Heat dissipation structure of computer terminal
By using fans and radiators at the same time in the computer terminal, the problem that a simple fan is difficult to meet the high-load heat dissipation needs is solved, and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202420953999.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-04-30
AI Technical Summary
In the prior art, relying solely on fans for heat dissipation is difficult to meet the strict heat dissipation needs when the load is too high.
The fan and the radiator are used to dissipate heat simultaneously. The fan is installed in the container of the radiator. The bottom of the radiator is equipped with a positioning cavity and a magnetic suction block. The mounting base and locking parts are designed for stable installation and fixing.
Through the heat conduction of the radiator and the air convection of the fan, faster heat dissipation effect is achieved and the heat dissipation needs are adapted to the high load.
Smart Images

Figure CN222506857U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chassis, in particular to a heat dissipation structure of a computer terminal. Background Art
[0002] As computer performance continues to improve, the heat generated by key hardware such as processors and graphics cards is increasing. Efficient heat dissipation has become a key factor in ensuring stable operation of the hardware and extending its service life.
[0003] Fan cooling is the most common means of heat dissipation. Its working principle is based on the principle of aerodynamics. The rotation of the fan promotes the exchange of air inside and outside the chassis, forming air convection to remove the heat generated by the hardware. However, relying solely on fan cooling still has limitations. For example, the chassis module disclosed in patent CN202121009889.1 mainly uses fans for heat dissipation. When the load is too high, it may be difficult to meet the stringent heat dissipation requirements by relying solely on fans. Summary of the invention
[0004] The utility model provides a heat dissipation structure of a computer terminal to solve the problems of the prior art. The heat dissipation structure can be effectively improved by using a fan and a radiator to dissipate heat for a computer case at the same time.
[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions: a heat dissipation structure of a computer terminal, comprising a fan, a radiator, a mounting seat and a plurality of locking members, the radiator is provided with a cavity, the fan is detachably assembled in the cavity, the mounting seat is convexly provided with a positioning base, the bottom of the radiator is provided with a positioning cavity, the positioning cavity is used for detachably assembling the positioning base, and the shape of the positioning cavity is adapted to the shape of the positioning base, the positioning base is provided with a magnetic block, and the radiator is a metal part; the mounting seat is provided with a plurality of mounting feet, the mounting feet are provided with mounting holes, the locking member is provided with a fixing portion and a fixing foot, the fixing portion is assembled in the mounting hole, the fixing foot is used for detachably assembling on a mainboard, and the periphery of the radiator is provided with a plurality of groups of heat dissipation fins, and the plurality of groups of heat dissipation fins are arranged at equal intervals.
[0006] Preferably, the fan is a magnetic bearing fan.
[0007] Preferably, the heat dissipation fins include two heat dissipation fins, which are arranged in an eight-shaped shape.
[0008] Preferably, a bending portion is provided between the mounting foot and the mounting seat, and after the mounting foot is mounted to the mainboard through a locking member, a heat dissipation space is formed between the mounting seat and the mainboard.
[0009] Preferably, the fixing portion is square in shape, and the mounting hole is square in shape.
[0010] Preferably, the fixed foot includes a first fixing rod and a second fixing rod, a gap is provided between the first fixing rod and the second fixing rod, and a clamping block is protruded from one end of the first fixing rod and the second fixing rod away from the gap, and a through hole is provided on the main board, and the clamping block is used to be clamped in the through hole.
[0011] Preferably, the heat dissipation structure of the computer terminal also includes a temperature detection module, and the temperature detection module and the fan are both connected to the control module signal of the mainboard. The temperature detection module is used to detect the temperature of the radiator, and the control module of the mainboard adjusts the fan speed according to the detection signal of the temperature detection module.
[0012] Beneficial effects of the utility model:
[0013] The utility model provides a heat dissipation structure of a computer terminal. A fan is installed on a radiator, and then the radiator is installed on the mainboard of a chassis. The radiator is set at the position of the load. The radiator can conduct heat and dissipate heat for the load, and then the fan provides air convection for the radiator and the internal space of the chassis to achieve the heat dissipation effect. The utility model can achieve a faster heat dissipation effect while the radiator supports heat conduction and cooperates with the fan to dissipate heat. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the structure of the utility model installed in a chassis;
[0015] Figure 2 The structure of the utility model is shown in FIG. Figure 1 ;
[0016] Figure 3 The structure of the utility model is shown in FIG. Figure 2 ;
[0017] Figure 4 The structure of the utility model is shown in FIG. Figure 3 ;
[0018] Figure 5 The decomposition structure of the utility model is shown in FIG. Figure 1 ;
[0019] Figure 6 The decomposition structure of the utility model is shown in FIG. Figure 2 ;
[0020] Figure 7 It is a structural schematic diagram of the locking member of the utility model.
