Bridging card and electronic equipment
By designing the operating part on the substrate side of the bridge card, the problem of difficulty in disassembly without tools when the chassis space is small and the thickness of the bridge card is small, a simple and convenient disassembly process is realized, saving the cost of disassembly tool.
Patent Information
- Application Number
- CN202420378687.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-28
- Publication Date
- 2025-02-18
- Estimated Expiration
- 2034-02-28
AI Technical Summary
When the existing bridge jam is limited to less than 2.6mm in thickness when the chassis space is small, it is difficult to disassemble without tools, which increases the disassembly complexity and cost.
A bridge card is designed with an operating portion formed on the side of the substrate, and provides an interface for manual disassembly through a bevel structure or a convex and recessed design.
It realizes that the bridge card can be removed without tools when the chassis space is small and the bridge card thickness is small, which simplifies operation and saves the cost of dismantling tool.
Smart Images

Figure CN222508074U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the technical field of electronic devices, and in particular, to a bridge card and an electronic device. Background Art
[0002] At present, PCIE cards can interconnect two or more cards through bridge cards. In the related art, due to the height restrictions of the chassis and PCIE cards, the thickness of the bridge card structure is thin, and the lower surface of the bridge card is flush with the PCIE card. When the bridge card needs to be removed, it is very difficult to remove it only by relying on the friction between the fingers and the bridge card. Tools are required, which increases the cost and complexity of removal. Utility Model Content
[0003] The purpose of the present disclosure is to provide a bridge card and an electronic device, wherein the bridge card can be disassembled without using tools, the operation is simple and convenient, and the cost of disassembly tools can be saved.
[0004] In order to achieve the above-mentioned object, the present disclosure provides a bridge card in a first aspect, comprising a substrate and a circuit board connected to the substrate and having an electrical insertion portion;
[0005] An operating portion for manually removing the bridge card is formed on a side of the base plate.
[0006] Optionally, at least a portion of the side edge of the substrate is convex outward and / or concave inward to form the operating portion.
[0007] Optionally, the substrate includes a first side surface and a second side surface that are opposite to each other in a first direction;
[0008] The side edge is constructed as an inclined surface structure which gradually inclines inward from the first side surface toward the second side surface, and the inclined surface structure forms the operating portion.
[0009] Optionally, the inclined surface structure extends from the first side surface to the second side surface.
[0010] Optionally, the operating parts are formed on two opposite side edges of the substrate in the second direction.
[0011] Optionally, the circuit board is detachably connected to the base plate via a connecting structure.
[0012] Optionally, the connection structure includes a locking member and a fixing member;
[0013] A first mounting hole is formed on the substrate, and a second mounting hole is formed on the fixing member;
[0014] The circuit board is located between the base plate and the fixing member, and the locking member passes through the first mounting hole and is connected to the second mounting hole, so as to fix the circuit board to the base plate.
[0015] Optionally, a groove for accommodating at least a portion of the circuit board is formed on a side of the substrate facing the circuit board.
[0016] Optionally, the depth of the groove is greater than or equal to the thickness of the circuit board.
[0017] According to a second aspect of the present disclosure, an electronic device is provided. The electronic device includes the above-mentioned bridge card.
[0018] Through the above technical solution, the bridge card disclosed in the present invention includes a substrate and a circuit board connected to the substrate, and the circuit board has an electrical plug-in portion for connecting to the PCIE slot, and an operating portion is formed on the side of the substrate. The operating portion is used to enable the user to directly remove the bridge card manually without the aid of tools when the bridge card needs to be removed. Therefore, the bridge card can be applied to working conditions where the chassis space is small and the bridge card thickness is small. The bridge card can be removed without the use of tools, the operation is simple and convenient, and the cost of removal tools can be saved.
[0019] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:
[0021] Figure 1 is a structural diagram of a bridge card provided in some embodiments of the present disclosure.
[0022] Figure 2 is an exploded diagram of a bridge card provided by some embodiments of the present disclosure.
[0023] Figure 3 is a side view of a bridge card provided by some embodiments of the present disclosure.
[0024] Figure 4 is a top view of a bridge card provided in some embodiments of the present disclosure.
[0025] Figure 5 is based on Figure 4 AA section view in.
[0026] Figure 6 is a side view of a bridge card provided in some other embodiments of the present disclosure.
[0027] Figure 7 is a side view of a bridge card provided by still other embodiments of the present disclosure.
[0028] Figure 8 It is a structural schematic diagram of the connection between the bridge card and the PCIE card provided by the embodiment of the present disclosure.
