Circuit board supporting device for circuit board solder mask process

Abstract

The utility model relates to the technical field of circuit board processing, in particular to a circuit board supporting device for a circuit board solder mask process, which comprises a positioning plate, a supporting nail and a fixing piece, a plurality of positioning holes are formed in the positioning plate, at least part of the positioning holes are formed around the edge of the positioning plate, and the other at least part of the positioning holes are located in the inner side of the positioning plate; the supporting nails are detachably connected to the positioning holes and protrude out of the surface of one side of the positioning plate. The fixing piece is detachably connected to the positioning plate, and the fixing piece is fixedly connected to the supporting nail and the positioning plate. When the supporting device is used, firstly, the supporting nails are connected with the positioning holes of the positioning plate, then the fixing pieces are connected with the positioning plate, at the moment, the supporting nails can be fixed to the positioning plate through the fixing pieces, and therefore the supporting nails can be fixed, the supporting device can conveniently support the circuit board, the structure is simple, and use is convenient and fast.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a circuit board support device for the solder resist process of circuit boards. Background Art

[0002] In PCB manufacturing, the solder mask process requires a support base plate to maintain the stability of the PCB. The base plate needs to add support points in open areas and molding grooves of the PCB. Depending on the size of the specific location, different types of holes are needed to install the corresponding plastic support pins. These support pins are available in 1.05mm, 1.55mm, and 2.55mm sizes. However, due to a lack of professional installation tools, when installing the support pins on the base plate, one can only use materials to support the sides, which is very inconvenient. During the entire installation process, the base plate is prone to deformation and bending, causing the installed support pins to easily fall off, and also affecting the flatness of the adhesive application. Therefore, it is necessary to improve upon these issues to change the current situation. Utility Model Content

[0003] This utility model provides a circuit board support device for the solder resist process of circuit boards, which solves the problem of inconvenient installation of support nails on the base plate in the existing circuit board solder resist process.

[0004] This utility model proposes a circuit board support device for the solder mask process of circuit boards, comprising:

[0005] A positioning plate has multiple positioning holes, wherein at least some of the positioning holes are arranged around the edge of the positioning plate, and at least some of the positioning holes are located on the inner side of the positioning plate;

[0006] A support pin, detachably connected to the positioning hole, and the support pin protruding from one side surface of the positioning plate; and

[0007] The fastener is detachably connected to the positioning plate, and the fastener is fixedly connected to the support nail and the positioning plate.

[0008] According to one embodiment of the present invention, the positioning hole includes a plurality of first positioning holes and a plurality of second positioning holes, wherein the diameter of the second positioning hole is smaller than the diameter of the first positioning hole, the plurality of first positioning holes are disposed along the edge of the positioning plate, and the second positioning holes are located inside the first positioning holes.

[0009] According to one embodiment of the present invention, the diameter of the first positioning hole is 2.55 mm, and the diameter of the second positioning hole is 1.55 mm.

[0010] According to one embodiment of the present invention, the positioning hole further includes a plurality of third positioning holes, the diameter of the third positioning holes being smaller than the diameter of the second positioning hole, and the plurality of third positioning holes being located on the side of the second positioning hole away from the first positioning hole.

[0011] According to one embodiment of the present invention, the diameter of the third positioning hole is 1.05 mm.

[0012] According to one embodiment of the present invention, the circuit board support device further includes a fixing panel, the fixing panel having a mounting hole, the fixing panel being fitted and connected to the positioning plate, and the mounting hole being coaxially arranged with the first positioning hole.

[0013] According to one embodiment of the present invention, the diameter of the mounting hole is not less than the diameter of the first positioning hole.

[0014] According to one embodiment of the present invention, the diameter of the mounting hole is 2.55 mm.

[0015] According to one embodiment of the present invention, the fixing member is bonded to the positioning plate.

[0016] According to one embodiment of the present invention, the fastener is a PVC tape.

[0017] Implementing the embodiments of this utility model has the following beneficial effects:

[0018] When using the support device of this embodiment, first connect the support nail to the positioning hole of the positioning plate, and then connect the fixing member to the positioning plate. At this time, the fixing member can fix the support nail on the positioning plate, thereby fixing the support nail, which facilitates the support device to support the circuit board. The structure is simple and easy to use. Attached Figure Description

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] in:

[0021] Figure 1 This is a schematic diagram of the positioning plate in the circuit board support device in an embodiment of this utility model;

[0022] Figure 2 This is a side view of the circuit board support device in an embodiment of this utility model;

[0023] Figure label:

[0024] 10. Circuit board support device; 100. Positioning plate; 110. First positioning hole; 120. Second positioning hole; 130. Third positioning hole; 200. Support pin; 300. Fixing component; 400. Fixing panel. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] See Figure 1 and Figure 2 As shown, this utility model embodiment provides a circuit board support device 10 for the solder resist process of circuit boards, which includes a positioning plate 100, a support pin 200, and a fixing member 300; the positioning plate 100 has a plurality of positioning holes, wherein at least some of the positioning holes are arranged around the edge of the positioning plate 100, and at least some of the positioning holes are located on the inner side of the positioning plate 100; the support pin 200 is detachably connected to the positioning holes, and the support pin 200 protrudes from one side surface of the positioning plate 100; the fixing member 300 is detachably connected to the positioning plate 100, and the fixing member 300 is fixedly connected to the support pin 200 and the positioning plate 100.

[0027] When using the support device of this embodiment, first connect the support nail 200 to the positioning hole of the positioning plate 100, and then connect the fixing member 300 to the positioning plate 100. At this time, the fixing member 300 can fix the support nail 200 on the positioning plate 100, thereby fixing the support nail 200, which makes it easy for the support device to support the circuit board. The structure is simple and easy to use.