[0021] exist Figures 1 to 7 Reference numerals in the drawings include:
[0022] 1-fan, 2-radiator, 3-mounting seat, 4-locking piece, 5-cavity, 6-positioning base, 7-heat dissipation space, 8-mounting foot, 9-mounting hole, 10-fixing part, 11-fixing foot, 12-heat sink, 13-bending part, 14-first fixing rod, 15-second fixing rod, 16-block, 17-gap, 19-mainboard, 20-positioning cavity. DETAILED DESCRIPTION
[0023] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with the embodiments and drawings, and the contents mentioned in the implementation modes are not intended to limit the present invention. The present invention is described in detail below in conjunction with the drawings.
[0024] This embodiment provides a heat dissipation structure of a computer terminal, such as Figures 1 to 7 , including a fan 1, a heat sink 2, a mounting seat 3 and a plurality of locking members 4, the heat sink 2 is provided with a cavity 5, the fan 1 can be detachably mounted in the cavity 5, the mounting seat 3 is provided with a positioning base 6, the bottom of the heat sink 2 is provided with a positioning cavity 20, the positioning cavity 20 is used for detachably mounting the positioning base 6, and the shape of the positioning cavity 20 is adapted to the shape of the positioning base 6, the positioning base 6 is provided with a magnetic suction block (not shown in the attached drawings), the heat sink 2 is a metal part; the mounting seat 3 is provided with a plurality of mounting feet 8, the mounting feet 8 are provided with mounting holes 9, the locking member 4 is provided with a fixing portion 10 and a fixing foot 11, the fixing portion 10 is mounted in the mounting hole 9, the fixing foot 11 is used for detachably mounting on the mainboard 19, the periphery of the heat sink 2 is provided with a plurality of groups of heat dissipation fins, and the plurality of groups of heat dissipation fins are arranged at equal intervals. Among them, the fan 1 of this embodiment adopts a magnetic suspension bearing fan 1, and the noise of the fan 1 when working will be smaller.
[0025] Specifically, Figures 2 to 5 As shown, the fan 1 is installed in the cavity 5 of the radiator 2, and the fan 1 can be fixed by a fixing method in the prior art, such as screws, etc., which is not limited in this embodiment. The radiator 2 of this embodiment is a metal device, such as made of aluminum. The bottom of the radiator 2 is provided with a positioning cavity 20 that is compatible with the positioning base 6, that is, during assembly, the positioning base 6 and the positioning cavity 20 can achieve the positioning function. The bottom of the radiator 2 is provided with a screw hole, and the mounting seat 3 is provided with a through hole corresponding to the screw hole. Therefore, after the positioning cavity 20 and the positioning base 6 are positioned, and the mounting seat 3 is adsorbed on the radiator 2 by the magnetic block, the through hole and the screw hole can be aligned, and then the mounting seat 3 is locked with the radiator 2 by penetrating the through hole with a screw and screwing it into the screw hole. This embodiment realizes the positioning of the assembly by providing a magnetic block, a positioning cavity 20 and a positioning base 6, which is convenient for improving the efficiency of actual production assembly.
[0026] Furthermore, the mounting feet 8 of this embodiment are provided with a plurality of Figure 5 The four mounting feet 8 shown in the figure each have a square mounting hole 9, the locking member 4 is provided with a slot, and the fixing portion 10 is located in the slot, so that during assembly, the hole wall of the mounting hole 9 is embedded in the slot and fits with the side wall of the fixing portion 10, thereby fixing the locking member 4 and the mounting foot 8 for assembly, and the locking member 4 cannot rotate, and the assembly stability is higher.
[0027] Furthermore, the fixing foot 11 of the locking member 4 is as follows Figure 7 As shown, it includes a first fixing rod 14 and a second fixing rod 15, a gap 17 is set between the first fixing rod 14 and the second fixing rod 15, and a block 16 is protruded from one end of the first fixing rod 14 and the second fixing rod 15 away from the gap 17. The main board 19 is provided with a through hole (not shown in the drawings), and the block 16 is used to be connected to the through hole.
[0028] Specifically, during assembly, since a gap 17 is provided between the first fixing rod 14 and the second fixing rod 15, when inserted into the through hole of the main board 19, the first fixing rod 14 and the second fixing rod 15 are squeezed by the through hole, so that after the clamping block 16 passes through the through hole, it is clamped at the bottom of the through hole, connecting the main board 19 to the mounting seat 3, thereby assembling the radiator 2 and the fan 1 on the main board 19. Without the assistance of external force, the radiator 2 is not easy to loosen and the installation is stable.
