Power supply device and charging and discharging equipment

Abstract

The utility model relates to the technical field of battery processing equipment, and discloses a power supply device and charging and discharging equipment, the power supply device comprises a cabinet body, a power supply module and a liquid cooling assembly, the liquid cooling assembly is arranged on the power supply module, and the liquid cooling assembly is used for heat dissipation of the power supply module. The liquid cooling assembly and the power supply module are integrally arranged in the cabinet body in a drawable manner, so that the liquid cooling assembly and the power supply module are integrally detachable relative to the cabinet body. According to the power supply device and the charging and discharging equipment, heat dissipation is carried out in a liquid cooling mode, the heat conductivity coefficient of liquid is high, the heat conduction speed is high, the heat dissipation efficiency of the power supply device is high, and the situation that the power supply device cannot operate normally or even is damaged due to the high temperature can be avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of battery processing equipment, in particular to a power supply device and a charging and discharging device. Background Art

[0002] During the production process of batteries, the batteries need to be formed and divided by charging and discharging equipment. When the charging and discharging equipment performs the above operations, the power supply device of the charging and discharging equipment will generate heat. If the heat cannot be dissipated quickly, the temperature of the power supply device will be high and it will not be able to operate normally, which will directly affect the operation of the charging and discharging equipment. Existing power supply devices usually use forced air cooling, using fans to enhance ventilation and cooling effects.

[0003] However, when forced air cooling is used, the heat dissipation efficiency of the power supply unit is low due to the low thermal conductivity of air and the limited heat conduction speed. The power supply unit is at risk of not being able to operate normally or even being damaged due to high temperature. Utility Model Content

[0004] The embodiment of the utility model discloses a power supply device and a charging and discharging device, which dissipate heat by adopting liquid cooling. The thermal conductivity of the liquid is high, the heat conduction speed is fast, and the heat dissipation efficiency of the power supply device is high, which can prevent the power supply device from being unable to operate normally or even being damaged due to high temperature.

[0005] In a first aspect, an embodiment of the utility model discloses a power supply device, comprising a cabinet, a power supply module and a liquid cooling component, wherein the liquid cooling component is arranged on the power supply module, the liquid cooling component is used to dissipate heat for the source module, and the liquid cooling component and the power supply module as a whole can be pulled out and arranged on the cabinet so that the liquid cooling component and the power supply module as a whole can be detached relative to the cabinet.

[0006] As an optional implementation, in an embodiment of the utility model, the power module includes a circuit board and components arranged on the circuit board, the liquid cooling assembly includes a first heat conducting plate and a cooling pipe, the first heat conducting plate is stacked on the circuit board, the cooling pipe is at least partially arranged on the first heat conducting plate, the cooling pipe is used to pass and discharge coolant, and the cooling pipe is distributed around the components.

[0007] As an optional implementation, in an embodiment of the utility model, the cooling pipe includes a first section and a second section that are connected to each other, the end of the first section away from the second section is the first end, the end of the second section away from the second section is the second end, one of the first end and the second end is used to allow the coolant to pass through, and the other is used to discharge the coolant, the first section is arranged on the first heat conducting plate, the second section and the first heat conducting plate are spaced apart from each other along the thickness direction of the circuit board, and at least the second section is distributed around the components.

[0008] As an optional implementation, in an embodiment of the utility model, the cooling pipes distributed around the components and the space between the components are filled with thermal conductive glue.

[0009] As an optional implementation, in an embodiment of the utility model, the components include at least one or more of inductors, capacitors, resistors and MOS tubes, and the liquid cooling assembly also includes a second heat conducting plate, which is arranged on the first heat conducting plate, and the second heat conducting plate is at an angle to the first heat conducting plate, and the second heat conducting plate is located on one side of a component with the highest heat generation among the multiple components.

[0010] As an optional implementation, in an embodiment of the utility model, the first heat conducting plate is provided with a hollow portion, the hollow portion is arranged corresponding to the components, and the hollow portion is used to avoid the components.

