Chip heat dissipation structure, controller, industrial control equipment and electronic product

Abstract

The utility model discloses a chip heat radiation structure, a controller, an industrial control device and an electronic product, the chip heat radiation structure comprises a heat radiation member, a substrate, a chip and a connection structure, and the lower side surface of the heat radiation member is provided with at least one adjusting part; the size of the installation space for installing the spring is defined between the adjusting part and the screw head of the corresponding connecting bolt, the size can be adjusted according to the actual situation requirement, and when the distance between the first screw hole and the center of the chip is larger than that between other screw holes, the installation space can be properly enlarged through the adjusting part; when the distance between the first screw hole and the center of the chip is smaller than the distance between the first screw hole and other screw holes, the installation space can be reduced, finally the moment of force between the first screw hole and the center of the chip can be adjusted to be approximately equal to the moment of force between other connecting bolt positions and the center of the chip, and relative inclination does not exist between the substrate and the heat dissipation piece. The problem that when a CPU cannot be completely and symmetrically placed relative to a screw hole and a mounting hole, a radiator may incline to cause poor heat conduction is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip heat dissipation, in particular to a chip heat dissipation structure, a controller, industrial control equipment and electronic products. Background Art

[0002] In consumer electronic products, such as computers, which are relatively large in size, the multiple mounting holes of the radiator are generally centered relative to the CPU during design. The multiple screw holes on the PCBA board and the multiple mounting holes of the radiator are flexibly connected together through multiple spring screws, and the CPU is clamped between the PCBA board and the radiator. In this way, the radiator can fully dissipate the heat of the CPU that is placed close to it. Because the multiple spring screws are equidistant from the CPU, the pressure applied to the CPU is relatively even, and the radiator can fully dissipate heat close to the CPU.

[0003] When the product is small or the layout is restricted, the CPU cannot be placed completely symmetrically relative to the screw holes and mounting holes. The pressure on the CPU here cannot be balanced, and the radiator may tilt, resulting in poor heat conduction. Utility Model Content

[0004] The main purpose of the utility model is to provide a chip heat dissipation structure, a controller and an electronic product, aiming to solve the problem that when the CPU cannot be placed completely symmetrically relative to the screw holes and the mounting holes, the radiator may be tilted, resulting in poor heat conduction.

[0005] In order to achieve the above-mentioned purpose, the utility model proposes a chip heat dissipation structure, wherein the chip heat dissipation structure comprises:

[0006] A heat sink having an upper side surface and a lower side surface which are arranged opposite to each other in the up-down direction, a heat sink area is formed in the middle of the upper side surface of the heat sink, a plurality of through holes are penetrated through the heat sink in the up-down direction, and the plurality of through holes are arranged at intervals on the periphery of the heat sink area along the circumferential direction of the heat sink;

[0007] A substrate and a chip are arranged above the heat sink, the chip is sandwiched between the heat sink and the substrate and arranged corresponding to the heat dissipation area, a plurality of screw holes are arranged on the substrate and correspond to the plurality of through holes, the plurality of screw holes include at least one first screw hole, the distance between the first screw hole and the center of the chip is different from the distance between the other screw holes and the center of the chip; and,

[0008] A connecting structure, comprising a plurality of connecting bolts and a plurality of springs respectively sleeved on the corresponding connecting bolts, wherein each connecting bolt is passed through the corresponding through hole and the screw hole and fixed;

[0009] The chip heat dissipation structure also includes an adjustment structure, which includes at least one adjustment part formed on the lower side of the heat sink, and the multiple through holes include a first through hole that penetrates the adjustment part and the heat sink in the up and down directions, and the adjustment part and the corresponding screw head of the connecting bolt are used to define an installation space for installing the spring.

[0010] Optionally, the distance between the first screw hole and the center of the chip is greater than the distance between the other screw holes and the center of the chip;

[0011] The adjusting portion includes a first groove recessed on the lower side of the heat sink, and the first through hole penetrates the bottom of the first groove.

[0012] Optionally, the distance between the first screw hole and the center of the chip is smaller than the distance between the other screw holes and the center of the chip;

[0013] The adjusting portion includes a first protrusion protruding from the lower side of the heat sink, and the first protrusion is penetrated by the first through hole.

