Heat dissipation device and projection equipment
By designing the heat dissipation device of semiconductor refrigeration components and heat conductor sheets in the projection equipment, the problem of dummy caused by heat in high-brightness operation of DLP projection technology is solved, efficient thermal management is achieved, and the performance and quality of the projection equipment are improved.
Patent Information
- Application Number
- CN202421147787.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-23
AI Technical Summary
Under high brightness operating conditions, the existing DLP projection technology causes the internal temperature of the optical machine to rise, cause the expansion and deformation of the plastic structure inside the equipment, affecting the precise position of the optical lens, and thus causing the optical path to shift and the virtual focus of the projected image, which seriously affects the Projection quality.
Design a heat dissipation device, including a semiconductor refrigeration assembly and a heat conductor fin, which quickly refrigerates under the action of current. The cold end is used to absorb heat around the heating component of the projection equipment, and the heat conductor fin realizes from the first side of the shell to the external environment. efficient thermal conduction path.
By quickly absorbing heat, the offset or deformation of the installation structure around the optical component caused by temperature changes is reduced, the optical path is prevented, the thermal immobilization problem is effectively solved, and the performance and quality of projection equipment are improved.
Smart Images
Figure CN222461881U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of projectors, in particular to a heat dissipation device and a projection device. Background Art
[0002] As a modern display device, projection equipment is widely popular for its portability, high brightness and rich color performance. With the growing market demand for projection equipment, the performance requirements for optical machines are also getting higher and higher, especially the demand for brightness and clarity in different usage scenarios. However, the widely used DLP (digital light processing) projection technology currently has certain technical bottlenecks. Especially under high-brightness operating conditions, the significant increase in the temperature inside the optical machine will cause the plastic structure inside the device to expand and deform. This deformation affects the precise position of the optical lens, which in turn causes the optical path to shift and the projection image to be out of focus, seriously affecting the projection quality. Utility Model Content
[0003] The purpose of the utility model is to at least solve the problem that thermal defocusing is easily generated in projection equipment. This purpose is achieved through the following technical solutions:
[0004] The first aspect of the utility model provides a heat dissipation device, which is applied to a projection device. The projection device includes a housing, the housing includes a first surface and a second surface arranged opposite to each other, the first surface is used to connect a heat generating component of the projection device, and the heat dissipation device includes:
[0005] A semiconductor refrigeration component, wherein the semiconductor refrigeration component comprises a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate comprises a hot end and a cold end disposed opposite to each other;
[0006] A heat conducting sheet is connected to the second surface and the cold end respectively.
[0007] According to the heat dissipation device of the utility model, the shell of the projection device has a first surface and a second surface which are arranged opposite to each other, the first surface is a part of the inner wall of the shell, the second surface is a part of the outer wall of the shell, and the first surface is directly connected to the heat generating component (such as a prism). The first surface and the second surface are arranged opposite to each other, so the heat of the first surface is directly transferred to the second surface. The second surface is connected to the cold end of the semiconductor refrigeration plate through a heat conducting plate, and the semiconductor refrigeration plate can quickly cool under the action of electric current. The cold end of the semiconductor refrigeration plate is used to absorb the heat of the mounting structure (i.e., the first surface) around the heat generating component of the projection device, while the hot end needs to dissipate heat. The cold end of the semiconductor refrigeration plate is connected to the second surface of the shell through the heat conducting plate, so that an efficient heat conduction path from the first surface of the shell to the external environment can be realized, and the semiconductor refrigeration plate is used to quickly absorb heat from the key position of the projection device (the first surface, such as the mounting structure around the prism, light source or processor), so as to reduce the optical displacement or deformation caused by the displacement or deformation of the mounting structure around the optical part caused by temperature change, thereby quickly solving the problem of thermal defocus.
[0008] In addition, the heat dissipation device according to the utility model may also have the following additional technical features:
[0009] In some embodiments of the present invention, the heat conducting sheet is bonded, clamped or screwed to the second surface and / or the cold end.
