Full-automatic wafer film laminating machine

Abstract

According to the full-automatic wafer film laminating machine disclosed by the utility model, the whole BG film is controlled to be in a flat state before being laminated through the matching between the die pressing assembly and the angle fixing assembly, the angle between the BG film between the die pressing roller and the angle fixing roller and the film laminating platform is kept unchanged, and the die pressing roller can exhaust air below the BG film completely, so that wrinkles are avoided; when the BG film is cut, the ring cutter assembly for hot cutting is adopted, a heated blade can be used for cutting the BG film, and the phenomenon that the BG film is wrinkled by a ring cutter in the cutting process is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer film lamination, in particular to a full-automatic wafer laminating machine. Background Art

[0002] With the advancement of technology, smart wearables, smartphones and tablets are developing towards high-speed and large-capacity storage; the size is developing towards thinness. The direction of technological development requires that flash memory and memory controllers are also continuously thinner. The wafer area tends to be larger and the thickness tends to be thinner, which makes the cracking problem when handling and cutting extremely thin wafers in conventional processes more challenging.

[0003] In order to meet the requirements of lightweight chips, the processing method of cutting first and then thinning is adopted in the processing technology; the specific operation is as follows: first cut the wafer forward to a suitable depth, and then attach the BG film to the front of the wafer. The BG film can effectively protect the chip on the surface of the wafer from damage and at the same time protect it from the influence of impurities during the thinning process.

[0004] Silicon carbide wafers are too hard to be cracked by film expansion. Suitable equipment is needed to crack them one by one along the wafer cutting path. The chip surface is sensitive to debris. During the cracking process, a layer of film is attached to the surface of the wafer to prevent the splitting knife of the splitting mechanism from directly contacting the wafer surface, and to prevent debris generated during the cracking process from contaminating the chip. When the film is attached, air will remain between the BG film and the wafer, causing wrinkles on the surface of the BG film. After the BG film is attached to the wafer, it needs to be cut into BG films that match the size of the wafer. When performing circular cutting, the rotation of the tool will cause wrinkles on the surface of the BG film. Utility Model Content

[0005] In order to solve the problem that wrinkles appear on the BG film during the wafer laminating process and when the BG film is cut, the utility model provides a full-automatic wafer laminating machine.

[0006] The specific plan is as follows:

[0007] A fully automatic wafer laminating machine comprises a machine frame with a longitudinal plate on the upper surface, a composite film placing system, a residual material collecting system, a protective film collecting system, a wafer laminating system, a multifunctional robot system with a multifunctional manipulator and a material bin, wherein the wafer laminating system comprises a laminating platform arranged on the machine frame; a die assembly located above the laminating platform and a fixed angle assembly arranged on the longitudinal plate; the fixed angle assembly ensures that when the die assembly is laminating, the angle between the film belt between the die assembly and the fixed angle assembly and the horizontal plane where the laminating platform is located remains unchanged;

[0008] The multifunctional manipulator is provided with a circular cutting knife assembly for hot cutting the BG film.

[0009] The die assembly includes a movable film pressing roller; the fixed angle assembly includes a reciprocating fixed angle roller, when the film pressing roller moves, the angle between the film strip between the film pressing roller and the fixed angle roller and the horizontal plane where the film laminating platform is located is kept unchanged.

[0010] The film pressing assembly also includes a die pressing servo movable module, a die pressing bracket is slidably connected to the die pressing servo movable module, and a height-adjustable film pressing roller is arranged on the die pressing bracket.

[0011] The reciprocating direction of the fixed angle component is the synchronous movement of the lamination roller and the fixed angle component, and the spacing remains unchanged.

[0012] The multifunctional manipulator is provided with a rotating cutting component and a film pasting platform. The rotating cutting component comprises a rotating cutting seat fixed on the multifunctional manipulator. A rotating driving motor is fixed on the rotating cutting seat. A rotating arm is connected to the output shaft of the rotating driving motor. A circular cutting knife assembly is provided at one end of the rotating arm and a balancing assembly is provided at the other end of the rotating arm. A circular cutting groove corresponding to the circular cutting knife in the circular cutting knife assembly is provided on the film pasting platform.