[0011] As an optional embodiment, in an embodiment of the utility model, the liquid cooling component has a liquid inlet and a liquid outlet, and the cabinet is provided with a liquid supply pipe and a return pipe. The liquid supply pipe is used to connect with the liquid inlet to introduce cooling liquid into the liquid inlet when the liquid cooling component and the power module are installed as a whole in the cabinet, and the return pipe is used to connect with the liquid outlet to receive the cooling liquid discharged from the liquid outlet when the liquid cooling component and the power module are installed as a whole in the cabinet.

[0012] As an optional implementation, in an embodiment of the utility model, one of the liquid inlet and the liquid supply pipe is provided with a first quick connector located outside the power module, and the first quick connector is used to achieve a detachable connection between the liquid inlet and the liquid supply pipe when the liquid cooling assembly and the power module are installed as a whole in the cabinet, and one of the liquid outlet and the return pipe is provided with a second quick connector located outside the power module, and the second quick connector is used to achieve a detachable connection between the liquid outlet and the return pipe when the liquid cooling assembly and the power module are installed as a whole in the cabinet.

[0013] As an optional implementation, in the embodiment of the utility model, one of the liquid cooling component and the power module can be slidably arranged on the cabinet, so that the liquid cooling component and the power module as a whole can be pulled relative to the cabinet;

[0014] Alternatively, the power supply device further comprises a carrier, the carrier carrying the power supply module and the liquid cooling assembly, and the carrier can be slidably disposed on the cabinet so that the liquid cooling assembly and the power supply module as a whole can be pulled relative to the cabinet.

[0015] As an optional implementation, in an embodiment of the utility model, the cabinet is provided with two guide rails, and the two guide rails are arranged in the cabinet at intervals along the length direction of the circuit board, each guide rail is provided with a slide groove, and the circuit board and the first heat conduction plate are slidably connected to the slide grooves of the two guide rails.

[0016] As an optional implementation, in an embodiment of the utility model, the power supply device includes multiple power modules and multiple liquid cooling components, the multiple power modules are distributed in the cabinet at intervals, and the multiple liquid cooling components are respectively arranged corresponding to the multiple power modules.

[0017] As an optional implementation, in an embodiment of the utility model, the cabinet is provided with a liquid supply port and a liquid drain port, and the cooling pipes of the multiple liquid cooling components are arranged in series in sequence, and the two ends of the multiple cooling pipes in series are respectively connected to the liquid supply port and the liquid drain port to receive the cooling liquid provided by the liquid supply port and discharge the cooling liquid to the liquid drain port.

[0018] In a second aspect, an embodiment of the utility model discloses a charging and discharging device, including the power supply device disclosed in the first aspect.

[0019] Compared with the prior art, the embodiments of the present invention have at least the following beneficial effects:

[0020] In the embodiment of the utility model, a liquid cooling component is provided in the power module, and the liquid cooling component is used to dissipate heat for the power module. The heat dissipation is performed by liquid cooling. The thermal conductivity of the liquid is high, the heat conduction speed is fast, and the heat dissipation efficiency of the power device is high, which can prevent the power device from being unable to operate normally or even being damaged due to high temperature. Moreover, compared with the existing method of using a fan to dissipate heat, the liquid cooling component runs more quietly when achieving heat dissipation, and the noise generated by the use of a fan can be avoided.

[0021] In addition, the liquid cooling assembly and the power module can be pulled out as a whole in the cabinet. By pulling out, the liquid cooling assembly and the power module can be removed from or installed in the cabinet as a whole. The disassembly and assembly is easy and maintenance is convenient. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this technical field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a structural schematic diagram of a power supply device disclosed in Embodiment 1 of the present utility model;

[0024] Figure 2 yes Figure 1 A schematic diagram of the structure of the disclosed power supply device (cabinet omitted) from a left-side perspective;

[0025] Figure 3 It is a structural schematic diagram of a power module and a liquid cooling assembly disclosed in Embodiment 1 of the present utility model;

[0026] Figure 4 yes Figure 3 A schematic diagram of the structure of the disclosed power module and liquid cooling assembly from a left perspective;

[0027] Figure 5 It is a simplified structural diagram of the charging and discharging device disclosed in the second embodiment of the present utility model.

