Wafer cleaning device

Abstract

The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device, which is convenient for fixing, cleaning and drying wafers with different sizes and improves the cleaning quality. Comprising a cleaning mechanism; the cleaning device comprises a cleaning mechanism, and further comprises a drying mechanism, a lifting mechanism, a rotating mechanism, three supporting mechanisms and three fixing mechanisms, the drying mechanism is installed on the cleaning mechanism, the lifting mechanism is installed on the cleaning mechanism, the rotating mechanism is installed on the lifting mechanism, the supporting mechanisms are installed on the rotating mechanism, and the fixing mechanisms are installed on the supporting mechanisms. The wafer is conveniently cleaned through the cleaning mechanism, the wafer is dried through the drying mechanism, the wafer is conveniently fished out through the lifting mechanism, the wafer is conveniently transported through the rotating mechanism, the fixing mechanism is supported through the supporting mechanism, and the wafers with different diameters are rapidly fixed through the fixing mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device. Background Art

[0002] Wafer, also known as chip substrate, is the carrier for chip processing in semiconductor manufacturing. Its original material is silicon, which undergoes a series of complex process treatments, such as crystal rod growth, cutting and testing, outer diameter grinding, slicing, rounding, surface grinding, etching, defect removal, polishing, cleaning and other steps to form a silicon wafer, that is, a wafer. During the processing and production of the wafer, various organic matter, particles and pollutants generated by contact with metal will remain on its surface. These residues will affect the qualified rate of the wafer, so it needs to be cleaned.

[0003] Existing wafer cleaning technologies, such as the prior art with application number CN202320295964.8, include a bracket, a water storage chamber, a baffle, a water pipe, a pump, a switch, a wafer placement box, a clamping mechanism, a slide, a cover, a motor, a water outlet pipe and a telescopic rod, etc. The wafer placement box is clamped by providing a clamping mechanism to ensure that the wafer clamping box remains fixed during the cleaning process. At the same time, rollers are provided on the clamping plate of the clamping mechanism to provide guidance during the movement of the wafer placement box.

[0004] However, the prior art does not dry the wafer after cleaning it, so that water stains cause secondary contamination to the wafer, reducing the cleaning quality, and the cleaning efficiency of the prior art is low. Utility Model Content

[0005] In order to solve the above technical problems, the utility model provides a wafer cleaning device which is convenient for fixing, cleaning and drying wafers of different sizes and improves the cleaning quality.

[0006] The utility model discloses a wafer cleaning device, comprising a cleaning mechanism; further comprising a drying mechanism, a lifting mechanism, a rotating mechanism, three groups of supporting mechanisms and three groups of fixing mechanisms, wherein the drying mechanism is mounted on the cleaning mechanism, the lifting mechanism is mounted on the cleaning mechanism, the rotating mechanism is mounted on the lifting mechanism, the supporting mechanism is mounted on the rotating mechanism, and the fixing mechanism is mounted on the supporting mechanism; the cleaning mechanism is convenient for cleaning the wafer, the drying mechanism dries the wafer, the lifting mechanism is convenient for fishing out the wafer, the rotating mechanism is convenient for transporting the wafer, the supporting mechanism supports the fixing mechanism, and the fixing mechanism quickly fixes wafers of different diameters; the cleaning mechanism is convenient for cleaning the wafer, the drying mechanism dries the wafer, water stains are prevented from affecting the cleaning effect, the lifting mechanism is convenient for fishing out the wafer, the rotating mechanism is convenient for transporting the wafer, the supporting mechanism supports the fixing mechanism, and the fixing mechanism quickly fixes wafers of different diameters, thereby improving practicality and convenience.

[0007] Preferably, the cleaning mechanism includes a base plate, a cleaning tank and an ultrasonic generator. The cleaning tank is installed on the top of the base plate, and the ultrasonic generator is installed in the cleaning tank. First, the cleaning liquid is added into the cleaning tank. When the wafer is immersed in the cleaning liquid in the cleaning tank, the ultrasonic generator is turned on to perform a low-acoustic cleaning on the wafer.