[0014] Optionally, the adjustment structure further includes a first gasket, which is arranged between the screw head of the connecting bolt for screwing with the first screw hole and the spring.

[0015] Optionally, the adjustment structure further includes a second gasket, which is arranged between the spring corresponding to the first through hole and the lower side of the heat sink.

[0016] The utility model provides a chip heat dissipation structure, which includes:

[0017] A heat sink having an upper side surface and a lower side surface which are arranged opposite to each other in the up-down direction, a heat sink area is formed in the middle of the upper side surface of the heat sink, a plurality of through holes are penetrated through the heat sink in the up-down direction, and the plurality of through holes are arranged at intervals on the periphery of the heat sink area along the circumferential direction of the heat sink;

[0018] An adjustment plate, wherein the adjustment plate is provided with through holes corresponding to the heat dissipation area, and the adjustment plate is provided with a plurality of internal threaded holes which are respectively arranged in one-to-one correspondence with the plurality of through holes;

[0019] A substrate and a chip are arranged above the adjustment plate, the chip is sandwiched between the heat sink and the substrate and arranged corresponding to the heat dissipation area, and the substrate is fixedly connected to the adjustment plate; and,

[0020] A connecting structure, comprising a plurality of connecting bolts and a plurality of springs, wherein each of the connecting bolts is passed through the corresponding through hole and fixed to the internal threaded hole, and each of the springs is sleeved around the outer periphery of the screw rod corresponding to the connecting bolt and is arranged on a side of the through hole away from the adjusting plate;

[0021] Wherein, the distances between each of the internal threaded holes and the center of the chip are arranged to be the same.

[0022] Optionally, the substrate is provided with a plurality of screw holes, and the adjustment plate is provided with a plurality of connection holes which are respectively arranged in one-to-one correspondence with the plurality of screw holes;

[0023] The chip heat dissipation structure further includes a plurality of fixing bolts, each of which is passed through a corresponding connecting hole and screwed to a corresponding screw hole.

[0024] The utility model also provides a controller, which includes the above-mentioned chip heat dissipation structure.

[0025] The utility model provides an industrial control device, which comprises the above-mentioned controller.

[0026] The utility model also provides an electronic product, which comprises the above-mentioned controller.

[0027] In the technical solution provided by the utility model, a plurality of through holes for connecting bolts to pass through are provided on the heat sink, and a plurality of screw holes corresponding to the plurality of through holes are also provided on the corresponding substrate. After the connecting bolts are covered with springs, they pass through the through holes and are screwed and fixed with the screw holes. The chip is provided between the heat sink and the substrate, and is provided corresponding to the heat dissipation zone. The plurality of through holes are arranged at intervals along the circumference of the heat sink at the periphery of the heat dissipation zone, so that it is convenient to apply pressure to the periphery of the chip sandwiched between the substrate and the heat sink. The plurality of screw holes include at least one first screw hole. The distance between the first screw hole and the center of the chip is set differently from the distance between the other screw holes and the center of the chip. Correspondingly, the distance between the through hole corresponding to the first screw hole and the center of the chip is also different. The size of the deformation generated by the spring extrusion affects the size of the pressure acting on the substrate. By providing at least one adjusting portion on the lower side of the heat sink, the first through hole corresponding to the first screw hole passes through the adjusting portion and the heat sink in the up-down direction, so that the size of the installation space for the spring installation is defined between the adjusting portion and the screw head of the corresponding connecting bolt, and the size of the installation space for the spring installation can be adjusted according to the actual situation. When the distance between the first screw hole and the center of the chip is greater than that between the other screw holes, the limited installation space can be enlarged by the adjustment part. When multiple connecting bolts are locked to the same depth, the compression amount of the spring arranged at the corresponding first through hole becomes smaller, and then the force of the spring reacting on the substrate will become smaller, and finally the moment between the point and the center of the chip can be adjusted to be roughly equal to the moment between the point and the center of the chip at other connecting bolts, so that the final pressure acting on the chip is also roughly equal. When the distance between the first screw hole and the center of the chip is smaller than that between the other screw holes, the installation space at the limited point can be enlarged by the adjustment part ... When the time between the two ends of the chip is reduced and multiple connecting bolts are locked to the same depth, the compression amount of the spring arranged at the corresponding first through hole increases, and the force of the spring acting on the substrate increases, and finally the torque between the two ends of the chip and the center of the chip can be adjusted to be roughly equal to the torque between other connecting bolts and the center of the chip, so that the pressure acting on the chip is also roughly equal, and there is no relative tilt between the substrate and the heat sink, and the chip can fit well with the heat dissipation area, so as to solve the problem that when the CPU cannot be placed completely symmetrically relative to the screw holes and the mounting holes, the heat sink may be tilted, resulting in poor thermal conductivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0029] Figure 1It is a top view schematic diagram of a chip heat dissipation structure in the prior art;

