Pressing plate structure of integrated circuit packaging wire bonder

Abstract

The utility model discloses a pressure plate structure of an integrated circuit packaging wire bonder, which is characterized in that the pressure plate structure comprises a first connecting plate and a second connecting plate, side surfaces of two inclined plates are fixedly connected with mounting plates, the two mounting plates are provided with mounting holes, and the first connecting plate and the second connecting plate are fixedly connected with the mounting holes. The connecting pressing plate is detachably connected between the first connecting plate and the second connecting plate through the arranged fixing mechanism, the connecting pressing plate can be mounted and dismounted through the fixing mechanism, then the connecting pressing plate is dismounted and replaced, connecting pressing plates of different sizes can be replaced conveniently, the universality of the pressing plate structure of the wire welding machine can be improved, and the practicability is high. Through the pressing mechanisms arranged on the first connecting plate and the second connecting plate, the connecting pressing plate can be fixedly pressed through the pressing mechanisms, so that the fixing effect of the connecting pressing plate is changed, the attaching effect of the pressing plate structure can be improved, and then the wire welding effect of the pressing plate structure of the integrated circuit packaging wire welding machine can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a pressing plate structure of an integrated circuit packaging wire bonding machine. Background Art

[0002] As we all know, wire bonding machines include gold wire bonding machines, aluminum wire bonding machines, and ultrasonic wire bonding machines, which are used to achieve surface welding of different media, which is a physical change process. First, the metal surface to be welded needs to be preheated, and then, under the combined effect of time and pressure, plastic deformation occurs on the metal welding surface, so that the two media can achieve reliable contact, and metal bonds are formed between the two metal atoms under the action of atomic affinity, completing the welding process.

[0003] During the use of the existing integrated circuit packaging wire bonding machine pressure plate structure, the pressure plate used for the wire bonding machine is not convenient to replace, and the size of the pressure plate cannot be adjusted, and the versatility is poor. During the use of the pressure plate, the pressure plate structure may become loose due to pressing, which is easy to affect the wire bonding effect of the wire bonding machine. Utility Model Content

[0004] In view of the problems mentioned in the background technology, the purpose of the utility model is to provide a platen structure of an integrated circuit packaging wire bonding machine to solve the problems mentioned in the background technology.

[0005] The above technical objectives of the utility model are achieved through the following technical solutions:

[0006] A pressure plate structure for an integrated circuit packaging wire bonding machine includes a first connecting plate and a second connecting plate, wherein a connecting pressure plate is detachably connected between the first connecting plate and the second connecting plate via a fixing mechanism, wherein a plurality of connecting holes are provided on the connecting pressure plate, wherein a clamping mechanism is provided on the first connecting plate and the second connecting plate, wherein the side surfaces of the first connecting plate and the second connecting plate are fixedly connected with inclined plates, wherein the side surfaces of the two inclined plates are fixedly connected with mounting plates, and mounting holes are provided on the two mounting plates.

[0007] By adopting the above technical scheme, a connecting pressure plate is detachably connected between the first connecting plate and the second connecting plate by means of a fixing mechanism. The fixing mechanism can be used to install and disassemble the connecting pressure plate, and then the connecting pressure plate can be disassembled and replaced, which facilitates the replacement of connecting pressure plates of different sizes, thereby improving the versatility of the pressure plate structure of the wire bonding machine. The clamping mechanism provided on the first connecting plate and the second connecting plate can be used to fix and press the connecting pressure plate, so that the fixing effect of the connecting pressure plate can be replaced, thereby improving the fitting effect of the pressure plate structure, and thereby improving the wire bonding effect of the pressure plate structure of the integrated circuit packaging wire bonding machine.

[0008] Preferably, six groups of the fixing mechanisms are provided, and the six groups of the fixing mechanisms are respectively provided at the connection between the first connecting plate and the second connecting plate and the connecting pressure plate.

[0009] By adopting the above technical solution, six groups of fixing mechanisms are provided, so that the installation around the connecting pressure plate can be made more firm and stable.

