamp board. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1 It is a structural schematic diagram of the heat dissipation assembly of the lighting module disclosed in the embodiment of the utility model;

[0028] Figure 2 It is a side cross-sectional view of the lighting module heat dissipation assembly disclosed in the embodiment of the utility model;

[0029] Figure 3 for Figure 2 A partial enlarged view of middle A;

[0030] Figure 4 This is a disassembled diagram of the lighting module heat dissipation assembly disclosed in the embodiment of the utility model;

[0031] Figure 5 It is a schematic structural diagram of the back side of the lamp board of the lighting module heat dissipation assembly disclosed in the embodiment of the utility model;

[0032] Figure 6 It is a structural schematic diagram of the boss of the radiator disclosed in the embodiment of the utility model;

[0033] Figure 7 This is an assembly structure diagram of a radiator disclosed in an embodiment of the utility model;

[0034] Figure 8 It is an assembly structure diagram of the thermal conductive adhesive, the heat sink and the insulating thermal conductive pad disclosed in the embodiment of the utility model;

[0035] Fig. 9 It is an assembly diagram of the lamp board and the insulating thermally conductive gasket disclosed in the embodiment of the utility model;

[0036] in,

[0037] 1 is the light board, 2 is the heat sink, 3 is the insulating thermal pad, and 4 is the thermal conductive glue;

[0038] 11 is a lamp bead, 21 is a heat dissipation panel, 22 is a heat dissipation fin, 23 is a boss, 31 is a through hole, 231 is a first section, and 232 is a second section. DETAILED DESCRIPTION

[0039] The utility model discloses a lighting module heat dissipation component, which meets the insulation and heat dissipation requirements of a multilayer board. In addition, the utility model also discloses a vehicle lamp and a vehicle having the lighting module heat dissipation component.

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features.

[0042] Light board usually refers to a special type of circuit board used for lighting fixtures, also known as printed circuit board (PCB), which is a support for electronic components, used for electrical connection and support, and widely used in various electronic products. Light board is usually made of aluminum substrate or fiberglass substrate, and has a thermal conductive layer and circuit layer to support and power LED lamp beads. On the PCB board, LED lamp beads are usually soldered using surface mount technology (SMT).

[0043] Single-layer light boards are usually made of single-layer boards bonded with copper plates. However, in view of the current industry demand and the continuous increase in density, single-layer light boards can no longer meet the market demand. Therefore, multi-layer copper substrates are designed to install multiple electronic components, forming multi-layer light boards that are developing rapidly.

[0044] In order to ensure the normal use of the light board, the light board needs to be cooled. Usually, the back of the light board is attached to the radiator. However, when attaching it to the radiator, the back of the light board needs to be insulated, that is, the insulation and heat dissipation requirements of the light board of the multilayer board need to be met at the same time.

[0045] Based on this, the present application discloses a lighting module heat dissipation component, which uses a combination of a thermally conductive gasket and a thermally conductive adhesive to meet the heat dissipation and insulation requirements of a multilayer board.

[0046] Combination Figures 1 to 5 As shown, the heat dissipation component of the lighting module includes: a lamp board 1, a heat sink 2, an insulating thermally conductive gasket 3 and a thermally conductive adhesive 4.

[0047] The lamp board 1 is a multi-layer board, and a lamp bead 11 is provided on the first side of the lamp board 1. The lamp bead 11 is the main heat source, and generates heat during the use of the lamp board 1. In an optional embodiment, the lamp bead 11 includes but is not limited to LED lamp beads, and of course, other types of lamp beads. The installation position of the lamp bead 11 on the lamp board 1 includes but is not limited to being located in the middle position of the lamp board 1; the number of the lamp bead 11 on the lamp board 1 may also be multiple, and the arrangement position may also be unlimited.

[0048] The second side surface (i.e., the back surface) of the lamp board 1 is connected to the heat sink 2 via the thermal conductive adhesive 4 at a position opposite to the lamp beads 11. The back surface of the lamp board 1 is connected to the heat sink 2 via the insulating thermal conductive pad 3. The insulating thermal conductive pad 3 has a through hole 31. The thermal conductive adhesive 4 is connected to the heat sink 2 via the through hole 31. In some embodiments, the first side surface is opposite to the second side surface.