[0030] Figure 2 A partial cross-sectional perspective diagram of an embodiment of a chip heat dissipation structure provided by the utility model;

[0031] Figure 3 for Figure 2 A plan view of the heat sink, chip and connection structure;

[0032] Figure 4 for Figure 2 A side view of the chip heat dissipation structure in FIG.

[0033] Figure 5 for Figure 4 The enlarged schematic diagram of point A in the middle;

[0034] Figure 6 for Figure 2 A schematic diagram of a second specific embodiment of a chip heat dissipation structure in FIG.

[0035] Figure 7 for Figure 2 A schematic diagram of a third specific embodiment of a chip heat dissipation structure in FIG.

[0036] Figure 8 for Figure 2 A schematic diagram of a fourth specific embodiment of a chip heat dissipation structure in FIG.

[0037] Fig. 9 It is a partial cross-sectional stereoscopic schematic diagram of another embodiment of the chip heat dissipation structure provided by the utility model.

[0038] Description of Figure Numbers:

[0039]

[0040]

[0041] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0043] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0044] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0045] In consumer electronics products, such as computers, which are relatively large, the heat sink's multiple mounting holes are usually centered relative to the CPU during design. Figure 1 , the multiple screw holes on the PCBA board and the multiple mounting holes of the radiator are flexibly connected together through multiple spring screws, and the CPU is clamped between the PCBA board and the radiator, so that the radiator can fully dissipate the heat of the CPU that is placed close to it. Because the multiple spring screws and the CPU are equidistantly arranged, the pressure applied to the CPU is relatively even, and the radiator can fully dissipate heat close to the CPU. When the product is small or the layout is limited, the CPU cannot be placed completely symmetrically relative to the screw holes and mounting holes, and the pressure on the CPU here cannot be balanced, and the radiator may be tilted, resulting in poor thermal conductivity.

[0046] In order to solve the above problems, the utility model provides a chip 3 heat dissipation structure. Figure 1 It is a top view schematic diagram of the heat dissipation structure of the chip 3 in the prior art; Figure 2 A partial cross-sectional perspective diagram of an embodiment of a heat dissipation structure for a chip 3 provided by the utility model; Figure 3 for Figure 2 A schematic plan view of the heat sink, chip 3 and connection structure; Figure 4 for Figure 2 A side view of the heat dissipation structure of chip 3; Figure 5 for Figure 4 The enlarged schematic diagram of point A in the middle; Figure 6 for Figure 2 A schematic diagram of a second specific embodiment of the heat dissipation structure of the chip 3; Figure 7 for Figure 2 A schematic diagram of a third specific embodiment of the heat dissipation structure of the chip 3; Figure 8 for Figure 2 A schematic diagram of a fourth specific embodiment of the heat dissipation structure of the chip 3; Fig. 9 It is a partial cross-sectional perspective diagram of another embodiment of the heat dissipation structure of the chip 3 provided by the present invention.

