LED device and heat dissipation light-emitting unit thereof

Abstract

The utility model discloses an LED device and a heat dissipation light-emitting unit thereof. The LED device comprises the heat dissipation light-emitting unit and a cooling plate connected with the heat dissipation light-emitting unit. The heat dissipation light-emitting unit comprises a light-emitting element and a heat dissipation plate connected with the light-emitting element. The heat dissipation plate is provided with at least one heat dissipation groove. The cooling plate comprises a cooling channel suitable for guiding cooling liquid to circulate. And the at least one heat dissipation groove is communicated with the cooling channel. The heat dissipation plate can conduct heat energy emitted by the light-emitting element to the at least one heat dissipation groove, and the at least one heat dissipation groove is suitable for guiding cooling liquid from the cooling channel to circulate, so that the heat energy of the light-emitting element is absorbed by the cooling liquid from the cooling channel. The at least one heat dissipation groove is communicated with the cooling channel, so that the contact area between the heat dissipation plate and the cooling liquid in the cooling channel can be increased, and the effect of improving the heat dissipation efficiency is further achieved.

Description

Technical Field

[0001] The utility model relates to an LED device and a heat dissipation and light emitting unit thereof, in particular to an LED device and a heat dissipation and light emitting unit thereof manufactured by using a COB packaging process. Background Art

[0002] When the existing LED chips are directly exposed to the air, they are susceptible to contamination or human damage, which may affect or destroy the function of the LED chips. In order to avoid damage to the LED chips, the COB (Chip On Board) packaging process (also known as the chip on board packaging process) is used to encapsulate the LED chips and bonding wires with packaging glue to protect the LED chips. Compared with the existing direct plug-in or SMD (Surface Mount Device) packaging LED chips, COB packaging LED chips are characterized by saving space and simplifying packaging work. However, the existing COB packaging LED chips will have excessive temperatures during operation due to the small space, causing damage to the LED grains, thereby affecting the brightness of the COB packaging LED chips. Utility Model Content

[0003] One of the purposes of the present invention is to provide a heat dissipation and light emitting unit with improved heat dissipation efficiency.

[0004] The heat dissipation and light-emitting unit of the utility model comprises a light-emitting element and a heat dissipation plate. The heat dissipation plate is connected to the light-emitting element and comprises a body and at least one heat dissipation groove. The body has a mounting surface for mounting the light-emitting element and a heat dissipation surface opposite to the mounting surface and suitable for being attached to the cooling plate. The at least one heat dissipation groove is formed on the heat dissipation surface and is suitable for being connected to the cooling channel. The mounting surface conducts the heat energy emitted by the light-emitting element to the heat dissipation surface. The at least one heat dissipation groove is suitable for guiding the coolant from the cooling channel to circulate so that the heat energy of the body is absorbed by the coolant from the cooling channel.

[0005] According to the heat dissipation and light emitting unit of the present invention, the at least one heat dissipation groove is recessed from the heat dissipation surface toward the mounting surface.

[0006] According to the heat dissipation and light emitting unit of the utility model, the heat dissipation plate includes a plurality of heat dissipation grooves, and the heat dissipation grooves are formed on the heat dissipation surface and are arranged at intervals along the extension direction of the heat dissipation surface.

[0007] According to the heat dissipation and light emitting unit of the utility model, the heat dissipation slots are long and narrow and are arranged at intervals along the first direction, and the length direction of each heat dissipation slot is not parallel to the first direction.

[0008] Another object of the present invention is to provide an LED device with improved heat dissipation efficiency.

[0009] The LED device according to the utility model comprises the heat dissipation and light emitting unit and a cooling plate. The cooling plate is connected to the heat dissipation and light emitting unit and comprises a cooling channel suitable for guiding the circulation of cooling liquid.

