Wafer position detection device

Abstract

The embodiment of the utility model provides a wafer position detection device, which comprises a cavity, the top of the cavity is provided with a cavity cover, the cavity is internally provided with a placing mechanism, and the placing mechanism is provided with a plurality of placing positions for placing wafers; the at least three groups of sensors are not located on the same straight line, the sensors are arranged on the cavity cover, and the sensors are used for emitting detection light rays and receiving reflected light rays of the detection light rays; and the at least three groups of light reflecting parts are not located on the same straight line, the light reflecting parts are arranged at the bottom in the cavity, and the light reflecting parts correspond to the sensors and are used for reflecting the detection light rays emitted by the corresponding sensors. When the wafer is in a normal position, the light reflecting parts normally reflect the detection light, at the moment, the sensors output high voltage, and when the wafer deviates from the normal position, the wafer is located between the at least one group of sensors and the corresponding light reflecting parts, so that the at least one group of light reflecting parts cannot emit the detection light, and the sensors output low voltage to give an alarm.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a wafer position detection device. Background Art

[0002] In the semiconductor manufacturing process, it is often necessary to use a robotic arm to store and retrieve silicon carbide wafers on the elevator. At present, the existing P5000 machine does not have the function of detecting whether the wafer is in the correct position. When the silicon carbide wafer is abnormally positioned in the common chamber elevator, the arm is likely to directly scratch the wafer when taking it, or even cause fragments; even if the arm can transfer the wafer into the chamber for processing, the thickness and uniformity will be abnormal due to position deviation. Summary of the invention

[0003] In view of this, an embodiment of the present specification provides a wafer position detection device, which is used to place the wafer through a placement mechanism, a plurality of sensors are arranged above the placement mechanism, and a plurality of reflective parts corresponding to the plurality of sensors are arranged below the placement mechanism. When the wafer is in a normal position, the reflective parts normally reflect the detection light, and the sensor outputs a high voltage at this time. When the wafer deviates from the normal position, the wafer is between at least one group of sensors and the corresponding reflective parts, so that at least one group of reflective parts cannot emit the detection light, and the sensor outputs a low voltage to alarm.

[0004] The embodiments of this specification provide the following technical solutions: a wafer position detection device, comprising:

[0005] A cavity, wherein a cavity cover is disposed on the top of the cavity, a placement mechanism is disposed in the cavity, and a plurality of placement positions for placing wafers are disposed on the placement mechanism;

[0006] At least three groups of sensors, at least three groups of sensors are not located on the same straight line, the sensors are arranged on the cavity cover, and the sensors are used to emit detection light and receive reflected light of the detection light;

[0007] At least three groups of reflective parts, at least three groups of reflective parts are not on the same straight line, the reflective parts are arranged at the bottom of the cavity, the reflective parts correspond to the sensors, and are used to reflect the detection light emitted by the corresponding sensors;

[0008] Among them, when the wafer is in the placement position, the reflecting part normally reflects the detection light. When the wafer deviates from the placement position, the wafer is between at least one group of the sensors and the corresponding reflecting part, so that at least one group of the reflecting parts cannot emit the detection light.

[0009] Preferably, the sensor is arranged above the placement mechanism, and the reflective portion is arranged below the placement mechanism.

[0010] Preferably, the sensor is arranged on a side of the cavity cover close to the placement mechanism, and the reflective portion is arranged on the inner bottom wall of the cavity.

[0011] Preferably, the sensors are arranged in four groups, and the four groups of sensors are evenly distributed in a circle;

[0012] And / or, the reflective portions are provided in four groups, and the four groups of reflective portions are evenly distributed in a circle.

[0013] Preferably, the four groups of reflective portions are respectively located directly below the four groups of sensors.

[0014] Preferably, the sensor is a fiber optic sensor.

[0015] Preferably, the detection device further comprises at least three groups of optical fiber amplifiers, and the optical fiber amplifiers are electrically connected to the optical fiber sensors.

[0016] Preferably, the placement mechanism comprises an elevator, and the elevator is provided with a plurality of sheet slots, and the plurality of sheet slots are distributed in sequence from top to bottom to form a plurality of placement positions.

[0017] Preferably, the reflective portion includes one of a reflective plate, a reflective mirror, and a reflective sheet.

[0018] Preferably, the cavity cover is a transparent cavity cover.

[0019] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification include at least:

[0020] A placement mechanism is used to place the wafer, a plurality of sensors are arranged above the placement mechanism, and a plurality of reflective parts corresponding to the plurality of sensors are arranged below the placement mechanism. When the wafer is in a normal position, the reflective parts normally reflect the detection light, and the sensor outputs a high voltage at this time. When the wafer deviates from the normal position, the wafer is between at least one group of sensors and the corresponding reflective parts, so that at least one group of reflective parts cannot emit the detection light, and the sensor outputs a low voltage to alarm. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a structural schematic diagram of a wafer position detection device provided by the present application;

[0023] Figure 2 It is a schematic diagram of the position distribution of the reflective part and the placement mechanism of the wafer position detection device provided in the present application.