[0013] The circular cutter assembly includes: a U-shaped cutting knife seat arranged at the end of a rotating arm, a circular cutter is arranged at the U-shaped opening, and a heating device is arranged adjacent to the circular cutter, and the heating device heats the circular cutter; the heating device includes a knife seat arranged at the U-shaped opening, and along the length direction of the rotating arm, an insulation board, an electric heating board and a PCT heater are fixed in sequence outside the knife seat, and the circular cutter is fixed between the electric heating board and the PCT heater; the electric heating board is heated by electric wires.

[0014] The knife seat is rotatably connected to the cutting knife seat. The circular cutter assembly also includes an angle adjustment mechanism and a reset mechanism. The angle adjustment structure adjusts the angle of the circular cutter by pushing the circular cutter, and the reset mechanism controls the circular cutter to always be in contact with the angle adjustment mechanism.

[0015] The angle adjustment mechanism includes a protrusion arranged at the bottom of the cutting knife seat, and an angle adjustment bolt is threaded in the protrusion; the end of the angle adjustment bolt moves to adjust the angle of the circular cutter; the reset mechanism includes a tension spring, and the two ends of the tension spring are respectively connected to the bottom of the cutting knife seat and the knife seat, and the two ends of the tension spring are respectively connected to the bottom of the cutting knife seat and the knife seat, and the connection point of the tension spring and the knife seat is located on the same side of the hinge point between the circular cutter assembly and the cutting knife seat.

[0016] The balancing assembly is fixed on the rotating arm through positioning bolts. The balancing assembly includes a balancing support, which is connected to a roller support through a balancing spring. A roller is rotatably arranged on the roller support.

[0017] The multifunctional manipulator is provided with a transfer manipulator; a wafer receiving mechanism is provided on the film pasting platform for receiving the wafers conveyed by the multifunctional manipulator, the wafer receiving mechanism comprises a lifting support vertically penetrating the film pasting platform, and an adsorption area is provided on the film pasting platform to adsorb and fix the wafers.

[0018] The fully automatic wafer laminating machine disclosed by the utility model controls the BG film to be in a flat state before laminating through the cooperation between the die assembly and the fixed angle assembly, and keeps the angle between the BG film and the laminating platform between the die roller and the fixed angle roller unchanged; the die roller can exhaust the air under the BG film to avoid wrinkles; when cutting the BG film, a hot-cutting circular cutter assembly is used, and the BG film can be cut with a heated blade, so that the circular cutter during the cutting process can avoid wrinkles on the BG film. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a fully automatic wafer laminating machine;

[0020] Figure 2 is a schematic diagram of the structure of the die assembly;

[0021] Figure 3 Schematic diagram of the angle fixing component Figure 1 ;

[0022] Figure 4 Schematic diagram of the angle fixing component Figure 1 ;

[0023] Figure 5 It is a structural schematic diagram of a wafer transfer device;

[0024] Figure 6 It is a structural schematic diagram of a wafer receiving mechanism;

[0025] Figure 7 It is a schematic diagram of the working state of the rotating cutting component;

[0026] Figure 8 Schematic diagram of the structure of the rotating cutting part Figure 1 ;

[0027] Fig. 9 Schematic diagram of the structure of the rotating cutting part Figure 2 ;

[0028] Fig.10 Schematic diagram of the structure of the circular cutter assembly Figure 1 ;

[0029] Fig.11 Schematic diagram of the structure of the circular cutter assembly Figure 2 ;

[0030] Fig.12It is a structural schematic diagram of the balancing component;

[0031] Fig.13 This is a diagram of the process of cutting BG film with a circular cutter.

