Large-size wafer clamping mechanism

Abstract

The utility model relates to the technical field of wafer processing, in particular to a large-size wafer clamping mechanism which comprises a bottom plate, a mounting seat is mounted on the upper end face of the bottom plate, a mechanical arm used for moving a wafer is fixedly connected to the upper end face of the mounting seat, and an electric push rod used for lifting a wafer clamping mechanism body is connected to the lower end face of the mechanical arm. According to the utility model, the sponge blocks at the two arc-shaped concave plates can clamp the two ends of a wafer in an attached manner, and then the two threaded clamping plates can move in opposite directions to adaptively clamp the other two ends of the wafer, so that the periphery of the wafer can be limited and fixed; according to the wafer clamping mechanism, the clamping force can be weakened through rubber pads at the two arc-shaped concave plates and rubber strips at the two threaded clamping plates, so that the periphery of a wafer can be elastically clamped, the wafer on the clamping mechanism is better protected, and the situation that the wafer is directly damaged due to the fact that the clamping force is too large is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a large-size wafer clamping mechanism. Background Art

[0002] Wafers are usually made of high-purity single-crystal silicon with very high purity and flatness. During the manufacturing process, this silicon wafer goes through a series of complex processes such as chemical vapor deposition, photolithography, etching, ion implantation, etc., on which electronic components such as transistors, diodes, field-effect transistors, optoelectronic devices, and integrated circuits can be built. In order to process the wafer, a wafer clamping mechanism is required.

[0003] The prior art discloses patent application number "CN202021104496.4", a chip processing wafer clamping device, including: a base, a rotating mechanism, a spacing adjustment mechanism, a fixing mechanism and a controller; the rotating mechanism is installed at the inner top center position of the base in the up and down direction, and the top of the rotating mechanism extends out of the upper surface of the base; the spacing adjustment mechanism is installed at the top of the rotating mechanism in the left and right direction; the fixing mechanism is installed at the top of the spacing adjustment mechanism; the controller is installed at the front center position of the base.

[0004] The wafer clamping device can only achieve adsorption and fixation of wafers of different specifications and sizes, but it cannot limit and fix the four sides of the wafer, resulting in poor stability when the wafer is clamped. At the same time, if the clamping force is too large, it will directly damage the wafer, increase costs, and thus affect the safety of wafer clamping, making it inconvenient to use. Utility Model Content

[0005] The purpose of the utility model is to provide a large-size wafer clamping mechanism to solve the problems raised in the above background technology.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] A large-size wafer clamping mechanism comprises a bottom plate, a mounting seat is installed on the upper end surface of the bottom plate, a mechanical arm for moving the wafer is fixedly connected to the upper end surface of the mounting seat, an electric push rod for lifting and lowering the main body of the wafer clamping mechanism is connected to the lower end surface of the mechanical arm, the main body of the wafer clamping mechanism is fixedly installed on the lower end surface of the electric push rod, and the lower end surface of the main body of the wafer clamping mechanism is fixedly connected to a limited position seat;

[0008] The limiting seat is internally slidably connected to a first sliding plate and a second sliding plate, two connecting springs are connected between the first sliding plate and the second sliding plate, two sliding rods are slidably connected to both ends of the first sliding plate and the second sliding plate, connecting plates are installed on the rear end faces of the two sliding rods, the inner side faces of the first sliding plate and the second sliding plate are connected to arc-shaped concave plates for clamping wafers, and sponge blocks are connected to the insides of the two arc-shaped concave plates.

[0009] Preferably, rubber pads are installed at the bottom ends of the two arc-shaped concave plates, the lower end surface of the wafer clamping mechanism body is rotatably connected to a rotating shaft, the lower end surface of the rotating shaft is connected to a double-headed convex plate, both ends of the double-headed convex plate are threadedly connected to screws, and one side of the two screws is fixedly connected to a cam.

[0010] Preferably, the upper side of the rotating shaft passes through the wafer clamping mechanism body and extends to the upper end surface of the wafer clamping mechanism body. The upper end surface of the rotating shaft is fixedly connected to the first servo motor through the motor mounting plate, and two baffles for limiting the first sliding plate and the second sliding plate are installed inside the limit seat.

