Chip gluing device

By designing an adjustable fixing mechanism and electric telescopic rod structure in the chip glue coating device, the problem of the cumbersome chip fixing and removal process in the prior art is solved, and stable fixing and convenient removal of chips of different sizes is achieved, and processing is improved Efficiency and applicability of equipment.

CN222469555UActive Publication Date: 2025-02-14WUXI XIHU PRECISION MFG CO LTD
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Patent Information

Application Number
CN202420411888.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-04
Publication Date
2025-02-14
Estimated Expiration
2034-03-04

AI Technical Summary

Technical Problem

The existing chip glue coating devices have cumbersome and difficult problems when fixing and removing chips, especially due to different chip types and large shape differences, which leads to a complicated process of adjusting the fixed size. After applying glue, you need to break apart the fixed block to take the chip. The process is cumbersome.

Method used

A chip glue coating device is designed, using technical means such as fixing mechanisms and electric telescopic rods. Through the adjustable fixed block and push plate structure, the chip can be stably fixed and conveniently removed. The device adjusts the motor and threaded rod, adjusts the distance of the fixed block according to the actual size of the chip, adapts to chips of different sizes, and supports the chip through an electric telescopic rod for easy clamping.

Benefits of technology

The device simplifies the fixing and removal process of the chip, improves processing efficiency, reduces the probability of damage, and adapts to different chip sizes through controllable fixed block distances, improving the flexibility and applicability of the equipment.

✦ Generated by Eureka AI based on patent content.

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    Figure CN222469555U_ABST
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Abstract

The utility model discloses a chip gluing device which comprises a base, a supporting seat is installed at the rear position of the top end of the base, a gluing gun head is movably installed at the front end of the supporting seat through an installation frame, a sliding groove is formed in the top end of the base, a fixing mechanism is arranged in the sliding groove, the fixing mechanism comprises a gluing platform, and the gluing platform is arranged in the sliding groove. The gluing platform is installed in the sliding groove in a sliding connection mode, four movable grooves are formed in the upper end and the lower end of the gluing platform in a penetrating mode, the movable grooves are arranged on the gluing platform at equal intervals, and the interiors of the four movable grooves are all slidably connected with fixing blocks. Electric telescopic rods are installed at the lower positions of the ends, away from the center point of the movable groove, of the four fixing blocks, and the top ends of the electric telescopic rods are fixedly connected with a push plate and the four fixing blocks. The chip gluing device provided by the utility model is convenient to adapt to chip bodies with different sizes, and is convenient to clamp the chip bodies.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip gluing, in particular to a chip gluing device. Background Art

[0002] The glue coating device is an industrial equipment, which is mainly used to coat glue on the surface of an object. Chips refer to all semiconductor components. When installing chips, glue coating devices are needed to coat them.

[0003] When using the existing chip gluing device, springs and fixing blocks are usually used to fix the chip. Since the shapes of different chip types are different, the process of adjusting the fixed size is relatively cumbersome. In addition, the chip is placed flat on the support table during gluing. When taking it out later, the fixing block needs to be pried open and the chip needs to be buckled up, which is a relatively difficult process. Utility Model Content

[0004] The main purpose of the utility model is to provide a chip glue coating device, which can effectively solve the problems in the background technology.

[0005] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0006] A chip glue coating device comprises a base, a support base is installed at the rear position of the top of the base, a glue coating gun head is movably installed at the front end of the support base through a mounting frame, a slide groove is opened at the top of the base, and a fixing mechanism is arranged inside the slide groove;

[0007] The fixing mechanism includes a gluing platform, which is slidably connected and installed inside a slide groove. Four movable grooves are provided through the upper and lower ends of the gluing platform, and the movable grooves are equidistantly arranged on the gluing platform. Fixed blocks are slidably connected inside the four movable grooves. Electric telescopic rods are installed at the lower positions of the ends of the four fixed blocks away from the center points of the movable grooves. A push plate is fixedly connected to the top of the electric telescopic rod. A chip body is provided between the four fixed blocks and at the top of the push plate.

[0008] As a further solution of the utility model, the bottom center position of the gluing platform is rotatably connected to an adjusting threaded rod 2 through a mounting block, and the adjusting threaded rod 2 is threadedly connected to the bottom ends of two of the fixed blocks. An adjusting motor 2 is installed on one side of the bottom end of the gluing platform, and the shaft of the adjusting motor 2 is connected to one end of the adjusting threaded rod 2.