[0010] Preferably, the six groups of fixing mechanisms respectively include a support plate, a mounting screw and a mounting groove, the support plate is fixedly connected to the side of the connecting pressure plate, the mounting groove is opened on the first connecting plate and the second connecting plate, and the support plate is detachably connected to the mounting groove by the mounting screw.

[0011] By adopting the above technical solution, the support plate is detachably connected to the installation groove by means of the installation screws, so that the connecting pressure plate can be disassembled and replaced.

[0012] Preferably, a cross disassembly groove is formed on the surface of the six mounting screws.

[0013] By adopting the above technical solution and the provision of the cross disassembly groove, the installation screws can be easily disassembled by using tools.

[0014] Preferably, the fixing mechanisms are provided in four groups, and the four groups of the fixing mechanisms are respectively provided on the first connecting plate and the second connecting plate.

[0015] By adopting the above technical solution, four groups of fixing mechanisms are provided, so that the four corners of the connecting pressing plate can be pressed more firmly.

[0016] Preferably, the four groups of fixing mechanisms respectively include a support rod, a guide plate, a mounting frame, a locking bolt and a pressing block, the support rod is fixedly connected to the first connecting plate and the second connecting plate, the guide plate is rotatably connected to the support rod, the mounting frame is fixedly connected to the guide plate, the locking bolt is threadedly connected to the mounting frame and the guide plate, and the pressing block is fixedly connected to the bottom of the locking bolt.

[0017] By adopting the above technical solution, the pressing block can be raised and lowered by threading the locking bolts on the guide plate and the mounting frame, and the connecting pressure plate can be pressed and fixed by the pressing block, thereby improving the installation effect of the connecting pressure plate.

[0018] Preferably, the four pressing blocks are all configured as rubber pressing blocks.

[0019] By adopting the above technical solution, by setting the pressing block to be made of rubber material, the friction of the pressing block can be made greater, and the pressing block can press and fix the connecting pressure plate more firmly.

[0020] Preferably, one side corner of the first connecting plate, the second connecting plate and the inclined plate are all rounded.

[0021] By adopting the above technical solution, the setting of rounded corners can, on the one hand, avoid the edges from being too sharp, and on the other hand, improve the overall structural strength.

[0022] In summary, the utility model mainly has the following beneficial effects:

[0023] First, the utility model uses a connecting pressure plate that is detachably connected between the first connecting plate and the second connecting plate by means of a fixing mechanism, and the connecting pressure plate can be installed and disassembled by means of the fixing mechanism, and then the connecting pressure plate can be disassembled and replaced, which is convenient for replacing connecting pressure plates of different sizes, and can improve the versatility of the pressure plate structure of the wire welding machine;

[0024] Second, the utility model uses the clamping mechanism arranged on the first connecting plate and the second connecting plate to fix and press the connecting pressure plate, so that the fixing effect of the connecting pressure plate can be changed, which can improve the fitting effect of the pressure plate structure, and further improve the wire bonding effect of the pressure plate structure of the integrated circuit packaging wire bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is one of the structural schematic diagrams of the utility model;

[0026] Figure 2 This is the second structural diagram of the utility model;

[0027] Figure 3 yes Figure 1 A is an enlarged schematic diagram.

[0028] Figure numerals: 1. first connecting plate; 2. second connecting plate; 3. fixing mechanism; 301. support plate; 302. mounting screw; 303. mounting groove; 304. cross disassembly groove; 4. connecting pressure plate; 5. connecting hole; 6. clamping mechanism; 601. support rod; 602. guide plate; 603. mounting frame; 604. locking bolt; 605. pressing block; 7. tilting plate; 8. mounting plate; 9. mounting hole; 10. rounded corner. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] Example 1