[0010] According to the LED device of the utility model, the heat dissipation plate has a plurality of heat dissipation grooves, and the heat dissipation grooves are formed on the heat dissipation surface and are arranged at intervals along the extension direction of the heat dissipation surface.

[0011] According to the LED device of the present invention, the cooling channel has a communication port formed on the side surface of the cooling plate facing the heat dissipation surface, and the communication port is communicated with the at least one heat dissipation groove.

[0012] According to the LED device of the present invention, the cooling channel has a communication port formed on the side surface of the cooling plate facing the heat dissipation surface, and the communication port is communicated with at least one of the heat dissipation grooves.

[0013] According to the LED device of the utility model, the cooling channel also has a cooling inlet and a cooling outlet formed on the side of the cooling plate away from the heat dissipation surface and spaced apart from each other, the cooling inlet is suitable for guiding the coolant to flow from the outside into the cooling channel, and the cooling outlet is suitable for guiding the coolant flowing in the cooling channel to flow out.

[0014] The beneficial effect of the utility model is that by guiding the coolant from the cooling channel to circulate through at least one of the heat dissipation slots, the contact area between the heat dissipation plate and the coolant from the cooling channel can be increased, thereby achieving the effect of improving the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a perspective view of a first embodiment of an LED device according to the utility model, showing the assembly relationship between the heat dissipation and light emitting unit and the cooling plate of the embodiment;

[0016] Figure 2 is a perspective exploded view of the first embodiment, showing implementation details of the heat dissipation and light emitting unit and the cooling plate;

[0017] Figure 3 is along Figure 1 Sectional view along the midline III-III;

[0018] Figure 4 is a bottom view showing the implementation details of the heat dissipation plate of the heat dissipation and light emitting unit of the first embodiment, with the cooling plate removed; and

[0019] Figure 5It is a top view of the second embodiment of the LED device of the present utility model, showing the assembly relationship between the heat dissipation and light emitting unit and the cooling plate of this embodiment. DETAILED DESCRIPTION

[0020] The utility model is described in detail below with reference to the accompanying drawings and embodiments.

[0021] Before the present invention is described in detail, it should be noted that similar elements are represented by the same reference numerals in the following description.

[0022] See also Figure 1 and Figure 2 , shows a first embodiment of the LED device 100 of the utility model. The LED device 100 is suitable for allowing a coolant (not shown) to pass through. The coolant is, for example, water but is not limited thereto. The LED device 100 includes a heat dissipation light-emitting unit 10 and a cooling plate 2 connected to the heat dissipation light-emitting unit 10. The heat dissipation light-emitting unit 10 includes a light-emitting element 1, and a heat dissipation plate 3 connected to the cooling plate 2 and located between the light-emitting element 1 and the cooling plate 2. The light-emitting element 1 is, for example, a COB packaged LED chip that packages multiple LED dies with a circuit board, and is used to emit light.

[0023] See also Figures 1 to 3 The cooling plate 2 includes a channel surface 21 attached to the heat sink 3, an inlet and outlet surface 22 opposite to the channel surface 21, and a cooling channel 23 suitable for guiding the circulation of the coolant. The cooling channel 23 has a connecting port 231, a cooling inlet 232 and a cooling outlet 233. The connecting port 231 is formed on the side of the cooling plate 2 facing the heat sink 3 (i.e., the channel surface 21) and is suitable for allowing the coolant to circulate. The cooling inlet 232 is suitable for guiding the coolant to flow from the outside into the cooling channel 23, and the cooling outlet 233 is suitable for guiding the coolant flowing in the cooling channel 23 to flow out. In this first embodiment, the cooling inlet 232 and the cooling outlet 233 are formed on the side of the cooling plate 2 away from the heat sink 3 (i.e., the inlet and outlet surface 22) and are spaced apart from each other and connected to the connecting port 231 to extend the time for the coolant to pass through the cooling plate 2 in the cooling channel 23, but the cooling inlet 232 and the cooling outlet 233 can also be formed on the side of the cooling plate 2 (i.e., the side of the cooling plate 2 located between the channel surface 21 and the inlet and outlet surface 22) to communicate with the outside world. The cooling inlet 232 and the cooling outlet 233 only need to be spaced apart from each other and connected to the connecting port 231 and are not limited to a specific position.