[0009] As a further solution of the utility model, an adjusting threaded rod is rotatably connected to the lower front and rear ends of the mounting block, and the adjusting threaded rod is threadedly connected to the other two fixed blocks. An adjusting motor is installed at the rear end of the bottom end of the gluing platform, and the shaft of the adjusting motor is connected to the rear end of the adjusting threaded rod.

[0010] As a further solution of the present utility model, two sections of threads with the same length and opposite directions are provided on the outer rings of the first adjusting threaded rod and the second adjusting threaded rod, and one end of the first adjusting threaded rod away from the first adjusting motor and one end of the second adjusting threaded rod away from the second adjusting motor are respectively rotationally connected to the glue application platform through bearings.

[0011] As a further solution of the present utility model, the push plate is arranged in a "U" shape, and the push plate is slidably connected to the fixed block. The bottom surface of the push plate is attached to the top surface of the glue application platform, and the top surface of the push plate is attached to the bottom surface of the chip body.

[0012] As a further solution of the present utility model, adjusting blocks are fixedly connected to both sides at the bottom end of the glue application platform. A rotating rod is threadedly connected through the front and rear ends of one of the adjusting blocks. A moving motor is installed at the rear position inside the base, and the shaft of the moving motor is connected to the rear end of the rotating rod. A sliding rod is slidably connected through the front and rear ends of the other adjusting block, and the sliding rod is fixedly connected to the base. A bearing is provided at the connection between the rotating rod and the base, and the rotating rod is rotationally connected to the base through the bearing.

[0013] As a further solution of the present utility model, a drying air duct is installed at the front position at the top end of the base, and an air delivery pipe is connected to the top end of the drying air duct.

[0014] Compared with the prior art, the present utility model has the following beneficial effects:

[0015] By setting the fixing mechanism and the rotating rod, when applying glue to the chip body, the chip body can be fixed through the cooperation of the fixed block and the glue application platform, and through the cooperation of the first adjusting motor, the first adjusting threaded rod, the second adjusting motor and the second adjusting threaded rod, the distance between several fixed blocks can be adjusted according to the actual size of the chip body, so as to facilitate adapting to chip bodies of different sizes;

[0016] By setting the electric telescopic rod, the push plate and the cooperating fixed block, after spraying, the chip body can be pushed upward by the push rod of the electric telescopic rod, so as to avoid the bottom of the chip body being attached to the top surface of the glue application platform, which is convenient for clamping the chip body. At the same time, during the taking process, it is not necessary to扳动 the fixed block to make it away, which improves the processing efficiency. At the same time, the distance between the fixed blocks can be controlled to avoid continuously clamping the chip body inward when using a spring for fixing, thereby reducing the damage probability. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of a chip glue application device of the present utility model;

[0018] Figure 2 It is a cross-sectional view of the internal structure of the base in the overall structure of a chip glue application device of the present utility model;

[0019] Figure 3 The utility model is a schematic diagram of the structure of a fixing mechanism in a chip gluing device.

[0020] In the figure: 1. Base; 2. Support seat; 3. Glue coating gun head; 4. Fixing mechanism; 5. Glue coating platform; 6. Movable groove; 7. Adjustment threaded rod 1; 8. Adjustment motor 1; 9. Fixing block; 10. Electric telescopic rod; 11. Push plate; 12. Chip body; 13. Rotating rod; 14. Moving motor; 15. Drying air duct. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0022] like Figure 1-3 As shown, a chip glue coating device comprises a base 1, a support base 2 is installed at the rear position of the top of the base 1, a glue coating gun head 3 is movably installed at the front end of the support base 2 through a mounting frame, a slide groove is opened at the top of the base 1, and a fixing mechanism 4 is arranged inside the slide groove;

[0023] The fixing mechanism 4 includes a gluing platform 5, which is slidably connected and installed inside the slide groove. Four movable grooves 6 are opened through the upper and lower ends of the gluing platform 5, and the movable grooves 6 are equidistantly arranged on the gluing platform 5. The insides of the four movable grooves 6 are all slidably connected with fixed blocks 9. The four fixed blocks 9 are each installed with an electric telescopic rod 10 at the lower position of one end away from the center point of the movable groove 6. The top of the electric telescopic rod 10 is fixedly connected with a push plate 11. A chip body 12 is arranged between the four fixed blocks 9 and at the top of the push plate 11.