[0029] like Figure 5 In this embodiment, a bending portion 13 is provided between the mounting foot 8 and the mounting seat 3. After the mounting foot 8 is installed to the mainboard 19 through the locking member 4, a heat dissipation space 7 is formed between the mounting seat 3 and the mainboard 19. Therefore, the radiator 2 of this embodiment can be installed above the load and the device with large heat generation of the mainboard 19, such as the main chip, so that the main chip is in the heat dissipation space 7, and the heat generated by the main chip is guided and dissipated by the radiator 2, and the air convection is improved by the fan 1 to increase the heat dissipation effect.
[0030] like Figure 4 As shown, the heat sink fins of this embodiment include two heat sinks 12, which are arranged in an eight-shaped pattern, that is, the heat sink 12 is inclined relative to the radiator 2. The eight-shaped heat sink 12 helps to increase the surface area of the heat sink 12 and improve the heat dissipation effect. Figure 4 The arrangement of the heat sink 12 shown can increase the area of the heat sink 12 while ensuring the number of the heat sink 12 , so that the radiator 2 can achieve the maximum heat dissipation effect.
[0031] In addition, this embodiment is also provided with a temperature detection module (not shown in the drawings), and the temperature detection module and the fan 1 are both connected to the control module signal of the mainboard 19. The temperature detection module is used to detect the temperature of the radiator 2, and the control module of the mainboard 19 adjusts the speed of the fan 1 according to the detection signal of the temperature detection module.
[0032] Specifically, when the temperature inside the chassis rises or the temperature of the radiator 2 rises, it means that the current heat dissipation efficiency is low. The control module of the mainboard controls the speed of fan 1 to increase according to the detection signal of the temperature detection module to improve the heat dissipation efficiency. When the temperature drops, the fan 1 is controlled to reduce the speed to avoid wasting resources. In actual settings, multiple temperature gears can be set. When the corresponding gear is reached, the fan 1 is changed to the corresponding speed to achieve a more flexible heat dissipation effect.
[0033] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model is disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical content disclosed above without departing from the scope of the technical solution of the utility model. However, any simple modification, equivalent change and modification made to the above embodiments according to the technology of the utility model, which does not depart from the content of the technical solution of the utility model, belongs to the scope of the technical solution of the utility model.
Claims
1. A heat dissipation structure of a computer terminal, characterized in that: The utility model comprises a fan, a radiator, a mounting seat and a plurality of locking members, wherein the radiator is provided with a cavity, the fan is detachably assembled in the cavity, the mounting seat is convexly provided with a positioning base, the bottom of the radiator is provided with a positioning cavity, the positioning cavity is used for detachably assembling the positioning base, and the shape of the positioning cavity is adapted to the shape of the positioning base, the positioning base is provided with a magnetic block, and the radiator is a metal member; the mounting seat is provided with a plurality of mounting feet, the mounting feet are provided with mounting holes, the locking member is provided with a fixing portion and a fixing foot, the fixing portion is assembled in the mounting hole, the fixing foot is used for detachably assembling on a mainboard, and the periphery of the radiator is provided with a plurality of groups of cooling fins, and the plurality of groups of cooling fins are arranged at equal intervals.
2. A heat dissipation structure for a computer terminal according to claim 1, characterized in that: The fan is a magnetic bearing fan.
3. The heat dissipation structure of a computer terminal according to claim 1, characterized in that: The heat dissipation fins include two heat dissipation fins, which are arranged in an eight-shaped shape.
4. The heat dissipation structure of a computer terminal according to claim 1, characterized in that: A bending portion is provided between the mounting foot and the mounting seat. After the mounting foot is mounted to the mainboard through a locking member, a heat dissipation space is formed between the mounting seat and the mainboard.
5. The heat dissipation structure of a computer terminal according to claim 1, characterized in that: The fixing portion is in a square shape, and the mounting hole is in a square shape.
6. The heat dissipation structure of a computer terminal according to claim 1, characterized in that: The fixing foot includes a first fixing rod and a second fixing rod, a gap is set between the first fixing rod and the second fixing rod, and a clamping block is protruded from one end of the first fixing rod and the second fixing rod away from the gap. The main board is provided with a through hole, and the clamping block is used to be clamped in the through hole.
7. The heat dissipation structure of a computer terminal according to claim 1, characterized in that: The heat dissipation structure of the computer terminal also includes a temperature detection module. The temperature detection module and the fan are both connected to the control module signal of the mainboard. The temperature detection module is used to detect the temperature of the radiator. The control module of the mainboard adjusts the speed of the fan according to the detection signal of the temperature detection module.
Citation Information
Patent Citations
Heat dissipation flow guide structure and case module
CN215181753U