[0047] In the first embodiment, see Figures 2 to 5 The chip heat dissipation structure 100 includes a heat sink 1, a substrate 2, a chip 3 and a connection structure 4. The heat sink 1 has an upper side surface and a lower side surface which are arranged opposite to each other in the up-down direction. A heat dissipation area 1a is formed in the middle of the upper side surface of the heat sink 1. The heat sink 1 is penetrated with a plurality of through holes in the up-down direction. The plurality of through holes are arranged at intervals along the circumference of the heat sink 1 at the periphery of the heat dissipation area 1a. The substrate 2 and the chip 3 are arranged above the heat sink 1. The chip 3 is sandwiched between the heat sink 1 and the substrate 2 and arranged corresponding to the heat dissipation area 1a. The substrate 2 is provided with a plurality of screw holes which are arranged one by one corresponding to the plurality of through holes. The plurality of screw holes include at least one first screw hole 2a1. The first screw hole 2a2 is provided at the bottom of the substrate 2. The distance between the thread hole 2a1 and the center of the chip 3 is set differently from the distance between the other screw holes and the center of the chip 3; the connecting structure 4 includes a plurality of connecting bolts 41, and a plurality of springs 42 respectively sleeved on the corresponding connecting bolts 41, and each connecting bolt 41 is passed through the corresponding through hole and fixed to the screw hole; the chip heat dissipation structure 100 also includes an adjustment structure, which includes at least one adjustment portion 5 formed on the lower side of the heat sink 1, and the plurality of through holes include a first through hole 1b1 that penetrates the adjustment portion 5 and the heat sink 1 in the up and down directions, and the adjustment portion 5 and the corresponding screw head of the connecting bolt 41 are used to define an installation space for installing the spring 42.

[0048] It should be noted that since a chip 3 is sandwiched between the substrate and the heat sink, the pressure of the chip 3 comes from the elastic force of the spring sleeved on the connecting bolt. However, when the distances between different springs and the center of the chip 3 are not equal, the heat sink and the substrate will tend to tilt and rotate. According to M=FL, the longer the distance L is and the F remains unchanged, the larger M is, that is, the greater the torque generated at the spring farther from the center of the chip 3. In order to avoid tilting between the heat sink and the substrate, F here needs to be reduced. The size of the reaction force of the spring depends on the elastic coefficient and compression deformation of the spring. During assembly, for convenience, the same material is generally used. Since the springs are similar in appearance, it is not conducive to production and manufacturing, and there may be mixing of materials.

[0049] It can be understood that the heat sink 1 is provided with a plurality of through holes for the connecting bolts 41 to pass through, and the corresponding substrate 2 is also provided with a plurality of screw holes which are respectively arranged one by one corresponding to the plurality of through holes. After the connecting bolts 41 are put on the springs 42, they pass through the through holes and are screwed and fixed with the screw holes. The chip 3 is arranged between the heat sink 1 and the substrate 2, and is arranged corresponding to the heat dissipation area 1a. The plurality of through holes are arranged at intervals along the circumferential direction of the heat sink 1 on the periphery of the heat dissipation area 1a, so that it is convenient to apply pressure to the periphery of the chip 3 sandwiched between the substrate 2 and the radiator. The plurality of screw holes include at least one first screw hole 2a1. The distance between the first screw hole 2a1 and the center of the chip 3 is different from the distance between the other screw holes and the center of the chip 3. Correspondingly, the distance between the through hole corresponding to the first screw hole 2a1 and the center of the chip 3 is also different, because the size of the deformation generated by the extrusion of the spring 42 affects the size of the pressure acting on the substrate 2.

[0050] In the technical solution provided by the utility model, at least one adjusting portion 5 is provided on the lower side of the heat sink 1, and the first through hole 1b1 provided corresponding to the first screw hole 2a1 penetrates the adjusting portion 5 and the heat sink 1 in the up-down direction, so that the size of the installation space for the installation of the spring 42 is defined between the adjusting portion 5 and the screw head of the corresponding connecting bolt 41, and can be adjusted according to the actual situation requirements. When the first screw hole 2a1 is farther away from the center of the chip 3 than other screw holes, the defined installation space can be enlarged by the adjusting portion 5. When multiple connecting bolts 41 are locked to the same depth, the compression amount of the spring 42 provided at the corresponding first through hole 1b1 becomes smaller, and then the force of the spring 42 reacting on the substrate 2 becomes smaller, and finally the torque between this point and the center of the chip 3 can be adjusted to the same as that between other connecting bolts 41 and the center of the chip 3. The torques are roughly equal, so that the final pressure acting on the chip 3 is also roughly equal; when the first screw hole 2a1 is closer to the center of the chip 3 than other screw holes, the installation space at the limited position can be reduced by the adjustment part 5. When multiple connecting bolts 41 are locked to the same depth, the compression amount of the spring 42 arranged at the corresponding first through hole 1b1 becomes larger, and then the force of the spring 42 reacting on the substrate 2 will become larger, and finally the torque at this point and the center of the chip 3 can be adjusted to be roughly equal to the torque at other connecting bolts 41 and the center of the chip 3, so that the final pressure acting on the chip 3 is also roughly equal, and there will be no relative tilt between the substrate 2 and the heat sink 1, and the chip 3 can fit well with the heat dissipation area 1a, which solves the problem that when the CPU cannot be placed completely symmetrically relative to the screw holes and the mounting holes, the radiator may be tilted, resulting in poor thermal conductivity.