[0032] In the figure: machine frame 1, longitudinal plate 11, film laminating platform 2, annular cutting groove 21, die assembly 3, die servo moving module 31, die support 32, die roller 33, die cylinder 34, die bracket 35, fixed angle assembly 4, fixed angle linear motor 41, fixed angle roller 42, rotary cutting component 5, annular cutting knife assembly 51, cutting knife seat 511, heating device 512, knife seat 5121, heat insulation board 5122, electric heating board 5123, PTC heater 5 124, tension spring 513, angle adjustment bolt 514, circular cutting knife 515, balance assembly 52, balance support 521, balance spring 522, roller support 523, roller 524, long bolt 525, rotating cutting seat 53, rotating drive motor 54, rotating arm 55, wafer receiving mechanism 6, lifting pillar 61, lifting plate 62, lifting cylinder 63, multi-functional manipulator 7, transfer manipulator 71, suction part 711, silo 8, wafer 9, BG film 10. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the implementation of the utility model, not all of the implementation. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] like Figure 1-Figure 13As shown, a fully automatic wafer laminating machine is disclosed, including a machine frame 1 with a longitudinal plate 11 on the upper surface, a wafer laminating system, a multifunctional robot system with a multifunctional machine 7 and a material bin 8, wherein the wafer laminating system includes a laminating platform 2 arranged on the machine frame 1, a die assembly 3 located above the laminating platform 2 and a fixed angle assembly 4 arranged on the longitudinal plate 11, wherein the fixed angle assembly 4 ensures that when the die assembly 3 is laminating, the angle between the BG film 10 between the laminating roller 33 and the fixed angle roller 42 and the horizontal plane where the laminating platform 2 is located remains unchanged; and a circular cutting knife assembly 51 for hot cutting the BG film 10 is arranged on the multifunctional manipulator 7. Through the cooperation between the die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before film pasting, and the angle between the BG film 10 and the film pasting platform 2 between the die roller 33 and the fixed angle roller 42 is kept unchanged. The die roller 33 can exhaust the air under the BG film 10 to avoid wrinkles; when cutting the BG film 10, a hot cutting circular cutter assembly 51 is used, and the heated circular cutter 515 can be used to cut the BG film 10 to avoid the blade causing wrinkles in the BG film 10 during the cutting process.

[0035] The die assembly 3 includes a die servo moving module 31, on which a die bracket 32 ​​is slidably connected, and a height-adjustable film pressing roller 33 is rotatably arranged on the die bracket 32. When the film pressing roller 33 moves downward and contacts the BG film 10, the die servo moving module 31 controls the die bracket 32 ​​to move in the direction of the BG film 10 to apply the film. When applying the film, the film pressing roller 33 can maintain the angle between the BG film 10 and the film applying platform 2 unchanged by ensuring the synchronous movement between the fixed angle roller 42 and the film pressing roller 33 when applying the film. The film pressing roller 33 can be controlled to reciprocate by a fixed angle linear motor, and also by an extended plate arranged on the die bracket 32. The length direction of the extended plate is consistent with the running direction of the film tape, and the film pressing roller 33 is rotatably arranged on the extended plate.

[0036] In order to ensure that the angle between the BG film 10 and the film pasting platform 2 between the die roller 33 and the fixed angle roller 42 remains unchanged, the running direction of the fixed angle roller 42 can be perpendicular to the direction of the film pasting platform 2, and the fixed angle roller 42 is rotatably set on the fixed angle linear motor 41.

[0037] In order to ensure that the BG film 10 is evenly stressed when the pressing roller 33 presses the BG film 10, the pressing support 32 is a door-shaped frame, and the film pasting platform 2 is located inside the door frame; pressing cylinders 34 are provided on both sides of the top of the door-shaped frame, and the telescopic rod of the pressing cylinder 34 passes through the top of the door-shaped frame, and the pressing bracket 35 is connected to the end of the telescopic rod of the pressing cylinder 34, and the film pressing roller 33 is rotatably connected to the pressing bracket 35.