[0024] In the figure, 1. cavity; 2. placement mechanism; 3. placement position; 4. cavity cover; 5. sensor; 6. reflective part. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0026] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0027] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on the present application, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspect described herein can be used to implement the device and / or practice the method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this device and / or practice this method.

[0028] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present application. The drawings only show components related to the present application rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0029] Additionally, in the following description, specific details are provided to facilitate a thorough understanding of the examples. However, it will be understood by those skilled in the art that the aspects described may be practiced without these specific details.

[0030] The technical solutions provided by various embodiments of the present application are described below in conjunction with the accompanying drawings.

[0031] like Figure 1-Figure 2 As shown, a wafer position detection device includes:

[0032] A cavity 1, a cavity cover 4 is arranged on the top of the cavity 1, a placement mechanism 2 is arranged in the cavity 1, and a plurality of placement positions 3 for placing wafers are arranged on the placement mechanism 2;

[0033] At least three groups of sensors 5, at least three groups of sensors 5 are not located on the same straight line, the sensors 5 are arranged on the cavity cover 4, and the sensors 5 are used to emit detection light and receive reflected light of the detection light;

[0034] At least three groups of reflective parts 6, at least three groups of reflective parts 6 are not on the same straight line, the reflective parts 6 are arranged at the bottom of the cavity 1, the reflective parts 6 correspond to the sensors 5, and are used to reflect the detection light emitted by the corresponding sensors 5;

[0035] Among them, when the wafer is in the placement position 3, the reflecting part 6 normally reflects the detection light. When the wafer deviates from the placement position 3, the wafer is between at least one group of the sensors 5 and the corresponding reflecting part 6, so that at least one group of the reflecting part 6 cannot emit the detection light.

[0036] A placement mechanism 2 is used to place wafers, at least three sensors 5 that are not on the same straight line are arranged on the cavity cover 4, and multiple reflective parts 6 corresponding to the multiple sensors 5 are arranged on the bottom of the cavity 1. When the wafer is in a normal position, the reflective part 6 normally reflects the detection light, and the sensor 5 outputs a high voltage at this time. When the wafer deviates from the normal position, the deviated wafer is between at least one group of sensors 5 and the corresponding reflective part 6, thereby blocking the reflective part 6, so that at least one group of reflective parts 6 cannot emit the detection light, and the sensor 5 outputs a low voltage to alarm.

[0037] It should be noted that the circle determined by the centers of the three groups of sensors 5 is larger than the circle formed by the placement position 3 to ensure that the wafer will not be isolated between the sensor 5 and the corresponding reflective portion 6 when it is on the placement position 3 .

[0038] like Figure 1-Figure 2As shown, in some embodiments, the sensor 5 is arranged above the placement mechanism 2, and the reflecting part 6 is arranged below the placement mechanism 2. By arranging the sensor 5 above the placement mechanism 2 and the reflecting part 6 below the placement mechanism 2, the placement mechanism 2 is located between the sensor 5 and the reflecting part 6. This ensures that no matter where the wafer position deviates, the wafer is located between the sensor 5 and the reflecting part 6, and the wafer will block the detection light emitted by the sensor 5, so that the reflecting part 6 cannot emit the detection light.

[0039] like Figure 1-Figure 2 As shown, in some embodiments, the sensor 5 is arranged on the side of the cavity cover 4 close to the placement mechanism 2, and the reflecting portion 6 is arranged at the inner bottom wall of the cavity 1. By arranging the sensor 5 on the inner side of the cavity cover 4, the cavity cover 4 will not affect the sensor 5. The reflecting portion 6 is arranged on the inner bottom wall of the cavity 1. The position of the reflecting portion 6 is fixed and will not change. It will not move up and down with the placement mechanism 2, and will not be disturbed by other factors, such as the placement position 3 is not placed properly, etc., which makes it convenient to maintain the placement mechanism 2 without disassembly.

[0040] It should be noted that the reflective portion 6 may also be disposed below the inner wall of the cavity 1 , as long as the reflective portion 6 is located below the lowest placement position 3 .

[0041] like Figure 1-Figure 2 As shown, in some embodiments, the sensors 5 are provided in four groups, and the four groups of sensors 5 are evenly distributed in a circle; the reflective parts 6 are provided in four groups, and the four groups of reflective parts 6 are evenly distributed in a circle. By providing four groups of sensors 5 and four groups of reflective parts 6, the four groups of sensors 5 and the four groups of reflective parts 6 are all evenly distributed in a circle, and the four groups of sensors 5 and the four groups of reflective parts 6 can realize position detection of all orientations of the wafer.