[0028] Description of main reference numerals

[0029] 100, power supply device; 10, cabinet; 10a, guide rail; 20, power supply module; 21, circuit board; 22, components; 22a, inductor; 22b, capacitor; 30, liquid cooling assembly; 30a, liquid inlet; 30b, liquid outlet; 31, first heat conduction plate; 32, cooling pipe; 32a, first section; 32b, second section; 33, second heat conduction plate; 200, charging and discharging equipment; x, length direction. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0031] In the present invention, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inside", "outside", "middle", "vertical", "horizontal", "lateral", "longitudinal" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0032] In addition, some of the above terms may be used to express other meanings in addition to indicating orientation or positional relationship. For example, the term "on" may also be used to express a certain dependency or connection relationship in some cases. For those skilled in the art, the specific meanings of these terms in this utility model can be understood according to specific circumstances.

[0033] In addition, the terms "installed", "set", "provided with", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0034] In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0035] The utility model discloses a power supply device and a charging and discharging device. Liquid cooling is used for heat dissipation. The liquid has a high thermal conductivity and a fast heat conduction speed. The power supply device has a high heat dissipation efficiency, which can prevent the power supply device from being unable to operate normally or even being damaged due to high temperature.

[0036] Embodiment 1

[0037] See also Figure 1 and Figure 2 , is a structural schematic diagram of a power supply device 100 provided in Embodiment 1 of the utility model, the power supply device 100 includes a cabinet 10, a power module 20 and a liquid cooling component 30, the liquid cooling component 30 is arranged on the power module 20, the liquid cooling component 30 is used for heat dissipation of the power module, the liquid cooling component 30 and the power module 20 are integrally retractable and arranged on the cabinet 10 so that the liquid cooling component 30 and the power module 20 are integrally detachable relative to the cabinet 10.

[0038] In this embodiment, a liquid cooling assembly 30 is provided on the power module 20, and the liquid cooling assembly 30 is used to dissipate heat from the power module 20. Liquid cooling is used for heat dissipation. The thermal conductivity of liquid is high, and the heat conduction speed is fast. The heat dissipation efficiency of the power supply device 100 is high, and the power supply device 100 can be prevented from being unable to operate normally or even damaged due to high temperature. Moreover, compared with the existing method of using a fan for heat dissipation, the liquid cooling assembly 30 runs more quietly when achieving heat dissipation, and the noise generated by the use of a fan can be avoided.

[0039] In addition, the liquid cooling assembly 30 and the power module 20 are integrally pullable and arranged in the cabinet 10. By pulling, the liquid cooling assembly 30 and the power module 20 can be integrally detached from or installed in the cabinet 10, which is easy to disassemble and assemble and convenient for maintenance.

[0040] The coolant may be water, mineral oil or fluorinated liquid, etc., which is not specifically limited in this embodiment.

[0041] In some embodiments, the power supply device 100 includes a plurality of power modules 20 and a plurality of liquid cooling components 30. The plurality of power modules 20 are spaced apart and distributed in the cabinet 10, and the plurality of liquid cooling components 30 are respectively arranged corresponding to the plurality of power modules 20. In this way, by arranging a plurality of power modules 20, the overall performance of the power supply device 100 can be improved, and the heat generated by each power module 20 can be dissipated through the corresponding liquid cooling component 30, and the heat dissipation effect is better.