[0038] The multifunctional manipulator 7 is provided with a rotating cutting component 5, which includes a rotating cutting seat 53 fixed on the multifunctional manipulator 7, a rotating driving motor 54 fixed on the rotating cutting seat 53, a rotating arm 55 connected to the output shaft of the rotating driving motor 54, a ring cutting knife assembly 51 is provided at one end of the rotating arm 55, and a balancing assembly 52 is provided at the other end of the rotating arm; when the ring cutting knife assembly 51 is cutting, a ring cutting groove 21 needs to be provided on the corresponding working surface. The working surface here refers to the film pasting platform 2. An adsorption area is provided on the film pasting platform 2, a negative pressure cavity is provided in the adsorption area, a negative pressure source is provided in the negative pressure cavity, the negative pressure source generates negative pressure to adsorb the wafer 9 through the negative pressure hole provided in the adsorption area, the wafer 9 to be pasted with film is placed inside the ring cutting groove 21, and the negative pressure source can adsorb the wafer 9 through the negative pressure hole to avoid the position of the wafer 9 from shifting during cutting. The width of the annular groove 21 is 5 mm, the depth of the annular groove 21 is 0.2 mm, the material of the film mounting platform 2 is ceramic, and the inner diameter of the annular groove 21 is 2 mm smaller than the outer diameter of the wafer 9 .

[0039] The circular cutting knife assembly 51 includes: a U-shaped cutting knife seat 511 arranged at the end of the rotating arm 55, a circular cutting knife 515 is arranged at the U-shaped opening, and a heating device 512 is arranged adjacent to the circular cutting knife 515, and the heating device 512 heats the circular cutting knife 515; the heating device 512 includes a knife seat 5121 arranged at the U-shaped opening, along the length direction of the rotating arm 55, an insulation board 5122, an electric heating plate 5123 and a PTC heater 5124 are fixed in sequence outside the knife seat 5121, and the circular cutting knife 515 is fixed between the electric heating plate 5123 and the PTC heater 5124; the electric heating plate 5123 is heated by electric wires.

[0040] In order to protect the circuit, a resistor is connected in series on the wire, and the resistor model used is Pt1000. The heating device 512 can heat the circular cutter 515, and the heated circular cutter 515 is used to cut the BG film 10 to prevent the blade from causing wrinkles in the BG film 10 during the cutting process.

[0041] The knife seat 5121 is rotatably connected to the cutting knife seat 511. The circular cutting knife assembly 51 also includes an angle adjustment mechanism and a reset mechanism. The angle adjustment mechanism allows the circular cutting knife assembly 51 to rotate relative to the rotating arm 55. The reset mechanism allows the circular cutting knife assembly 51 to fix the circular cutting knife 515 assembly after rotation. The angle adjustment mechanism includes a protrusion arranged at the bottom of the cutting knife seat 511, and the protrusion is threadedly connected with an angle adjustment bolt 514; the movement of the end of the angle adjustment bolt 514 adjusts the angle of the circular cutting knife 515;

[0042] The reset mechanism is a tension spring 513, and the two ends of the tension spring 513 are respectively connected to the bottom of the cutting knife seat 511 and the knife seat 5121. The two ends of the tension spring are respectively connected to the bottom of the cutting knife seat and the knife seat, and the connection point of the tension spring and the knife seat 5121 is located on the same side of the hinge point between the ring cutting knife assembly 51 and the cutting knife seat 511.

[0043] The reset mechanism is a compression spring, the two ends of which are respectively connected to the bottom of the cutting knife seat 511 and the knife seat 5121 , and the connection points between the compression spring and the knife seat 5121 are located on different sides of the hinge point between the circular cutting knife assembly 51 and the cutting knife seat 511 .

[0044] A spherical nut is provided at the end of the angle adjustment bolt 514 to protect the knife seat 5121 . The angle adjustment mechanism and reset mechanism provided can adjust the angle of the circular cutting knife 515 and protect the knife head of the circular cutting knife 515 .

[0045] An oblong hole is provided on the rotating arm 55, and the length direction of the oblong hole is consistent with the length direction of the rotating arm 55. The balancing component 52 is fixed in the oblong hole by a positioning bolt, and the balance during the ring cutting is ensured by adjusting the distance between the positioning bolt and the rotating center line; the balancing component 52 includes a balancing support 521, and the balancing support 521 is connected to a roller support 523 through a balancing spring 522, and a roller 524 is rotatably provided on the roller support 523. A long bolt is provided on the balancing support 523, and the end of the long bolt abuts against the roller support 523. The maximum distance of the roller support 523 moving upward can be limited to avoid damaging the overall balance of the rotating cutting component 5.