[0042] It should be noted that, in other implementations, the number of sensors 5 may also be three groups, five groups, or other numbers, which can be set according to actual conditions.

[0043] like Figure 1-Figure 2 As shown, in some embodiments, the four groups of reflective portions 6 are respectively located directly below the four groups of sensors 5. The four groups of reflective portions 6 are arranged directly below the four groups of sensors 5 to ensure that when the wafer position is not deviated, the reflective portions 6 can reflect the detection light emitted by the sensor 5.

[0044] In some embodiments, the sensor 5 is a fiber optic sensor 5, which has extremely high sensitivity and can accurately sense tiny changes in physical quantities. It can also be used in various harsh environments such as high temperature, high pressure, strong magnetic interference, corrosion, etc., and has excellent stability and reliability.

[0045] In some embodiments, the detection device further includes at least three groups of optical fiber amplifiers, which are electrically connected to the optical fiber sensors 5. By providing an optical fiber amplifier electrically connected to each group of optical sensors 5, the optical signal of the optical sensor 5 can be amplified, thereby enhancing the intensity or power of the optical signal to ensure that the signal does not lose information due to attenuation during transmission.

[0046] like Figure 1 As shown, in some embodiments, the placement mechanism 2 includes an elevator, and a plurality of wafer slots are arranged on the elevator. The plurality of wafer slots are distributed from top to bottom to form a plurality of placement positions 3. The position height of the wafer is adjusted by lifting and lowering the elevator. A plurality of wafer slots are installed on the elevator to facilitate the placement of the wafer.

[0047] In some embodiments, the reflecting portion 6 includes one of a reflective plate, a reflective mirror, and a reflective sheet. In this embodiment, the reflecting portion 6 is a reflective plate, and the reflective plate is directly mounted on the inner bottom wall of the cavity 1. In other embodiments, the reflecting portion 6 can also be a reflective object such as a reflective mirror and a reflective sheet, which can be selected according to actual conditions.

[0048] In some embodiments, the cavity cover 4 is a transparent cavity cover 4 . By providing the cavity cover 4 with a transparent cover, the situation inside the cavity 1 can be directly observed.

[0049] The same or similar parts between the various embodiments in this specification can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the method embodiment described later, since it corresponds to the system, the description is relatively simple, and the relevant parts can be referred to the partial description of the system embodiment.

[0050] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A wafer position detection device, characterized in that: include: A cavity, wherein a cavity cover is disposed on the top of the cavity, a placement mechanism is disposed in the cavity, and a plurality of placement positions for placing wafers are disposed on the placement mechanism; At least three groups of sensors, at least three groups of sensors are not located on the same straight line, the sensors are arranged on the cavity cover, and the sensors are used to emit detection light and receive reflected light of the detection light; At least three groups of reflective parts, at least three groups of reflective parts are not on the same straight line, the reflective parts are arranged at the bottom of the cavity, the reflective parts correspond to the sensors, and are used to reflect the detection light emitted by the corresponding sensors; Among them, when the wafer is in the placement position, the reflecting part normally reflects the detection light. When the wafer deviates from the placement position, the wafer is between at least one group of the sensors and the corresponding reflecting part, so that at least one group of the reflecting parts cannot emit the detection light.

2. The wafer position detection device according to claim 1, characterized in that: The sensor is arranged above the placing mechanism, and the reflecting part is arranged below the placing mechanism.

3. The wafer position detection device according to claim 2, characterized in that: The sensor is arranged on a side of the cavity cover close to the placement mechanism, and the reflective portion is arranged on the inner bottom wall of the cavity.

4. The wafer position detection device according to any one of claims 1 to 3, characterized in that: The sensors are arranged in four groups, and the four groups of sensors are evenly distributed in a circle; And / or, the reflective portions are provided in four groups, and the four groups of reflective portions are evenly distributed in a circle.

5. The wafer position detection device according to claim 4, characterized in that: The four groups of reflective parts are respectively located directly below the four groups of sensors.

6. The wafer position detection device according to claim 1, characterized in that: The sensor is an optical fiber sensor.

7. The wafer position detection device according to claim 6, characterized in that: The detection device further comprises at least three groups of optical fiber amplifiers, and the optical fiber amplifiers are electrically connected to the optical fiber sensors.

8. The wafer position detection device according to claim 1, characterized in that: The placement mechanism comprises an elevator, on which a plurality of sheet slots are arranged, and the plurality of sheet slots are sequentially distributed from top to bottom to form a plurality of placement positions.

9. The wafer position detection device according to claim 1, characterized in that: The reflective portion includes one of a reflective plate, a reflective mirror, and a reflective sheet.

10. The wafer position detection device according to claim 1, characterized in that: The cavity cover is a transparent cavity cover.

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