[0008] Preferably, the drying mechanism includes a drying tank, a heating wire, a mounting plate, fan blades and a drying motor. The drying tank is installed on the top of the bottom plate, the heating wire is installed on the inner wall of the drying tank, the mounting plate is installed on the inner wall of the drying tank, the fan blades are rotatably installed on the mounting plate, the drying motor is installed on the bottom end of the mounting plate, and the output end of the drying motor is connected to the fan blades. When the wafer is transported into the drying tank, the fan blades are driven to rotate by turning on the drying motor, and then the heating wire is turned on to heat the wind of the drying motor, thereby drying the wafer, improving the drying efficiency, and preventing water stains from affecting the cleaning effect.

[0009] Preferably, the lifting mechanism includes a sliding sleeve, a sliding rod, a lead screw, a first bevel gear and a second bevel gear. The sliding sleeve is installed at the top of the base plate, the sliding rod is slidably installed in the sliding sleeve, the lead screw is rotatably installed in the sliding sleeve, the lead screw is threadedly matched with the sliding rod, the first bevel gear is installed on the lead screw, and the second bevel gear is rotatably installed on the side wall of the sliding sleeve through a rotating shaft, and the second bevel gear is meshed with the first bevel gear; the second bevel gear is driven to rotate by rotating the rotating shaft of the second bevel gear, the lead screw is driven to rotate through the meshing relationship, and then the sliding rod is driven to slide in the sliding sleeve through the threaded relationship, thereby facilitating the lifting and lowering of the wafer on the fixing mechanism, so as to facilitate the wafer to be removed from the base plate and the drying tank.

[0010] Preferably, the rotating mechanism includes a rotating box, a rotating shaft, a turbine, a worm gear and a rotating motor. The rotating box is installed on the top of the sliding rod, the rotating shaft is rotatably installed on the rotating box, the turbine is installed on the rotating shaft, the worm gear is rotatably installed on the inner wall of the rotating box, the rotating motor is installed on the side wall of the rotating box, the worm gear is meshed with the turbine, and the output end of the rotating motor is connected to the worm gear; the worm gear is driven to rotate by turning on the rotating motor, and then the rotating shaft is driven to rotate through the meshing relationship, thereby transporting the wafer on the fixed mechanism.

[0011] Preferably, the supporting mechanism includes a first connecting bent rod, a mounting seat and a second connecting rod, a turntable is provided at the top of the rotating shaft, one end of the first connecting bent rod is installed on the turntable, the mounting seat is installed on the other end of the first connecting bent rod, and the fixing mechanism is installed on the first connecting bent rod through the second connecting rod. Three groups of supporting mechanisms are all installed on the turntable, and three groups of fixing mechanisms are respectively installed on three second connecting rods; the fixing mechanism is supported by the first connecting bent rod, the mounting seat and the second connecting rod.

[0012] Preferably, the fixing mechanism includes a fixed plate, a guide rod, a fixed block, a spring, a telescopic rod and a connecting wall. The fixed plate is installed on the mounting seat through a second connecting rod. A slide groove is provided on the fixed plate. The guide rod is installed in the slide groove of the fixed plate. The fixed block is slidably installed on the guide rod. The spring is connected to the fixed block on the inner wall of the slide groove. The telescopic rod is installed on the bottom end of the fixed plate. One end of the connecting wall is rotatably installed on the fixed block, and the other end of the connecting wall is rotatably installed on the telescopic rod. When the wafer needs to be quickly fixed, the telescopic rod is pressed so that the connecting wall pushes the fixed block to slide on the guide rod, and then the wafer is placed on the fixed plate, the telescopic rod is released, and the fixed block slides on the guide rod through the elastic labor of the spring, and wafers of different diameters are fixed through the fixed block.