[0042] Exemplarily, the cabinet 10 is provided with a liquid supply port (not shown) and a liquid discharge port (not shown), and the cooling pipes 32 of the plurality of liquid cooling components 30 are sequentially arranged in series, and the two ends of the plurality of cooling pipes 32 in series are respectively connected to the liquid supply port and the liquid discharge port to receive the cooling liquid provided by the liquid supply port and discharge the cooling liquid to the liquid discharge port. In this way, when a plurality of power modules 20 and a plurality of liquid cooling components 30 are stacked, the cooling pipes 32 of the plurality of liquid cooling components 30 are sequentially arranged in series, and the two ends of the plurality of cooling pipes 32 in series are respectively connected to the liquid supply port and the liquid discharge port, so that the cooling liquid provided by the liquid supply port enters the cooling pipe 32, can flow along the plurality of cooling pipes 32 in series, and be discharged from the liquid discharge port, forming a water circuit circulation.

[0043] Among them, the pulling direction of the power module 20 and the liquid cooling module as a whole relative to the cabinet 10 can be different from the spacing direction of multiple power modules 20, thereby avoiding the interference between some power modules 20 and liquid cooling modules as a whole and other power modules 20 and liquid cooling modules when they are pulled relative to the cabinet 10.

[0044] In some embodiments, such as Figure 3 and Figure 4As shown, the power module 20 includes a circuit board 21 and components 22 arranged on the circuit board 21, and the liquid cooling assembly 30 includes a first heat conducting plate 31 and a cooling pipe 32. The first heat conducting plate 31 is stacked on the circuit board 21, and the cooling pipe 32 is at least partially arranged on the first heat conducting plate 31. The cooling pipe 32 is used for passing and discharging coolant, and the cooling pipes 32 are distributed around the components 22. In this way, on the one hand, when the power module 20 is running, the heat generated by the circuit board 21 can be transferred to the first heat conducting plate 31, and then to the cooling pipe 32 arranged on the first heat conducting plate 31, and the heat is taken away by the coolant passed into and discharged from the cooling pipe 32, while the heat generated by the components 22 can be transferred to the cooling pipes 32 distributed around, and the heat is also taken away by the coolant passed into and discharged from the cooling pipes 32, thereby achieving efficient heat dissipation, reducing the overall temperature of the power supply device 100, and ensuring the normal operation of the power supply device 100. On the other hand, by stacking the first heat conducting plate 31 on the circuit board 21 and distributing the cooling pipes 32 around the components 22, the liquid cooling assembly 30 and the power module 20 are compactly arranged, the overall volume is small, and the occupied space can be reduced.

[0045] The periphery of the component 22 refers to a circumference of the component 22 in the lateral direction (ie, the horizontal direction of the plane where the circuit board 21 is located).

[0046] Exemplarily, the cooling pipe 32 includes a first section 32a and a second section 32b that are connected to each other, an end of the first end 32a away from the second section 32b is the first end, and an end of the second section 32b away from the first section 32a is the second end, one of the first end and the second end is used to pass the coolant, and the other of the first end and the second end is used to discharge the coolant, the first section 32a is arranged on the first heat conducting plate 31, the second section 32b and the first heat conducting plate 31 are arranged at intervals along the thickness direction of the circuit board 21, and at least the second section 32b is distributed around the component 22. In this way, the first section 32a is arranged on the first heat conducting plate 31, and the first heat conducting plate 31 is in contact with the first section 32a to transfer heat to the first section 32a, and the second section 32b and the first heat conducting plate 31 are arranged at intervals along the thickness direction of the circuit board 21, and in the thickness direction of the circuit board 21, the second section 32b can be located as much as possible in the middle of the component 22, and the heat generated by the component 22 can be transferred to the second section 32b more evenly, so as to avoid the situation where the local temperature difference is large and the heat dissipation effect is affected.

[0047] Among them, the first section 32a and the second section 32b form a height difference along the thickness direction of the circuit board 21, so the end for introducing the coolant can be set lower, and the end for discharging the coolant can be set higher, or vice versa. This embodiment does not make specific limitations on this.