[0028] Specifically, the positioning hole includes a plurality of first positioning holes 110 and a plurality of second positioning holes 120. The diameter of the second positioning hole 120 is smaller than the diameter of the first positioning hole 110. The plurality of first positioning holes 110 are arranged along the edge of the positioning plate 100, and the second positioning hole 120 is located inside the first positioning hole 110.

[0029] When processing the positioning plate 100 of this embodiment, firstly, data for drilling holes in the positioning plate 100 is prepared. Multiple first positioning holes 110 are drilled near the edge of the positioning plate 100, and multiple second positioning holes 120 are drilled on the inner side of the positioning plate 100. Then, support pins 200 are installed in the first positioning holes 110 and the second positioning holes 120 respectively. In one embodiment, the diameter of the first positioning hole 110 is 2.55 mm, and the diameter of the second positioning hole 120 is 1.55 mm.

[0030] Furthermore, the positioning hole also includes a plurality of third positioning holes 130, the diameter of which is smaller than that of the second positioning hole 120, and the plurality of third positioning holes 130 are located on the side of the second positioning hole 120 away from the first positioning hole 110. In one embodiment, the diameter of the third positioning hole 130 is 1.05 mm.

[0031] With this configuration, support pins 200 of corresponding specifications can be installed in the first positioning hole 110, the second positioning hole 120 and the third positioning hole 130 respectively. When the circuit board is supported by the support pins 200, the support pins 200 of different specifications can support different positions of the circuit board.

[0032] In a preferred embodiment, the circuit board support device 10 further includes a fixing panel 400, which has mounting holes. The fixing panel 400 is fitted and connected to the positioning plate 100, and the mounting holes are coaxially arranged with the first positioning hole 110.

[0033] In this embodiment, the positioning plate 100 can preferably be made of FR-4 material with a thickness of 2-3mm. After the support nail 200 is installed, the support nail 200 is fixed to the positioning plate 100 using the fastener 300. Then, the fixing panel 400 is made of FR-4 material with a thickness of 2-3mm, and mounting holes corresponding to the first positioning hole 110 are machined on the fixing panel 400. After that, the fixing panel 400 and the positioning plate 100 are combined and fixed together. Finally, the assembly of the circuit board support device 10 is completed by placing the protruding surface of the support nail 200 upward.

[0034] Specifically, the diameter of the mounting hole is not less than the diameter of the first positioning hole 110.

[0035] This configuration allows the support pin 200, installed in the first positioning hole 110, to protrude from the surface of the side away from the positioning plate 100 and be accommodated within the mounting hole, thus ensuring that the surface of the fixing panel 400 away from the positioning plate 100 is flat. In one embodiment, the diameter of the mounting hole is 2.55 mm.

[0036] In one embodiment, the fastener 300 is bonded to the positioning plate 100.

[0037] By using adhesive bonding to connect the fastener 300 and the positioning plate 100, the fastener 300 can be easily assembled and disassembled. In other embodiments, the fastener 300 can also be snapped into the positioning plate 100, and the support nail 200 can be fixedly connected to the positioning plate 100 by means of pressing or other methods. Specifically, the fastener 300 can be made of PVC tape.

[0038] In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance.

[0039] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model based on the specific circumstances.

[0040] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0042] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A circuit board support device for a circuit board solder mask process, characterized in that: include: A positioning plate having a plurality of positioning holes, wherein at least some of the positioning holes are arranged around the edge of the positioning plate, and at least some of the positioning holes are located on the inner side of the positioning plate; A support nail is detachably connected to the positioning hole, and the support nail protrudes from a side surface of the positioning plate; as well as A fixing member is detachably connected to the positioning plate, and the fixing member is fixedly connected to the supporting nail and the positioning plate.

2. The circuit board support device for the circuit board solder mask process according to claim 1, characterized in that: The positioning holes include a plurality of first positioning holes and a plurality of second positioning holes, the aperture of the second positioning holes is smaller than the aperture of the first positioning holes, the plurality of first positioning holes are arranged along the edge of the positioning plate, and the second positioning holes are located inside the first positioning holes.

3. The circuit board support device for the circuit board solder mask process according to claim 2, characterized in that: The diameter of the first positioning hole is 2.55 mm, and the diameter of the second positioning hole is 1.55 mm.

4. The circuit board support device for the circuit board solder mask process according to claim 2, characterized in that: The positioning holes further include a plurality of third positioning holes, the aperture of the third positioning holes is smaller than the aperture of the second positioning hole, and the plurality of third positioning holes are located on a side of the second positioning hole away from the first positioning hole.

5. The circuit board support device for the circuit board solder mask process according to claim 4, characterized in that: The diameter of the third positioning hole is 1.05 mm.

6. The circuit board support device for the circuit board solder mask process according to claim 2, characterized in that: The circuit board supporting device also includes a fixing panel, the fixing panel is provided with a mounting hole, the fixing panel is fitted and connected to the positioning plate, and the mounting hole is coaxially arranged with the first positioning hole.

7. The circuit board support device for the circuit board solder mask process according to claim 6, characterized in that: The diameter of the mounting hole is not smaller than the diameter of the first positioning hole.

8. The circuit board support device for the circuit board solder mask process according to claim 7, characterized in that: The diameter of the mounting hole is 2.55 mm.

9. The circuit board support device for circuit board solder mask process according to claim 1, characterized in that: The fixing piece is bonded and matched with the positioning plate.

10. The circuit board support device for circuit board solder mask process according to claim 9, characterized in that: The fixing piece is a PVC tape.

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