[0013] Compared with the prior art, the utility model has the following beneficial effects: the cleaning mechanism facilitates the cleaning of the wafer, the drying mechanism dries the wafer to prevent water stains from affecting the cleaning effect, the lifting mechanism facilitates the removal of the wafer, the rotating mechanism facilitates the transportation of the wafer, the supporting mechanism supports the fixing mechanism, and the fixing mechanism quickly fixes wafers of different diameters, thereby improving practicality and convenience. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a first axonometric structural schematic diagram of the utility model;

[0015] Figure 2 It is a second axonometric structural schematic diagram of the utility model;

[0016] Figure 3 It is a third axonometric structural schematic diagram of the utility model;

[0017] Figure 4 It is a front-view cross-sectional axonometric structural schematic diagram of the utility model;

[0018] Figure 5 It is a schematic diagram of the top-view cross-section axonometric structure of the utility model;

[0019] Figure 6 It is a schematic diagram of the side-view cross-section axonometric structure of the utility model;

[0020] Markings in the accompanying drawings: 01, cleaning mechanism; 11, bottom plate; 12, cleaning tank; 13, ultrasonic generator; 02, drying mechanism; 21, drying tank; 22, heating wire; 23, mounting plate; 24, fan blade; 25, drying motor; 03, lifting mechanism; 31, sliding sleeve; 32, sliding rod; 33, lead screw; 34, first bevel gear; 35, second bevel gear; 04, rotating mechanism; 41, rotating box; 42, rotating shaft; 43, turbine; 44, vortex rod; 45, rotating motor; 05, supporting mechanism; 51, first connecting bent rod; 52, mounting seat; 53, second connecting rod; 06, fixing mechanism; 61, fixing plate; 62, guide rod; 63, fixing block; 64, spring; 65, telescopic rod; 66, connecting wall. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively below with reference to the relevant drawings. The utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0022] Example 1

[0023] like Figure 3 and Figure 4 As shown, it includes a cleaning mechanism 01, a drying mechanism 02, a lifting mechanism 03, a rotating mechanism 04, three groups of supporting mechanisms 05 and three groups of fixing mechanisms 06. The drying mechanism 02 is installed on the cleaning mechanism 01, the lifting mechanism 03 is installed on the cleaning mechanism 01, the rotating mechanism 04 is installed on the lifting mechanism 03, the supporting mechanism 05 is installed on the rotating mechanism 04, and the fixing mechanism 06 is installed on the supporting mechanism 05;

[0024] The cleaning mechanism 01 is used to clean the wafer, the drying mechanism 02 is used to dry the wafer, the lifting mechanism 03 is used to fish out the wafer, the rotating mechanism 04 is used to transport the wafer, the supporting mechanism 05 is used to support the fixing mechanism 06, and the fixing mechanism 06 is used to quickly fix wafers of different diameters;

[0025] The cleaning mechanism 01 includes a bottom plate 11, a cleaning tank 12 and an ultrasonic generator 13. The cleaning tank 12 is installed on the top of the bottom plate 11, and the ultrasonic generator 13 is installed in the cleaning tank 12.

[0026] The drying mechanism 02 includes a drying tank 21, a heating wire 22, a mounting plate 23, a fan blade 24 and a drying motor 25. The drying tank 21 is mounted on the top of the bottom plate 11, the heating wire 22 is mounted on the inner wall of the drying tank 21, the mounting plate 23 is mounted on the inner wall of the drying tank 21, the fan blade 24 is rotatably mounted on the mounting plate 23, the drying motor 25 is mounted on the bottom end of the mounting plate 23, and the output end of the drying motor 25 is connected to the fan blade 24;

[0027] First, the cleaning liquid is added into the cleaning tank 12. When the wafer is immersed in the cleaning liquid in the cleaning tank 12, the ultrasonic generator 13 is turned on to perform a low-sonic cleaning on the wafer. When the wafer is transported to the drying tank 21, the drying motor 25 is turned on to drive the fan blade 24 to rotate, and then the heating wire 22 is turned on to heat the wind of the drying motor 25, so as to dry the wafer, improve the drying efficiency, and prevent water stains from affecting the cleaning effect. The lifting mechanism 03 facilitates the removal of the wafer, the rotating mechanism 04 facilitates the transportation of the wafer, the supporting mechanism 05 supports the fixing mechanism 06, and the fixing mechanism 06 can quickly fix wafers of different diameters to improve practicality and convenience.