[0048] Optionally, the second section 32 b is distributed around the component 22 , or the first section 32 a and the second section 32 b are distributed simultaneously. This can be selected according to actual conditions, and this embodiment does not specifically limit this.

[0049] Exemplarily, the cooling pipes 32 distributed around the components 22 and the components 22 are filled with thermally conductive adhesive (not shown). In this way, on the one hand, the thermally conductive adhesive between the cooling pipes 32 and the components 22 can be used as a heat-conducting medium, so that the heat generated by the components 22 can be transferred to the cooling pipes 32 more efficiently, thereby improving the heat dissipation efficiency. On the other hand, the thermally conductive adhesive can make the components 22 and the cooling pipes 32 relatively fixed, thereby preventing the cooling pipes 32 from shaking and hitting the components 22 under the action of external forces, thereby causing damage to the components 22, and can buffer the tiny vibrations generated by the cooling pipes 32 when the coolant is introduced and discharged, thereby enabling the components 22 to operate stably.

[0050] Furthermore, in order to prevent the thermal conductive adhesive from overflowing outside the circuit board 21 while filling the thermal conductive adhesive, a baffle can be arranged around the circuit board 21, so that a receiving cavity is formed between the baffle and the circuit board 21, and the components 22 and the cooling pipe 32 are placed within the receiving cavity to fill the thermal conductive adhesive.

[0051] Optionally, the components 22 include at least one or more of an inductor 22a, a capacitor 22b, a resistor and a MOS tube. This embodiment provides a variety of different types of components 22, which can be selected according to actual conditions, and this embodiment does not specifically limit this.

[0052] Exemplarily, the liquid cooling assembly 30 further includes a second heat conducting plate 33, which is disposed on the first heat conducting plate 31, and the second heat conducting plate 33 is at an angle to the first heat conducting plate 31, and the second heat conducting plate 33 is located on one side of a component 22 with the largest heat generation among the multiple components 22. This embodiment is described by taking the inductor 22a as an example of a component 22 with the largest heat generation among the multiple components 22, that is, the second heat conducting plate 33 is located on one side of the inductor 22a. In this way, when the power module 20 is running, the inductor 22a is a component 22 that generates a large amount of heat. By further providing the second heat conducting plate 33, the heat generated by the inductor 22a can also be transferred to the first heat conducting plate 31 through the second heat conducting plate 33, and transferred and dissipated through the cooling pipe 32 disposed on the first heat conducting plate 31, thereby avoiding the occurrence of a situation where the temperature of a local component 22 (such as the inductor 22a) is high.

[0053] In some other embodiments, the second heat conducting plate 33 may be disposed on one side of other components 22, such as resistors, capacitors 22b, etc., according to actual heat generation of the components 22, which is not specifically limited in this embodiment.

[0054] For example, the first heat conducting plate 31 is provided with a hollow portion (not shown), which is arranged corresponding to the components 22, and is used to avoid the components 22. In this way, the components 22 can be normally arranged on the circuit board 21 by avoiding the components 22 through the hollow portion, and the first heat conducting plate 31 does not need to be bent at the position of the components 22 and arranged away from the circuit board 21. The first heat conducting plate 31 can be closely attached to the circuit board 21, and the efficiency of heat transfer is high.