[0051] It is understandable that, generally in the prior art, four screw holes are provided on the substrate, and correspondingly, four through holes are provided on the heat sink, and the four screw holes are provided at the four corners of the chip, that is, two screw holes are provided on one side of the longitudinal axis of the chip, and the other two screw holes are provided on the other side of the longitudinal axis of the chip, and at the same time, relative to the transverse axis of the chip, the two screw holes on both sides of the transverse axis of the chip are symmetrically provided about the transverse axis of the chip. If the distance L2 between the two screw holes on one side of the longitudinal axis of the chip and the chip is larger than the distance L1 between the other two screw holes and the chip, it means that the two springs on this side need to provide a smaller reverse force F2; if the distance between the two screw holes on one side of the longitudinal axis and the chip is smaller than the distance between the other two screw holes and the chip, it means that the two springs on this side need to provide a larger reverse force.

[0052] It should be noted that the longitudinal axis of the chip is not longitudinal in an absolute sense. The longitudinal can refer to the length direction of the chip or the width direction. It can be understood that the transverse axis of the chip mentioned below is also not transverse in an absolute sense. When the longitudinal axis of the chip refers to the width direction of the chip, the transverse axis of the chip refers to the length direction of the chip; when the longitudinal axis of the chip refers to the length direction of the chip, the transverse axis of the chip refers to the width direction of the chip.

[0053] Specifically, see Figure 5 In the first specific embodiment, the distance between the first screw hole 2a1 and the center of the chip 3 is greater than the distance between the other screw holes and the center of the chip 3, indicating that at this time, the spring 42 at the first screw hole 2a1 needs to provide a smaller reaction force, so the adjustment portion 5 includes a first groove 5a recessed on the lower side of the heat sink 1, and the bottom of the first groove 5a is penetrated by the first through hole 1b1. In this way, when multiple connecting bolts 41 are locked to the same depth, the spring 42 that is against the bottom of the first groove 5a will be squeezed and deformed less, so the force of the spring 42 reacting on the substrate 2 will become smaller, and finally the torque between this place and the center of the chip 3 can be adjusted to be roughly equal to the torque between the other connecting bolts 41 and the center of the chip 3. In this way, by directly opening the first groove 5a on the lower side of the heat sink 1, the torque here can be reduced, without setting different material springs 42, and without adding new parts, so that the cost will not increase while achieving pressure equalization.

[0054] See also Figure 6In the second specific embodiment, the distance between the first screw hole 2a1 and the center of the chip 3 is smaller than the distance between the other screw holes and the center of the chip 3; the adjusting portion 5 includes a first convex portion 51 convexly arranged on the lower side of the heat sink 1, and the first convex portion 51 is penetrated with the first through hole 1b1. It can be understood that the end face of the first convex portion 51 is used for the end face of the spring 42 to abut against, so that when the connecting bolts 41 are locked to the same depth, the deformation amount generated by the spring 42 matched with the first convex portion 51 is larger, then the reaction force will increase, and the torque can also be adjusted so that the torque generated by each connection point is ultimately roughly the same. Therefore, in addition to setting the first groove 5a to adjust the torque at the screw hole with a larger distance, the purpose of increasing the reverse force at the screw hole with a smaller distance can be achieved by setting the first convex portion 51, thereby achieving the final adjustment of the decoupling torque, so that the torque at this point and the center of the chip 3 can be adjusted to be roughly equal to the torque at the other connecting bolts 41 and the center of the chip 3.

[0055] See also Figure 7 In the third specific embodiment, the adjustment structure further includes a first gasket 61, which is arranged between the screw head of the connecting bolt 41 for screwing with the first screw hole 2a1 and the spring 42. The thickness of the first gasket 61 can be set according to the actual required compression amount. Since the first gasket 61 occupies part of the original installation space, the installation space where the spring 42 is located is eventually reduced, so that the compression amount of the spring 42 becomes larger after the connecting bolt 41 is locked, and the purpose of increasing the reverse force at the screw hole with a smaller distance can be achieved, thereby achieving the final adjustment of the decoupling torque, so that the torque at this point and the center of the chip 3 can be adjusted to be roughly equal to the torque at other connecting bolts 41 and the center of the chip 3.