[0010] In some embodiments of the present invention, the heat conducting sheet is bonded to the second surface via a connecting layer.
[0011] In some embodiments of the present invention, the heat conducting sheet is bonded to the cold end via a heat conducting pad.
[0012] In some embodiments of the present invention, the semiconductor refrigeration component includes heat sink fins, and the heat sink fins are connected to the hot end.
[0013] In some embodiments of the present invention, along the thickness direction of the heat conductive sheet, the heat conductive sheet has a first end surface and a second end surface that are arranged opposite to each other, the first end surface is connected to the second surface, and the second end surface is connected to the cold end;
[0014] A first protective film layer is disposed on the first end surface, and / or a second protective film layer is disposed on the second end surface.
[0015] In some embodiments of the present invention, the heat conductive sheet is a graphite sheet or a copper foil sheet.
[0016] A second aspect of the present invention provides a projection device, the projection device comprising:
[0017] shell;
[0018] The above-mentioned heat dissipation device;
[0019] A prism assembly, the prism assembly being connected to the first surface of the housing;
[0020] A light source component is disposed in the housing and is used to provide a light source to the prism assembly.
[0021] In some embodiments of the present invention, the projection device further comprises a centrifugal fan, and an air suction port of the centrifugal fan is arranged toward the hot end of the semiconductor refrigeration element.
[0022] In some embodiments of the utility model, the projection device also includes a baffle portion, which is located on the light path when the projection device is in a dark state, the shell includes two first surfaces arranged opposite to each other, the heat dissipation device includes two heat conductive sheets, the baffle portion is arranged on one of the first surfaces, the prism assembly is connected to the other first surface, the baffle portion is connected to the cold end through one of the heat conductive sheets, and the prism assembly is connected to the cold end through the other heat conductive sheet. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] By reading the detailed description of the preferred embodiment below, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used for the purpose of illustrating the preferred embodiment and are not to be considered as limiting the present invention. Moreover, the same reference numerals are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:
[0024] Figure 1 The schematic diagram of the structure of the heat dissipation device according to the embodiment of the utility model from a first viewing angle is shown schematically;
[0025] Figure 2 A schematic diagram of the structure of the heat dissipation device according to an embodiment of the utility model from a second viewing angle is schematically shown;
[0026] Figure 3 The structure diagram of the first embodiment of the semiconductor refrigeration component and the heat conducting sheet combination according to the embodiment of the utility model is schematically shown;
[0027] Figure 4 The structure diagram of the second embodiment of the semiconductor refrigeration component and the heat conducting sheet combination according to the embodiment of the utility model is schematically shown;
[0028] Figure 5 A partial structural diagram of a projection device according to an embodiment of the utility model is schematically shown;
[0029] Figure 6 The schematic diagram shows the structure of the projection device according to the embodiment of the utility model.
[0030] The reference numerals are as follows:
[0031] 100. Heat dissipation device;
[0032] 10. heat conducting sheet; 11. first heat conducting sheet; 12. second heat conducting sheet;
[0033] 20. semiconductor refrigeration component; 21. semiconductor refrigeration sheet; 22. heat sink fin; 23. electrode; 231. first electrode; 232. second electrode;
[0034] 200, projection device; 201, housing; 202, prism assembly; 203, baffle portion; 204, centrifugal fan. DETAILED DESCRIPTION
[0035] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.
[0036] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0037] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.
[0038] For ease of description, spatial relative terms may be used herein to describe the relationship of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure is turned over, then the elements described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." can include both above and below orientations.
[0039] like Figure 1 and Figure 2 As shown, according to an embodiment of the utility model, a heat dissipation device 100 is proposed, and the heat dissipation device 100 is applied to a projection device 200, the projection device 200 includes a shell 201, and a housing cavity is provided inside the shell 201, the housing cavity is used to accommodate a prism assembly 202, a light source component and a lens of the projection device 200, the shell 201 includes a first surface and a second surface arranged opposite to each other, the first surface faces the housing cavity, and the first surface is used to connect the heat-generating components of the projection device 200, the heat dissipation device 100 includes a semiconductor refrigeration component 20 and a heat conducting plate 10, the semiconductor refrigeration component 20 includes a semiconductor refrigeration plate 21, the semiconductor refrigeration plate 21 includes a cold end and a hot end arranged opposite to each other, and the heat conducting plate 10 is respectively connected to the second surface and the cold end.