[0028] Example 2

[0029] like Figure 2 , Figure 5 and Figure 6 As shown, it includes a cleaning mechanism 01, a drying mechanism 02, a lifting mechanism 03, a rotating mechanism 04, three groups of supporting mechanisms 05 and three groups of fixing mechanisms 06. The drying mechanism 02 is installed on the cleaning mechanism 01, the lifting mechanism 03 is installed on the cleaning mechanism 01, the rotating mechanism 04 is installed on the lifting mechanism 03, the supporting mechanism 05 is installed on the rotating mechanism 04, and the fixing mechanism 06 is installed on the supporting mechanism 05;

[0030] The cleaning mechanism 01 is used to clean the wafer, the drying mechanism 02 is used to dry the wafer, the lifting mechanism 03 is used to fish out the wafer, the rotating mechanism 04 is used to transport the wafer, the supporting mechanism 05 is used to support the fixing mechanism 06, and the fixing mechanism 06 is used to quickly fix wafers of different diameters;

[0031] The lifting mechanism 03 includes a sliding sleeve 31, a sliding rod 32, a lead screw 33, a first bevel gear 34 and a second bevel gear 35. The sliding sleeve 31 is mounted on the top of the bottom plate 11. The sliding rod 32 is slidably mounted in the sliding sleeve 31. The lead screw 33 is rotatably mounted in the sliding sleeve 31. The lead screw 33 and the sliding rod 32 are threadedly matched. The first bevel gear 34 is mounted on the lead screw 33. The second bevel gear 35 is rotatably mounted on the side wall of the sliding sleeve 31 through a rotating shaft. The second bevel gear 35 is meshed with the first bevel gear 34.

[0032] The rotating mechanism 04 includes a rotating box 41, a rotating shaft 42, a turbine 43, a worm 44 and a rotating motor 45. The rotating box 41 is mounted on the top of the sliding rod 32, the rotating shaft 42 is rotatably mounted on the rotating box 41, the turbine 43 is mounted on the rotating shaft 42, the worm 44 is rotatably mounted on the inner wall of the rotating box 41, the rotating motor 45 is mounted on the side wall of the rotating box 41, the worm 44 is meshed with the turbine 43, and the output end of the rotating motor 45 is connected to the worm 44;

[0033] The supporting mechanism 05 includes a first connecting bent rod 51, a mounting seat 52 and a second connecting rod 53. A turntable is provided at the top of the rotating shaft 42. One end of the first connecting bent rod 51 is mounted on the turntable. The mounting seat 52 is mounted on the other end of the first connecting bent rod 51. The fixing mechanism 06 is mounted on the first connecting bent rod 51 through the second connecting rod 53. The three groups of supporting mechanisms 05 are all mounted on the turntable, and the three groups of fixing mechanisms 06 are respectively mounted on the three second connecting rods 53.

[0034] The fixing mechanism 06 includes a fixing plate 61, a guide rod 62, a fixing block 63, a spring 64, a telescopic rod 65 and a connecting wall 66. The fixing plate 61 is installed on the mounting seat 52 through the second connecting rod 53. A slide groove is provided on the fixing plate 61. The guide rod 62 is installed in the slide groove of the fixing plate 61. The fixing block 63 is slidably installed on the guide rod 62. The spring 64 is connected to the fixing block 63 on the inner wall of the slide groove. The telescopic rod 65 is installed at the bottom end of the fixing plate 61. One end of the connecting wall 66 is rotatably installed on the fixing block 63, and the other end of the connecting wall 66 is rotatably installed on the telescopic rod 65.