[0056] It is understandable that the thickness of the first gasket 61 can be set in various specifications, and gaskets of different thicknesses can be set for screw holes at different distances, thereby adjusting the compression of the spring 42 to different degrees. It is understandable that multiple first gaskets 61 can be set, and different numbers of multiple first gaskets 61 can be stacked to achieve the required thickness according to the required thickness.

[0057] See also Figure 8In the fourth specific embodiment, the adjustment structure further includes a second gasket 62, which is arranged between the spring 42 corresponding to the first through hole 1b1 and the lower side of the heat sink 1. In this way, it is not necessary to set the first protrusion 51 when forming the heat sink 1, thereby avoiding manufacturing tolerances. During assembly, the second gaskets 62 of different thicknesses and numbers can be flexibly arranged, which can eventually reduce the installation space where the spring 42 is located, thereby increasing the compression amount of the spring 42 after the connection bolt 41 is locked, and also achieving the purpose of increasing the reverse force at the screw hole with a smaller distance.

[0058] See also Fig. 9 The utility model also provides another chip heat dissipation structure 100, which includes a heat sink 1, an adjustment plate 7, a substrate 2, a chip 3 and a connection structure 4. The heat sink 1 has an upper side surface and a lower side surface that are arranged opposite to each other in the up-down direction. A heat dissipation area 1a is formed in the middle of the upper side surface of the heat sink 1. The heat sink 1 is provided with a plurality of through holes along the up-down direction. The plurality of through holes are arranged at intervals along the circumference of the heat sink 1 at the periphery of the heat dissipation area 1a. The adjustment plate 7 is provided with through holes corresponding to the heat dissipation area 1a. The adjustment plate 7 is provided with a plurality of inner holes that are arranged one by one in correspondence with the plurality of through holes. Threaded hole 7a; the substrate 2 and the chip 3 are arranged above the adjustment plate 7, the chip 3 is clamped between the heat sink 1 and the substrate 2, and is arranged corresponding to the heat dissipation area 1a, and the substrate 2 is fixedly connected to the adjustment plate 7; the connection structure 4 includes a plurality of connecting bolts 41 and a plurality of springs 42, each of the connecting bolts 41 is passed through the corresponding through hole and fixed to the internal threaded hole 7a, each of the springs 42 is sleeved on the outer periphery of the screw corresponding to the connecting bolt 41, and is arranged on the side of the through hole away from the adjustment plate 7; wherein, each of the internal threaded holes 7a is arranged at the same distance from the center of the chip 3.

[0059] In the technical solution provided by the utility model, the substrate 2 and the adjustment plate 7 are fixedly connected to form an integrated structure. After the connecting bolt 41 is sleeved with the spring 42, it passes through the through hole and is screwed and fixed with the internal threaded hole 7a on the adjustment plate 7. The chip 3 is arranged between the heat sink 1 and the substrate 2, and is arranged corresponding to the heat dissipation area 1a. A through hole is arranged on the adjustment plate 7. The chip 3 can pass through the through hole and abut against the heat dissipation area 1a. Because a plurality of through holes are arranged at intervals along the circumference of the heat sink 1 on the periphery of the heat dissipation area 1a, it is convenient to apply pressure to the periphery of the chip 3 sandwiched between the substrate 2 and the radiator. This solution does not need to pay attention to the position of the original screw holes on the substrate 2, and the adjustment plate 7 is used to rearrange the plurality of screw holes connected to the connecting bolts 41. The positions of the internal threaded holes 7a enable the chip 3 to always be at the geometric center of the multiple internal threaded holes 7a, and by setting the through holes and the internal threaded holes 7a to be at the same distance from the center of the chip 3, the force distances of the springs 42 acting on the substrate 2 can be equal, so that the pressures finally acting on the chip 3 are also roughly equal; finally, there will be no relative tilt between the substrate 2 and the heat sink 1, and the chip 3 can fit well with the heat dissipation area 1a, which solves the problem that when the CPU cannot be placed completely symmetrically relative to the screw holes and the mounting holes, the heat sink may be tilted, resulting in poor thermal conductivity, and this method can be used when there are other heat-generating power components on the substrate 2, so as to achieve heat dissipation of multiple power components.