[0040] According to the heat dissipation device 100 of this embodiment, a housing 201 of the projection device 200 is provided with a receiving cavity, and the housing 201 has a first surface and a second surface arranged opposite to each other, the first surface is a part of the inner wall of the housing 201, and the second surface is a part of the outer wall of the housing 201, and the first surface is directly connected to the heat generating component (such as a prism), and the heat of the first surface is directly transferred to the second surface by directly connecting the first surface of the housing 201 to the heat generating sensitive component such as the prism. The first surface and the second surface are arranged opposite to each other, so the heat of the first surface is directly transferred to the second surface. The second surface is connected to the cold end of the semiconductor cooling sheet 21 through the heat conducting sheet 10, and the semiconductor cooling sheet 21 can be quickly cooled under the action of electric current. The cold end of the semiconductor cooling sheet 21 is used to absorb the heat of the mounting structure around the heat generating component of the projection device 200, while the hot end needs to dissipate heat. The cold end of the semiconductor cooling sheet 21 is connected to the outer wall of the housing 201 through the heat conducting sheet 10, and an efficient heat conduction path can be realized from the mounting structure around the heat generating component inside the housing 201 to the external environment. The semiconductor cooling sheet 21 is used to quickly absorb heat from key parts of the projection device 200 (such as the prism, light source or mounting structure around the processor), reducing optical deviation or deformation caused by deviation or deformation of the mounting structure around the optical parts caused by temperature changes, thereby quickly solving the thermal defocus problem.
[0041] In some embodiments, the heat conductive sheet 10 is bonded to the second surface and the cold end, or the heat conductive sheet 10 is only bonded to the second surface, or the heat conductive sheet 10 is only bonded to the cold end. In addition to bonding, the heat conductive sheet 10 can also be mechanically fixed (such as clamping or screwing) or designed as an integrated structure. For example, the heat conductive sheet 10 is connected to the second surface by bonding and is an integrated structure with the cold end. The bonding method can maximize the rapid transfer and dissipation of heat, ensure fast heat dissipation speed, improve heat dissipation efficiency, and further avoid the problem of thermal defocusing.
[0042] Specifically, a thermally conductive adhesive may be used to bond the thermally conductive sheet 10 to the second surface and / or the cold end. The thermally conductive adhesive is an adhesive used to improve the thermal conductivity of the thermal interface material (TIM). Commonly used thermally conductive adhesives include silicone-based thermally conductive adhesives, epoxy resin thermally conductive adhesives, and acrylic thermally conductive adhesives. These materials not only provide good thermal conductivity, but also have certain mechanical strength.
[0043] Specifically, the end surface of the heat conducting sheet 10 facing the second surface is provided with a connection layer, and the heat conducting sheet 10 is bonded to the second surface through the connection layer. In the heat dissipation device 100, the heat conducting sheet 10 is a key component for effectively conducting and dissipating the heat of the mounting structure around the heat generating components of the projection device 200. In this embodiment, the end surface of the heat conducting sheet 10 facing the second surface is provided with a special connection layer, and this connection layer can be a black double-sided adhesive. The black double-sided adhesive not only serves as an adhesive material to bond the heat conducting sheet 10 to the second surface, but also has the function of blocking light. It can be understood that the thermal conductivity of the black double-sided adhesive ensures that heat can be efficiently transferred from the outer wall of the housing 201 to the heat conducting sheet 10, thereby accelerating the heat dissipation to the external environment and maintaining the low-temperature operation state of the mounting structure around the heat generating components of the housing 201. In addition, the light blocking function of the black double-sided adhesive can prevent light leakage, which is particularly important for improving the image clarity and contrast of the projection device 200, especially in high-end devices where light control has a significant impact on image quality.