[0035] The cleaning mechanism 01 is used to clean the wafers, and the drying mechanism 02 dries the wafers to prevent water stains from affecting the cleaning effect. The second bevel gear 35 is driven to rotate by rotating the rotating shaft of the second bevel gear 35, and the lead screw 33 is driven to rotate through the meshing relationship, and then the sliding rod 32 is driven to slide in the sliding sleeve 31 through the threaded relationship, so as to facilitate the lifting of the wafers on the fixing mechanism 06, so as to facilitate the wafers to be fished out from the bottom plate 11 and the drying tank 21. The worm 44 is driven to rotate by turning on the rotating motor 45, and then the rotating shaft 42 is driven to rotate through the meshing relationship, so as to transport the wafers on the fixing mechanism 06. When the wafers need to be quickly fixed, the telescopic rod 65 is pressed so that the connecting wall 66 pushes the fixing block 63 to slide on the guide rod 62, and then the wafer is placed on the fixing plate 61, and the telescopic rod 65 is loosened. The fixing block 63 slides on the guide rod 62 through the elasticity of the spring 64, and wafers of different diameters are fixed by the fixing block 63.

[0036] like Figures 1 to 6As shown, a wafer cleaning device of the utility model, when working, firstly adds the cleaning liquid into the cleaning tank 12, when the wafer is immersed in the cleaning liquid in the cleaning tank 12, the wafer is cleaned by a small amount of ultrasonic waves by turning on the ultrasonic generator 13, when the wafer is transported to the drying tank 21, the fan blades 24 are driven to rotate by turning on the drying motor 25, and then the heating wire 22 is turned on to heat the wind of the drying motor 25, so as to dry the wafer, improve the drying efficiency, and prevent the influence of water stains on the cleaning effect, and the second bevel gear 35 is driven to rotate by rotating the rotating shaft of the second bevel gear 35, and the lead screw 33 is driven to rotate through the meshing relationship, and then the slide is driven through the threaded relationship. The movable rod 32 slides in the sliding sleeve 31, thereby driving the wafer on the fixing mechanism 06 to rise and fall, so as to take the wafer out of the bottom plate 11 and the drying tank 21. The worm rod 44 is driven to rotate by turning on the rotating motor 45, and then the rotating shaft 42 is driven to rotate through the meshing relationship, thereby transporting the wafer on the fixing mechanism 06. When the wafer needs to be quickly fixed, the telescopic rod 65 is pressed so that the connecting wall 66 pushes the fixing block 63 to slide on the guide rod 62, and then the wafer is placed on the fixing plate 61, and the telescopic rod 65 is loosened. The fixing block 63 slides on the guide rod 62 through the elasticity of the spring 64, and wafers of different diameters are fixed through the fixing block 63.

[0037] The ultrasonic generator 13, heating wire 22, drying motor 25 and rotating motor 45 of the utility model are purchased on the market, and technicians in the industry only need to install and operate them according to the accompanying instruction manual, without the need for creative work by technicians in this field.

[0038] The main functions realized by the utility model are: in the process of wafer cleaning, it is convenient to fix, clean and dry wafers of different sizes, thereby improving the cleaning quality.

[0039] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A wafer cleaning device, comprising a cleaning mechanism (01); characterized in that: It also includes a drying mechanism (02), a lifting mechanism (03), a rotating mechanism (04), three groups of supporting mechanisms (05) and three groups of fixing mechanisms (06), wherein the drying mechanism (02) is mounted on the cleaning mechanism (01), the lifting mechanism (03) is mounted on the cleaning mechanism (01), the rotating mechanism (04) is mounted on the lifting mechanism (03), the supporting mechanism (05) is mounted on the rotating mechanism (04), and the fixing mechanism (06) is mounted on the supporting mechanism (05); The cleaning mechanism (01) is convenient for cleaning the wafers, the drying mechanism (02) is convenient for drying the wafers, the lifting mechanism (03) is convenient for fishing out the wafers, the rotating mechanism (04) is convenient for transporting the wafers, the supporting mechanism (05) supports the fixing mechanism (06), and the fixing mechanism (06) is convenient for quickly fixing wafers of different diameters.