[0029] Description of Reference Numerals
[0030] 100-bridge card; 110-base board; 110a-first side; 110b-second side; 111-operating part; 112-first mounting hole; 113-groove; 120-circuit board; 121-electrical plug-in part; 130-fixing part; 140-locking part; 141-second mounting hole; 200-PCIE card. DETAILED DESCRIPTION
[0031] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.
[0032] In the present disclosure, unless otherwise stated, the directional words used, such as "up, down, left, right", generally refer to the up, down, left, and right of the corresponding drawings; "inside and outside" refer to the inside and outside of the outline of the component or structure itself; as shown in the drawings, X represents the second direction; Y represents the third direction; Z represents the first direction, wherein the first direction corresponds to the width direction of the module body, the second direction corresponds to the length direction of the module body, and the third direction corresponds to the thickness direction of the module body. "First, second", etc. are used to distinguish one element from another and do not have order or importance. In addition, in the description of the reference drawings, the same mark in different drawings represents the same element.
[0033] The PCIE cards currently on the market can interconnect two or more cards through a bridge card. The installation of the bridge card is very simple, you only need to align the connector for assembly, but the disassembly scheme is more complicated. There are currently two main disassembly structural schemes for the bridge card. One is that the structural parts of the bridge card are thicker, usually more than 8mm, and the bridge card can be removed by the friction between the operator's fingers and the structural parts. This bridge card is suitable for situations where there is sufficient space in the chassis. The other is that in view of insufficient chassis space, the structural parts of the bridge card can only be within 2.6mm. At the same time, due to space limitations, the lower surface of the bridge card is flush with the PCIE card. At this time, the friction between the fingers and the structural parts is not enough to remove the bridge, and a disassembly jig is required, which increases the cost and complexity of disassembly.
[0034] Therefore, the present disclosure provides a bridge card 100 and an electronic device to solve the problem that when the height of the chassis is small and the thickness of the bridge card 100 is limited to a small thickness (for example, within 2.6 mm), the bridge card 100 can still be disassembled without the aid of tools.
[0035] In order to achieve the above purpose, Figures 1 to 8 As shown, an embodiment of the present disclosure provides a bridge card 100, which includes a substrate 110 and a circuit board 120 connected to the substrate 110 and having an electrical plug-in portion; an operating portion 111 for manually disassembling the bridge card 100 is formed on the side of the substrate 110.
[0036] Through the above technical solution, the bridge card 100 disclosed in the present invention includes a substrate 110 and a circuit board 120 connected to the substrate 110, and the circuit board 120 has an electrical plug-in portion for connecting to a PCIE slot, and an operating portion 111 is formed on the side of the substrate 110. The operating portion 111 is used to enable a user to manually directly disassemble the bridge card 100 without the aid of tools when the bridge card needs to be disassembled. Therefore, the bridge card 100 can be applied to working conditions where the chassis space is small and the thickness of the bridge card 100 is small. The bridge card 100 can be disassembled without the use of tools, the operation is simple and convenient, and the cost of disassembly tools can be saved.
[0037] It should be noted that the operating unit 111 can be constructed in any suitable structure, such as Figure 7 As shown, for example, it can be a protrusion arranged on the side of the substrate 110 in the first direction (thickness direction) and close to the first side 110a (upper side) or a depression close to the second side 110b (lower side), which is used to form a hand-gripping position on at least one side of the substrate 110, that is, a structure that can cooperate with fingers, so that when the substrate 110 is thin, the bridge card 100 can be directly disassembled by hand without the need for tools.
[0038] like Figure 3 , Figure 6 and Figure 7 As shown, in some embodiments, the substrate 110 may include at least one side, and the side of the substrate 110 at least partially bulges inward and / or is recessed inward to form an operating portion 111. Along the side of the substrate 110, the operating portion 111 that is convenient for manual operation can be formed by partially bulging outward or partially recessing inward. Among them, an outward bulge can be formed on the first side 110a (upper side) to form the operating portion 111, and the bulge can be a bulge of any suitable shape, for example, its cross-section can be rectangular, triangular, etc., which is not specifically limited here, and any shape that can facilitate manual operation can be used.
[0039] In addition, if Figure 6As shown, at least a partial inward depression may be formed on the second side surface 110b (lower side surface) of the side edge of the substrate 110. Since the lower side surface is depressed toward the wind, an outward protrusion may be formed on the upper side surface, and an operating portion 111 may also be formed, thereby facilitating direct disassembly by the user by hand.