[0044] Specifically, the black double-sided adhesive may be thermally conductive acrylic adhesive, epoxy resin or silicone adhesive with carbon black added thereto.
[0045] Specifically, the thermally conductive sheet 10 is bonded to the cold end through a thermally conductive pad, and the thermally conductive pad fills the gap between the thermally conductive sheet 10 and the cold end to ensure that the heat of the cold end can be discharged in time. The use of the thermally conductive pad can significantly reduce the thermal resistance between the thermally conductive sheet 10 and the cold end, so that the heat can be transferred from the surrounding of the heat-generating component to the heat sink 100 faster and more effectively, thereby accelerating the heat dissipation speed and improving the cooling efficiency of the heat sink 100. In addition, due to its excellent physical and thermal properties, the thermally conductive pad can provide stable thermal conductivity performance in a dynamic working environment. At the same time, its application can also reduce the impact of thermal expansion and contraction caused by temperature changes on the stability of the connection. In a specific embodiment, the thermally conductive pad can be selected from a silicone thermally conductive pad or a graphite thermally conductive pad. These materials have good thermal conductivity and flexibility, and can effectively fill the small gap between the thermally conductive sheet 10 and the cold end.
[0046] like Figure 3 and Figure 4 As shown, in some embodiments, the semiconductor refrigeration assembly 20 includes a heat sink fin 22, which is connected to the hot end. The heat sink fin 22 significantly improves the heat dissipation capacity of the hot end of the semiconductor refrigeration plate 21, and effectively transfers heat from the hot end to the surrounding air. This efficient heat conduction and heat convection mechanism helps maintain the low temperature state of the cold end, improves the performance of the entire semiconductor refrigeration assembly 20, further improves the heat dissipation effect of the heat sink 100, and avoids the problem of thermal defocusing.
[0047] Specifically, the heat dissipation fins 22 are straight fins, which are made of a linear thin sheet material. The straight fins are arranged in parallel and along a straight line. This layout helps to achieve uniform airflow distribution.
[0048] In some embodiments, along the thickness direction of the thermal conductive sheet 10, the thermal conductive sheet 10 has a first end face and a second end face that are arranged opposite to each other, the first end face is connected to the second face, the second end face is connected to the cold end, and a first protective film layer is provided on the first end face, and / or a second protective film layer is provided on the second end face. The first end face of the thermal conductive sheet 10 is provided with a first protective film layer, and the first protective film layer wraps the first end face to prevent the first end face of the thermal conductive sheet 10 from falling off, and also prevents external dust from contaminating the thermal conductive sheet 10. The second end face of the thermal conductive sheet 10 is provided with a second protective film layer, and the second protective film layer wraps the second end face to prevent the first end face of the thermal conductive sheet 10 from falling off, and also prevents external dust from contaminating the thermal conductive sheet 10. For example, the first protective film layer and the second protective film layer can both be black single-sided adhesive.
[0049] In some embodiments, the thermal conductive sheet 10 is a graphite sheet or a copper foil. First, the graphite sheet has extremely high thermal conductivity (its planar thermal conductivity coefficient can reach more than 1000W / mK), and can quickly conduct heat in its plane. The anisotropy of graphite makes its thermal conductivity in the planar direction much higher than that in the vertical direction, which is suitable for use as a diffuse heat flow. At the same time, due to its thin and soft characteristics, the graphite sheet can be easily attached to an irregular surface, providing good thermal contact, and is particularly suitable for heat dissipation occasions with limited space or complex shapes. In addition, copper has excellent thermal conductivity and good mechanical strength, which makes the copper foil superior in thermal conductivity and durability. The thermal conductivity of the copper foil is stable, which can effectively reduce the interface thermal resistance and is suitable for applications requiring rapid thermal response and high heat flux density. The use of graphite sheets and copper foils can significantly improve the heat dissipation efficiency. In short, the high planar thermal conductivity of the graphite sheet is suitable for rapid heat diffusion, while the high thermal conductivity of the copper foil is suitable for rapid heat conduction from the heat source to the cooling area.