[0011] Preferably, fixed side plates are installed at both ends of the wafer clamping mechanism body, the inner sides of the two fixed side plates are rotatably connected to bidirectional threaded rotating rods, the outer surfaces of the bidirectional threaded rotating rods are threadedly connected to two threaded clamps, the inner sides of the two threaded clamps are fixedly installed with positioning plates, and the inner sides of the two threaded clamps are connected to rubber strips in an array.

[0012] Preferably, the right side of the bidirectional threaded rotating rod passes through the fixed side plate and extends to the right end surface of the fixed side plate. The right end surface of the bidirectional threaded rotating rod is fixedly connected to the second servo motor through the motor mounting plate. The inner side surfaces of the two fixed side plates are connected to two limit rods, and the outer surfaces of the two limit rods are slidably connected to the two ends of the threaded clamp.

[0013] Preferably, one side of the connecting spring is connected to the rear end surface of the first sliding plate, and the other side of the connecting spring is connected to the front end surface of the second sliding plate, and the second sliding plate is located at the rear side of the first sliding plate.

[0014] Beneficial effects of the utility model:

[0015] 1. The utility model squeezes the second sliding plate and the connecting plate by rotating two cams at the same time, so that the first sliding plate and the second sliding plate with elastic force can move toward each other on the two sliding rods, so that the sponge blocks at the two arc-shaped concave plates can fit and clamp the two ends of the wafer, and then the two threaded clamping plates can move toward each other and adaptively clamp the other two ends of the wafer, so that the four sides of the wafer can be limited and fixed, and the stability of the wafer when clamping is improved;

[0016] 2. The utility model can reduce the clamping force by utilizing rubber pads at the two arc-shaped concave plates and rubber strips at the two threaded clamping plates, so that the wafer can be elastically clamped all around, thereby better protecting the wafer on the clamping mechanism and avoiding direct damage to the wafer due to excessive clamping force. At the same time, cams of different lengths can be replaced by screws to push the two arc-shaped concave plates to adapt to clamp wafers of different sizes, thereby improving the flexibility of the wafer clamping mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This utility model Figure 1 Schematic diagram of the structure of the middle arc concave plate, rubber pad and sponge block;

[0020] Figure 3 This utility model Figure 1 Schematic diagram of the installation of the middle sliding bar, the second sliding plate and the sliding bar;

[0021] Figure 4 This utility model Figure 1 Schematic diagram of the structure of the middle thread clamp, positioning plate and rubber strip;

[0022] The reference numerals in the figures are as follows:

[0023] 1. Base plate; 2. Mounting seat; 3. Robotic arm; 4. Electric push rod; 5. Wafer clamping mechanism body; 6. Limit seat; 7. First sliding plate; 8. Second sliding plate; 9. Connecting spring; 10. Sliding rod; 11. Connecting plate; 12. Arc concave plate; 13. Rubber pad; 14. Sponge block; 15. Double-headed convex plate; 16. Screw; 17. Cam; 18. First servo motor; 19. Baffle; 20. Fixed side plate; 21. Bidirectional threaded rotating rod; 22. Second servo motor; 23. Threaded clamp; 24. Positioning plate; 25. Rubber strip; 26. Limit rod; 111. Rotating shaft. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] like Figures 1 to 4 As shown, a large-size wafer clamping mechanism comprises a base plate 1, a mounting seat 2 is installed on the upper end surface of the base plate 1, a mechanical arm 3 for moving the wafer is fixedly connected to the upper end surface of the mounting seat 2, an electric push rod 4 for lifting and lowering a wafer clamping mechanism body 5 is connected to the lower end surface of the mechanical arm 3, a wafer clamping mechanism body 5 is fixedly installed on the lower end surface of the electric push rod 4, through the installation and use of the mechanical arm 3 and the electric push rod 4, the mechanical arm 3 can be used to facilitate the clamping mechanism to move the wafer, and then the electric push rod 4 can also drive the adjustment of the clamping height of the clamping mechanism, which is convenient to use, and the lower end surface of the wafer clamping mechanism body 5 is fixedly connected to a limited position seat 6;

[0026] The limiting seat 6 is internally slidably connected to a first sliding plate 7 and a second sliding plate 8. The limiting seat 6 can be used to limit the moving directions of the first sliding plate 7 and the second sliding plate 8 so that the two sliding plates can move back and forth more stably. Two connecting springs 9 are connected between the first sliding plate 7 and the second sliding plate 8. Through the setting of the connecting springs 9, the elastic force of the connecting springs 9 can allow the two sliding plates to return to their original positions so as to release the clamped wafers and clamp wafers of different sizes at the same time. Two sliding rods 10 are slidably connected to both ends of the first sliding plate 7 and the second sliding plate 8. A connecting plate 11 is installed on the rear end faces of the two sliding rods 10. The inner side faces of the first sliding plate 7 and the second sliding plate 8 are connected to arc-shaped concave plates 12 for clamping wafers, and the interiors of the two arc-shaped concave plates 12 are connected to sponge blocks 14.