[0060] Specifically, in this embodiment, the substrate 2 is provided with a plurality of screw holes, and the adjustment plate 7 is provided with a plurality of connection holes 7b which are respectively arranged one-to-one corresponding to the plurality of screw holes; the chip heat dissipation structure 100 further includes a plurality of fixing bolts 8, each of which is passed through the corresponding connection hole 7b and is screwed to the corresponding screw hole. The plurality of screw holes on the substrate 2 and the connection holes 7b on the adjustment plate 7 are fixedly screwed by ordinary fixing bolts 8, and no additional connection components need to be provided on the substrate 2, and the overall connection structure 4 is simple and easy to operate.

[0061] The utility model also provides a controller, which includes the above-mentioned chip heat dissipation structure 100. The controller also includes a power module, a memory, a peripheral interface, etc. Since the controller includes the chip heat dissipation structure 100, the specific structure of the chip heat dissipation structure 100 refers to the above-mentioned embodiment. Since the chip heat dissipation structure 100 of the controller adopts all the technical solutions of all the above-mentioned embodiments, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0062] The utility model also provides an industrial control device, which can generally be set as a frequency converter, a motor or a communication device, etc. The industrial control device includes a controller. The specific structure of the controller refers to the above embodiment. Since the controller of the industrial control device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0063] The utility model also provides an electronic product, which can generally be set as a computer, a mobile phone or a notebook, etc. The electronic product includes a controller. The specific structure of the controller refers to the above embodiment. Since the controller of the electronic product adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0064] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A chip heat dissipation structure, characterized in that: include: A heat sink having an upper side surface and a lower side surface which are arranged opposite to each other in the up-down direction, a heat sink area is formed in the middle of the upper side surface of the heat sink, a plurality of through holes are penetrated through the heat sink in the up-down direction, and the plurality of through holes are arranged at intervals on the periphery of the heat sink area along the circumferential direction of the heat sink; A substrate and a chip are arranged above the heat sink, the chip is sandwiched between the heat sink and the substrate and arranged corresponding to the heat dissipation area, a plurality of screw holes are arranged on the substrate and correspond to the plurality of through holes, the plurality of screw holes include at least one first screw hole, the distance between the first screw hole and the center of the chip is different from the distance between the other screw holes and the center of the chip; and, A connecting structure, comprising a plurality of connecting bolts and a plurality of springs respectively sleeved on the corresponding connecting bolts, wherein each connecting bolt is passed through the corresponding through hole and the screw hole and fixed; The chip heat dissipation structure also includes an adjustment structure, which includes at least one adjustment part formed on the lower side of the heat sink, and the multiple through holes include a first through hole that penetrates the adjustment part and the heat sink in the up and down directions, and the adjustment part and the corresponding screw head of the connecting bolt are used to define an installation space for installing the spring.

2. The chip heat dissipation structure according to claim 1, characterized in that: The distance between the first screw hole and the center of the chip is greater than the distance between the other screw holes and the center of the chip; The adjusting portion includes a first groove recessed on the lower side of the heat sink, and the first through hole penetrates the bottom of the first groove.

3. The chip heat dissipation structure according to claim 1, characterized in that: The distance between the first screw hole and the center of the chip is smaller than the distance between the other screw holes and the center of the chip; The adjusting portion includes a first convex portion convexly arranged on the lower side surface of the heat sink, and the first convex portion is penetrated by the first through hole.

4. The chip heat dissipation structure according to claim 1, characterized in that: The adjustment structure also includes a first gasket, which is arranged between the screw head of the connecting bolt used for screwing with the first screw hole and the spring.

5. The chip heat dissipation structure according to claim 1, characterized in that: The adjustment structure further includes a second gasket, which is arranged between the spring corresponding to the first through hole and the lower side of the heat sink.

6. A controller, characterized in that: It comprises the chip heat dissipation structure as claimed in any one of claims 1 to 5.

7. An industrial control device, characterized in that: Comprising a controller as claimed in claim 6.

8. An electronic product, characterized in that: Including the industrial control equipment as described in claim 7.

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