[0046] The multifunctional robot 7 is provided with a transfer robot 71; the film laminating platform 2 is provided with a wafer receiving mechanism 6 for receiving the wafer 9 transported by the multifunctional robot 7. The wafer receiving mechanism 6 includes at least three lifting pillars 61 and the film laminating platform 2.

[0047] The entire film-sticking platform 2 is an adsorption area, in which a negative pressure cavity is arranged, in which a negative pressure source is arranged, and the negative pressure source generates negative pressure to adsorb the wafer 9 through the negative pressure holes arranged in the adsorption area, and the lifting pillar 61 and the film-sticking platform 2 are sealed and slidably connected.

[0048] The middle area of ​​the adsorption area where the lifting pillars 61 are located does not have an adsorption function, and there is no sliding between the lifting pillars 61 and the film laminating platform 2. The lifting pillars 61 are preferably 4 in number;

[0049] A lifting plate 62 is connected to the bottom of the lifting pillar 2, and the lifting plate 62 is lifted and lowered by a lifting cylinder 63. The suction part 711 of the transfer robot 71 is U-shaped, and the lifting column 61 will not limit the suction part. The transfer robot 71, the lifting pillar 61 and the film sticking platform 2 constitute a wafer transfer device. The transfer robot 71 is equipped with a negative pressure adsorption mechanism to adsorb the wafer 9. The negative pressure adsorption mechanism includes a suction part with a cavity inside. Negative pressure is generated inside the suction part by a negative pressure source, and the wafer 9 is adsorbed through the small holes on the surface of the suction part. The suction part 711 can be U-shaped, and the lifting column 61 will not limit the suction part. The suction part 711 can also be a suction cup.

[0050] The suction part 711 uses negative pressure to suck the wafer 9 from the silo, and transports it to the top of the lifting pillar 62 under the action of the multifunctional manipulator. After the lifting pillar 62 rises, the wafer 9 is placed on the lifting pillar 62, and then the wafer 9 is placed on the film laminating platform 2 under the action of the lifting cylinder 63, and the wafer 9 is adsorbed by negative pressure. After the film laminating is completed, the lifting pillar 62 rises under the action of the lifting cylinder 63, and the transfer manipulator 71 picks up the wafer 9 and puts it back into the silo. The use of a wafer transfer device can avoid damage to the wafer 9 during the transfer process.

[0051] A wafer coating method comprises the following steps:

[0052] Step 1: The wafer 9 in the silo 8 is taken out by the transfer robot 71 in the multifunctional robot 7 , and the wafer 9 is placed on the film pasting platform 2 under the action of the wafer receiving mechanism 6 , and the film pasting platform 2 adsorbs the wafer 9 .

[0053] Step 2: The BG film 10 is transported to the top of the wafer 9 by the composite film discharge system, and the BG film 10 is attached to the surface of the wafer 9 under the action of the die assembly 31 .

[0054] Step three: The position of the wafer 9 is positioned by the visual positioning device in the multifunctional robot 7 , and the BG film 10 is cut by the rotating cutting component 5 .

[0055] Step 4: After the BG film 10 is cut, the wafer 9 with the film attached is transferred to the transfer robot 71 through the wafer receiving mechanism 6 , and then the wafer 9 with the film attached is transferred to the silo 8 .

[0056] Step 5: The cut BG film 10 is recycled through a waste material collection system.

[0057] In step one, the wafer receiving mechanism 6 receives the wafer 9 , including receiving the wafer 9 through a lifting pillar 61 that can be raised and lowered. After receiving the wafer 9 , the lifting pillar 61 can be lowered below the film pasting platform, and the wafer 9 is adsorbed by the negative pressure generated on the film pasting platform 2 .

[0058] In step 2, the composite film unwinding system transports the composite film from the film unwinding air expansion axis to the film laminating platform via the film unwinding driven roller system, and the composite film is divided into a protective film and a BG film 10 before entering the film laminating platform 2. The protective film is recovered by the protective film collecting system; the BG film 10 is transported to the top of the film laminating platform.