[0050] like Figure 3 As shown, in one embodiment, a housing 201 of a projection device 200 has a set of first and second surfaces, the first surface is fixedly connected to a prism assembly 202, and a heat dissipation device 100 includes a heat conductive sheet 10, and the heat conductive sheet 10 is respectively connected to the second surface and the cold end. The heat conductive sheet 10 connects the cold end of the semiconductor cooling sheet 21 and the second surface of the housing 201, so that the heat generated from key components such as the prism assembly 202 can be transferred to the second surface through the first surface, and then quickly guided to the cold end of the semiconductor cooling sheet 21 by the heat conductive sheet 10. This configuration effectively manages heat flow, ensures that the surrounding mounting structures of sensitive optical components (such as prisms) are not affected by high temperatures, thereby maintaining the stability of optical performance and avoiding the problem of thermal defocus.
[0051] like Figure 4As shown, in one embodiment, the housing 201 has two sets of first surfaces and second surfaces, one of which is disposed at the top of the housing 201, and the other is disposed at the bottom of the housing 201. There are also two heat conductive sheets 10, namely, the first heat conductive sheet 11 and the second heat conductive sheet 12. Specifically, the first surface at the top is used to connect the baffle portion 203, which is a baffle for shielding dark field light. When the projection device 200 projects a dark field image, the temperature of the baffle increases due to the light projected onto the position of the baffle. The baffle structure and the prism are relatively arranged, and the distance between the two is close. The increase in the temperature of the baffle will radiate and increase the temperature of the prism. Therefore, the first heat conductive sheet 11 is connected to the first surface at the top to cool the baffle. The bottom of the housing 201 is connected to the prism assembly 202, and the bottom of the housing 201 is connected to the second heat conductive sheet 12 to directly cool the prism assembly 202. The two dedicated heat conducting sheets 10 are used to specifically solve the heat problems of the prism assembly 202 and the baffle, respectively, so that the heat management of the entire heat dissipation device 100 is more efficient and targeted. This partitioned heat dissipation strategy allows for more precise control of the temperature distribution inside the projection device 200, thereby reducing the overall degradation of optical performance caused by heat, especially for the problem of thermal defocus.
[0052] It can be understood that the semiconductor refrigeration component 20 further includes an electrode 23 , and the electrode 23 is divided into a first electrode 231 and a second electrode 232 . The first electrode 231 and the second electrode 232 can be positive electrodes or negative electrodes, respectively.
[0053] like Figure 5 and Figure 6 As shown, this embodiment further proposes a projection device 200 , which includes a housing, a heat dissipation device 100 and a prism assembly 202 . The prism assembly 202 is disposed in a receiving cavity of a housing 201 and connected to a first surface of the housing 201 .
[0054] It is understandable that the projection device 200 further includes a light source component, a projection lens, a power supply, a control circuit, a housing, a bracket and an input / output interface. The housing 201 is disposed in the housing.
[0055] In some embodiments, the projection device 200 includes a centrifugal fan 204, and the air intake of the centrifugal fan 204 is arranged facing the hot end of the semiconductor refrigeration element. The air intake of the centrifugal fan 204 is directly aimed at the hot end of the semiconductor refrigeration element. This layout helps to maximize the cooling effect of the air flow directly on the hot end. By directly aiming the air intake of the centrifugal fan 204 at the hot end of the semiconductor refrigeration element, heat can be effectively sucked away, thereby significantly improving the heat dissipation efficiency of the hot end. This direct cooling method helps to quickly reduce the temperature of the hot end of the semiconductor refrigeration element, thereby improving the performance of the entire heat dissipation device 100.
