Bottom protection plate, battery pack frame, battery pack and electric equipment

Abstract

The utility model belongs to the technical field of battery packs, and provides a bottom protection plate, a battery pack frame, a battery pack and electric equipment.The bottom protection plate mainly comprises a buffer layer, a first surface layer, a net-shaped structure layer and a second surface layer, the net-shaped structure layer is clamped between the first surface layer and the second surface layer, and the first surface layer and the second surface layer are bonded to each other; the side surface of the bottom of the buffer layer is bonded with the first surface layer, and the side surface of the top of the buffer layer is arranged to be a bonding connecting surface for connecting external equipment; the side face of the bottom of the second surface layer is arranged to be a collision contact face. According to the scheme, the protection performance of the formed bottom protection plate can be improved conveniently, and the influence of collision acting force on external equipment is reduced; and moreover, the integral forming is simpler and more convenient, and the application cost and the corresponding process difficulty can be conveniently reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of battery packs, and specifically, relates to a bottom guard plate, a battery pack frame, a battery pack and electrical equipment. Background Art

[0002] At present, in order to reduce the impact of bottom ball hits and collisions that may occur during driving, a bottom guard plate is usually installed at the bottom of the vehicle. The bottom guard plate in traditional technology is usually made of metal materials, such as steel, aluminum alloy, etc. However, in this application form, the metal bottom guard plate needs to be anti-corrosion processed; moreover, the bottom guard plate is usually installed with bolts, and hundreds of bolts are required in the general fixing scheme, which has a high overall application cost and increases the difficulty of the production process. Utility Model Content

[0003] In order to overcome at least one disadvantage of the above-mentioned prior art, the purpose of the present application is to provide a bottom guard plate, a battery pack frame, a battery pack and an electrical device.

[0004] The technical means adopted by this application to solve the above technical problems are:

[0005] The embodiment of the present application provides a bottom guard plate, comprising a buffer layer, a first surface layer, a mesh structure layer and a second surface layer, wherein the mesh structure layer is sandwiched between the first surface layer and the second surface layer, and the first surface layer and the second surface layer are bonded to each other;

[0006] The bottom side surface of the buffer layer is bonded to the first surface layer, and the top side surface of the buffer layer is configured as a bonding connection surface for connecting to an external device;

[0007] The bottom side surface of the second surface layer is configured as a collision contact surface.

[0008] In the embodiment scheme of the present application, by setting the mesh structure layer, the protective performance of the bottom guard plate after molding can be improved; by setting the buffer layer, the force after the collision can be buffered and absorbed to reduce the impact of the collision force on external equipment; moreover, the internal structure layers of the bottom guard plate and the bottom guard plate and external equipment are connected by bonding, which makes the overall molding simpler and more convenient, and can reduce the application cost and the corresponding process difficulty.

[0009] In some embodiments, a honeycomb structure is disposed in the buffer layer.

[0010] In the embodiment of the present application, the formed honeycomb structure can improve the buffer performance of the buffer layer.

[0011] In some embodiments, the buffer layer includes a plurality of monomer tubes, and the plurality of monomer tubes are bonded to each other on the surface to form the honeycomb structure.

[0012] In the embodiment of the present application, a plurality of the monomer tubes are bonded together to form the honeycomb structure, so that the manufacturing and forming of the buffer layer can be simpler and more convenient.

[0013] In some embodiments, the mesh structure layer includes at least one protective mesh layer made of metal material.

[0014] In the embodiment of the present application, by providing the protective mesh layer, it is possible to improve the force strength between the first surface layer and the second surface layer after bonding.

[0015] In some embodiments, the thickness of the mesh structure layer is less than the sum of the thicknesses of the first surface layer and the second surface layer.

[0016] In the embodiment of the present application, by designing the thickness of the mesh structure layer, the mesh structure layer can be effectively embedded between the first surface layer and the second surface layer after the bottom guard plate is formed.

[0017] On the other hand, the embodiment of the present application provides a battery pack frame, including a frame bottom plate and the bottom guard plate;

[0018] The bonding connection surface is bonded to the bottom side surface of the frame bottom plate.

[0019] In the embodiment scheme of the present application, the bottom guard plate can be bonded and fixed to the frame bottom plate by bonding the bonding connection surface with the frame bottom plate. Compared with the method of setting openings and fixing with bolts in traditional technology, the present application scheme can avoid the problems of increased difficulty in sealing design and cumbersome bolt installation operation caused by openings, and has better application benefits.

[0020] In some embodiments, a cooling channel for circulating coolant is integrated in the frame bottom plate.

[0021] In the embodiment of the present application, by providing the cooling channel in the frame bottom plate, the frame bottom plate can also serve as a cooling plate, thereby improving the integration of the battery pack frame.