[0049] The lighting module heat dissipation assembly disclosed in the present application realizes an insulating connection between the lamp board 1 and the radiator 2 by setting an insulating thermally conductive gasket 3 between the lamp board 1 and the radiator 2, and the insulating thermally conductive gasket 3 also has a heat-conducting function, thereby realizing heat dissipation of the lamp board 1; in addition, the second side surface of the lamp board 1 is connected to the radiator 2 via a thermally conductive adhesive 4 at a position opposite to the lamp beads 11, thereby realizing heat dissipation of the lamp beads 11; the combination of the insulating thermally conductive gasket 3 and the thermally conductive adhesive 4 can meet the heat dissipation requirements and insulation requirements of different areas on the second side surface of the lamp board 1.

[0050] In some embodiments, the heat sink 2 includes a heat sink panel 21 and heat sink fins 22. The light board 1 is detachably connected to the first surface of the heat sink panel 21, and the heat sink fins 22 are at least arranged on the second surface of the heat sink panel 21, and the first surface and the second surface are opposite. The first surface of the heat sink panel 21 can be a plane, combined with Figure 5 As shown, the second side surface of the lamp board 1 is a plane, so that the insulating thermally conductive gasket 3 can be a planar structure, so as to increase the contact area of ​​the insulating thermally conductive gasket 3 with the lamp board 1 and the heat dissipation panel 21 when the lamp board 1 is attached to the heat dissipation panel 21, and can improve the stability of the insulating thermally conductive gasket 3 after installation. The lamp board 1 can be fixedly connected to the heat dissipation panel 21 by screws or other threaded parts. The arrangement position and shape of the heat dissipation fins 22 are not specifically limited.

[0051] After the heat dissipation panel 21 is connected to the light board 1, the thermal conductive adhesive 4 is bonded to the first surface of the heat dissipation panel 21; and / or, the insulating thermal conductive pad 3 is bonded to the first surface of the heat dissipation panel 21. In some embodiments, the insulating thermal conductive pad 3 can also be clamped, that is, the insulating thermal conductive pad 3 is fixed between the heat dissipation panel 21 and the light board 1 by fitting them together.

[0052] In some embodiments, the insulating thermally conductive gasket 3 may be a rubber gasket or a plastic gasket, and any structure that can achieve insulation of the second side of the lamp board 1 is within the protection range. Of course, the insulation between the second side of the lamp board 1 and the heat dissipation panel 21 may also be an insulating coating, that is, the insulating coating forms the insulating thermally conductive gasket 3.

[0053] Combination Figure 6 and Figure 7 As shown, the heat dissipation panel 21 of the heat sink 2 has a boss 23, and the shape and size of the boss 23 are not specifically limited. For example, the boss 23 is a rectangular groove and is opposite to the lamp bead 11. Since the boss 23 protrudes from the heat dissipation panel 21, in order to facilitate the installation of the insulating thermally conductive gasket 3, the through hole 31 on the insulating thermally conductive gasket 3 is opposite to the boss 23, and the thermally conductive glue 4 is arranged between the boss 23 and the lamp board 1.

[0054] According to the structure of the boss 23, the boss 23 includes a first section 231 and a second section 232. The first section 231 is fixedly connected to the heat dissipation panel 21; the second section 232 and the first section 231 are integrally formed, and the second section 232 cooperates with the through hole 31, and the heat conductive glue 4 is filled in the through hole 31 and between the second section 232 and the lamp board 1.

[0055] Combination Figures 5 to 9 As shown, the insulating thermally conductive gasket 3 has an escape area, and the escape area is used to escape the mounting hole on the lamp board 1 and / or the mounting hole on the radiator 2. The escape area includes but is not limited to an escape hole or an escape gap. The position, shape and size of the escape area are set according to the mounting hole on the lamp board 1 and the mounting hole on the radiator 2, and are not specifically limited here.

[0056] Setting the avoidance area can ensure the connection between the light board 1 and the radiator 2. During the connection between the light board 1 and the radiator 2, the mounting holes on the light board 1 and the mounting holes on the radiator 2 can be connected together by using screws, thereby achieving the connection between the light board 1 and the radiator 2. In the example, the screws are insulating screws.