[0027] Rubber pads 13 are installed at the bottom ends of the two arc-shaped concave plates 12. Through the setting of the rubber pads 13, the rubber pads 13 can fit to the bottom end of the wafer, which is convenient for further positioning the wafer. The lower end surface of the wafer clamping mechanism main body 5 is rotatably connected to the rotating shaft 111, and the lower end surface of the rotating shaft 111 is connected to a double-headed convex plate 15. Through the setting of the double-headed convex plate 15, the double-headed convex plate 15 is in an initial state when squeezing the second sliding plate 8 and the connecting plate 11, which is convenient for clamping the wafer. Screws 16 are threadedly connected to both ends of the double-headed convex plate 15, and cams 17 are fixedly connected to one side of the two screws 16. Through the setting of the cams 17, when the two cams 17 squeeze the second sliding plate 8 and the connecting plate 11 at the same time, it is convenient to clamp the wafer and is easy to use.

[0028] The upper side of the rotating shaft 111 passes through the wafer clamping mechanism body 5 and extends to the upper end surface of the wafer clamping mechanism body 5. The upper end surface of the rotating shaft 111 is fixedly connected to the first servo motor 18 through the motor mounting plate. Two baffles 19 for limiting the first sliding plate 7 and the second sliding plate 8 are installed inside the limit seat 6.

[0029] Fixed side plates 20 are installed at both ends of the wafer clamping mechanism body 5, and the inner sides of the two fixed side plates 20 are rotatably connected with a bidirectional threaded rotating rod 21. The outer surface of the bidirectional threaded rotating rod 21 is threadedly connected with two threaded clamping plates 23. The inner sides of the two threaded clamping plates 23 are fixedly installed with positioning plates 24. Through the setting of the positioning plates 24, the two positioning plates 24 can be limited under the wafer to facilitate fixing the position of the wafer. The inner sides of the two threaded clamping plates 23 are connected with rubber strips 25 in an array.

[0030] The right side of the bidirectional threaded rotating rod 21 passes through the fixed side plate 20 and extends to the right end face of the fixed side plate 20. The right end face of the bidirectional threaded rotating rod 21 is fixedly connected to the second servo motor 22 through the motor mounting plate. The inner side faces of the two fixed side plates 20 are connected to two limit rods 26. Through the setting of the limit rods 26, the two limit rods 26 can limit the moving trajectory of the two threaded clamps 23, so that the two threaded clamps 23 can move back and forth smoothly to clamp the wafer around. The outer surfaces of the two limit rods 26 are slidably connected to the two ends of the threaded clamps 23.

[0031] One side of the connecting spring 9 is connected to the rear end surface of the first sliding plate 7 , and the other side of the connecting spring 9 is connected to the front end surface of the second sliding plate 8 , which is located at the rear side of the first sliding plate 7 .

[0032] The working principle of a large-size wafer clamping mechanism provided by the utility model is as follows:

[0033] The mechanical arm 3 is used to drive the wafer clamping mechanism body 5 to move to the top of the wafer, and then the electric push rod 4 is used to drive the wafer clamping mechanism body 5 to move downward, and then the first servo motor 18 is started. The output shaft of the first servo motor 18 can drive the rotating shaft 111 to rotate, so that the two cams 17 at the rotating shaft 111 can rotate and squeeze the second sliding plate 8 and the connecting plate 11 at the same time, so that the first sliding plate 7 and the second sliding plate 8 equipped with the connecting spring 9 can move toward each other on the two sliding rods 10, so that the sponge blocks 14 at the two arc-shaped concave plates 12 can fit and clamp the two ends of the wafer. Then, the output shaft of the second servo motor 22 can drive the two-way threaded rotating rod 21 to rotate. At this time, the two threaded clamping plates 23 on the two-way threaded rotating rod 21 can move toward each other and adaptively clamp to the other two ends of the wafer, so that the four sides of the wafer will be limited and fixed, and the stability of the wafer during clamping will be improved;