[0022] In some embodiments, a modified film layer is disposed between the frame bottom plate and the bottom guard plate.

[0023] In the embodiment of the present application, by setting the modified film layer, the bonding reliability between the bottom guard plate and the frame bottom plate can be improved.

[0024] On the other hand, an embodiment of the present application provides a battery pack, in which the battery pack frame as described above is disposed.

[0025] In the embodiment of the present application, by applying the battery pack frame to a battery pack product, it is possible to reduce the manufacturing cost and assembly difficulty of the battery pack and improve production efficiency.

[0026] On the other hand, the embodiment of the present application provides an electrical device, the bottom of which is provided with the bottom guard plate as described above;

[0027] Or, a battery pack as described above is arranged therein.

[0028] In the embodiment scheme of the present application, by applying the bottom guard plate provided in the embodiment scheme to the electrical equipment, the electrical equipment can better cope with ball hits and collisions from the bottom during application, thereby improving the degree of protection, and the assembly process can be simpler and more convenient, with better application benefits. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0030] Figure 1 This is a schematic diagram of the assembly of the bottom guard plate of this application.

[0031] Figure 2 This is a schematic diagram of the cross-sectional structure of the bottom guard plate of this application.

[0032] Marking Description:

[0033] 1-buffer layer, 11-monotube;

[0034] 2- first surface layer;

[0035] 3-net structure layer, 31-protective net layer;

[0036] 4- second surface layer;

[0037] 5-Frame base plate. DETAILED DESCRIPTION

[0038] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.

[0039] It should be noted that: unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0040] like Figure 1 , 2 As shown, in this embodiment, a bottom guard plate is provided, including a buffer layer 1, a first surface layer 2, a mesh structure layer 3 and a second surface layer 4.

[0041] Among them, the mesh structure layer 3 is sandwiched between the first surface layer 2 and the second surface layer 4, and the first surface layer 2 and the second surface layer 4 are bonded to each other to achieve relative fixation between the first surface layer 2 and the second surface layer 4, and fix the mesh structure layer 3 located between the first surface layer 2 and the second surface layer 4.

[0042] The bottom side of the buffer layer 1 is bonded to the top side of the first surface layer 2, and the top side of the buffer layer 1 is set as a bonding connection surface, so that bonding and installation with external equipment can be achieved through the bonding connection surface. At this time, the bottom side of the second surface layer 4 is set as a collision contact surface, so that the collision contact surface can be used to deal with ball hits and collisions from the bottom.

[0043] By setting the mesh structure layer 3, the protective performance of the bottom guard plate after molding can be improved; by setting the buffer layer 1, the force after the collision can be buffered and absorbed to reduce the impact of the collision force on external equipment; moreover, the internal structure layers of the bottom guard plate and the bottom guard plate and external equipment are connected by bonding, and the overall molding is simpler and more convenient, which can reduce the application cost and the corresponding process difficulty.

[0044] As one application example, a honeycomb structure is provided in the buffer layer 1; the buffer performance of the buffer layer 1 is improved by forming the honeycomb structure, such as Figure 1 shown.

[0045] In some embodiments, the honeycomb structure may be formed by opening holes on a large side surface of the buffer layer 1 to reduce the impact effect from the bottom of the buffer layer 1 .

[0046] In some embodiments, the buffer layer 1 includes a plurality of monomer tubes 11 made of PP material, and the plurality of monomer tubes 11 are bonded to each other on the outer surface to form the honeycomb structure. By bonding the plurality of monomer tubes 11 to form the honeycomb structure, the manufacturing and molding of the buffer layer 1 can be simpler and more convenient.

[0047] In some embodiments, the buffer layer 1 is formed by heating and pressurizing a plurality of the monomer tubes 11 ; wherein the diameter of the monomer tube 11 is about 10 mm, and the wall thickness is about 0.5 mm.

[0048] In some embodiments, the first surface layer 2 and the second surface layer 4 can be made of the same material, such as PP material, so that the first surface layer 2 and the second surface layer 4 can have similar hot-melt properties and adhesive properties.

[0049] As one application example, the mesh structure layer 3 includes at least one protective mesh layer 31 made of metal material, such as steel or other materials. By setting the protective mesh layer, it is easy to improve the force strength between the first surface layer 2 and the second surface layer 4 after bonding, reduce the occurrence of possible breakdown caused by ball hitting and collision, and improve the application effect of the bottom guard plate.