2. A wafer cleaning device as claimed in claim 1, characterized in that: The cleaning mechanism (01) comprises a bottom plate (11), a cleaning tank (12) and an ultrasonic generator (13). The cleaning tank (12) is installed on the top of the bottom plate (11), and the ultrasonic generator (13) is installed in the cleaning tank (12).

3. A wafer cleaning device as claimed in claim 2, characterized in that: The drying mechanism (02) comprises a drying tank (21), a heating wire (22), a mounting plate (23), a fan blade (24) and a drying motor (25), wherein the drying tank (21) is mounted on the top of the bottom plate (11), the heating wire (22) is mounted on the inner wall of the drying tank (21), the mounting plate (23) is mounted on the inner wall of the drying tank (21), the fan blade (24) is rotatably mounted on the mounting plate (23), the drying motor (25) is mounted on the bottom end of the mounting plate (23), and the output end of the drying motor (25) is connected to the fan blade (24).

4. A wafer cleaning device as claimed in claim 2, characterized in that: The lifting mechanism (03) comprises a sliding sleeve (31), a sliding rod (32), a lead screw (33), a first bevel gear (34) and a second bevel gear (35); the sliding sleeve (31) is mounted on the top of the base plate (11); the sliding rod (32) is slidably mounted in the sliding sleeve (31); the lead screw (33) is rotatably mounted in the sliding sleeve (31); the lead screw (33) and the sliding rod (32) are threadedly matched; the first bevel gear (34) is mounted on the lead screw (33); the second bevel gear (35) is rotatably mounted on the side wall of the sliding sleeve (31) via a rotating shaft; and the second bevel gear (35) is meshed with the first bevel gear (34).

5. A wafer cleaning device as claimed in claim 4, characterized in that: The rotating mechanism (04) comprises a rotating box (41), a rotating shaft (42), a turbine (43), a worm gear (44) and a rotating motor (45). The rotating box (41) is mounted on the top end of the sliding rod (32), the rotating shaft (42) is rotatably mounted on the rotating box (41), the turbine (43) is mounted on the rotating shaft (42), the worm gear (44) is rotatably mounted on the inner wall of the rotating box (41), the rotating motor (45) is mounted on the side wall of the rotating box (41), the worm gear (44) is meshed with the turbine (43), and the output end of the rotating motor (45) is connected to the worm gear (44).

6. A wafer cleaning device as claimed in claim 5, characterized in that: The supporting mechanism (05) comprises a first connecting bent rod (51), a mounting seat (52) and a second connecting rod (53); a turntable is arranged at the top end of the rotating shaft (42); one end of the first connecting bent rod (51) is mounted on the turntable; the mounting seat (52) is mounted on the other end of the first connecting bent rod (51); the fixing mechanism (06) is mounted on the first connecting bent rod (51) via the second connecting rod (53); the three groups of supporting mechanisms (05) are all mounted on the turntable; and the three groups of fixing mechanisms (06) are respectively mounted on the three second connecting rods (53).

7. A wafer cleaning device as claimed in claim 6, characterized in that: The fixing mechanism (06) comprises a fixing plate (61), a guide rod (62), a fixing block (63), a spring (64), a telescopic rod (65) and a connecting wall (66). The fixing plate (61) is mounted on the mounting seat (52) through a second connecting rod (53). A sliding groove is provided on the fixing plate (61). The guide rod (62) is mounted in the sliding groove of the fixing plate (61). The fixing block (63) is slidably mounted on the guide rod (62). The spring (64) is connected to the fixing block (63) on the inner wall of the sliding groove. The telescopic rod (65) is mounted on the bottom end of the fixing plate (61). One end of the connecting wall (66) is rotatably mounted on the fixing block (63), and the other end of the connecting wall (66) is rotatably mounted on the telescopic rod (65).

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