[0024] See also Figures 2 to 4The heat sink 3 is shaped like a cube or a cuboid, but not limited thereto, and has a body 31 and a plurality of heat dissipation slots 32. The body 31 has a mounting surface 311 for mounting the light emitting element 1, and a heat dissipation surface 312 opposite to the mounting surface 311 and attached to the channel surface 21 of the cooling plate 2. The mounting surface 311 can conduct the heat energy emitted by the light emitting element 1 to the heat dissipation surface 312 to reduce the temperature of the light emitting element 1. In this embodiment, the heat sink 3 and the light emitting element 1 are integrated.

[0025] A plurality of heat dissipation grooves 32 are formed on the heat dissipation surface 312 and are recessed from the heat dissipation surface 312 toward the mounting surface 311, and are connected to the connecting opening 231 of the cooling channel 23. The plurality of heat dissipation grooves 32 are suitable for guiding the coolant from the cooling channel 23 to circulate, so that the heat energy absorbed by the body 31 is absorbed by the coolant from the cooling channel 23 through the groove walls of the plurality of heat dissipation grooves 32, thereby improving the heat dissipation efficiency of the heat dissipation plate 3. In addition, forming a plurality of heat dissipation grooves 32 on the heat dissipation surface 312 of the heat dissipation plate 3 can reduce the weight of the heat dissipation plate 3 and save materials during production. In the first embodiment, the plurality of heat dissipation slots 32 are spaced apart from each other and are all connected to the connecting port 231, so that the plurality of heat dissipation slots 32 can simultaneously guide the coolant from the cooling channel 23 to circulate, but in other embodiments, the plurality of heat dissipation slots 32 can also be connected to each other, and one or more of the plurality of heat dissipation slots 32 are connected to the connecting port 231, so that the coolant from the cooling channel 23 can still be guided to flow into the plurality of heat dissipation slots 32 via the connecting port 231, and the connection relationship between the plurality of heat dissipation slots 32 and the connecting port 231 is not limited to the above description. In addition, the number of the plurality of heat dissipation slots 32 is not limited to a plurality, and can also be only one, depending on the use requirements. On the other hand, the heat dissipation surface 312 extends along the first direction X and the second direction Y which is not parallel to the first direction X. Moreover, the plurality of heat dissipation slots 32 are in a narrow and long shape and are arranged at intervals along the first direction X. The length direction of each heat dissipation slot 32 is parallel to the second direction Y, so that the contact area between the slot wall of the plurality of heat dissipation slots 32 and the coolant can be increased to improve the heat dissipation efficiency of the heat dissipation plate 3. In the first embodiment, the second direction Y is perpendicular to the first direction X.

[0026] See also Figures 1 to 3, the operation of the LED device 100 is described in detail below. First, the mounting surface 311 conducts the heat energy emitted by the light-emitting element 1 to the heat dissipation surface 312. Next, the cooling plate 2 continuously guides the coolant from the outside to flow into the cooling channel 23 through the cooling inlet 232. Then, the plurality of heat dissipation grooves 32 guide the coolant in the cooling channel 23 to circulate through the connecting port 231 and fully contact with the groove walls of the plurality of heat dissipation grooves 32 to absorb the heat energy of the body 31 of the heat dissipation plate 3, so that the temperature of the light-emitting element 1 is reduced. Finally, the cooling plate 2 guides the coolant that has absorbed the heat energy of the heat dissipation plate 3 to flow out of the cooling outlet 233 through the connecting port 231, so that the heat dissipation plate 3 can continuously cool down the light-emitting element 1 to reduce the probability of overheating and damage of the LED die of the light-emitting element 1.