[0031] refer to Figure 1-3 A pressure plate structure for an integrated circuit packaging wire bonding machine includes a first connecting plate 1 and a second connecting plate 2. A connecting pressure plate 4 is detachably connected between the first connecting plate 1 and the second connecting plate 2 through a fixing mechanism 3. The fixing mechanism 3 is provided with six groups. The six groups of fixing mechanisms 3 are respectively provided at the connection between the first connecting plate 1 and the second connecting plate 2 and the connecting pressure plate 4. The fixing mechanism 3 is provided with six groups, so that the surrounding installation of the connecting pressure plate 4 can be made more firm and stable. The six groups of fixing mechanisms 3 respectively include a support plate 301, a mounting screw 302 and a mounting groove 303. The support plate 301 is fixedly connected to the side of the connecting pressure plate 4. The mounting groove 303 is provided on the first connecting plate 1 and the second connecting plate 2. The support plate 301 is detachably connected to the mounting groove 303 by means of mounting screws 302. The support plate 301 is detachably connected to the mounting groove 303 by means of mounting screws 302, so that the connecting pressure plate 4 can be disassembled and replaced. A plurality of connecting holes 5 are provided on the connecting pressure plate 4. A clamping mechanism 6 is provided on the first connecting plate 1 and the second connecting plate 2. The fixing mechanism 3 is provided with four groups, and the four groups of fixing mechanisms 3 are respectively provided on the first connecting plate 1 and the second connecting plate 2. The fixing mechanism 3 is provided with four groups, so that the four corners of the connecting pressure plate 4 can be pressed more firmly. The four groups of fixing mechanisms 3 respectively include a support rod 601, a guide plate 602, a mounting frame 603, a locking bolt 604 and a pressing block 60 5. The support rod 601 is fixedly connected to the first connecting plate 1 and the second connecting plate 2, the guide plate 602 is rotatably connected to the support rod 601, the mounting frame 603 is fixedly connected to the guide plate 602, the locking bolt 604 is threadedly connected to the mounting frame 603 and the guide plate 602, and the pressing block 605 is fixedly connected to the bottom of the locking bolt 604. The locking bolt 604 is threadedly connected to the guide plate 602 and the mounting frame 603, so that the pressing block 605 can be raised and lowered. The pressing block 605 can be used to press and fix the connecting pressure plate 4, thereby improving the installation effect of the connecting pressure plate 4. The sides of the first connecting plate 1 and the second connecting plate 2 are fixedly connected with the inclined plates 7, and the sides of the two inclined plates 7 are fixedly connected A mounting plate 8 is connected, and mounting holes 9 are provided on both mounting plates 8. A connecting pressure plate 4 is detachably connected between the first connecting plate 1 and the second connecting plate 2 by means of a fixing mechanism 3. The connecting pressure plate 4 can be installed and disassembled by means of the fixing mechanism 3, and then the connecting pressure plate 4 can be disassembled and replaced, which facilitates the replacement of connecting pressure plates 4 of different sizes, and can improve the versatility of the pressure plate structure of the wire bonding machine. The clamping mechanism 6 provided on the first connecting plate 1 and the second connecting plate 2 can be used to fix and press the connecting pressure plate 4, so that the fixing effect of the connecting pressure plate 4 can be replaced, which can improve the fitting effect of the pressure plate structure, and then can improve the wire bonding effect of the pressure plate structure of the integrated circuit packaging wire bonding machine.

[0032] refer to Figure 1 and Figure 3 A cross disassembly groove 304 is provided on the surface of the six mounting screws 302. The cross disassembly groove 304 can be easily disassembled by tools.

[0033] refer to Figure 3 The four pressing blocks 605 are all configured as rubber pressing blocks. By configuring the pressing blocks 605 to be made of rubber material, the friction of the pressing blocks 605 can be made greater, and the pressing blocks 605 can press and fix the connecting pressure plate 4 more firmly.

[0034] refer to Figure 1 and Figure 2 The first connecting plate 1, the second connecting plate 2 and the inclined plate 7 are all provided with rounded corners 10 on one side. The setting of the rounded corners 10 can avoid the edges being too sharp on the one hand, and can improve the overall structural strength on the other hand.