[0024] In this embodiment, an adjusting threaded rod 2 is rotatably connected to the center position of the bottom end of the glue coating platform 5 through a mounting block, and the adjusting threaded rod 2 is threadedly connected to the bottom ends of two of the fixed blocks 9. An adjusting motor 2 is installed on one side of the bottom end of the glue coating platform 5, and the shaft of the adjusting motor 2 is connected to one end of the adjusting threaded rod 2. By starting the adjusting motor 2, the shaft of the adjusting motor 2 rotates, driving the adjusting threaded rod 2 to rotate, thereby pushing two of the fixed blocks 9 away from and close to each other, making it easy to adjust the position of the fixed block 9.

[0025] In this embodiment, an adjusting screw rod 7 is rotatably connected to a position near the lower part of the front and rear ends of the mounting block, and the adjusting screw rod 7 is threadedly connected to the other two fixing blocks 9. An adjusting motor 8 is installed at a position near the rear end of the bottom end of the glue application platform 5, and the shaft of the adjusting motor 8 is connected to the rear end of the adjusting screw rod 7. By starting the adjusting motor 8, the adjusting screw rod 7 is driven to rotate, so that the other two fixing blocks 9 move away from and close to each other, and their positions are adjusted, facilitating the adjustment of the fixing size according to the size of the chip body 12.

[0026] In this embodiment, two sections of threads with the same length and opposite directions are provided on the outer circles of the adjusting screw rod 7 and the adjusting screw rod 2, and one end of the adjusting screw rod 7 away from the adjusting motor 8 and one end of the adjusting screw rod 2 away from the adjusting motor 2 are respectively rotatably connected to the glue application platform 5 through bearings, which can avoid the influence of the glue application platform 5 on the rotation of the adjusting screw rod 7 and the other adjusting screw rod, and improve the rotation stability.

[0027] In this embodiment, the push plate 11 is arranged in a "U" shape, and the push plate 11 is slidably connected to the fixing block 9. The bottom surface of the push plate 11 is attached to the top surface of the glue application platform 5, and the top surface of the push plate 11 is attached to the bottom surface of the chip body 12. By the push rod of the electric telescopic rod 10 extending out, the push plate 11 is driven to move upward, so as to lift the chip body 12, facilitating the clamping of the chip body 12.

[0028] In this embodiment, adjusting blocks are fixedly connected to both sides near the bottom end of the glue application platform 5. A rotating rod 13 is threadedly connected to the front and rear ends of one of the adjusting blocks. A moving motor 14 is installed at a position near the rear end inside the base 1, and the shaft of the moving motor 14 is connected to the rear end of the rotating rod 13. A sliding rod is slidably connected to the front and rear ends of the other adjusting block, and the sliding rod is fixedly connected to the base 1. A bearing is arranged at the connection between the rotating rod 13 and the base 1, and the rotating rod 13 is rotatably connected to the base 1 through the bearing. By starting the moving motor 14, the moving motor 14 drives the rotating rod 13 to rotate, so as to drive the glue application platform 5 to slide inside the base 1, facilitating the adjustment of the position of the chip body 12. And through the arranged sliding rod, the stability of the glue application platform 5 during the moving process is improved, and its deviation is avoided.

[0029] In this embodiment, a drying air duct 15 is installed at a position near the front end of the top end of the base 1, and an air delivery pipe is connected to the top end of the drying air duct 15. By connecting an external drying air duct to the air delivery pipe on the drying air duct 15, the drying air is conveyed to the drying air duct 15, and the chip body 12 after glue application can be dried when it is below the drying air duct 15.

[0030] It should be noted that the utility model is a chip glue coating device. When in use, first, the base 1 can be moved to a suitable position as needed, and then the chip to be sprayed can be fixed to the movable groove 6, and it is ensured that the chip body 12 is between the multiple fixed blocks 9, and at the same time, it is ensured that the bottom surface of the chip body 12 is in contact with the top surfaces of the multiple push plates 11. After the chip body 12 is fixed, the moving motor 14 can be started as needed, and the moving motor 14 drives the rotating rod 13 to rotate, thereby driving the glue coating platform 5 to slide inside the base 1, which plays a role in adjusting the position of the chip body 12. The chip body 12 can be adjusted to the bottom of the glue coating gun head 3, and then the spraying process is carried out;

[0031] After spraying, the mobile motor 14 can be reversed and started again as needed to drive the chip body 12 away from the glue gun head 3, and the chip body 12 can be adjusted to the bottom of the drying air duct 15 according to actual needs. At the same time, the external drying air duct is pre-connected with the air delivery duct on the drying air duct 15, so that the drying air is delivered to the drying air duct 15. When the chip body 12 passes by, it plays a role in drying it. In addition, according to the above steps, by controlling the mobile motor 14, the chip body 12 can be moved back and forth under the drying air duct 15 for drying;