[0059] A film unloading electromagnetic brake is fixed at the end of the film unloading air inflation shaft. The film unloading electromagnetic brake is electrically connected to the tension control roller. The tension control roller detects the tension of the film belt and feeds back to the film unloading electromagnetic brake to keep the composite film always tensioned. A film unloading buffer roller is arranged between the film unloading driven roller system. The film unloading buffer roller contacts the composite film through its own gravity.

[0060] In step 2, the die assembly 3 cooperates with the fixed angle assembly 4 when attaching the BG film 10 to the surface of the wafer 9; when the die roller 33 in the die assembly 3 moves the BG film 10 close to the film pasting platform 2, it can move along the running direction of the mold under the action of the die moving servo module 31, and the position of the fixed angle roller 42 in the fixed angle assembly 4 will also change, and the angle between the BG film 10 between the die roller 33 and the fixed angle roller 42 and the horizontal plane where the film pasting platform 2 is located remains unchanged.

[0061] In step three, the rotating cutting component 5 includes a rotating cutting seat 53 fixed on the multifunctional manipulator 7, a rotating driving motor 54 is fixed on the rotating cutting seat 3, a rotating arm 55 is connected to the output shaft of the rotating driving motor 54, a circular cutting knife assembly 51 is arranged at one end of the rotating arm 55, and a balancing assembly 52 is arranged at the other end of the rotating arm 55; when the circular cutting knife assembly 51 is cutting, a circular cutting groove needs to be arranged on the corresponding working surface.

[0062] The residual material collection system includes a residual material collection air expansion shaft, a residual material collection drive roller, a residual material collection roller system and a residual material collection buffer roller. The cut BG film 10 is transported to the residual material collection buffer roller by the material collection roller system.

[0063] A residual material collection electromagnetic brake is fixed at the end of the residual material collection air inflation shaft, and the residual material collection electromagnetic brake is electrically connected to the residual material collection tension control roller. The residual material collection tension control roller detects the tension of the film strip and feeds back to the residual material collection electromagnetic brake to keep the cut BG film 10 always tensioned; a residual material collection buffer roller is arranged between the residual material collection driven roller system, and the residual material collection buffer roller contacts the cut BG film 10 through its own gravity.

[0064] In step 5, the cut BG film 10 passes through the gap between the two locking plates of the locking device, and is then recycled by the waste material system after being cut; the cut BG film 10 is fixed by controlling the opening and closing between the two locking plates. Specifically, the lower locking plate is fixed on the longitudinal plate 11, and the upper locking plate is controlled by the locking cylinder to control the lifting of the upper locking plate, thereby controlling the closing between the two locking plates.

[0065] Through the cooperation between the die assembly 3 and the fixed angle assembly 4, the BG film 10 is controlled to be in a flat state before film pasting, and the angle between the BG film 10 and the film pasting platform between the die roller 33 and the fixed angle roller 42 is kept unchanged. The die roller 33 can exhaust the air under the BG film 10 to avoid wrinkles; when cutting the BG film 10, the hot cutting ring cutter assembly 51 can be used to cut the BG film 10 with a heated blade to avoid the ring cutter 515 causing wrinkles in the BG film 10 during the cutting process. The cooperation between the lifting support 61 and the transfer robot 71 can avoid damage to the wafer 9 during the transfer process. The cooperation between the ring cutter assembly 51 and the balance assembly 52 can keep the ring cutter 515 in a balanced position during the film cutting process. The cooperation between the tension spring 513 and the angle adjustment bolt 514 allows the angle of the ring cutter 515 to be adjusted, which can avoid damage to the blade head of the ring cutter 515 during the film cutting process.

[0066] The technical means disclosed in the solution of the utility model are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical solutions composed of any combination of the above technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model, and these improvements and modifications are also regarded as the protection scope of the utility model.