[0035] Principle and advantages of use: When in use, the pressure plate structure is pressed against the bracket, and the pressure plate structure of the integrated circuit packaging wire bonding machine can be fixedly installed through the mounting holes 9 on the two mounting plates 8. The six support plates 301 are connected to the six mounting grooves 303, and the six mounting screws 302 are used to fix the connection pressure plate 4 with the first connection plate 1 and the second connection plate 2. The six mounting screws 302 are removed, and the connection pressure plate 4 is removed from the first connection plate 1 and the second connection plate 2, respectively, so that the connection pressure plate 4 can be installed and removed, and then the connection pressure plate 4 can be removed. The versatility of the wire bonding machine pressure plate structure can be improved by manually rotating the six locking bolts 604, which are threadedly connected to the guide plate 602 and the mounting frame 603, so that the pressing block 605 can be raised and lowered. The connecting pressure plate 4 can be pressed and fixed by relying on the pressing block 605, thereby improving the installation effect of the connecting pressure plate 4. The connecting pressure plate 4 can be fixed and pressed, so that the fixing effect of the connecting pressure plate 4 can be replaced, which can improve the fitting effect of the pressure plate structure, and further improve the wire bonding effect of the pressure plate structure of the integrated circuit packaging wire bonding machine.

[0036] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A platen structure for an integrated circuit packaging wire bonding machine, comprising a first connecting plate (1) and a second connecting plate (2), characterized in that: A connecting pressure plate (4) is detachably connected between the first connecting plate (1) and the second connecting plate (2) via a fixing mechanism (3), and a plurality of connecting holes (5) are provided on the connecting pressure plate (4). A clamping mechanism (6) is provided on the first connecting plate (1) and the second connecting plate (2). Inclined plates (7) are fixedly connected to the sides of the first connecting plate (1) and the second connecting plate (2), and mounting plates (8) are fixedly connected to the sides of the two inclined plates (7), and mounting holes (9) are provided on the two mounting plates (8).

2. The platen structure of an integrated circuit packaging wire bonding machine according to claim 1, characterized in that: The fixing mechanisms (3) are provided in six groups, and the six groups of the fixing mechanisms (3) are respectively provided at the connection between the first connecting plate (1) and the second connecting plate (2) and the pressing plate.

3. The platen structure of an integrated circuit packaging wire bonding machine according to claim 2, characterized in that: The six groups of fixing mechanisms (3) respectively comprise a support plate (301), a mounting screw (302) and a mounting groove (303); the support plate (301) is fixedly connected to the side of the connecting pressure plate (4); the mounting groove (303) is provided on the first connecting plate (1) and the second connecting plate (2); and the support plate (301) is detachably connected to the mounting groove (303) via the mounting screw (302).

4. The platen structure of an integrated circuit packaging wire bonding machine according to claim 3, characterized in that: A cross disassembly groove (304) is formed on the surface of each of the six mounting screws (302).

5. The platen structure of an integrated circuit packaging wire bonding machine according to claim 1, characterized in that: Four groups of the fixing mechanisms (3) are provided, and the four groups of the fixing mechanisms (3) are respectively provided on the first connecting plate (1) and the second connecting plate (2).

6. The platen structure of an integrated circuit packaging wire bonding machine according to claim 5, characterized in that: The four groups of fixing mechanisms (3) respectively include a support rod (601), a guide plate (602), a mounting frame (603), a locking bolt (604) and a pressing block (605); the support rod (601) is fixedly connected to the first connecting plate (1) and the second connecting plate (2); the guide plate (602) is rotatably connected to the support rod (601); the mounting frame (603) is fixedly connected to the guide plate (602); the locking bolt (604) is threadedly connected to the mounting frame (603) and the guide plate (602); and the pressing block (605) is fixedly connected to the bottom of the locking bolt (604).

7. The platen structure of an integrated circuit packaging wire bonding machine according to claim 6, characterized in that: The four pressing blocks (605) are all configured as rubber pressing blocks.

8. The platen structure of an integrated circuit packaging wire bonding machine according to claim 1, characterized in that: One side corner of the first connecting plate (1), the second connecting plate (2) and the inclined plate (7) is provided with a rounded corner (10).

Images