[0032] After the chip body 12 is coated with glue, the chip body 12 can be adjusted to a suitable position as needed, and then the electric telescopic rod 10 can be started. Since the bottom of the push plate 11 is connected to the top of the push rod of the electric telescopic rod 10, the push plate 11 can be lifted by extending the push rod of the electric telescopic rod 10, thereby lifting the chip body 12 upward, and then the chip body 12 can be clamped to prevent its bottom surface from being attached to the glue coating platform 5, which affects the taking;

[0033] When the fixed size of the fixing block 9 is adjusted according to the size of the chip body 12, the adjusting motor 1 8 and the adjusting motor 2 can be started as needed. Since multiple fixing blocks 9 are threadedly connected with the adjusting threaded rod 1 7 and the adjusting threaded rod 2, the adjusting threaded rod 1 7 and the adjusting threaded rod 2 can be driven to rotate by rotating the machine shaft, thereby pushing the multiple fixing blocks 9 away from and close to each other and adjusting their positions. The position of the fixing block 9 can be adjusted to the four sides of the chip body 12 as needed to fix it to prevent the chip body 12 from shaking during glue coating.

[0034] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A chip glue coating device, comprising a base (1), a support base (2) is installed at the rear position of the top of the base (1), a glue coating gun head (3) is movably installed at the front end of the support base (2) through a mounting frame, and a slide groove is opened at the top of the base (1), characterized in that: A fixing mechanism (4) is arranged inside the sliding groove; The fixing mechanism (4) includes a glue - applying platform (5). The glue - applying platform (5) is slidably connected and installed inside the sliding groove. Four moving grooves (6) are opened through the upper and lower ends of the glue - applying platform (5), and the moving grooves (6) are arranged at equal intervals on the glue - applying platform (5). Fixing blocks (9) are slidably connected inside the four moving grooves (6). At a position near the lower end of one end of each of the four fixing blocks (9) away from the center point of the moving groove (6), an electric telescopic rod (10) is installed. The top end of the electric telescopic rod (10) is fixedly connected to a push plate (11). A chip body (12) is arranged between the four fixing blocks (9) and at the top of the push plate (11).

2. A chip glue coating device according to claim 1, characterized in that: At the middle position of the bottom end of the glue - applying platform (5), a second adjusting threaded rod is rotatably connected through a mounting block, and the second adjusting threaded rod is threadedly connected to the bottom ends of two of the fixing blocks (9). At a position near one side of the bottom end of the glue - applying platform (5), a second adjusting motor is installed, and the shaft of the second adjusting motor is connected to one end of the second adjusting threaded rod.

3. A chip glue coating device according to claim 2, characterized in that: A first adjusting threaded rod (7) is rotatably connected through the lower positions of the front and rear ends of the mounting block, and the first adjusting threaded rod (7) is threadedly connected to the other two fixing blocks (9). At the rear position of the bottom end of the glue - applying platform (5), a first adjusting motor (8) is installed, and the shaft of the first adjusting motor (8) is connected to the rear end of the first adjusting threaded rod (7).

4. A chip glue coating device according to claim 3, characterized in that: Two sections of threads with the same length and opposite directions are provided on the outer circles of both the first adjusting threaded rod (7) and the second adjusting threaded rod. One end of the first adjusting threaded rod (7) away from the first adjusting motor (8) and one end of the second adjusting threaded rod away from the second adjusting motor are respectively rotatably connected to the glue - applying platform (5) through bearings.

5. The chip glue coating device according to claim 1, characterized in that: The push plate (11) is arranged in a "U" shape and is slidably connected to the fixing block (9). The bottom surface of the push plate (11) is in contact with the top surface of the glue - applying platform (5), and the top surface of the push plate (11) is in contact with the bottom surface of the chip body (12).

6. The chip glue coating device according to claim 1, characterized in that: Adjusting blocks are fixedly connected to both sides near the bottom end of the glue - applying platform (5). A rotating rod (13) is threadedly connected through the front and rear ends of one of the adjusting blocks. A moving motor (14) is installed at the rear position inside the base (1), and the shaft of the moving motor (14) is connected to the rear end of the rotating rod (13). A sliding rod is slidably connected through the front and rear ends of the other adjusting block, and the sliding rod is fixedly connected to the base (1). A bearing is arranged at the connection between the rotating rod (13) and the base (1), and the rotating rod (13) is rotatably connected to the base (1) through the bearing.

7. The chip glue coating device according to claim 1, characterized in that: A drying air duct (15) is installed at the front position of the top end of the base (1), and an air delivery pipe is connected to the top end of the drying air duct (15).