[0057] Since the boss 23 extends into the through hole 31 of the insulating thermally conductive gasket 3 , the thickness of the insulating thermally conductive gasket 3 is greater than the thickness of the thermally conductive adhesive 4 , and the thermally conductive adhesive 4 fills the gap between the boss 23 and the lamp board 1 .

[0058] In some embodiments, the thickness of the insulating thermally conductive gasket 3 is 0.2 mm-0.4 mm, and / or the thickness of the thermally conductive adhesive 4 in the through hole 31 is 0.04 mm-0.06 mm. Optionally, the thickness of the insulating thermally conductive gasket 3 is 0.3 mm, and the thickness of the thermally conductive adhesive 4 is 0.05 mm. Those skilled in the art can connect that the thickness of the insulating thermally conductive gasket 3 can be adjusted according to different needs. Since the boss 23 is the structure of the heat sink 2, it can be considered as an existing structure. Therefore, when the thickness of the insulating thermally conductive gasket 3 changes, since the size of the boss 23 remains unchanged, the thickness of the thermally conductive adhesive 4 will change accordingly.

[0059] The thickness of the thermal conductive adhesive 4 in the present application is very small, so the amount of the thermal conductive adhesive 4 can be reduced, thereby reducing the cost.

[0060] In addition, the present application also discloses a vehicle lamp, comprising the lighting module heat dissipation assembly disclosed in the above embodiments. Therefore, the vehicle lamp having the lighting module heat dissipation assembly also has all the above technical effects, which will not be described one by one here.

[0061] The present application also discloses a vehicle, including the headlight disclosed in the above embodiment. Therefore, the vehicle with the headlight also has all the above technical effects, which will not be described one by one here.

[0062] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0063] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A lighting module heat dissipation component, characterized in that: include: A lamp board, wherein the lamp board is a multi-layer board, and a lamp bead is provided on a first side surface of the lamp board; The heat sink, the second side of the lamp board is bonded to the heat sink through an insulating thermally conductive gasket, the insulating thermally conductive gasket has a through hole, and the through hole is opposite to the lamp bead, and the position on the second side of the lamp board opposite to the lamp bead is bonded to the heat sink through thermally conductive adhesive, and the thermally conductive adhesive passes through the through hole.

2. The lighting module heat dissipation assembly according to claim 1, characterized in that: The heat sink comprises a heat dissipation panel and heat dissipation fins. The lamp panel is detachably connected to a first surface of the heat dissipation panel. The heat dissipation fins are at least arranged on a second surface of the heat dissipation panel. The first surface and the second surface are opposite to each other.

3. The lighting module heat dissipation assembly according to claim 2, characterized in that: The thermal conductive adhesive is bonded to the first surface of the heat dissipation panel; and / or, The insulating thermally conductive gasket is adhesively connected to the first surface of the heat dissipation panel.

4. The lighting module heat dissipation assembly according to claim 2, characterized in that: The first surface of the heat dissipation panel has a boss, at least a portion of the boss can extend into the through hole, and the thermal conductive adhesive is filled in the through hole and contacts both the lamp board and the boss.

5. The lighting module heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The insulating thermally conductive gasket has a avoidance area for avoiding the mounting holes on the lamp board and / or the mounting holes on the heat sink; The mounting holes on the lamp board and the mounting holes on the heat sink can be used to achieve the connection between the lamp board and the heat sink.

6. The lighting module heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The thickness of the insulating thermally conductive gasket is greater than the thickness of the thermally conductive adhesive.

7. The lighting module heat dissipation assembly according to claim 6, characterized in that: The thickness of the insulating thermally conductive pad is 0.2mm-0.4mm. and / or, The thickness of the thermal conductive adhesive in the through hole is 0.04 mm-0.06 mm.

8. The lighting module heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The insulating heat-conducting pad is a silicone pad or a rubber pad.

9. A vehicle lamp, comprising a lighting module heat dissipation assembly, characterized in that: The lighting module heat dissipation assembly is the lighting module heat dissipation assembly according to any one of claims 1 to 8.

10. A vehicle, comprising a lamp, characterized in that: The vehicle lamp is the vehicle lamp as claimed in claim 9.