[0050] In some embodiments, the thickness of the mesh structure layer 3 is less than the sum of the thicknesses of the first surface layer 2 and the second surface layer 4. By designing the thickness of the mesh structure layer 3, the mesh structure layer 3 can be effectively embedded between the first surface layer 2 and the second surface layer 4 after the bottom guard plate is formed, thereby eliminating the need for anti-corrosion operations on the mesh structure layer 3 made of metal material, thereby reducing application costs.

[0051] In some embodiments, the thickness of the mesh structure layer 3 is set at about 0.5 mm.

[0052] On the other hand, the present embodiment provides a battery pack frame, including a frame bottom plate 5 and the bottom guard plate; the bottom guard plate is bonded to the bottom side of the frame bottom plate 5 via the bonding connection surface to achieve the installation and fixation of the bottom guard plate on the battery pack frame.

[0053] By bonding the bonding connection surface with the frame bottom plate 5, the bottom guard plate can be bonded and fixed to the frame bottom plate 5. Compared with the method of setting openings and fixing with bolts in the traditional technology, this embodiment can avoid the problems of increased difficulty in sealing design and troublesome bolt installation operation caused by openings, and has better application benefits.

[0054] In some embodiments, a cooling channel for cooling liquid to flow is integrated in the frame bottom plate 5. By providing the cooling channel in the frame bottom plate 5, the frame bottom plate 5 can also serve as a cooling plate, thereby improving the integration of the battery pack frame and improving the internal space utilization of the battery pack frame.

[0055] In some embodiments, a modified film layer is provided between the frame bottom plate 5 and the bottom guard plate; for example, since the frame bottom plate 5 is usually made of metal, the bonding properties between the metal frame bottom plate 5 and the buffer layer 1 made of PP material are not the same, which may result in reduced bonding effect.

[0056] Therefore, a method of coating a modifier or sticking a modified film layer on the frame bottom plate 5 can be adopted to improve the bonding reliability between the bottom guard plate and the frame bottom plate 5 .

[0057] On the other hand, the present embodiment provides a battery pack, in which the battery pack frame as described above is arranged. By applying the battery pack frame to the battery pack product, the manufacturing cost and assembly difficulty of the battery pack can be reduced, and the production efficiency can be improved.

[0058] On the other hand, the present embodiment also provides an electrical device, wherein a bottom guard plate as described above is disposed at the bottom of the electrical device; or, a battery pack as described above is disposed inside the electrical device.

[0059] In some embodiments, the electrical device may be configured as a transportation vehicle such as a car.

[0060] By applying the bottom guard plate or the battery pack provided in this embodiment to the electrical equipment, the electrical equipment can better cope with ball hits and collisions from the bottom during application, thereby improving the degree of protection, and the overall assembly process can be simpler and more convenient, with better application benefits.

[0061] The above description is only a specific implementation mode of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various modifications and changes. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should also be included in the scope of protection of the present application. Therefore, the scope of protection of the present application shall be based on the scope of protection of the claims.

[0062] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Claims

1. A bottom guard plate, characterized in that: It comprises a buffer layer, a first surface layer, a mesh structure layer and a second surface layer, wherein the mesh structure layer is sandwiched between the first surface layer and the second surface layer, and the first surface layer and the second surface layer are bonded to each other; The bottom side surface of the buffer layer is bonded to the first surface layer, and the top side surface of the buffer layer is configured as a bonding connection surface for connecting to an external device; The bottom side surface of the second surface layer is configured as a collision contact surface.

2. The bottom guard plate according to claim 1, characterized in that: A honeycomb structure is arranged in the buffer layer.

3. The bottom guard plate according to claim 2, characterized in that: The buffer layer includes a plurality of monomer tubes, and the plurality of monomer tubes are bonded to each other on the surface to form the honeycomb structure.

4. The bottom guard plate according to any one of claims 1 to 3, characterized in that: The mesh structure layer includes at least one protective mesh layer made of metal material.

5. The bottom guard plate according to claim 4, characterized in that: The thickness of the mesh structure layer is less than the sum of the thicknesses of the first surface layer and the second surface layer.

6. A battery pack frame, characterized in that: A frame bottom plate and a bottom guard plate as claimed in any one of claims 1 to 5; The bonding connection surface is bonded to the bottom side surface of the frame bottom plate.

7. The battery pack frame according to claim 6, characterized in that: A cooling channel for the circulation of coolant is integrated in the frame bottom plate.

8. The battery pack frame according to claim 6 or 7, characterized in that: A modified film layer is arranged between the frame bottom plate and the bottom guard plate.

9. A battery pack, characterized in that: A battery pack frame as described in any one of claims 6 to 8 is arranged therein.

10. An electrical device, characterized in that: The bottom thereof is provided with a bottom guard plate as described in any one of claims 1 to 5 above; Or, a battery pack as described in claim 9 is arranged therein.

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