[0055] In some embodiments, such as Figure 3 and Figure 4 As shown, the liquid cooling component 30 has a liquid inlet 30a and a liquid outlet 30b, and the cabinet 10 is provided with a liquid supply pipe (not shown) and a return pipe (not shown). The liquid supply pipe is used to communicate with the liquid inlet 30a to pass cooling liquid into the liquid inlet 30a when the liquid cooling component 30 and the power module 20 are integrally installed in the cabinet 10, and the return pipe is used to communicate with the liquid outlet 30b to receive the cooling liquid discharged from the liquid outlet 30b when the liquid cooling component 30 and the power module 20 are integrally installed in the cabinet 10. In this way, by presetting the liquid supply pipe and the return pipe in the cabinet 10, when the liquid cooling component 30 and the power module 20 are integrally installed in the cabinet 10 by pulling, the liquid inlet 30a and the liquid supply pipe, and the liquid outlet 30b and the return pipe can be quickly docked and installed. When the liquid cooling assembly 30 and the power supply module 20 are removed from the cabinet 10 as a whole by pulling, the liquid inlet 30a and the liquid supply pipe can be quickly separated and disassembled, and the liquid outlet 30b and the return pipe can be quickly separated and disassembled. The overall disassembly and installation efficiency of the power supply device 100 is high and the operation is simple.

[0056] Exemplarily, one of the liquid inlet 30a and the liquid supply pipe is provided with a first quick connector (not shown) located outside the power module 20, and the first quick connector is used to achieve a detachable connection between the liquid inlet 30a and the liquid supply pipe when the liquid cooling assembly 30 and the power module 20 are integrally installed in the cabinet 10, and one of the liquid outlet 30b and the return pipe is provided with a second quick connector (not shown) located outside the power module 20, and the second quick connector is used to achieve a detachable connection between the liquid outlet 30b and the return pipe when the liquid cooling assembly 30 and the power module 20 are integrally installed in the cabinet 10. In this way, when the liquid cooling assembly 30 and the power module 20 are integrally installed in the cabinet 10, the first quick connector can achieve a quick docking installation between the liquid inlet 30a and the liquid supply pipe, and the second quick connector can achieve a quick docking installation between the liquid outlet 30b and the return pipe. When the liquid cooling assembly 30 and the power module 20 are detached from the cabinet 10 as a whole, the first quick connector can realize the rapid separation and disassembly of the liquid inlet 30a and the liquid supply pipe, and the second quick connector can realize the rapid separation and disassembly of the liquid outlet 30b and the return pipe.

[0057] Furthermore, by distributing the first quick connector and the second quick connector at positions outside the circuit board 21 (i.e., the projections of the first quick connector and the second quick connector on the plane where the circuit board 21 is located are located outside the circuit board 21), it is possible to prevent the coolant remaining in the first quick connector and the second quick connector from dripping onto the circuit board 21 when the first quick connector and the second quick connector are disassembled, thereby causing the circuit board 21 to be short-circuited and damaged. It is also possible to prevent the coolant leaking from dripping onto the circuit board 21 due to sealing problems when the first quick connector and the second quick connector are passed into or discharged from the coolant during use, thereby causing the circuit board 21 to be short-circuited and damaged.

[0058] Among them, the quick connector is also called a quick connector, which is a connector that can connect or disconnect pipes without tools. Quick connectors can be divided into: quick connectors for air, quick connectors for oxygen fuel gas, quick connectors for gas and liquid, quick connectors for oil pressure, quick connectors for inert gas, quick connectors for cooling water temperature oil, semiconductor quick connectors, etc. The quick connector of this embodiment can be a quick connector for cooling water temperature oil.

[0059] In order to realize that the liquid cooling assembly 30 and the power module 20 can be pulled relative to the cabinet 10 as a whole, this embodiment includes but is not limited to the following methods:

[0060] As an optional embodiment, one of the liquid cooling component 30 and the power module 20 can be slidably disposed on the cabinet 10, so that the liquid cooling component 30 and the power module 20 can be pulled relative to the cabinet 10 as a whole. In this way, by sliding one of the liquid cooling component 30 and the power module 20 on the cabinet 10, when it slides relative to the cabinet 10, it can drive the other to slide relative to the cabinet 10 together, thereby realizing that both can be pulled relative to the cabinet 10 as a whole.