[0040] Of course, if Figure 7 As shown, in some embodiments, the first side surface 110 a (upper side surface) may be convex outward and the second side surface 110 b (lower side surface) may be concave inward, thereby forming the operating portion 111 together.
[0041] It is understandable that in some preferred embodiments, the protrusions and depressions may extend along the extension direction of the side, for example, they may be the same or similar in length to the side, so that the user's fingers can operate at any position when they touch. It may also be a plurality of spaced structures formed in the extension direction of the side, and the user needs to operate at the corresponding position to achieve disassembly. There is no specific limitation here, and they can all be operated directly by hand without the need for tools, which simplifies the difficulty of disassembly.
[0042] In the embodiment of the present disclosure, a protrusion protruding outward is formed at the upper position of the side of the substrate 110, and a concave depression is formed at the lower position of the side, that is, a suspended position is formed below the protrusion, thereby forming an operating portion 111. In actual operation, the operating portion 111 can be clamped by hand to pull out the electrical plug-in portion (such as a connector) on the circuit board 120 of the bridge card 100. The suspended position can also be pressed downward by hand, and the connector will also be subjected to tension, causing the connector to separate from the mating PCIE card 200. The above two methods can also be used in combination, thereby achieving the purpose of disassembling the bridge card 100 without a jig when the bridge card 100 is thin.
[0043] like Figure 3 As shown, in some embodiments, the substrate 110 includes a first side surface 110 a and a second side surface 110 b opposite to each other in a first direction, wherein the first side surface 110 a is an upper side surface of the substrate 110 , and the second side surface 110 b is a lower side surface of the substrate 110 .
[0044] like Figure 3 and Figure 5 As shown, the side edge may be constructed as an inclined surface structure gradually inclined inward from the first side surface 110a toward the second side surface 110b, and the inclined surface structure forms the operating portion 111. The inclined surface structure may be a plane, an arc surface or a curved surface.
[0045] For example, when the inclined surface structure is a plane, the side forms a chamfered structure from the first side 110a toward the second side 110b, that is, the side close to the first side 110a protrudes outward, and the side close to the second side 110b is recessed inward, thereby forming the operating portion 111.
[0046] It should be noted that if Figure 6 and Figure 7 As shown, the above-mentioned inclined surface structure can also be an arc surface, which can be an inwardly concave arc surface or an outwardly convex arc surface, and can form the operating portion 111, and can also achieve the purpose of directly disassembling the bridge card 100 by hand.
[0047] In some embodiments, the inclined structure may extend from the first side surface 110a to the second side surface 110b, that is, the entire thickness dimension of the substrate 110 is utilized to maximize the hand-gripping space for finger operation, further ensuring the convenience of disassembly.
[0048] There may be multiple operating parts 111, and they are distributed on any suitable side of the substrate 110, such as Figure 3 As shown, in some embodiments, operating portions 111 are formed on two opposite sides of the substrate 110 in the second direction. During actual disassembly, the user can operate the operating portion 111 from any side with fingers to directly disassemble the bridge card 100.
[0049] The circuit board 120 may be connected to the substrate 110 in any suitable manner, for example, may be fixedly connected to the substrate 110 .
[0050] In some embodiments, the circuit board 120 is detachably connected to the substrate 110 via a connection structure, so that maintenance of the circuit board 120 is convenient.
[0051] The connection structure can be implemented in any suitable manner, such as Figure 2 and Figure 5 As shown, optionally, the connection structure includes a locking member 140 and a fixing member 130; a first mounting hole 112 is formed on the substrate 110, and a second mounting hole 141 is formed on the fixing member 130; the circuit board 120 is located between the substrate 110 and the fixing member 130, and the locking member 140 passes through the first mounting hole 112 and is connected to the second mounting hole 141, so as to fix the circuit board 120 to the substrate 110. The locking member 140 can be a screw or a bolt, and the second mounting hole 141 can be a screw hole, and the circuit board 120 is fixed to the substrate 110 through the locking member 140 and the fixing member 130.
[0052] It is understandable that the circuit board 120 has two electrical plug-in parts, such as connectors, and the two electrical plug-in parts are arranged at intervals along the third direction for connecting with two different PCIE cards 200. At this time, the sides of the substrate 110 formed with the operating part 111 can be two opposite sides in the second direction, wherein the first direction, the second direction and the third direction are perpendicular to each other. Through the above arrangement, when operating the operating part 111, it is convenient to pull out the electrical plug-in part, which is more conducive to the operator to achieve disassembly.