[0027] See also Figure 5 , shows a second embodiment of the LED device 100 of the utility model, and its overall structure is roughly the same as the first embodiment, except that the heat sink 3 is in the shape of a missing-corner circle. It is particularly important to note that as long as the heat energy generated by the light-emitting element 1 can be conducted to the cooling liquid (not shown) to improve the heat dissipation effect, the shapes of the light-emitting element 1, the cooling plate 2 and the heat sink 3 are not limited to the present embodiment.

[0028] In summary, by guiding the coolant from the cooling channel 23 to circulate through at least one of the multiple heat dissipation grooves 32, the contact area between the heat dissipation plate 3 and the coolant from the cooling channel 23 can be increased, thereby achieving the effect of improving the heat dissipation efficiency, and also achieving the effect of reducing the weight of the LED device 100 and saving production costs, so the purpose of this utility model can indeed be achieved.

[0029] The above is only an embodiment of the present utility model and should not be used to limit the scope of the present utility model. Any simple equivalent changes and modifications made according to the scope of the patent application of the present utility model and the content of the patent specification are still within the scope of the present utility model patent.

Claims

1. A heat dissipation and light emitting unit, the heat dissipation and light emitting unit is suitable for a cooling plate, the cooling plate comprises a cooling channel suitable for guiding the circulation of a coolant, characterized in that: The heat dissipation and light emitting unit comprises: Light emitting element; and A heat sink, the heat sink is connected to the light emitting element and comprises a body and at least one heat sink, the body having a mounting surface for mounting the light emitting element and a heat sink opposite to the mounting surface and suitable for being attached to the cooling plate, the at least one heat sink is formed on the heat sink and suitable for being connected to the cooling channel, the mounting surface conducts the heat energy emitted by the light emitting element to the heat sink, the at least one heat sink is suitable for guiding the coolant from the cooling channel to circulate, so that the heat energy of the body is absorbed by the coolant from the cooling channel.

2. The heat dissipation and light emitting unit according to claim 1, characterized in that: The at least one heat dissipation slot is recessed from the heat dissipation surface toward the mounting surface.

3. The heat dissipation and light emitting unit according to claim 2, characterized in that: The heat dissipation plate includes a plurality of heat dissipation grooves, which are formed on the heat dissipation surface and arranged at intervals along the extension direction of the heat dissipation surface.

4. The heat dissipation and light emitting unit according to claim 3, characterized in that: The heat dissipation slots are in a long and narrow shape and are arranged at intervals along a first direction, and the length direction of each heat dissipation slot is not parallel to the first direction.

5. An LED device, characterized in that: The LED device comprises: The heat dissipation and light emitting unit as claimed in any one of claims 1, 2 and 4; and A cooling plate is connected to the heat dissipation and light emitting unit and comprises a cooling channel suitable for guiding the circulation of cooling liquid.

6. The LED device according to claim 5, characterized in that: The heat dissipation plate has a plurality of heat dissipation grooves, which are formed on the heat dissipation surface and arranged at intervals along the extension direction of the heat dissipation surface.

7. The LED device according to claim 5, characterized in that: The cooling channel has a communication port formed on a side surface of the cooling plate facing the heat dissipation surface, and the communication port is communicated with the at least one heat dissipation groove.

8. The LED device according to claim 6, characterized in that: The cooling channel has a communication port formed on a side surface of the cooling plate facing the heat dissipation surface, and the communication port is communicated with at least one of the heat dissipation grooves.

9. The LED device according to any one of claims 7 or 8, characterized in that: The cooling channel also has a cooling inlet and a cooling outlet formed on the side of the cooling plate away from the heat dissipation surface and spaced apart from each other. The cooling inlet is suitable for guiding the coolant to flow from the outside into the cooling channel, and the cooling outlet is suitable for guiding the coolant flowing in the cooling channel to flow out.

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