[0061] As another optional embodiment, the power supply device 100 further includes a bearing member (not shown), the bearing member carries the power module 20 and the liquid cooling assembly 30, and the bearing member can be slidably disposed on the cabinet 10 so that the liquid cooling assembly 30 and the power module 20 as a whole can be pulled relative to the cabinet 10. In this way, the power module 20 and the liquid cooling assembly 30 are carried by the bearing member, and the bearing member slides relative to the cabinet 10, while driving the power module 20 and the liquid cooling assembly 30 to slide relative to the cabinet 10, so that the power module 20 and the liquid cooling assembly 30 as a whole can be pulled relative to the cabinet 10. Exemplarily, the cabinet 10 is provided with two guide rails 10a, and the two guide rails 10a are spaced apart on the cabinet 10 along the length direction x of the circuit board, and each guide rail 10a is provided with a slide groove (not shown), and the circuit board 21 and the first heat conducting plate 31 are slidably connected to the slide grooves of the two guide rails 10a. In this way, the sliding grooves of the two guide rails 10a arranged at intervals are slidably connected with the circuit board 21 and the first heat conducting plate 31. On the one hand, the circuit board 21 and the first heat conducting plate 31 can be supported at two opposite sides thereof, and the forces are relatively balanced. On the other hand, the two guide rails 10a located at two opposite sides of the circuit board 21 and the first heat conducting plate 31 can guide and limit, so that the circuit board 21 and the first heat conducting plate 31 slide as a whole along the extension direction of the guide rails 10a, avoiding deviation and affecting the correct installation of the power module 20 and the liquid cooling assembly 30 with the cabinet 10.

[0062] In some other embodiments, rollers may be provided on both sides of the liquid cooling assembly 30 and / or the power module 20, and the rollers may be used to roll on the cabinet 10 to achieve pulling and drawing.

[0063] The first embodiment of the utility model provides a power supply device 100, which dissipates heat from the power supply module 20 by arranging a liquid cooling component 30 on the power supply module 20, and dissipates heat by using the liquid cooling method. The liquid has a high thermal conductivity and a fast heat conduction speed, and the power supply device 100 has a high heat dissipation efficiency, which can prevent the power supply device 100 from being unable to operate normally or even being damaged due to high temperature. Moreover, compared with the existing method of using a fan to dissipate heat, the liquid cooling component 30 runs more quietly when dissipating heat, and can avoid the noise generated by using a fan.

[0064] In addition, the liquid cooling assembly 30 and the power module 20 are integrally pullable and arranged in the cabinet 10. By pulling, the liquid cooling assembly 30 and the power module 20 can be integrally detached from or installed in the cabinet 10, which is easy to disassemble and assemble and convenient for maintenance.

[0065] Embodiment 2

[0066] See also Figure 5 , which is a schematic structural diagram of a charging and discharging device 200 provided in Embodiment 2 of the present utility model. The charging and discharging device 200 includes the power supply device 100 of Embodiment 1.

[0067] The second embodiment of the present invention provides a charging and discharging device 200. The power supply device 100 has a high heat dissipation efficiency, which can prevent the power supply device 100 from being unable to operate normally or even damaged due to high temperature, thereby ensuring the normal operation of the charging and discharging device 200.

[0068] The above is a detailed introduction to a power supply device and a charging and discharging device disclosed in the embodiment of the utility model. This article uses individual examples to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the power supply device and the charging and discharging device of the utility model and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the utility model, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the utility model.

Claims

1. A power supply device, characterized in that: include: Cabinet; Power module; as well as A liquid cooling component is arranged on the power module, and is used to dissipate heat for the source module. The liquid cooling component and the power module can be pulled out and arranged on the cabinet as a whole so that the liquid cooling component and the power module can be detached from the cabinet as a whole.

2. The power supply device according to claim 1, characterized in that: The power module includes a circuit board and components arranged on the circuit board. The liquid cooling assembly includes a first heat conducting plate and a cooling pipe. The first heat conducting plate is stacked on the circuit board. The cooling pipe is at least partially arranged on the first heat conducting plate. The cooling pipe is used for passing and discharging coolant. The cooling pipe is distributed around the components.