Claims

1. A fully automatic wafer laminating machine, comprising a machine frame with a longitudinal plate on the upper surface, a composite film placing system, a residual material collecting system, a protective film collecting system, a wafer laminating system, a multifunctional robot system with a multifunctional manipulator and a material bin, characterized in that: The wafer film attaching system comprises a film attaching platform arranged on a machine frame; a die assembly located above the film attaching platform and a fixed angle assembly arranged on a longitudinal plate; the fixed angle assembly ensures that when the die assembly is attaching the film, the angle between the film strip between the die assembly and the fixed angle assembly and the horizontal plane where the film attaching platform is located remains unchanged; The multifunctional manipulator is provided with a circular cutting knife assembly for hot cutting the BG film.

2. The fully automatic wafer laminating machine according to claim 1, characterized in that: The die assembly includes a movable film pressing roller; the fixed angle assembly includes a reciprocating fixed angle roller, when the film pressing roller moves, the angle between the film strip between the film pressing roller and the fixed angle roller and the horizontal plane where the film laminating platform is located is kept unchanged.

3. The fully automatic wafer laminating machine according to claim 2, characterized in that: The film pressing assembly also includes a die pressing servo movable module, a die pressing bracket is slidably connected to the die pressing servo movable module, and a height-adjustable film pressing roller is arranged on the die pressing bracket.

4. The fully automatic wafer laminating machine according to claim 1, characterized in that: The reciprocating direction of the fixed angle component is the synchronous movement of the lamination roller and the fixed angle component, and the spacing remains unchanged.

5. The fully automatic wafer laminating machine according to claim 1, characterized in that: The multifunctional manipulator is provided with a rotating cutting component and a film pasting platform. The rotating cutting component comprises a rotating cutting seat fixed on the multifunctional manipulator. A rotating driving motor is fixed on the rotating cutting seat. A rotating arm is connected to the output shaft of the rotating driving motor. A circular cutting knife assembly is provided at one end of the rotating arm and a balancing assembly is provided at the other end of the rotating arm. A circular cutting groove corresponding to the circular cutting knife in the circular cutting knife assembly is provided on the film pasting platform.

6. The fully automatic wafer laminating machine according to claim 5, characterized in that: The circular cutter assembly includes: a U-shaped cutting knife seat arranged at the end of a rotating arm, a circular cutter is arranged at the U-shaped opening, and a heating device is arranged adjacent to the circular cutter, and the heating device heats the circular cutter; the heating device includes a knife seat arranged at the U-shaped opening, and along the length direction of the rotating arm, an insulation board, an electric heating board and a PCT heater are fixed in sequence outside the knife seat, and the circular cutter is fixed between the electric heating board and the PCT heater; the electric heating board is heated by electric wires.

7. The fully automatic wafer laminating machine according to claim 6, characterized in that: The knife seat is rotatably connected to the cutting knife seat. The circular cutter assembly also includes an angle adjustment mechanism and a reset mechanism. The angle adjustment structure adjusts the angle of the circular cutter by pushing the circular cutter, and the reset mechanism controls the circular cutter to always be in contact with the angle adjustment mechanism.

8. The fully automatic wafer laminating machine according to claim 7, characterized in that: The angle adjustment mechanism includes a protrusion arranged at the bottom of the cutting knife seat, and an angle adjustment bolt is threaded in the protrusion; the end of the angle adjustment bolt moves to adjust the angle of the circular cutter; the reset mechanism includes a tension spring, and the two ends of the tension spring are respectively connected to the bottom of the cutting knife seat and the knife seat, and the two ends of the tension spring are respectively connected to the bottom of the cutting knife seat and the knife seat, and the connection point of the tension spring and the knife seat is located on the same side of the hinge point between the circular cutter assembly and the cutting knife seat.

9. The fully automatic wafer laminating machine according to claim 5, characterized in that: The balancing assembly is fixed on the rotating arm through positioning bolts. The balancing assembly includes a balancing support, which is connected to a roller support through a balancing spring. A roller is rotatably arranged on the roller support.

10. The fully automatic wafer laminating machine according to claim 1, characterized in that: The multifunctional manipulator is provided with a transfer manipulator; a wafer receiving mechanism is provided on the film pasting platform for receiving the wafers conveyed by the multifunctional manipulator, the wafer receiving mechanism comprises a lifting support vertically penetrating the film pasting platform, and an adsorption area is provided on the film pasting platform to adsorb and fix the wafers.

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