[0056] In one embodiment, the projection device 200 further includes a baffle portion 203, which is located on the optical path when the projection device 200 is in a dark state. The housing 201 includes two first surfaces arranged opposite to each other. The heat dissipation device 100 includes two heat conductive sheets 10, namely a first heat conductive sheet 11 and a second heat conductive sheet 12. The baffle portion 203 is arranged on one of the first surfaces. The prism assembly 202 is connected to the other first surface. The baffle portion 203 is connected to the cold end through the first heat conductive sheet 11, and the prism assembly 202 is connected to the cold end through the second heat conductive sheet 12. The first heat conductive sheet 11 at the top is connected to the baffle portion 203, and the temperature of the baffle increases due to the direct projection of the dark field light when projecting a dark field image. Since the baffle is adjacent to the prism, the high temperature of the baffle can directly affect the temperature of the prism through thermal radiation, thereby causing the thermal expansion of the mounting structure around the prism, resulting in the projection image being out of focus. Through the heat dissipation function of the first heat conductive sheet 11, the temperature of the baffle can be effectively reduced, and the influence of thermal radiation on the prism can be reduced, thereby directly reducing the occurrence of thermal out of focus. The second heat conductive sheet 12 at the bottom is directly connected to the prism assembly 202, providing the most direct temperature control of the prism. Since the prism is the most critical component in the optical system, its temperature stability directly affects the accuracy and quality of optical imaging. By effectively reducing the temperature of the mounting structure around the prism assembly 202, the second heat conductive sheet 12 helps maintain the stability of the optical path and prevents the optical path from being offset due to temperature changes, thereby effectively reducing or eliminating thermal defocus.
[0057] The above is only a preferred specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A heat dissipation device, the heat dissipation device is applied to a projection device, the projection device comprises a housing, the housing comprises a first surface and a second surface arranged opposite to each other, the first surface is used to connect a heat generating component of the projection device, characterized in that: The heat dissipation device comprises: A semiconductor refrigeration component, wherein the semiconductor refrigeration component comprises a semiconductor refrigeration plate, wherein the semiconductor refrigeration plate comprises a hot end and a cold end disposed opposite to each other; A heat conducting sheet is connected to the second surface and the cold end respectively.
2. The heat dissipation device according to claim 1, characterized in that: The heat conducting sheet is bonded, clamped or screwed to the second surface and / or the cold end.
3. The heat dissipation device according to claim 2, characterized in that: The heat conducting sheet is bonded to the second surface via a connecting layer.
4. The heat dissipation device according to claim 2, characterized in that: The heat conducting sheet is bonded to the cold end via a heat conducting pad.
5. The heat dissipation device according to claim 1, characterized in that: The semiconductor refrigeration component includes heat dissipation fins, and the heat dissipation fins are connected to the hot end.
6. The heat dissipation device according to claim 1, characterized in that: Along the thickness direction of the heat conducting sheet, the heat conducting sheet has a first end surface and a second end surface which are arranged opposite to each other, the first end surface is connected to the second surface, and the second end surface is connected to the cold end; A first protective film layer is disposed on the first end surface, and / or a second protective film layer is disposed on the second end surface.
7. The heat dissipation device according to claim 1, characterized in that: The heat conducting sheet is a graphite sheet or a copper foil sheet.
8. A projection device, characterized in that: The projection device comprises: shell; The heat dissipation device according to any one of claims 1 to 7; A prism assembly, the prism assembly being connected to the first surface of the housing; A light source component is disposed in the housing and is used to provide a light source to the prism assembly.
9. The projection device according to claim 8, characterized in that: The projection device further comprises a centrifugal fan, wherein an air suction port of the centrifugal fan is arranged toward a hot end of the semiconductor refrigeration element.
10. The projection device according to claim 8, characterized in that: The projection device also includes a baffle portion, which is located on the light path when the projection device is in a dark state. The shell includes two first surfaces arranged opposite to each other. The heat dissipation device includes two heat conductive sheets. The baffle portion is arranged on one of the first surfaces. The prism assembly is connected to the other first surface. The baffle portion is connected to the cold end through one of the heat conductive sheets, and the prism assembly is connected to the cold end through the other heat conductive sheet.