3. The power supply device according to claim 2, characterized in that: The cooling pipe includes a first section and a second section that are connected to each other, an end of the first section away from the second section is a first end, an end of the second section away from the second section is a second end, one of the first end and the second end is used for introducing the coolant, and the other is used for discharging the coolant, the first section is arranged on the first heat conducting plate, the second section and the first heat conducting plate are spaced apart along the thickness direction of the circuit board, and at least the second section is distributed around the components.

4. The power supply device according to claim 2, characterized in that: The cooling pipes distributed around the components and the space between the components are filled with heat-conducting glue.

5. The power supply device according to claim 2, characterized in that: The components include at least one or more of an inductor, a capacitor, a resistor and a MOS tube. The liquid cooling assembly also includes a second heat conducting plate, which is arranged on the first heat conducting plate, and there is an angle between the second heat conducting plate and the first heat conducting plate. The second heat conducting plate is located on one side of a component with the highest heat generation among the multiple components.

6. The power supply device according to claim 2, characterized in that: The first heat conducting plate is provided with a hollow portion, the hollow portion is arranged corresponding to the components, and the hollow portion is used to avoid the components.

7. The power supply device according to any one of claims 1 to 6, characterized in that: The liquid cooling component has a liquid inlet and a liquid outlet, and the cabinet is provided with a liquid supply pipe and a return pipe. The liquid supply pipe is used to communicate with the liquid inlet to introduce cooling liquid into the liquid inlet when the liquid cooling component and the power module are installed as a whole in the cabinet, and the return pipe is used to communicate with the liquid outlet to receive the cooling liquid discharged from the liquid outlet when the liquid cooling component and the power module are installed as a whole in the cabinet.

8. The power supply device according to claim 7, characterized in that: One of the liquid inlet and the liquid supply pipe is provided with a first quick connector located outside the power module, and the first quick connector is used to achieve a detachable connection between the liquid inlet and the liquid supply pipe when the liquid cooling component and the power module are installed as a whole in the cabinet. One of the liquid outlet and the return pipe is provided with a second quick connector located outside the power module, and the second quick connector is used to achieve a detachable connection between the liquid outlet and the return pipe when the liquid cooling component and the power module are installed as a whole in the cabinet.

9. The power supply device according to any one of claims 1 to 6, characterized in that: One of the liquid cooling component and the power module can be slidably arranged on the cabinet, so that the liquid cooling component and the power module as a whole can be pulled relative to the cabinet; Alternatively, the power supply device further comprises a carrier, the carrier carrying the power supply module and the liquid cooling assembly, and the carrier can be slidably disposed on the cabinet so that the liquid cooling assembly and the power supply module as a whole can be pulled relative to the cabinet.

10. The power supply device according to any one of claims 2 to 6, characterized in that: The cabinet is provided with two guide rails, which are arranged on the cabinet at intervals along the length direction of the circuit board. Each guide rail is provided with a slide groove, and the circuit board and the first heat conducting plate are slidably connected to the slide grooves of the two guide rails.

11. The power supply device according to any one of claims 1 to 6, characterized in that: The power supply device includes a plurality of power modules and a plurality of liquid cooling components. The plurality of power modules are distributed in the cabinet at intervals, and the plurality of liquid cooling components are respectively arranged corresponding to the plurality of power modules.

12. The power supply device according to claim 11, characterized in that: The cabinet is provided with a liquid supply port and a liquid discharge port, and the cooling pipes of the multiple liquid cooling components are arranged in series in sequence, and the two ends of the multiple cooling pipes in series are respectively connected to the liquid supply port and the liquid discharge port to receive the cooling liquid provided by the liquid supply port and discharge the cooling liquid to the liquid discharge port.

13. A charging and discharging device, characterized in that: Comprising the power supply device according to any one of claims 1 to 12.

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