[0053] In order to further reduce the overall thickness of the bridge card 100 to meet the needs of a small-sized chassis, such as Figure 5 As shown, in some embodiments, a groove 113 for accommodating at least part of the circuit board 120 is formed on the side of the substrate 110 facing the circuit board 120. The circuit board 120 can be at least partially accommodated in the groove 113 to reduce the size in the thickness direction and facilitate application in a smaller space.
[0054] In some embodiments, the depth of the groove 113 is greater than or equal to the thickness of the circuit board 120. This configuration can save the size occupied in the thickness direction to the greatest extent, minimize the thickness of the bridge card 100, and is suitable for the case where the chassis space is small. It should be noted that the circuit board 120 here may include a circuit board 120 body and a connector connected to the circuit board 120 body, and the connector forms an electrical plug-in portion of the circuit board 120. Among them, the electrical plug-in portion can adopt any known structure in the relevant technology, and can be plug-in-matched and connected with the PCIE card 200, which will not be repeated here.
[0055] In one embodiment, Figure 8 The figure shows the state of the bridge card 100 after installation. The thickness of the base plate 110 of the bridge card 100 is 2.6 mm. The operating part 111 is formed on the two side edges of the base plate 110, that is, the chamfer structure with a wide top and a narrow bottom. After the assembly is completed, there is no gap between the bridge card 100 and the PCIE card 200. When disassembling, the chamfer position can be clamped with fingers, and then the bridge card 100 can be slowly pulled out. During the pulling out process, the chamfer position can also be pressed from the upper part of the base plate 110 by hand, because the bottom of the chamfer is a suspended structure, and at this time, the connector will also be subjected to an upward pulling force and detached from the gold finger of the PCIE card 200. Thus, when the chassis space is small, the thickness of the bridge card 100 is limited to 2.6 mm, and the purpose of tool-free disassembly can also be achieved.
[0056] The embodiment of the present disclosure also provides an electronic device, which includes the above-mentioned bridge card 100, and the electronic device also includes at least two PCIE cards 200, and the connection of the two PCIE cards 200 is realized through the above-mentioned bridge card 100. Therefore, the electronic device also has all the advantages of the above-mentioned bridge card 100, which will not be repeated here.
[0057] Among them, electronic equipment includes but is not limited to computers, servers, etc.
[0058] The bridge card 100 and the electronic device disclosed in the present invention can be used in a case where the chassis space is small and the thickness of the bridge card 100 is limited to within 2.6 mm. The bridge card 100 can be disassembled without tools, which is simple and convenient to operate and can save the cost of disassembly jigs. In addition, the solution can also be used in a case where the chassis space is sufficient, and the size and complexity of the structural parts can also be reduced, thereby reducing the material and processing costs of the structural parts.
[0059] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.
[0060] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.
[0061] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.
Claims
1. A bridge card, characterized in that: It comprises a substrate and a circuit board connected to the substrate and having an electrical plug-in portion; An operating portion for manually removing the bridge card is formed on a side of the base plate.
2. The bridge card according to claim 1, characterized in that: At least part of the side edge of the base plate is convex outward and / or concave inward to form the operating portion.
3. The bridge card according to claim 1, characterized in that: The substrate includes a first side surface and a second side surface that are opposite to each other in a first direction; The side edge is constructed as an inclined surface structure which gradually inclines inward from the first side surface toward the second side surface, and the inclined surface structure forms the operating portion.
4. The bridge card according to claim 3, characterized in that: The inclined surface structure extends from the first side surface to the second side surface.
5. The bridge card according to any one of claims 1 to 4, characterized in that: The operating parts are formed on two opposite sides of the substrate in the second direction.
6. The bridge card according to claim 1, characterized in that: The circuit board is detachably connected to the base plate via a connecting structure.
7. The bridge card according to claim 6, characterized in that: The connecting structure includes a locking member and a fixing member; A first mounting hole is formed on the substrate, and a second mounting hole is formed on the fixing member; The circuit board is located between the base plate and the fixing member, and the locking member passes through the first mounting hole and is connected to the second mounting hole, so as to fix the circuit board to the base plate.
8. The bridge card according to claim 7, characterized in that: A groove for accommodating at least a portion of the circuit board is formed on a side of the substrate facing the circuit board.
9. The bridge card according to claim 8, characterized in that: The depth of the groove is greater than or equal to the thickness of the circuit board.
10. An electronic device, characterized in that: The electronic device comprises the bridge card according to any one of claims 1-9.