[0034] By utilizing the rubber pads 13 at the two arc-shaped concave plates 12 and the rubber strips 25 at the two threaded clamps 23, the clamping force can be weakened, so that the wafer can be elastically clamped around to better protect the wafer on the clamping mechanism. Then, the screw 16 can be used to drive the cam 17 to be installed on the double-headed convex plate 15 so as to replace the cam 17 of different lengths. In this way, the two sliding plates can drive the two arc-shaped concave plates 12 to adapt to clamp wafers of different sizes, thereby improving the flexibility of the wafer clamping mechanism.

[0035] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments, and the above embodiments and descriptions are only for explaining the principle of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, and these changes and improvements fall within the scope of the utility model to be protected.

Claims

1. A large-size wafer clamping mechanism, comprising a base plate (1), characterized in that: The upper end surface of the base plate (1) is mounted with a mounting seat (2), the upper end surface of the mounting seat (2) is fixedly connected with a mechanical arm (3) for moving a wafer, the lower end surface of the mechanical arm (3) is connected with an electric push rod (4) for lifting and lowering a wafer clamping mechanism body (5), the lower end surface of the electric push rod (4) is fixedly mounted with a wafer clamping mechanism body (5), and the lower end surface of the wafer clamping mechanism body (5) is fixedly connected with a limit seat (6); The limiting seat (6) is internally slidably connected to a first sliding plate (7) and a second sliding plate (8); two connecting springs (9) are connected between the first sliding plate (7) and the second sliding plate (8); two sliding rods (10) are slidably connected to both ends of the first sliding plate (7) and the second sliding plate (8); a connecting plate (11) is installed on the rear end faces of the two sliding rods (10); the inner side faces of the first sliding plate (7) and the second sliding plate (8) are connected to arc-shaped concave plates (12) for clamping wafers; and the insides of the two arc-shaped concave plates (12) are connected to sponge blocks (14).

2. A large-size wafer clamping mechanism according to claim 1, characterized in that: The bottom ends of the two arc-shaped concave plates (12) are both installed with rubber pads (13); the lower end surface of the wafer clamping mechanism body (5) is rotatably connected to a rotating shaft (111); the lower end surface of the rotating shaft (111) is connected to a double-headed convex plate (15); both ends of the double-headed convex plate (15) are threadedly connected to screw rods (16); and one side of the two screw rods (16) is fixedly connected to a cam (17).

3. A large-size wafer clamping mechanism according to claim 2, characterized in that: The upper side of the rotating shaft (111) passes through the wafer clamping mechanism body (5) and extends to the upper end surface of the wafer clamping mechanism body (5); the upper end surface of the rotating shaft (111) is fixedly connected to a first servo motor (18) via a motor mounting plate; and two baffles (19) for limiting the first sliding plate (7) and the second sliding plate (8) are installed inside the limiting seat (6).

4. A large-size wafer clamping mechanism according to claim 1, characterized in that: Both ends of the wafer clamping mechanism body (5) are installed with fixed side plates (20), the inner side surfaces of the two fixed side plates (20) are rotatably connected with a bidirectional threaded rotating rod (21), the outer surface of the bidirectional threaded rotating rod (21) is threadedly connected with two threaded clamping plates (23), the inner side surfaces of the two threaded clamping plates (23) are fixedly installed with positioning plates (24), and the inner side surfaces of the two threaded clamping plates (23) are array-connected with rubber strips (25).

5. A large-size wafer clamping mechanism according to claim 4, characterized in that: The right side of the bidirectional threaded rotating rod (21) passes through the fixed side plate (20) and extends to the right end surface of the fixed side plate (20); the right end surface of the bidirectional threaded rotating rod (21) is fixedly connected to the second servo motor (22) via a motor mounting plate; the inner side surfaces of the two fixed side plates (20) are connected to two limit rods (26); the outer surfaces of the two limit rods (26) are slidably connected to the two ends of the threaded clamping plate (23).

6. A large-size wafer clamping mechanism according to claim 1, characterized in that: One side of the connecting spring (9) is connected to the rear end surface of the first sliding plate (7), and the other side of the connecting spring (9) is connected to the front end surface of the second sliding plate (8), and the second sliding plate (8) is located at the rear side of the first sliding plate (7).

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